Photocoupler Product Data Sheet LTV-M601 Series LITE-ON DCC RELEASE

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1 Product Data Sheet LTV-M61 Series Spec No. :DS Effective Date: 8/16/218 Revision: E LITE-ON DCC RELEASE BNS-OD-FC1/A4 LITE-ON Technology Corp. / Optoelectronics No.9,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: Fax: /

2 Small Outline, 5Lead, High CMR Photocoupler 1. DESCRIPTION The consists of a high efficient AlGaAs Light Emitting Diode and a high speed optical detector. This unique design provides maximum AC and DC circuit isolation while achieving LVTTL/LVCMOS compatibility. The output of the optical detector features an open collector Schottky clamped transistor. The internal shield provides a guaranteed common mode transient immunity specification of 1 KV/us at 3.3/5V operation. The Optocoupler operational parameters are guaranteed over the temperature range from -4 C ~ +1 C. 1.1 Features 3.3V / 5V Dual Supply Voltages Low power consumption High speed 1MBd typical Functional Diagram Pin No. and Internal connection diagram Low input current capability: 5mA 1KV/μs minimum Common Mode Rejection (CMR) at V CM = 1V Guaranteed AC and DC performance over temperature -4 C ~ +1 C. LVTTL/LVCMOS Compatible. 1. Anode 3. Cathode 4. GND 5. Vo (Output) 6. Vcc Strobable output. Safety approval 1 3 UL/ cul 1577, 375 Vrms/1 min VDE DIN EN , V IORM = 567 Vpeak 1.2 Applications Isolation in line receivers Ground loop elimination Feedback Element in Switching Mode Power Supplier High Speed Logic Ground Isolation TTL/TTL, TTL/CMOS, TTL/LSTTL Pulse transformer replacement Power transistor isolation in motor drives Interface between Microprocessor system, computer and their peripheral Truth Table (Positive Logic) LED OUT ON L OFF H A.1μF bypass Capacitor must be connected between Pin4 and Pin6 1/16 Part No. :

3 2. PACKAGE DIMENSIONS 2.1 Date Code *1 Factory Code *2. VDE Option *3 Notes : 1. The first digit is year date code, second and third digit is work week 2. Factory identification mark (W :China-CZ) Dimensions are all in Millimeters or V for VDE option. * Dimensions are in Millimeters and (Inches). 2/16 Part No. :

4 3. TAPING DIMENSIONS 3.1 LTV-M LTV-M61-TP Description Symbol Dimension in mm (inch) Tape wide W 12 ±.3 (.472) Pitch of sprocket holes P 4 ±.1 (.157) Distance of compartment Distance of compartment to compartment F 5.5 ±.1 (.217) P 2 2 ±.1 (.79) P 1 8 ±.1 (.315) 3.3 Quantities Per Reel Package Type Quantities (pcs) 3 3/16 Part No. :

5 4. RATING AND CHARACTERISTICS 4.1 Absolute Maximum Ratings at Ta=25 C * Parameter Symbol Rating Unit Note Average Forward Input Current I F 2 ma 2 Input Reverse Input Voltage V R 5 V Power Dissipation P I 4 mw Output Collector Current I O 5 ma Output Output Collector Voltage V O 7 V Output Collector Power Dissipation P o 85 mw Isolation Voltage V iso 375 V rms Supply Voltage V CC 7 V Operating Temperature T opr -4 ~ +1 C Storage Temperature T stg -4 ~ +125 C Lead Solder Temperature ** T sol 26 C *Ambient temperature = 25 C, unless otherwise spec ified. Stresses exceeding the absolute maximum ratings can cause permanent damage to the device. Exposure to absolute maximum ratings for long periods of time can adversely affect reliability. **26 C for 1 seconds. Refer to Lead Free Reflow Profile. 4.2 Recommended Operating Conditions Parameter Symbol Min Max Unit Operating Temperature T A -4 1 C Supply Voltage V CC V Low Level Input Current I FL 25 μa High Level Input Current I FH 5 15 ma Output Pull-up Resistor R L 33 4k Ω Fan Out (at R L=1kΩ per channel) N 5 TTL Loads 4/16 Part No. :

