Unconventional Micro-Manufacturing and Integration Technologies. Frank Niklaus
|
|
|
- Harvey McDowell
- 6 years ago
- Views:
Transcription
1 Unconventional Micro-Manufacturing and Integration Technologies Frank Niklaus
2 Outline Background Micro-Manufacturing and Integration Research Heterogeneous 3D Integration for MEMS & NEMS Integration and Packaging for MEMS Nanofabrication Technologies and Graphene NEMS Summary
3 KTH Royal Institute of Technology Sweden s largest technical university: More than 13,000 full-time students. Close to 1,800 research students. Around 3,500 full-time positions.
4 Department of Micro- and Nanosystems Head: Prof. Göran Stemme Micro and Nanosystem Integration Prof. Frank Niklaus Lab-on-a-Chip and Polymer Devices Prof. Wouter van der Wijngaart Microwave and THz MEMS Prof. Joachim Oberhammer Biomedical Devices Assoc. Prof. Niclas Roxhed Bioelectric Hybrid Systems Ass. Prof. Anna Herland Photonic MEMS Ass. Prof. Kristinn Gylfason
5 Thanks to all Colleagues at KTH! Support Erika Appel Ulrika Pettersson Mikael Bergqvist Cecilia Aronsson Admin. Ass. Admin. Ass. Technician Technician Researchers Göran Stemme Prof. Wouter van der Wijngaart Prof. Joachim Oberhammer Prof. Niclas Roxhed Assoc. Prof. Kristinn B. Gylfason Assis. Prof. Anna Herland Assis.Prof. Hans Sohlström Assoc. Prof. Tommy Haraldsson Researcher Ilya Anoshkin Researcher Oleksandr Glubokov Researcher Jonas Hansson Researcher Petr Makhalov Researcher Umer Shah Researcher Simon Bleiker Researcher PhD Students Gabriel Lenk Floria Ottonello Briano Simone Pagliano Arne Quellmalz Mina Rajabi Federico Ribet Stephan Schröder Serguei Smirnov Fritzi Töpfer Alexander Vastesson Xiaojing Wang Reza Zandi Shafagh Zhou Xiamo Zhao Xinghai James Campion Valentin Dubois Alessandro Enrico Xuge Fan Jessica Liljeholm Linnea Gustafsson Maoxiang Guo Weijin Guo Carlos Errando Herranz Emre Iseri Staffan Johansson Aleksandr Krivovitca Laila Ladhani Miku Laakso Torben Last
6 Micro and Nanosystem Integration Group 8 Ph.D. students at MST 2 industrial Ph.D. students at SenseAir and Silex Microsystems 1 postdoc and 3 contributing senior researchers
7 Four Research Topics Heterogeneous 3D Integration Technologies for MEMS and NEMS CMOS IC MEMS Integration and Packaging for MEMS Nanofabrication Technologies and Graphene-Based NEMS Wire Bond Pads Silicon Cavity Covered with Graphene Membrane Femotosecond Laser-Based Micromachining for MEMS & NEMS SiO 2 Schematic of Pressure Sensor
8 Research Topics in Group MEMS Heterogeneous 3D Integration for MEMS & NEMS CMOS IC Integration and Packaging for MEMS Nanomanufacturing Technologies and Graphene NEMS
9 Heterogeneous 3D Integration for MEMS & NEMS Motivation New MEMS designs, functionalities and material combinations. High performance MEMS materials on standard foundry ICs. Very high integration densities for smaller and cheaper components. MEMS CMOS IC
10 3D Integrated MEMS on ICs Commercial Examples: Invensense (gyro), mcube (accel.)
11 Via-Last Heterogeneous 3D Integration Platform Advantages No wafer-to-wafer alignment. Extreme reduction of via and dimensions (sub µm) possible.
12 Implemented Applications Si Micromirror Arrays IR Bolometer Arrays NEM Relays
13 Tilting Micro-Mirror Arrays (SLMs) for Maskless DUV Lithography Systems Step and repeat maskless lithography. 1 million mirrors (mirror size 16 x 16 µm 2 ). Single mirror actuation with underlying CMOS. Analogue tilt actuation in 16 steps (gray-tones) possible. Source: Zimmer, Fraunhofer IPMS
14 Via-Last Heterogeneous Integration for Mono-Crystalline Si Mirrors on CMOS SOI Wafer Si Device Layer CMOS IC
15 Si Mirror Integration: Dispense Glue SOI Wafer CMOS IC Glue
16 Si Mirror Integration: Adhesive Wafer Bonding SOI Wafer CMOS IC Glue
17 Si Mirror Integration: Sacrificial Wafer Thinning CMOS IC Glue
18 Si Mirror Integration: Removal of SiO 2 Etch-Stop CMOS IC Glue
19 Si Mirror Integration: Via Etch CMOS IC Glue
20 Si Mirror Integration: Via Formation CMOS IC Glue
21 Si Mirror Integration: Mirror Formation CMOS IC Glue
22 Si Mirror Integration: Mirror Release CMOS IC
23 1 M-pixel Mono-Si Mirror Array on CMOS Mirror Membrane Torsional Hinges Distance Holders Posts (Vias) Addressing Electrode Zimmer, Lapisa to appear MEMS 2011
24 SLMs for Adaptive Optics in Astronomy and Microscopy Wave-front correction using piston-type mirror arrays MEMS CMOS IC Source: Lapisa, KTH and Zimmer, Fraunhofer IPMS
25 2-Layer SLMs Fabrication Process Lapisa, M., Zimmer, F., Stemme, G., Gehner, A., & Niklaus, F. (2013). Heterogeneous 3D integration of hidden hinge micromirror arrays consisting of two layers of monocrystalline silicon. Journal of Micromechanics and Microengineering, 23(7),
26 2-Layer SLMs Fabrication Process Lapisa, M., Zimmer, F., Stemme, G., Gehner, A., & Niklaus, F. (2013). Heterogeneous 3D integration of hidden hinge micromirror arrays consisting of two layers of monocrystalline silicon. Journal of Micromechanics and Microengineering, 23(7),
27 Via-Last Heterogeneous Integration for Piston- Mirrors Using Two-Step Layer Transfer Lapisa, M., Zimmer, F., Stemme, G., Gehner, A., & Niklaus, F. (2013). Heterogeneous 3D integration of hidden hinge micromirror arrays consisting of two layers of monocrystalline silicon. Journal of Micromechanics and Microengineering, 23(7),
28 Bolometer Array for IR Imaging Forsberg, Fredrik, et al. "CMOS-integrated Si/SiGe quantum-well infrared microbolometer focal plane arrays manufactured with very large-scale heterogeneous 3-D integration." IEEE Journal of Selected Topics in Quantum Electronics 21.4 (2015):
