AON65 3V NChannel AlphaMOS General Description Latest Trench Power AlphaMOS (αmos LV) technology Very Low RDS(on) at.5v GS Low Gate Charge High Current Capability RoHS and HalogenFree Compliant Product Summary V DS I D (at V GS =V) R DS(ON) (at V GS =V) R DS(ON) (at V GS =.5V) 3V 85A <.mω < 3.mΩ Application DC/DC Converters in Computing, Servers, and POL Isolated DC/DC Converters in Telecom and Industrial % UIS Tested % R g Tested Top View DFN5X6 Bottom View Top View D 3 8 7 6 5 G PIN S Absolute Maximum Ratings T A =5 C unless otherwise noted Parameter Symbol Maximum DrainSource Voltage 3 GateSource Voltage Continuous Drain Current G V DS V GS ± Pulsed Drain Current C I DM 3 T A =5 C I DSM 5 Continuous Drain Current Avalanche Current C V DS Spike T C =5 C T C = C ns Junction and Storage Temperature Range I D 85 Avalanche energy L=.5mH C 9 Power Dissipation B Power Dissipation A T A =7 C T C =5 C T C = C T A =5 C T A =7 C I AS E AS V SPIKE P D P DSM T J, T STG 66 6 36 83 33 7.3.7 Units V V A A A mj 55 to 5 C V W W Thermal Characteristics Parameter Symbol Typ Max Maximum JunctiontoAmbient A t s 7 R θja Maximum JunctiontoAmbient A D SteadyState 55 Maximum JunctiontoCase SteadyState..5 R θjc Units C/W C/W C/W Rev..: February www.aosmd.com Page of 6
Electrical Characteristics (T J =5 C unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units STATIC PARAMETERS BV DSS DrainSource Breakdown Voltage I D =5µA, V GS =V 3 V I DSS V DS =3V, V GS =V T J =55 C 5 I GSS GateBody leakage current V DS =V, V GS = ±V na V GS(th) Gate Threshold Voltage V DS =V GS, I D =5µA.3.7. V R DS(ON) Zero Gate Voltage Drain Current Static DrainSource OnResistance V GS =V, I D =A V GS =.5V, I D =A.75. T J =5 C.55 3.5. 3. mω g FS Forward Transconductance V DS =5V, I D =A S V SD Diode Forward Voltage I S =A,V GS =V.7 V I S Maximum BodyDiode Continuous Current G 85 A DYNAMIC PARAMETERS C iss Input Capacitance 79 pf C oss Output Capacitance V GS =V, V DS =5V, f=mhz pf C rss Reverse Transfer Capacitance 69 pf R g Gate resistance V GS =V, V DS =V, f=mhz.9. 3 Ω SWITCHING PARAMETERS Q g (V) Total Gate Charge 6 nc Q g (.5V) Total Gate Charge 8 nc V GS =V, V DS =5V, I D =A Q gs Gate Source Charge 9 nc Q gd Gate Drain Charge 7 nc Q gs Gate Source Charge 9 nc V GS =.5V, V DS =5V, I D =A Q gd Gate Drain Charge 7 nc t D(on) TurnOn DelayTime 9.7 ns t r TurnOn Rise Time V GS =V, V DS =5V, R L =.75Ω, 5. ns t D(off) TurnOff DelayTime R GEN =3Ω 3.5 ns t f TurnOff Fall Time.3 ns t rr Body Diode Reverse Recovery Time I F =A, di/dt=5a/µs 9.6 ns Q rr Body Diode Reverse Recovery Charge I F =A, di/dt=5a/µs.7 nc A. The value of R θja is measured with the device mounted on in FR board with oz. Copper, in a still air environment with T A =5 C. The Power dissipation P DSM is based on R θja and the maximum allowed junction temperature of 5 C. The value in any given application depends on the user's specific board design. B. The power dissipation P D is based on T J(MAX) =5 C, using junctiontocase thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Single pulse width limited by junction temperature T J(MAX) =5 C. D. The R θja is the sum of the thermal