MC74HC244A. Octal 3-State Noninverting Buffer/Line Driver/ Line Receiver. High Performance Silicon Gate CMOS

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1 Octal 3-State Noninverting Buffer/Line Driver/ Line Receiver High Performance Silicon Gate CMOS The MC74HC244A is identical in pinout to the LS244. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This octal noninverting buffer/line driver/line receiver is designed to be used with 3 state memory address drivers, clock drivers, and other bus oriented systems. The device has noninverting outputs and two active low output enables. The HC244A is similar in function to the HC240A. Features Output Drive Capability: 5 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating oltage Range: to Low Input Current: A High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7 A Chip Complexity: 36 FETs or 34 Equivalent Gates NL Prefix for Automotive and Other Applicatio Requiring Unique Site and Control Change Requirements; AEC Q00 Qualified and PPAP Capable These Devices are Pb Free, Halogen Free/BFR Free and are RoHS Compliant DATA INPUTS A A2 A3 A4 B B2 B B4 7 LOGIC DIAGRAM YA YA2 YA3 YA4 YB YB2 YB3 YB4 NONINERTING S SOIC DW SUFFIX CASE 75D ENABLE A A YB4 MARKING DIAGRAMS HC244A AWLYYWWG SOIC PIN ASSIGNMENT A2 A3 YB2 A4 YB GND YB DT SUFFIX CASE 948E ENABLE B YA B4 YA2 B3 B2 HC 244A ALYW A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or = Pb Free Package (*Note: Microdot may be in either location) FUNCTION TABLE YA3 YA4 B Inputs Outputs Enable A, Enable B A, B YA, YB L L L L H H H X Z Z = high impedance ENABLES ENABLE A ENABLE B 9 PIN = PIN 0 = GND ORDERING INFORMATION See detailed ordering and shipping information in the package dimeio section on page 5 of this data sheet. Semiconductor Components Industries, LLC, 4 August, 4 Rev. 5 Publication Order Number: MC74HC244A/D

2 MAXIMUM RATINGS Symbol Parameter alue Unit DC Supply oltage (Referenced to GND) 0.5 to +7.0 in DC Input oltage (Referenced to GND) 0.5 to out DC Output oltage (Referenced to GND) 0.5 to I in DC Input Current, per Pin ± ma I out DC Output Current, per Pin ±35 ma I CC DC Supply Current, and GND Pi ±75 ma I IK Input Clamp Current ( I < 0 or I > ) ± ma I OK Output Clamp Current ( O < 0 or O > ) ± ma P D Power Dissipation in Still Air, SOIC Package TSSOP Package mw This device contai protection circuitry to guard agait damage due to high static voltages or electric fields. However, precautio must be taken to avoid applicatio of any voltage higher than maximum rated voltages to this high impedance circuit. For proper operation, in and out should be cotrained to the range GND ( in or out ). Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or ). Unused outputs must be left open. T stg Storage Temperature 65 to +50 C T L Lead Temperature, mm from Case for 0 Seconds (SOIC, SSOP or TSSOP Package) 2 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Derating: SOIC Package: 7 mw/ C from 65 to 25 C TSSOP Package: 6. mw/ C from 65 to 25 C RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit DC Supply oltage (Referenced to GND) in, out DC Input oltage, Output oltage (Referenced to GND) 0 T A Operating Temperature, All Package Types C t r, t f Input Rise and Fall Time = (Figure ) = = Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. C

3 DC ELECTRICAL CHARACTERISTICS (oltages Referenced to GND) Symbol Parameter Test Conditio IH Minimum High Level Input oltage out = I out A IL Maximum Low Level Input oltage out = I out A OH OL Minimum High Level Output oltage Maximum Low Level Output oltage in = IH I out A in = IH I out 2.4 ma I out ma I out 7.8 ma in = IL I out A in = IL I out 2.4 ma I out ma I out 7.8 ma Guaranteed Limit 55 to 25 C 85 C 25 C Unit I in Maximum Input Leakage Current in = or GND ± ±.0 ±.0 A I OZ Maximum Three State Leakage Current Output in High Impedance State in = IL or IH out = or GND ±0.5 ±5.0 ±0 A I CC Maximum Quiescent Supply Current (per Package) in = or GND I out = 0 A A AC ELECTRICAL CHARACTERISTICS (C L = 50 pf, Input t r = t f = 6 ) Guaranteed Limit Symbol Parameter 55 to 25 C 85 C 25 C Unit t PLH, t PHL Maximum Propagation Delay, A to YA or B to YB (Figures and 3) t PLZ, t PHZ Maximum Propagation Delay, Output Enable to YA or YB (Figures 2 and 4) t PZL, t PZH Maximum Propagation Delay, Output Enable to YA or YB (Figures 2 and 4) t TLH, t THL Maximum Output Traition Time, Any Output (Figures and 3) C in Maximum Input Capacitance pf C out Maximum Three State Output Capacitance (Output in High Impedance State) pf 25 C, = 5.0 C PD Power Dissipation Capacitance (Per Buffer)* * Used to determine the no load dynamic power coumption: P D = C PD 2 f + I CC. 34 pf 3