29 Design of QW Si/SiGe IR Bolometer Forsberg, Fredrik, et al. "CMOS-integrated Si/SiGe quantum-well infrared microbolometer focal plane arrays manufactured with very large-scale heterogeneous 3-D integration." IEEE Journal of Selected Topics in Quantum Electronics 21.4 (2015):
30 Heterogeneously Integrated 17 µm pitch QW SiGe Bolometers on Fan-Out-Wafers Forsberg, Fredrik, et al. "CMOS-integrated Si/SiGe quantum-well infrared microbolometer focal plane arrays manufactured with very large-scale heterogeneous 3-D integration." IEEE Journal of Selected Topics in Quantum Electronics 21.4 (2015):
31 Functional Double-Layer 25 µm pitch IR Bolometers on 0.35 µm CMOS Forsberg, Fredrik, et al. "CMOS-integrated Si/SiGe quantum-well infrared microbolometer focal plane arrays manufactured with very large-scale heterogeneous 3-D integration." IEEE Journal of Selected Topics in Quantum Electronics 21.4 (2015):
32 NEMS Switch Design Gate Source Drain
33 Integration of NEM Switches Goal: NEM switch on top of 2 metal layer interconnect wafer Method: Metal anchors for mechanical stability and electrical connection
34 Heterogeneous Integration Process
35 Heterogeneous Integration Process
36 Challenges Etching of Anchor holes - Use hard mask to etch through different materials a How do you know when to stop etching?
37 Integrated Moni-Si NEM Switches Qin, T., Bleiker, S. J., Rana, S., Niklaus, F., & Pamunuwa, D. (2018). Performance Analysis of Nanoelectromechanical Relay-Based Field-Programmable Gate Arrays. IEEE Access.
38 Research Topics in Group Heterogeneous 3D Integration for MEMS & NEMS Integration and Packaging for MEMS Nanomanufacturing Technologies and Graphene NEMS
39 Wafer-Level Vacuum Sealing Using Cold Metal Welding in Combination with Solder Bumps Au sealing ring prevents solder vaport enter cavity. Solder bumps provide bond strength. Antelius, M., Stemme, G., & Niklaus, F. (2011). Small footprint wafer-level vacuum packaging using compressible gold sealing rings. Journal of Micromechanics and Microengineering, 21(8),
40 Wafer-Level Vacuum Sealing: Process Flow Antelius, M., Stemme, G., & Niklaus, F. (2011). Small footprint wafer-level vacuum packaging using compressible gold sealing rings. Journal of Micromechanics and Microengineering, 21(8),
41 Wafer-Level Low-Temperature Vacuum Sealing Using 8 µm Wide Copper Rings
42 Wafer-Level Low-Temperature Vacuum Sealing Using Copper Sealing
43 Wire Bonded TSVs Low-cost for low to medium TSV density Enable high aspect ratio TSV formation No lithography (mask-less) TSV formation Low temperature budget approach
44 TSVs Manufacturing Using Wire Bonding
45 Gold TSVs with Aspect Ratios > 20 Schröder, Stephan, et al. "Very high aspect ratio through silicon vias (TSVs) using wire bonding." Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on. IEEE, 2013.
46 Sealing of Liquids in MEMS Cavities Using Cold Metal Plugging Image source: Antelius, Proc Transducers 2011, KTH
47 Sealing of Liquids in MEMS Cavities Using Cold Metal Plugging Image source: Antelius, Proc Transducers 2011, KTH
48 Wafer-Level Vacuum Sealing Using Cold Metal Plugging Image source: Antelius, Proc Transducers 2011, KTH
49 Wafer-Level Vacuum Sealing Using Cold Metal Plugging Image source: Antelius, Proc Transducers 2011, KTH
50 Wire Bonded Infrared Emitter Joule-heated suspended Kanthal filament Integration using an automated wire bonding tool Mechanical fixation and placement by Attachment structures for free air ball & wire Guiding posts Schröder, Stephan, et al. "Fabrication of an infrared emitter using a generic integration platform based on wire bonding." Journal of Micromechanics and Microengineering (2016):
51 Filament Integration Results 2.Free air ball attachment 3.Filament placement 1.Filament Emitter 5.Electrical contact 4.Filament attachment
52 Fabrication of High-Aspect Ratio TSVs by Magnetic Assembly of Metal Studs Image source: Fischer, Proc MEMS 2011, KTH
53 High-Aspect Ratio Nickel TSVs Image source: Fischer, Proc MEMS 2011, KTH
54 Robotic Magnetic Self-assembly of TSVs Image source: Fischer, Proc MEMS 2011, KTH
55 Magnetic Self-assembly for Stretchable Microneedle Patches Rajabi, M., Roxhed, N., Shafagh, R. Z., Haraldson, T., Fischer, A. C., van der Wijngaart, W.,... & Niklaus, F. (2016). Flexible and stretchable microneedle patches with integrated rigid stainless steel microneedles for transdermal biointerfacing. PloS one, 11(12), e
56 Magnetic Self-assembly for Stretchable Microneedle Patches Combination of : Stretchable and flexible substrate for comfort; and Sharp and stiff needles for reliable penetration Rajabi, M., Roxhed, N., Shafagh, R. Z., Haraldson, T., Fischer, A. C., van der Wijngaart, W.,... & Niklaus, F. (2016). Flexible and stretchable microneedle patches with integrated rigid stainless steel microneedles for transdermal biointerfacing. PloS one, 11(12), e
57 Research Topics in Group Heterogeneous 3D Integration for MEMS & NEMS Integration and Packaging for MEMS Nanomanufacturing Technologies and Graphene NEMS Wire Bond Pads Silicon SiO 2 Cavity Covered with Graphene Membrane Schematic of Pressure Sensor
58 Nanogap Electrodes Nanogap electronics: Require sub-3 nm wide gaps between electrodes! Major problem: Extremely difficult to realize
59 Scalable Fabrication of Crack-Defined Nanogap Electrodes Control of gap size: nm Realization of tunneling junctions Massively parallel fabrication Valentin Dubois, Frank Niklaus, and Göran Stemme. "Crack Defined Electronic Nanogaps." Adv. Mater. (2016).
