Mechanical Simulations for Chip Package Interaction: Failure Mechanisms, Material Characterization, and Failure Data

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1 Mechanical Simulations for Chip Package Interaction: Failure Mechanisms, Material Characterization, and Failure Data Ahmer Syed Amkor Technology Enabling a Microelectronic World

2 Outline Effect of Chip on Package Effect of Package on Chip Steps for predictive models development Lessons from Package and Board Level Simulations What is needed? 2

3 Effect of Chip on Package Performance & Reliability Enabling a Microelectronic World

4 Die Effect on Substrate Design Trace Crack Mechanical simulations early in the design cycle to determine trace and via design in susceptible areas Die (Bottom) Via. Trace 3 Trace 1 Trace 2 Detailed view of the metal structure in sub model Trace : width = 50um space=50um 4

5 Effect of die thickness and number of die on package warpage Warpage (um) (25) (50) (75) (100) (125) (150) Die size (mm) Warpage (um) C 260C single die, 0.1mm thick single die, 0.17mm thick 2-die stacked 25C, Shadow Moire 260C, Shadow Moire -30 Temperature (C) Different die thickness may change the package warpage direction. Single thick die has similar warpage as two thin dies stacked. 5

6 Board Level Reliability Test Die Size Effect 16x16mm Die Mean Life: st Failure: x12mm Die Mean Life: st Failure: 5242 Cumulative Failure (%) Weibull 12x12mm Die W2 RRX - SRM MED F=21 / S=9 16x16mm Die W2 RRX - SRM MED F=27 / S= Cycles To Failure β1=9.3509, η1= , ρ= β2=8.0367, η2= , ρ= x12mm Die 16x16mm Die 6

7 Effect of Package on Chip Enabling a Microelectronic World

8 Mechanical Simulation Die Stress Database of die strength for various thickness and orientations Probability of die cracking determined in early phase of design cycle Die strength(kgf/mm^2) Die strength vs position on wafer Position 2 8

9 9

10 Cu/low-K Damage Factors affecting Cu/low-k failures Bump metallurgy Passivation opening Substrate CTE Die thickness other 10

11 Building Accurate Models Lessons Learned From Package and Board Level Performance Prediction Enabling a Microelectronic World

12 Life Prediction Model Requirements/Steps Load Profile Geometric Description Tests & Measurement Simulation Models Material Behavior Failure Definition & Failure Data Stress,Strain, Energy Density Predictive Models Model Validation Predictions for New Designs and Conditions 12

13 Measure Performance / Reliability Warpage Warpage during reflow 13

14 Measure Performance / Reliability Board Level Tests Temperature Cycling Drop & Bend Peak Acceleration: Half sine, 1500 G Pulse duration: 0.5 millisecond 14

15 Statistical Failure Data Cumulative % Failed SAC305 LF-A β1=2.78, η1=318.62, ρ=0.93 β2=2.41, η2=334.92, ρ=0.97 β3=1.06, η3=260.44, ρ=0.96 LF-A3 Drop to Failure Weibull LF-A3 W2 RRX - SRM MED F=20 / S=10 LF-A4 W2 RRX - SRM MED F=21 / S=13 SAC305 W2 RRX - SRM MED F=8 / S=8 15

16 Failure Analysis Dye & Pry Investigate failure location and pattern X-section Check failure mode Investigate crack position and pattern SAT Observe intermetallic compound C-SCAN SAT T-SCAN Investigate package delamination Dye & Pry result X-section 16

17 Failure Analysis (cont.) SEM/EDX analysis Observe microstructure and intermetallic compound Analyze IMC composition 17

18 Property measurement Viscoelastic properties for mold compounds and Underfills Measure material stress relaxation curve Curve fitting for viscoelastic property using Maxwell model and shift factor Maxwell model: Can be directly input to Ansys. Has been used for EMC and underfill materials. t G = G 0 α + α i exp τ i Shift factor: c1( T Tref ) log(α T ) = c2 + T T ref Stress Relaxation 18

19 Deformation Mechanisms - Sn/Pb Solder Real Joint Specimen Steady State Creep Behavior Darveaux et al Steady State Creep Behavior Wiese et al ε& cr G σ = sinh 751 T G exp kt Sn63Pb37 (Flip Chip) Sn59Pb40Ag1 (Bulk) ε& ε& cr cr 44.9 kt 2 [ ( 0.2σ )] exp = 10 sinh = kt 2.7 [ sinh( 0.1σ )] exp Steady State Strain Rate (1/sec) C 132C Shear Stress (psi) 67C 27C 10 4 Microstructure of SnPb Solder Joint 19