6 4.3 ELECTRICAL OPTICAL CHARACTERISTICS Input Parameter Symbol Min. Typ. Max. Unit Test Condition Fig. Note Input Forward Voltage V F V I F=1mA, T A=25 C 7 Input Forward Voltage Temperature Coefficient ΔV F/ΔT -1.6 mv/ C I F=1mA Input Reverse Voltage BV R 5. V I R = 1μA Input Threshold Current I TH ma V CC = 3.3V, V O =.6V I OL (sinking) = 13mA 4 Input Capacitance C IN 34 pf V F=; f=1mh Z Detector Logic low output voltage V OL.3.6 V Logic high output current I OH 5 1 μa V CC = 3.3V, I F = 5mA, I OL (sinking) = 13mA V CC = 3.3V, V O = 3.3V, I F = 25μA 5 3 Logic low supply current I CCL ma V CC = 3.3V, I F = 1mA 1 Logic high supply current I CCH ma V CC = 3.3V, I F = ma 1 Specified over recommended temperature (T A = -4 C to +1 C, 2.7V V CC 3.6V), I F = 7.5mA unless otherwise specified. All typicals at T A = 25 C, V CC = 3.3V. 5/16 Part No. :

7 4.4 ELECTRICAL OPTICAL CHARACTERISTIC Input Parameter Symbol Min. Typ. Max. Unit Test Condition Fig. Note Input Forward Voltage V F V I F=1mA, T A=25 C 7 Input Forward Voltage Temperature Coefficient ΔV F/ΔT -1.6 mv/ C I F=1mA Input Reverse Voltage BV R 5. V I R = 1μA Input Threshold Current I TH ma V CC = 5.5V, V O=.6V I OL 13mA 4 Input Capacitance C IN 34 pf V F=; f=1mh Z Detector Logic low output voltage V OL.4.6 V Logic high output current I OH 3 1 μa V CC = 5.5V, I F = 5mA, I OL (sinking) = 13mA V CC = 5.5V, V O = 5.5V, I F = 25μA 5 3 Logic low supply current I CCL 8 13 ma V CC = 5.5V, I F = 1mA 1 Logic high supply current I CCH 6 1 ma V CC = 5.5V, I F = ma 1 Specified over recommended temperature (T A = -4 C to +1 C, 4.5V V CC 5.5V), I F = 7.5mA unless otherwise specified. All typicals at T A = 25 C, V CC = 5.V. 6/16 Part No. :

8 5. SWITCHING SPECIFICATION Parameter Symb Min. Typ. Max. Unit Test Condition Fig. Note Propagation Delay Time to High Output Level t PLH 6 9 1,9 3 Propagation Delay Time to Low Output Level t PHL ,9 4 Pulse Width Distortion t PLH - t PHL ns R L=35Ω, C L=15pF Propagation Delay Skew t PSK 4 Output Rise Time (1 to 9%) t r 27 Output Fall Time (9 to 1%) t f 7 Specified over recommended temperature (T A = -4 C to +1 C, 2.7V V CC 3.6V), I F = 7.5mA unless otherwise specified. All typicals at T A = 25 C, V CC = 3.3V. Parameter Symbol Min. Typ. Max. Unit Test Condition Not Fig. Propagation Delay Time to High Output Level t PLH T A = 25 C R L=35Ω, C L =15pF 1,9 3 Propagation Delay Time to Low Output Level t PHL T A = 25 C 1 R L=35Ω, C L =15pF 1,9 4 Pulse Width Distortion t PLH - t PHL 1 35 ns 1 Propagation Delay Skew t PSK 4 R L = 35Ω, C L =15pF Output Rise Time (1 to 9%) t r 21 Output Fall Time (9 to 1%) t f 7 Specified over recommended temperature (T A = -4 C to +1 C, 4.5V V CC 5.5V), I F = 7.5mA unless otherwise specified. All typicals at T A = 25 C, V CC = 5.V. 7/16 Part No. :