60 Control of Gap Size 1 μm in electrode bridge length 3.1 nm in nanogap width L3 L1 L2 Valentin Dubois, Frank Niklaus, and Göran Stemme. "Crack Defined Electronic Nanogaps." Adv. Mater. (2016).
61 Nanogap Tunneling Junctions Electron quantum tunneling occurs with sub-3 nm nanogaps Demonstration of quantum tunneling in crack-defined nanogap electrodes down to sub-1 nm in titanium nitride (TiN) and gold (Au) Valentin Dubois, Frank Niklaus, and Göran Stemme. "Crack Defined Electronic Nanogaps." Adv. Mater. (2016).
62 Massively Parallel Fabrication Density up to 7,000,000 junctions per cm 2 Compatible with wafer-scale processes and CMOS integration
63 Graphene-Based NEMS: Pressure Sensing Wire Bond Pads Cavity Covered with Graphene Membrane Silicon SiO 2 Schematic of Pressure Sensor Smith, A. D., Niklaus, F., Paussa, A., Vaziri, S., Fischer, A. C., Sterner, M.,... & Ostling, M. (2013). Electromechanical piezoresistive sensing in suspended graphene membranes. Nano letters, 13(7),
64 Graphene-Integration in NEMS Smith, A. D., Niklaus, F., Paussa, A., Vaziri, S., Fischer, A. C., Sterner, M.,... & Ostling, M. (2013). Electromechanical piezoresistive sensing in suspended graphene membranes. Nano letters, 13(7),
65 Graphene-NEMS Pressure Sensing Smith, A. D., Niklaus, F., Paussa, A., Vaziri, S., Fischer, A. C., Sterner, M.,... & Ostling, M. (2013). Electromechanical piezoresistive sensing in suspended graphene membranes. Nano letters, 13(7),
66 Graphene-NEMS Pressure Sensing Smith, A. D., Niklaus, F., Paussa, A., Vaziri, S., Fischer, A. C., Sterner, M.,... & Ostling, M. (2013). Electromechanical piezoresistive sensing in suspended graphene membranes. Nano letters, 13(7),
67 Summary Heterogeneous 3D integration platform for micro-mirrors, IR bolometers and NEMS relays. Wafer-level vacuum packaging, and wire bonding and magnetic assembly for wire integration in MEMS. Graphene NEMS pressure sensors and nanofabrication technologies for tunnelling junctions.
68 Acknowledgements Funding Sources Collaboration Partners
69
70 3D Printing Process for Si Nano Devices A.C. Fischer et al., Advanced Functional Materials, 2012.
71 3D Printing of Si Micro and Nano Devices A.C. Fischer et al., Advanced Functional Materials, 2012
72 3D Printing of Si Micro and Nano Devices A.C. Fischer et al., Advanced Functional Materials, 2012
73 Cross Section of Si Nano Devices A.C. Fischer et al., Advanced Functional Materials, 2012
74 3-Layer 3D Printed Si Micro-Structures
75 Resolution Limits of 3D Si Printed Nano-Structures Line-width resolution of 33 nm demonstrated. Line-width resolution of 20 nm with FIB writing, reported in literature. Layer thickness on the order of nm. A.C. Fischer et al., Advanced Functional Materials, 2012
http://kth.diva-portal.org This is an author produced version of a paper published in IEEE 6th International Conference on Micro Electro Mechanical Systems (MEMS), 013. This paper has been peer-reviewed
Peer-reviewed publications of Dr. Niclas Roxhed. H-index: 15
Peer-reviewed publications of Dr. Niclas Roxhed. H-index: 15 Journal publications in refereed international journals: [1] P. Nadeau, D. El-Damak, D. Glettig, Y. L. Kong, S. Mo, C. Cleveland, L. Booth,
Postprint.
