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1 Flame-resistant polyimide (PI) film based flexible copperclad laminates: base materials Specification Thickness [µm] Single/Double Copper PI-film Cu-foil dhesive sided type SF SR 13, single R SF DR 13, double R SF SE 13, single ED SF DE 13, double ED SF SR 25,0 18 single R SF DR 25,0 18 double R SF SE 25,0 18 single ED SF DE 25,0 18 double ED SF SR 25,0 35 single R SF SE 25,0 35 single ED SF302 35SR 50,0 35 single R SF302 35DR 50,0 35 double R SF302 35SE 50,0 35 single ED SF302 35DE 50,0 35 double ED SF302 70SE 50,0 70 single ED SF SR 75,0 35 single R PI: Polyimid R-copper: Rolled nnealed ED-copper: Electrolytic Deposit
2 Flame-resistant polyimide (PI) film based flexible copper clad laminates: specifications Features: - Excellent flexibility, soldering reliability, chemical resistance and dimensional stability - High peel strength, flammability UL94V-0 - Excellent mechanical and electrical properties - RoHS compliant: Free of Pb, Hg, Cd, Cr 5+, PBB, PBDE etc. Test item Peel strength (90 ) Folding Endurance (MIT- R0.38x4.9N) Secifications Treatment Unit conditions SR 1018SE DR 1035DR 1,5 1,8 1,9 2,2 288 C, 5s 1,4 1,7 1,8 2,1 Times >300 >150 >0 >350 Solder float 300 C, 30s pass pass Max. oper. Temp. C Tg C Dimensional MD ±0,07 ±0,05 ±0,1 ±0,1 E-0.5/150 % Stability TD ±0.06 ±0,05 ±0,1 ±0,1 2mol/l Chemical resist. NaOH pass pass pass pass 2mol/l HCl pass pass pass pass IP pass pass pass pass Dielectric constant (1MHz) C-24/23/50 3,5 3,5 3,6 3,5 Dissipation factor C-24/23/50 0,031 0,032 0,031 0,030 Resistivity C-96/35/90 MΩ*m 2,0x10 8 2,0x10 8 3,0x10 8 3,5x10 8 Surface resistance C-96/35/90 MΩ 2,0x10 7 2,0x10 7 2,5x10 7 2,5x10 7 Electrical strength D-48/50+D- 0.5/23 V/µm Moisture absorption E-1/105+D- 24/23 % 0,9 1,1 1,0 1,0 Flammability C-48/23/50 UL94 V-0 UL94 V-0 UL94 V-0 UL94 V-0 = room environment C = humidity conditioning D = immersion conditioning in distilled water E = Temperature conditioning *send an enquiry to kontakt@leiton.de to receive the exact IPC specifications.
3 Flame Resistant epoxy bonding film (adhesive/prepreg) for multilayers: specifications Features - High bonding strength, good dimensional stability - Flammability UL94V-0 - Excellent soldering reliability, chemical resistance and electrical properties - Low adhesive flow, good process-ability, suitable for both fast and traditional lamination - RoHS compliant: Free of Pb, Hg, Cd, Cr 5+, PBB, PBDE etc. Test item Property data Treatment Unit conditions Thickness µm Peel strength (90 ) 1,1 1,4 288 C, 5s 0,9 1,3 Resin flow mm <0,15 <0,15 Solder float 300 C,10s pass pass Maximum operating temp. C 1 1 Tg C mol/l NaOH pass pass Chemical resistance 2mol/l HCl pass pass IP pass pass = room environment
4 Flame Resistant epoxy bonding film (adhesive/prepreg) for multilayers: materials Specification dhesive thickness [µm] SF302B 13 13,0 SF302B 15 15,0 SF302B 25 25,0 SF302B 35 35,0 SF302B 50 50,0 C Fast pressing cycle kg/cm² Explanation: fter fast press, the curing condition is 170±10 C for 90 min min 0 C Hot pressing cycle kg/cm² min 0
5 Flame-resistant polyimid film based coverlay Features - High bonding strength, good dimensional stability - Flammability UL94V-0 - Excellent soldering reliability, chemical resistance and electrical properties - Low adhesive flow, good process-ability, suitable for both fast and traditional lamination - RoHs - free of Pb, Hg, Cd, Cr 5+, PBB, PBDE etc. Test item Treatment conditions Unit Property data dhesive thickness µm PI thickness µm Peel strength (90 ) 1 1,1 1,5 288 C, 5s 0,9 1,3 Resin flow mm <0,15 <0,15 Solder float 300 C,10s pass pass 2mol/l NaOH pass pass Chemical resistance 2mol/l HCl pass pass IP pass pass Dimensional Stability MD ±0,07 ±0,05 E-0.5/150 % TD ±0.06 ±0,05 Volume Resistivity C-96/35/90 MΩ*m 7,5x10 7 5,0x10 7 Surface resistance C-96/35/90 MΩ 4,0x10 8 3,5x10 8 Moisture absorption E-1/105+D-24/23 % 1,0 1,2 Flammability C-48/23/50 UL94 V-0 UL94 V-0 = room environment C = humidity conditioning D = immersion conditioning in distilled water 1. Testing after laminating with shining side of copper foil in suitable condition For Pressing cycles please see page 5.
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