9 Parameter Test Condition Sym. Min. Typ. Max. Units Fig. Note V CC = 3.3V V CM = 1V R L = 35Ω 1 I F = ma Common Mode Transient Immunity at High Output Level T A = 25 C V CC = 5V CM H KV/μs 2 5 V CM = 1V R L = 35Ω 1 I F = ma T A = 25 C V CC = 3.3V V CM = 1V R L = 35Ω 1 I F=1.mA Common Mode Transient Immunity at Low Output Level T A = 25 C V CC = 5V CM L KV/μs 2 6 V CM = 1V R L = 35Ω 1 I F=1.mA T A = 25 C 8/16 Part No. :

10 6. ISOLATION CHARACTERISTIC Parameter Symbol Min. Typ. Max. Unit Test Condition Note Input-Output Insulation Leakage Current I I-O 1. μa 45% RH, t = 5s, V I-O = 3kV DC, T A =25 C 7 Withstand Insulation Test Voltage V ISO 375 V RMS RH 5%, t = 1min, T A = 25 C 7, 8 Input-Output Resistance R I-O 1 12 Ω V I-O = 5V DC 7 Input-Output Capacitance C I-O 1. p f = 1MHz, T A = 25 C 7 Specified over recommended temperature (T A = -4 C to +1 C) unless otherwise specified. Typi cal values applies to T A = 25 C Note 1. A.1µF or bigger bypass capacitor for V CC is needed as shown in Fig.1 2. Peaking driving circuit may be used to speed up the LED. The peak drive current of LED may go up to 5mA and maximum pulse width 5ns, as long as average current doesn t exceed 2mA. 3. t PLH (propagation delay) is measured from the 3.75 ma point on the falling edge of the input pulse to the 1.5 V point on the rising edge of the output pulse. 4. t PHL (propagation delay) is measured from the 3.75 ma point on the rising edge of the input pulse to the 1.5 V point on the falling edge of the output pulse. 5. CM H is the maximum tolerable rate of rise of the common mode voltage to assure that the output will remain in a high logic state (i.e., VO > 2. V). 6. CM L is the maximum tolerable rate of fall of the common mode voltage to assure that the output will remain in a low logic state (i.e., VO <.8 V). 7. Device is considered a two-terminal device: pins 1, 3 shorted together, and pins 4, 5, 6 shorted together. 8. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage 45 Vrms for one second (leakage current less than 1 ua). This test is performed before the 1% production test for partial discharge 9/16 Part No. :

11 7. SWITCHING TIME TEST CIRCUIT Photocoupler PULSE GEN. Z O I F 1 Vcc 6 3.3V or 5V t f = t r = 5 ns uf BYPASS RL VO CL INPUT 3 GND 4 RM ILED IF=7.5mA IF=3.75mA tphl tplh VOUT 1.5V Figure 1: Test Circuit for tphl and tplh I F VFF B A 1 2 Vcc uf BYPASS 3.3V or 5V VO 3 GND 4 VCM + - PULSE GEN. VCM (PEAK) VCM V VO 3.3V or 5V SWITCH AT A: IF =ma VO(MIN) SWITCH AT A: IF=7.5mA VO(MAX) CMH VO.5V CML Figure 2: Test Circuit for Common Mode Transient Immunity 1/16 Part No. :

12 8. TYPICAL PERFORMANCE CURVES Photocoupler I OH -High Level Out Current -μa V CC = 3.3V V O = 3.3V I F = 25μA I OH -High Level Output Current -μa V CC = 5.5V V O = 5.5V I F = 25μA I TH -Input Threshold Current -ma V OL -Low Level Output Voltage -V V CC = 3.3V V O =.6V R L = 1KΩ R L = 35Ω R L = 4KΩ Figure 3: Typical high level output current vs. temperature..1 I TH -Input Threshold Current -ma V CC = 5.V V O =.6V Figure 4: Typical Input Diode Threshold Current vs. Ambient Temperature V CC = 3.3V I F = 5.mA I O = 13mA V OL -Low Level Output Voltage -V R L = 1KΩ R L = 35Ω R L = 4KΩ V CC = 5.5V I F = 5.mA Figure 5: Typical Low Level Output Voltage vs. Ambient Temperature I O = 12.8mA.1 11/16 Part No. :