http://www.diva-portal.org Postprint This is the accepted version of a paper presented at 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016, Shanghai, China, 24 January
Characterization and Predictive Modeling of Epitaxial Silicon-Germanium Thermistor Layers
Characterization and Predictive Modeling of Epitaxial Silicon-Germanium Thermistor Layers B. Gunnar Malm, Mohammadreza Kolahdouz, Fredrik Forsberg, Frank Niklaus School of ICT and EES KTH Royal Institute
Towards 17 µm pitch heterogeneously integrated Si/SiGe quantum well bolometer focal plane arrays
Towards 17 µm pitch heterogeneously integrated Si/SiGe quantum well bolometer focal plane arrays Per Ericsson a, Andreas C. Fischer b, Fredrik Forsberg b, Niclas Roxhed b, Björn Samel a, Susan Savage a,
Simple piezoresistive accelerometer
Simple piezoresistive pressure sensor Simple piezoresistive accelerometer Simple capacitive accelerometer Cap wafer C(x)=C(x(a)) Cap wafer may be micromachined silicon, pyrex, Serves as over-range protection,
ESS 5855 Surface Engineering for. MicroElectroMechanicalechanical Systems. Fall 2010
ESS 5855 Surface Engineering for Microelectromechanical Systems Fall 2010 MicroElectroMechanicalechanical Systems Miniaturized systems with integrated electrical and mechanical components for actuation
Performance, Packaging, Price: Challenges for Sensor Research I. Eisele Fraunhofer EMFT
Performance, Packaging, Price: Challenges for Sensor Research I. Eisele Fraunhofer EMFT Introduction There are many sensor effects... but only a a very few sensors! Outline CMOS Encapsulated CMOS/MEMS
Platform Isolation Using Out-of-plane Compliant Mechanism
Platform Isolation Using Out-of-plane Compliant Mechanism by Arpys Arevalo PhD Candidate in Electrical Engineering Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) King Abdullah University
Simulation of a Micro-Scale Out-of-plane Compliant Mechanism
Simulation of a Micro-Scale Out-of-plane Compliant Mechanism by Arpys Arevalo PhD Candidate in Electrical Engineering Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) King Abdullah
2.76/2.760 Multiscale Systems Design & Manufacturing
2.76/2.760 Multiscale Systems Design & Manufacturing Fall 2004 MOEMS Devices for Optical communications system Switches and micromirror for Add/drops Diagrams removed for copyright reasons. MOEMS MEMS
Microfabrication for MEMS: Part I
Microfabrication for MEMS: Part I Carol Livermore Massachusetts Institute of Technology * With thanks to Steve Senturia, from whose lecture notes some of these materials are adapted. CL: 6.777J/2.372J
Wafer-scale fabrication of graphene
Wafer-scale fabrication of graphene Sten Vollebregt, MSc Delft University of Technology, Delft Institute of Mircosystems and Nanotechnology Delft University of Technology Challenge the future Delft University
Vertically-Integrated Array-Type Miniature Interferometer as a Core Optical Component of a Coherence Tomography System for Tissue Inspection
Vertically-Integrated Array-Type Miniature Interferometer as a Core Optical Component of a Coherence Tomography System for Tissue Inspection Wei-Shan Wang a, Maik Wiemer *a, Joerg Froemel a, Tom Enderlein
Solder Self-assembly for MEMS
Solder Self-assembly for MEMS Kevin F. Harsh, Ronda S. Irwin and Y. C. Lee NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics, Department of Mechanical Engineering
MICROOPTOELECTROMECHANICAL
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, VOL. 17, NO. 3, MAY/JUNE 2011 629 Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS Martin Lapisa, Göran Stemme, Fellow, IEEE, and
F R A U N H O F E R I N
FRAUNHOFER Institute FoR Electronic NAno systems ENAS System Packaging 1 2 3 4 5 The actual developments of micro and nano technologies are fascinating. Undoubted they are playing a key role in today s
Self-study problems and questions Processing and Device Technology, FFF110/FYSD13
Self-study problems and questions Processing and Device Technology, FFF110/FYSD13 Version 2016_01 In addition to the problems discussed at the seminars and at the lectures, you can use this set of problems
Low-Temperature Bonding for Silicon-Based Micro-Optical Systems
Photonics 2015, 2, 1164-1201; doi:10.3390/photonics2041164 Review OPEN ACCESS photonics ISSN 2304-6732 www.mdpi.com/journal/photonics Low-Temperature Bonding for Silicon-Based Micro-Optical Systems Yiheng
Temporary Wafer Bonding - Key Technology for 3D-MEMS Integration
Temporary Wafer Bonding - Key Technology for 3D-MEMS Integration 2016-06-15, Chemnitz Chemnitz University of Technology Basic Research Fraunhofer ENAS System-Packaging (SP) Back-End of Line (BEOL) Applied
Development and Characterization of High Frequency Bulk Mode Resonators
Excerpt from the Proceedings of the COMSOL Conference 008 Hannover Development and Characterization of High Frequency Bulk Mode Resonators Hossein Pakdast 1*, Zachary James Davis 1 1 DTU Nanotech, Technical
M 3 System for Viscous Drag Reduction
122 Chapter 5 M 3 System for Viscous Drag Reduction In aerospace engineering, drag reduction is one of the most challenging problems of aircraft. Drag limits the maximum speed, the maximum range of flight
Integration and Packaging Concepts for Infrared Bolometer Arrays
Integration and Packaging Concepts for Infrared Bolometer Arrays Adit Decharat MICROSYSTEM TECHNOLOGY SCHOOL OF ELECTRICAL ENGINEERING ROYAL INSTITUTE OF TECHNOLOGY TRITA-EE 2009:030 ISSN 1653-5146 ISRN
Final Project Report. Contract/Grant Title: Development of High-Fill-Factor Large-Aperture Micromirrors for Agile Optical Phased Arrays