impedance from junction to case R θjc and case to ambient. E. The static characteristics in Figures to 6 are obtained using <3µs pulses, duty cycle.5% max. F. These curves are based on the junctiontocase thermal impedance which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of T J(MAX) =5 C. The SOA curve provides a single pulse rating. G. The maximum current rating is package limited. H. These tests are performed with the device mounted on in FR board with oz. Copper, in a still air environment with T A =5 C. µa mω THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev..: February www.aosmd.com Page of 6
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 8.5V 3.5V 8 V DS =5V 6 V 6 I D (A) I D (A) V GS =3V 5 C 5 C 3 5 V DS (Volts) Fig : OnRegion Characteristics (Note E) 3 5 6 V GS (Volts) Figure : Transfer Characteristics (Note E).6 R DS(ON) (mω) 3 V GS =.5V V GS =V Normalized OnResistance.. V GS =V I D =A V GS =.5V I D =A 5 5 5 3 I D (A) Figure 3: OnResistance vs. Drain Current and Gate Voltage (Note E).8 5 5 75 5 5 75 Temperature ( C) Figure : OnResistance vs. Junction Temperature (Note E) 5.E I D =A.E.E R DS(ON) (mω) 3 5 C 5 C I S (A).E.E.E3.E 5 C 5 C 6 8 V GS (Volts) Figure 5: OnResistance vs. GateSource Voltage (Note E).E5....6.8.. V SD (Volts) Figure 6: BodyDiode Characteristics (Note E) Rev..: February www.aosmd.com Page 3 of 6
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 8 V DS =5V I D =A 35 3 C iss V GS (Volts) 6 Capacitance (pf) 5 5 5 C oss 3 5 Q g (nc) Figure 7: GateCharge Characteristics C rss 5 5 5 3 V DS (Volts) Figure 8: Capacitance Characteristics. 5 I D (Amps).... R DS(ON) limited T J(Max) =5 C T C =5 C DC µs µs µs ms Power (W) 3 T J(Max) =5 C T C =5 C 7 5... V DS (Volts) Figure 9: Maximum Forward Biased Safe Operating Area (Note F).... Figure : Single Pulse Power Rating JunctiontoCase 8 (Note F) t Z θjc Normalized Transient Thermal Resistance.. D=T on /T T J,PK =T C P DM.Z θjc.r θjc R θjc =.5 C/W Single Pulse 7.3.7 In descending order D=.5,.3,.,.5,.,., single pulse..... Figure : Normalized Maximum Transient Thermal Impedance (Note F) P D T on T Rev..: February www.aosmd.com Page of 6
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 9 9 Power Dissipation (W) 8 7 6 5 3 5 5 75 5 5 T CASE ( C) Figure : Power Derating (Note F) Current rating I D (A) 8 7 6 5 3 5 5 75 5 5 T CASE ( C) Figure 3: Current Derating (Note F) T A =5 C Power (W)... Figure : Single Pulse Power Rating Junctionto Ambient (Note H) t Z θja Normalized Transient Thermal Resistance... D=T on /T T J,PK =T A P DM.Z θja.r θja R θja =55 C/W Single Pulse In descending order D=.5,.3,.,.5,.,., single pulse.... Figure 5: Normalized Maximum Transient Thermal Impedance (Note H) P D T on T Rev..: February www.aosmd.com Page 5 of 6
Gate Charge Test Circuit & Waveform Qg V Qgs Qgd Ig RL Resistive Switching Test Circuit & Waveforms Charge Rg 9% % td(on) t r t d(off) t f t on t off Unclamped Inductive Switching (UIS) Test Circuit & Waveforms L E = / LI AR AR BV DSS Rg Id Id I AR Diode Recovery Test Circuit & Waveforms Q = Idt rr Ig Isd L Isd I F di/dt I RM t rr Rev..: February www.aosmd.com Page 6 of 6