4 SWITCHING WAEFORMS DATA INPUT A OR B YA OR YB t r t PLH t TLH 0% 90% 0% 90% t f GND t PHL t THL ENABLE A OR B Y Y t PZL t PZH t PLZ t PHZ 0% 90% GND HIGH IMPEDANCE OL OH HIGH IMPEDANCE Figure. Figure 2. TEST CIRCUITS TEST POINT TEST POINT DEICE UNDER TEST C L * DEICE UNDER TEST k C L * CONNECT TO WHEN TESTING t PLZ AND t PZL. CONNECT TO GND WHEN TESTING t PHZ AND t PZH. *Includes all probe and jig capacitance *Includes all probe and jig capacitance Figure 3. Test Circuit Figure 4. Test Circuit PIN DESCRIPTIONS INPUTS A, A2, A3, A4, B, B2, B3, B4 (Pi 2, 4, 6, 8,, 3, 5, 7) Data input pi. Data on these pi appear in noninverted form on the corresponding Y outputs, when the outputs are enabled. CONTROLS Enable A, Enable B (Pi, 9) Output enables (active low). When a low level is applied to these pi, the outputs are enabled and the devices function as noninverting buffers. When a high level is applied, the outputs assume the high impedance state. S YA, YA2, YA3, YA4, YB, YB2, YB3, YB4 (Pi 8, 6, 4, 2, 9, 7, 5, 3) Device outputs. Depending upon the state of the output enable pi, these outputs are either noninverting outputs or high impedance outputs. 4

5 LOGIC DETAIL TO THREE OTHER A OR B INERTERS ONE OF 8 INERTERS DATA INPUT A OR B YA OR YB ENABLE A OR ENABLE B ORDERING INFORMATION MC74HC244ADWG Device Package Shipping SOIC WIDE 38 Units / Rail MC74HC244ADWR2G MC74HC244ADTG MC74HC244ADTR2G NL74HC244ADWR2G* SOIC WIDE SOIC WIDE 000 / Tape & Reel 75 Units / Rail 2500 / Tape & Reel 000 / Tape & Reel NL74HC244ADTR2G* 2500 / Tape & Reel For information on tape and reel specificatio, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specificatio Brochure, BRD80/D. *NL Prefix for Automotive and Other Applicatio Requiring Unique Site and Control Change Requirements; AEC Q00 Qualified and PPAP Capable 5

6 PACKAGE DIMENSIONS DT SUFFIX CASE 948E 02 ISSUE C 5 (0.006) T L 5 (0.006) T U 2X L/2 PIN IDENT U S S C 00 (0.004) T SEATING PLANE X K REF 0 (0.004) M T U S S 0 A D G H B U N J J N SOLDERING FOOTPRINT 7.06 K K ÍÍÍÍ ÍÍÍÍ SECTION N N 0.25 (0.00) M NOTES:. DIMENSIONING AND TOLERANCING PER ANSI YM, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 5 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.00) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE W. F MILLIMETERS INCHES DIM MIN MAX MIN MAX DETAIL E A B C W D F G 0.65 BSC BSC H J DETAIL E J K K L 6.40 BSC BSC M PITCH 6X X.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 6

7 PACKAGE DIMENSIONS SOIC DW SUFFIX CASE 75D 05 ISSUE G H 0X 0.25 M B M D E A h X 45 NOTES:. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME YM, DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 5 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 3 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. X B 0.25 M T A S 8X e 0 B B S A A T SEATING PLANE C L MILLIMETERS DIM MIN MAX A A B C D E e.27 BSC H h L ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC ow the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC s product/patent coverage may be accessed at Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, coequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specificatio can and do vary in different applicatio and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any licee under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicatio intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless agait all claims, costs, damages, and expees, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 563, Denver, Colorado 8027 USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@oemi.com N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative MC74HC244A/D

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