Final Project Report Contract/Grant Title: Development of High-Fill-Factor Large-Aperture Micromirrors for Agile Optical Phased Arrays Contract/Grant #: FA9550-08-1-0292 Reporting Period: 1 June 2008 to
Enhanced performance of microbolometer. using coupled feed horn antenna
Enhanced performance of microbolometer using coupled feed horn antenna Kuntae Kim*,a, Jong-Yeon Park*, Ho-Kwan Kang*, Jong-oh Park*, Sung Moon*, Jung-ho Park a * Korea Institute of Science and Technology,
EE C245 ME C218 Introduction to MEMS Design Fall 2007
EE C245 ME C218 Introduction to MEMS Design Fall 2007 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 12: Mechanics
There's Plenty of Room at the Bottom
There's Plenty of Room at the Bottom 12/29/1959 Feynman asked why not put the entire Encyclopedia Britannica (24 volumes) on a pin head (requires atomic scale recording). He proposed to use electron microscope
Especial Bump Bonding Technique for Silicon Pixel Detectors
Especial Bump Bonding Technique for Silicon Pixel Detectors E. Cabruja, M. Bigas, M. Ullán, G. Pellegrini, M. Lozano Centre Nacional de Microelectrònica Spain Outline Motivation Summary of bump bonding
EE C245 ME C218 Introduction to MEMS Design Fall 2007
EE C245 ME C218 Introduction to MEMS Design Fall 2007 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 11: Bulk
Flexible Piezoelectric-Induced Pressure Sensors for Static. Measurements Based on Nanowires/Graphene Heterostructures
Flexible Piezoelectric-Induced Pressure Sensors for Static Measurements Based on Nanowires/Graphene Heterostructures Zefeng Chen,, Zhao Wang,, Xinming Li,*, Yuxuan Lin, Ningqi Luo, Mingzhu Long, Ni Zhao,
Instrumentation for sub-mm astronomy. Adam Woodcraft SUPA, University of Edinburgh
Instrumentation for sub-mm astronomy Adam Woodcraft http://woodcraft.lowtemp.org SUPA, University of Edinburgh 1 2 Introduction Sub-mm astronomy 1 Astronomy at sub-mm wavelengths Between infrared and millimetre
MODELING OF T-SHAPED MICROCANTILEVER RESONATORS. Margarita Narducci, Eduard Figueras, Isabel Gràcia, Luis Fonseca, Joaquin Santander, Carles Cané
Stresa, Italy, 5-7 April 007 MODELING OF T-SHAPED MICROCANTILEVER RESONATORS Margarita Narducci, Eduard Figueras, Isabel Gràcia, Luis Fonseca, Joaquin Santander, Carles Centro Nacional de Microelectrónica
NEM Relays Using 2-Dimensional Nanomaterials for Low Energy Contacts
NEM Relays Using 2-Dimensional Nanomaterials for Low Energy Contacts Seunghyun Lee, Ji Cao 10/29/2013 A Science & Technology Professor H. -S. Philip Wong Electrical Engineering, Stanford University Center
Introduction to Microeletromechanical Systems (MEMS) Lecture 9 Topics. MEMS Overview
Introduction to Microeletromechanical Systems (MEMS) Lecture 9 Topics MicroOptoElectroMechanical Systems (MOEMS) Grating Light Valves Corner Cube Reflector (CCR) MEMS Light Modulator Optical Switch Micromirrors
EV Group. Engineered Substrates for future compound semiconductor devices
EV Group Engineered Substrates for future compound semiconductor devices Engineered Substrates HB-LED: Engineered growth substrates GaN / GaP layer transfer Mobility enhancement solutions: III-Vs to silicon
TRANSVERSE SPIN TRANSPORT IN GRAPHENE
International Journal of Modern Physics B Vol. 23, Nos. 12 & 13 (2009) 2641 2646 World Scientific Publishing Company TRANSVERSE SPIN TRANSPORT IN GRAPHENE TARIQ M. G. MOHIUDDIN, A. A. ZHUKOV, D. C. ELIAS,
Design and Optimization of Piezoelectric Dual-Mode Micro-Mirror
Design and Optimization of Piezoelectric Dual-Mode Micro-Mirror Jichao Zhong, Xingguo Xiong, Zheng Yao, Junling Hu*, Prabir Patra* Department of Electrical and Computer Engineering, *Department of Mechanical
CURRENT STATUS OF NANOIMPRINT LITHOGRAPHY DEVELOPMENT IN CNMM
U.S. -KOREA Forums on Nanotechnology 1 CURRENT STATUS OF NANOIMPRINT LITHOGRAPHY DEVELOPMENT IN CNMM February 17 th 2005 Eung-Sug Lee,Jun-Ho Jeong Korea Institute of Machinery & Materials U.S. -KOREA Forums
SCB10H Series Pressure Elements PRODUCT FAMILY SPEFICIFATION. Doc. No B
PRODUCT FAMILY SPEFICIFATION SCB10H Series Pressure Elements SCB10H Series Pressure Elements Doc. No. 82 1250 00 B Table of Contents 1 General Description... 3 1.1 Introduction... 3 1.2 General Description...
Deposition of Multilayer Fibers and Beads by Near-Field Electrospinning for Texturing and 3D Printing Applications
Deposition of Multilayer Fibers and Beads by Near-Field Electrospinning for Texturing and 3D Printing Applications Nicolas Martinez-Prieto, Jian Cao, and Kornel Ehmann Northwestern University SmartManufacturingSeries.com
MICROMECHANICAL TEMPERATURE SENSOR
MICROMECHANICAL TEMPERATURE SENSOR Ralitza Simeonova Gjosheva 2, Krassimir Hristov Denishev 1 1 Department of Microelectronics, Technical University - Sofia, 8 Kliment Ohridski Blvd., bl. 1, 1797-Sofia,
１ INTRODUCTION ２ SAMPLE PREPARATIONS
Chikage NORITAKE This study seeks to analyze the reliability of three-dimensional (3D) chip stacked packages under cyclic thermal loading. The critical areas of 3D chip stacked packages are defined using
20 MHz Free-Free Beam Microelectromechanical Filter with High Quality Factor
20 MHz Free-Free Beam Microelectromechanical Filter with High Quality Factor Group 4 Yang Lu 1, Tianfeng Lu 1, Han Wang 2, Zichen Tang 2 1 Department of Material Science and Engineering 2 Department of
Micro/nano and precision manufacturing technologies and applications
The 4th China-American Frontiers of Engineering Symposium Micro/nano and precision manufacturing technologies and applications Dazhi Wang School of Mechanical Engineering Dalian University of Technology
Design and Simulation of A MEMS Based Horseshoe Shaped Low Current Lorentz Deformable Mirror (LCL-DM).