20 Deformation Mechanisms Pb free Solder Real Joint Specimen Creep Behavior 20

21 Develop Simulation Methodologies Package Warpage Viscoelastic properties Detailed substrate design Package diagonal distance (mm) Warpage (um) Accuracy Target = ± 20% 21

22 Develop Simulation Methodologies Solder Joint Life Prediction - Temp Cycle Detailed modeling All solder joints with non-linear properties Time & temperature dependent properties for other materials can be used 22

23 Develop Simulation Methodologies Solder Joint Life Prediction - Temp Cycle A board level model incorporating effect of components for dynamic analysis of the board (Syed et al, ECTC05) Large Mass 23

24 Validate Models Measured & Predicted strain Location #5 has the maximum strain amplitude Strain at location #4 slightly higher than at #2 Longitudenal Strain (microstrain) Measured Location 1 Location 2 Location 3 Location 4 Location Time (seconds) Longitudenal Strain (microstrain) Predicted Location 1 Location 2 Location 3 Location 4 Location Time (seconds) 24

25 PoP Warpage Model vs Shadow Moiré Correlation Model has been validated for 20 different packages covering: Package types include: TMV (FC and WB), Bare die FC, PsvfBGA Body size: 12 ~14mm, die size: 5 ~ 9.5mm Substrate type: regular core, low-cte core, ultra-low CTE core Substrate thickness: 0.21mm ~ 0.6mm EMC: CTE from 8ppm ~ 23ppm Warpage model prediction accuracy within 20um at 25C and 260C Warpage Model vs Shadow Moire Data at 25C +20um Warpage Model vs Shadow Moire Data at 260C um -180 Warpage from model (um) um Warpage from model (um) um Shadow Moire Measurement (um) Shadow Moire Measurement (um)

26 Solder Joint Life Prediction Temp Cycle Cycles to Mean Failure (Predictions) SnPb Solder (Syed, 1997) Originally published in 1997 PBGAs LCCCs QFPs Flip Chips * PBGAs - Motorola TSOPs * Master 2X Above 2X Below 25% Above 25% Below Open Symbols : Model Development Closed Symbols : Model Validation * Unpublished Test Data Test Data & Predictions Scaled by the Same Factor N f Cycles to Mean Failure (Test) ( 0.02ε ε ) 1 = II III Mean Cycles to Failure (Test) SnAgCu solder (Syed, 2004) Acc. Creep Strain Acc. Energy Density y = x R 2 = y = x R 2 = Acc. Creep Strain or Energy Density (Simulation) N f N f ( ε ) 1 = acc ( w ) 1 = acc 26

27 Solder Joint Life Prediction Drop Life Prediction Model (Syed, 2007) 1000 Drops to Failure (Mean) Accumualted Plastic Strain Accumulated Plastic Work y = x R 2 = y = 12633x R 2 = Number of Drops to Failure (Predictions) 100 2X 2X Accumulated Plastic Strain or Plastic Work D f = p 1. 5 ( ε ) Number of Drops to Failure (Test) D f = wp ( ) Further correlations in progress using different packages 27

28 What is needed for predictive modeling for CPI Enabling a Microelectronic World

29 29

30 30

31 What is Needed for CPI Failure Prediction? Relative Comparison are not enough, need to be able to predict failures Load Profile Geometric Description Tests & Measurement Simulation Models Material Behavior Failure Definition & Failure Data Stress,Strain, Energy Density Predictive Models Model Validation Predictions for New Designs and Conditions 31

32 Physics of Failure Based Predictive Modeling Geometric Description Material Behavior Tests & Measurement Failure Definition & Failure Data Accurate Geometric Description Detailed low-k layers structure Stronger co-design activity between Semiconductor and Packaging companies Share models across companies boundaries while protecting IP Material Behavior Temperature dependent behavior Thin Film, Nano-Indentation Fracture and Adhesion data Test Data Controlled tests (assembly, use) Statistical data 32

33 Disclaimer While every effort has been made to ensure that these data are accurate and reliable within the limits of the current test and simulation methods commonly used in the packaging industry, Amkor cannot assume liability for any damages caused by any errors or omissions in the data, nor as a result of the failure of the data to function on a particular system. Amkor makes no warranty, expressed or implied, nor does the fact of distribution constitute such a warranty. Expressly disclaimed are the implied warranties of merchantability and fitness for a particular purpose. 33

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