2013 SIMULIA Regional User Meeting
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1 press fit EON PCB Ò,, jg² ŸÄy ï o uþi Á eîî³ ì e γ n Ôhê x PCB w mø THT(Through Hole Technology* Æï SMT(Surface Mount Technology* Press Fit } Ê ³ Ç } Ù ROHS Ì û ke n³ û m «Ä í } EON ³ ê ³ ì ì Š EON Ù PCB f{켚µlšé PCB ksåž EON PCB dº åž j¹¹i dº n ³ ³ EON PCB ABSTRACT As consumption level upgrades, consumer electronic products continue to evolve development. Product performance requirements continue to improve. The reliability standards of quality characteristics increase stringently, thus keep on promoting the electronic components and the PCB packaging technology to be innovative. That includes a Through Hole assembly Technology (THT), Surface Mount assembly Technology (SMT), press-fit assembly technology. The press-fit assembly technology does not need a welding process, which consists with the environmental protection policy. Accordingly, press-fit technology began to be developed in Europe where ROHS is implemented. Its excellent substitutability also allowed the development with a more stable trend, moreover, connector manufacturers also followed this trend and began to enter the field of press-fit connectors. The key technology of a press-fit connector is the Eye Of Needle (EON). The mechanical properties of an EON require low insertion force and high withdrawal force. High insertion force will cause the EON collapse; low withdrawal force will result in an EON to escape from PCB hole. So this research studies the process for the EON inserting into the PCB, and the simulation results and experimental results will be compared, thereby to determine the reliability and accuracy of simulation techniques. Keywords: Press Fit Connector EON PCB Electronics Packaging Technology 1/5
2 ó ÎÙu ~ž ž wùu ~ x u{ º(PCB) x PCB Á É ì u º uþi Á eî γ ì e Î ³ n Ôhê x PCB w vì žx ä y uá PCB º jìmø 1. THT(Through Hole Technology) 2.Æï SMT(Surface Mount Technology) 3. Press Fit {Á ã Á jì uá Î { Á 2.1 Ó THT(Through Hole Technology) Ó THT(Through Hole Technology)Þ jìmø () 1. PCB x f 2. x PCB ï f 3. PCB o ï Ô ž PCB x sš x uâ mø ½ü i Á umø DIP(dual in line package)g PGA(pin grid array package) z 2.2 Æï Ó SMT(Surface Mount Technology) Æï Ó SMT(Surface Mount Technology)Þ jìmø () 1. PCB x ÇgØ() { (Ù Á À) 2. x PCB ÇgØ 3. PCB x dõá È } x ÇgØ x«x ÔPCB  u fº THT Ô ý x ( x ) mø çp ð i Á umø QFP(quad flat-pick package)p g q BGA(ball grid array) z Press Fit 2.3 Press Fit Þ jìmø () 1. PCB x f 2.x PCB x ºf n³ Ê( ) Ô ž n ³ PCB x s àš x PCB fs Ôì Š Ôã l f ³ mø  u p i Á umø EON(Eye Of Needle)Ð Action Pin ÔÐ 2/5
3 EON } Ê ³ Ç } Ù ROHS Ì û ke n³ û m «Ä í vì u à EON-Ð EON jì u} PCB fu Á ¹ Á( Ô Ô)x( f fs Ô) EON Ô Ô { à Ê xán ³ k Áw n k ŠlÀ½ Ù PCB f} ïé Õ Ô }µlì ¼n ŠŠ û l PCB Á k} u µl ì ABAQUS 4.1 dºþ ¹ EON µ dº ðy PCB( p ) 3D Ð d()õ Ð ABAQUS } ABAQUS d EON u à È C5191-H PCB u àá FR4 z nu ke n ò Ë x í â Õ} d ÕÉ dº ì u à C3D10M udº ¹nk  EON µ () ke à N µl à 3.471N À½() 4.2 upà µ Þ ày u EON «µ ý k«eon h uô zu PCB n Û Õµ p( ) òùœ É n PCB mø ýke µl ý ÕÉ Œ k EON PCB µ d u ¹  EON à N µl à N k ¹ dºnk dº Ãüò(Æ ) ke µ dº ¹ (* Õ EON ½) * ã dº ä ³}nk press fit EON PCB dº nk dº ¹ i  z 1.dº ¹ üò 9~11% }n }às Á ü( EON PCB Á Ô s Ô fü) 2. åžd Ð ³ Î ³ 3. } ABAQUS Ôv EON µdº Ùn Á( ò À½) [1] M. Thoben, I. Graf, R. Tschirbs, Press-Fit Technology, a Solder less Method for Mounting Power Modules, PCIM [2] Thilo Stolze, Markus Thoben, Michael Koch, Robert Severin; Infineon Technologies AG, Reliability of PressFIT Connections, BTiP Library [3] Printed circuit board from Wikipedia, the free encyclopedia t_board [4] SMT û 3/5
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5 p PCB (a) (b) (a) Ì(b) Õ EON dº ¹ (a) (b) (a) EON (b)pcb Û µ p dõ EON PCB Ð dºµ µ dº (a) (b) Õ EON ½! (a) Ì(b) Õ 5/5
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