Design and Simulation of A MEMS Based Horseshoe Shaped Low Current Lorentz Deformable Mirror (LCL-DM). Byoungyoul Park 1, Tao Chen 1, Cyrus Shafai 1 1 Electrical and Computer Engineering, University of
Microfabricated out-of-plane arrays of integrated capillary nano-electrospray emitters
Microfabricated out-of-plane arrays of integrated capillary nano-electrospray emitters IEPC-2009-188 Presented at the 31st International Electric Propulsion Conference, University of Michigan Ann Arbor,
Dynamic Strain of Ultrasonic Cu and Au Ball Bonding Measured In-Situ by Using Silicon Piezoresistive Sensor
2017 IEEE 67th Electronic Components and Technology Conference Dynamic Strain of Ultrasonic Cu and Au Ball Bonding Measured In-Situ by Using Silicon Piezoresistive Sensor Keiichiro Iwanabe, Kenichi Nakadozono,
Resonator Fabrication for Cavity Enhanced, Tunable Si/Ge Quantum Cascade Detectors
Resonator Fabrication for Cavity Enhanced, Tunable Si/Ge Quantum Cascade Detectors M. Grydlik 1, P. Rauter 1, T. Fromherz 1, G. Bauer 1, L. Diehl 2, C. Falub 2, G. Dehlinger 2, H. Sigg 2, D. Grützmacher
Real-Time High Resolution X-Ray Microscopy (XM)
The Information You Need...When You Need It. Real-Time High Resolution X-Ray Microscopy (XM) Through high-resolution X-ray microscopy, we are able to non-destructively examine the internal structure of
Supporting Information
Copyright WILEY-VCH Verlag GmbH & Co. KGaA, 69469 Weinheim, Germany, 213. Supporting Information for Adv. Mater., DOI: 1.12/adma.2134949 Large Arrays and Properties of 3-Terminal Graphene Nanoelectromechanical
Supplementary Methods A. Sample fabrication
Supplementary Methods A. Sample fabrication Supplementary Figure 1(a) shows the SEM photograph of a typical sample, with three suspended graphene resonators in an array. The cross-section schematic is
Institute for Electron Microscopy and Nanoanalysis Graz Centre for Electron Microscopy
Institute for Electron Microscopy and Nanoanalysis Graz Centre for Electron Microscopy Micromechanics Ass.Prof. Priv.-Doz. DI Dr. Harald Plank a,b a Institute of Electron Microscopy and Nanoanalysis, Graz
Heterogeneous MEMS device assembly and integration
DRDC Doc Number: DRDC-RDDC-2014-N2 Heterogeneous MEMS device assembly and integration Patrice Topart a1, Francis Picard a, Samir Ilias a, Christine Alain a, Claude Chevalier a, Bruno Fisette a, Jacques
Simulation based Analysis of Capacitive Pressure Sensor with COMSOL Multiphysics
Simulation based Analysis of Capacitive Pressure Sensor with COMSOL Multiphysics Nisheka Anadkat MTech- VLSI Design, Hindustan University, Chennai, India Dr. M J S Rangachar Dean Electrical Sciences, Hindustan
ALIGNMENT ACCURACY IN A MA/BA8 GEN3 USING SUBSTRATE CONFORMAL IMPRINT LITHOGRAPHY (SCIL)
ALIGNMENT ACCURACY IN A MA/BA8 GEN3 USING SUBSTRATE CONFORMAL IMPRINT LITHOGRAPHY (SCIL) Robert Fader Fraunhofer Institute for Integrated Systems and Device Technology (IISB) Germany Ulrike Schömbs SUSS
Regents of the University of California
Deep Reactive-Ion Etching (DRIE) DRIE Issues: Etch Rate Variance The Bosch process: Inductively-coupled plasma Etch Rate: 1.5-4 μm/min Two main cycles in the etch: Etch cycle (5-15 s): SF 6 (SF x+ ) etches
HSG-IMIT Application AG
B4.1 Acceleration Sensors IP-Blocks for MEMS Foundry Surface Micromachining Process R. Knechtel, S. Dempwolf S. Hering X-FAB Semiconductor Foundries AG Haarberstraße 67 99097 Erfurt / Germany T. Link J.
TCAD Modeling of Stress Impact on Performance and Reliability
TCAD Modeling of Stress Impact on Performance and Reliability Xiaopeng Xu TCAD R&D, Synopsys March 16, 2010 SEMATECH Workshop on Stress Management for 3D ICs using Through Silicon Vias 1 Outline Introduction
Nanoelectronics. Topics
Nanoelectronics Topics Moore s Law Inorganic nanoelectronic devices Resonant tunneling Quantum dots Single electron transistors Motivation for molecular electronics The review article Overview of Nanoelectronic
Nonlinear Time and Temperature Dependent Analysis of the Lead-Free Solder Sealing Ring of a Photonic Switch
Nonlinear Time and Temperature Dependent Analysis of the Lead-Free Solder Sealing Ring of a Photonic Switch J. Lau, Z. Mei, S. Pang, C. Amsden, J. Rayner and S. Pan Agilent Technologies, Inc. 5301 Stevens
ELECTROMECHANICAL RELIABILITY TESTING OF THREE-AXIAL SILICON FORCE SENSORS
ELECTROMECHANICAL RELIABILITY TESTING OF THREE-AXIAL SILICON FORCE SENSORS S. Spinner 1,2, J. Bartholomeyczik 1, B. Becker 2, M. Doelle 1, O. Paul 1, I. Polian 2, R. Roth 3, K. Seitz 3, and P. Ruther 1
Effect of Direction of Ultrasonic Vibration on Flip-Chip Bonding
Transactions of The Japan Institute of Electronics Packaging Vol. 6, No. 1, 13 [Technical Paper] Effect of Direction of Ultrasonic Vibration on Flip-Chip Bonding Mutsumi Masumoto*, Yoshiyuki Arai*, **,
SUPPLEMENTARY FIGURES
SUPPLEMENTARY FIGURES a b c Supplementary Figure 1 Fabrication of the near-field radiative heat transfer device. a, Main fabrication steps for the bottom Si substrate. b, Main fabrication steps for the
Research strategy for Micro and complex fluids
Research strategy for Micro and complex fluids Introduction Presently there is a strong trend towards miniaturizing equipment for chemical analysis and synthesis. This is made possible by development of
Self assembly. Prof. Karl F Böhringer, Electrical Engineering. Freshman Seminar GEN ST 197 D Nanoscience & Molecular Engineering
Self assembly from Nano to Milli Scales Prof. Karl F Böhringer, Electrical Engineering Freshman Seminar GEN ST 197 D Nanoscience & Molecular Engineering Monday, March 1, 2010 Introduction Micro Electro
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 6, NO. 3, MARCH
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 6, NO. 3, MARCH 2016 471 A Self-Aligning Flip-Chip Assembly Method Using Sacrificial Positive Self-Alignment Structures Hyung
CAPACITIVE MICRO PRESSURE SENSORS WITH UNDERNEATH READOUT CIRCUIT USING A STANDARD CMOS PROCESS
Journal of the Chinese Institute of Engineers, Vol. 26, No. 2, pp. 237-241 (2003) 237 Short Paper CAPACITIVE MICRO PRESSURE SENSORS WITH UNDERNEATH READOUT CIRCUIT USING A STANDARD CMOS PROCESS Ching-Liang
A final review session will be offered on Thursday, May 10 from 10AM to 12noon in 521 Cory (the Hogan Room).