13 I OL -Low Level Output Current -ma V CC = 3.3V V O =.6V I F = 5.mA I OL -Low Level Output Current -ma V CC = 5.V V O =.6V Figure 6: Typical Low Level Output Current vs. Ambient Temperature I F = 5.mA 1 I F -Forward Current -ma Ta = 15 o C Ta = 25 o C Ta = -4 o C V F -Forward Voltage -V Figure 7: Typical Input Diode Forward Characteristics 12/16 Part No. :

14 t P -Propagation Delay -ns V CC = 3.3V I F = 7.5mA t PLH,R L = 1kΩ t PLH,R L = 35Ω t PHL,R L = 35Ω, 1kΩ t P -Propagation Delay -ns V CC = 5.V I F = 7.5mA t PLH,R L = 35Ω t PLH,R L = 1kΩ t PHL,R L = 35Ω Figure 8: Typical Propagation Delay vs. Ambient Temperature PWD -Pulse Width Distortion -ns V CC = 3.3V I F = 7.5mA R L = 35Ω PWD -Pulse Width Distortion -ns V CC = 5.V I F = 7.5mA R L = 35Ω Figure 9: Typical Pulse Width Distortion vs. Ambient Temperature 13/16 Part No. :

15 9. TEMPERATURE PROFILE OF SOLDERING 9.1 IR Reflow soldering (JEDEC-STD-2C compliant) One time soldering reflow is recommended within the condition of temperature and time profile shown below. Do not solder more than three times. Profile item Conditions Preheat - Temperature Min (T Smin) - Temperature Max (T Smax) - Time (min to max) (ts) 15 C 2 C 9±3 sec Soldering zone - Temperature (T L) - Time (t L) Peak Temperature (T P) Ramp-up rate Ramp-down rate 217 C 6 ~ 1sec 26 C 3 C / sec max. 3~6 C / sec Ramp-up 2 sec TP 26 C Temperature ( C) Tsmin 15 C TL 217 C Tsmax 2 C 6-1 sec tl (Soldering) Ramp-down 25 C 6 ~ 12 sec ts (Preheat) Time (sec) 14/16 Part No. :

16 9.2 Wave soldering (JEDEC22A111 compliant) One time soldering is recommended within the condition of temperature. Temperature: 26+/-5 C Time: 1 sec. Preheat temperature:25 to 14 C Preheat time: 3 to 8 sec. 9.3 Hand soldering by soldering iron Allow single lead soldering in every single process. One time soldering is recommended. Temperature: 38+/-5 C Time: 3 sec max. 15/16 Part No. :

17 1. NAMING RULE Photocoupler Part Number Options LTV-M61-TP LTV-M61 LTVM61TP-V LTVM61-V Definition of Suffix "M61" Remark LiteOn model name " no suffix " Pin 1 location at upper right of the tape "TP" "V" Pin 1 location at lower left of the tape VDE approved option 11. NOTES LiteOn is continually improving the quality, reliability, function or design and LiteOn reserves the right to make changes without further notices. The products shown in this publication are designed for the general use in electronic applications such as office automation equipment, communications devices, audio/visual equipment, electrical application and instrumentation. For equipment/devices where high reliability or safety is required, such as space applications, nuclear power control equipment, medical equipment, etc, please contact our sales representatives. When requiring a device for any specific application, please contact our sales in advice. If there are any questions about the contents of this publication, please contact us at your convenience. The contents described herein are subject to change without prior notice. Immerge unit s body in solder paste is not recommended. 16/16 Part No. :

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