A final review session will be offered on Thursday, May 10 from 10AM to 12noon in 521 Cory (the Hogan Room). The Final Exam will take place from 12:30PM to 3:30PM on Saturday May 12 in 60 Evans.» All of
Comparative Assessment of the Transient Temperature Response during Single-discharge Machining by Micro-EDM and LIP-MM Processes
Comparative Assessment of the Transient Temperature Response during Single-discharge Machining by Micro-EDM and LIP-MM Processes ICOMM 2014 No. 37 Ishan Saxena #1, Xiaochun Li 2, K. F. Ehmann 1 1 Department
Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages
Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages K. N. Chiang Associate Professor e-mail: knchiang@pme.nthu.edu.tw C. W. Chang Graduate Student C. T. Lin Graduate Student
Integrating MEMS Electro-Static Driven Micro-Probe and Laser Doppler Vibrometer for Non-Contact Vibration Mode SPM System Design
Tamkang Journal of Science and Engineering, Vol. 12, No. 4, pp. 399 407 (2009) 399 Integrating MEMS Electro-Static Driven Micro-Probe and Laser Doppler Vibrometer for Non-Contact Vibration Mode SPM System
Introduction to Actuators PK
Introduction to Actuators Primary Knowledge Participant Guide Description and Estimated Time to Complete This learning module is one of three SCME modules that discuss the types of components found in
Design and Calibration of a Microfabricated 6-Axis Force-Torque Sensor for Microrobotic Applications
Design and Calibration of a Microfabricated 6-Axis orce-torque Sensor for Microrobotic Applications. Beyeler, Member, IEEE, S. Muntwyler, and B.J. Nelson, Member, IEEE Abstract This work describes the
Simulation of a Polyimide Based Micromirror
Simulation of a Polyimide Based Micromirror A. Arevalo* *1, S. Ilyas **1, D. Conchouso and I. G. Foulds *1, 2 * Computer, Electrical and Mathematical Sciences and Engineering Division (CEMSE), ** Physical
Electrical Conductive Adhesives with Nanotechnologies
Yi Li Daniel Lu C.P. Wong Electrical Conductive Adhesives with Nanotechnologies Springer 1 Introduction 1 1.1 Electronics Packaging and Interconnect 1 1.2 Interconnection Materials 11 1.2.1 Lead-Free Interconnect
Gold Nanoparticles Floating Gate MISFET for Non-Volatile Memory Applications
Gold Nanoparticles Floating Gate MISFET for Non-Volatile Memory Applications D. Tsoukalas, S. Kolliopoulou, P. Dimitrakis, P. Normand Institute of Microelectronics, NCSR Demokritos, Athens, Greece S. Paul,
Ge Quantum Well Modulators on Si. D. A. B. Miller, R. K. Schaevitz, J. E. Roth, Shen Ren, and Onur Fidaner
10.1149/1.2986844 The Electrochemical Society Ge Quantum Well Modulators on Si D. A. B. Miller, R. K. Schaevitz, J. E. Roth, Shen Ren, and Onur Fidaner Ginzton Laboratory, 450 Via Palou, Stanford CA 94305-4088,
Thin Wafer Handling Challenges and Emerging Solutions
1 Thin Wafer Handling Challenges and Emerging Solutions Dr. Shari Farrens, Mr. Pete Bisson, Mr. Sumant Sood and Mr. James Hermanowski SUSS MicroTec, 228 Suss Drive, Waterbury Center, VT 05655, USA 2 Thin
PY5020: Nanomechanics Nanoscience MEMS and NEMS
PY5020: Nanomechanics Nanoscience MEMS and NEMS Toby Hallam hallamt@tcd.ie Overview - MEMS (Micro-Electro-Mechanical Systems) - Some enabling technologies RIE CPD - Capacitive actuators Pull-in instability
Hybrid Wafer Level Bonding for 3D IC
Hybrid Wafer Level Bonding for 3D IC An Equipment Perspective Markus Wimplinger, Corporate Technology Development & IP Director History & Roadmap - BSI CIS Devices???? 2013 2 nd Generation 3D BSI CIS with
EV Group. Enabling processes for 3D interposer. Dr. Thorsten Matthias EV Group
EV Group Enabling processes for 3D interposer Dr. Thorsten Matthias EV Group EV Group in a Nutshell st Our philosophy Our mission in serving next generation application in semiconductor technology Equipment
Design of Electrostatic Actuators for MOEMS Applications
Design of Electrostatic Actuators for MOEMS Applications Dooyoung Hah 1,, Hiroshi Toshiyoshi 1,3, and Ming C. Wu 1 1 Department of Electrical Engineering, University of California, Los Angeles Box 951594,
Design and Fabrication of Microheaters for Localized Carbon Nanotube Growth
Design and Fabrication of Microheaters for Localized Carbon Nanotube Growth Y. Zhou 1, J. Johnson 1, L. Wu 1, S. Maley 2, A. Ural 1, and H. Xie 1 1 Department of Electrical and Computer Engineering, University
Foundations of MEMS. Chang Liu. McCormick School of Engineering and Applied Science Northwestern University. International Edition Contributions by
Foundations of MEMS Second Edition Chang Liu McCormick School of Engineering and Applied Science Northwestern University International Edition Contributions by Vaishali B. Mungurwadi B. V. Bhoomaraddi
EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2014 C. Nguyen PROBLEM SET #4
Issued: Wednesday, Mar. 5, 2014 PROBLEM SET #4 Due (at 9 a.m.): Tuesday Mar. 18, 2014, in the EE C247B HW box near 125 Cory. 1. Suppose you would like to fabricate the suspended cross beam structure below
DEPFET sensors development for the Pixel Detector of BELLE II
DEPFET sensors development for the Pixel Detector of BELLE II 13 th Topical Seminar on Innovative Particle and Radiation Detectors (IPRD13) 7 10 October 2013, Siena, Italy Paola Avella for the DEPFET collaboration
Supplementary Figure 1 shows overall fabrication process and detailed illustrations are given
Supplementary Figure 1. Pressure sensor fabrication schematics. Supplementary Figure 1 shows overall fabrication process and detailed illustrations are given in Methods section. (a) Firstly, the sacrificial
Study of Capacitive Tilt Sensor with Metallic Ball
Study of Capacitive Tilt Sensor with Metallic Ball Chang Hwa Lee and Seung Seob Lee In this paper, a new, simple capacitive tilt sensor with a metallic ball is proposed. The proposed tilt sensor has only
Design and Analysis of dual Axis MEMS Capacitive Accelerometer
International Journal of Electronics Engineering Research. ISSN 0975-6450 Volume 9, Number 5 (2017) pp. 779-790 Research India Publications http://www.ripublication.com Design and Analysis of dual Axis
Micro Capacitive Tilt Sensor for Human Body Movement Detection
Micro Capacitive Tilt Sensor for Human Body Movement Detection L. Zhao, E. M. Yeatman Optical and Semiconductor Devices Group, Department of Electrical & Electronic Engineering Imperial College London,
Fabrication and Characterization of High Performance Micro Impedance Inclinometer
Fabrication and Characterization of High Performance Micro Impedance Inclinometer Chia-Yen Lee Department of Vehicle Engineering National Pingtung University of Science and Technology, Pingtung, Taiwan
Sensors and Metrology. Outline
Sensors and Metrology A Survey 1 Outline General Issues & the SIA Roadmap Post-Process Sensing (SEM/AFM, placement) In-Process (or potential in-process) Sensors temperature (pyrometry, thermocouples, acoustic
1. Narrative Overview Questions
Homework 4 Due Nov. 16, 010 Required Reading: Text and Lecture Slides on Downloadable from Course WEB site: http://courses.washington.edu/overney/nme498.html 1. Narrative Overview Questions Question 1
2D Materials for Gas Sensing
2D Materials for Gas Sensing S. Guo, A. Rani, and M.E. Zaghloul Department of Electrical and Computer Engineering The George Washington University, Washington DC 20052 Outline Background Structures of
Proposal of A New Structure Thermal Vacuum Sensor with Diode-Thermistors Combined with a Micro-Air-Bridge Heater
Proposal of A New Structure Thermal Vacuum Sensor with Diode-Thermistors Combined with a Micro-Air-Bridge Heater M. Kimura, F. Sakurai, H. Ohta, T. Terada To cite this version: M. Kimura, F. Sakurai, H.
Drug Delivery Systems
Introduction to BioMEMS & Medical Microdevices Drug Delivery Systems Companion lecture to the textbook: Fundamentals of BioMEMS and Medical Microdevices, by Prof., http://saliterman.umn.edu/ Star Tribune
MSN551 LITHOGRAPHY II
MSN551 Introduction to Micro and Nano Fabrication LITHOGRAPHY II E-Beam, Focused Ion Beam and Soft Lithography Why need electron beam lithography? Smaller features are required By electronics industry:
DEVELOPMENT OF A MEMS REPULSIVE ACTUATOR FOR LARGE OUT-OF-PLANE FORCE
DEVELOPMENT OF A MEMS REPULSIVE ACTUATOR FOR LARGE OUT-OF-PLANE FORCE by Imran Khan A thesis submitted in conformity with the requirements for the degree of Masters of Applied Science Graduate Department
MINIATURIZATION TECHNOLOGIES FOR DEPLOYABLE SYSTEMS
MINIATURIZATION TECHNOLOGIES FOR DEPLOYABLE SYSTEMS MEMS, MICROSENSORS, AND NANOTECHNOLOGY Harish Manohara NANO AND MICRO SYSTEMS GROUP Jet Propulsion Laboratory 4800 Oak Grove Drive Pasadena, CA 91109
LATEST INSIGHTS IN MATERIAL AND PROCESS TECHNOLOGIES FOR INTERPOSER AND 3D STACKING
LATEST INSIGHTS IN MATERIAL AND PROCESS TECHNOLOGIES FOR INTERPOSER AND 3D STACKING European 3D TSV Summit, January 22-23, 2013, Grenoble Dr. Rainer Knippelmeyer, CTO and VP of R&D, GM Product Line Bonder