NL27WZU04. Dual Unbuffered Inverter
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1 Dual Unbuffered Inverter The N27WZU04 is a high performance dual unbuffered inverter operating from a.5 to 5.5 V supply. These devices are well suited for use as oscillators, pulse shapers, and in many other applications requiring a high input impedance amplifier. For digital applications, the N27WZ04 is recommended. Features Designed for.5 V to 5.5 V Operation Unbuffered for Crystal Oscillator and Analog Applications VCMOS Compatible Source/Sink ± 4.5 V Near Zero Static Supply Current Substantially Reduces System Power Requirements Chip Complexity: FET = 72; Equivalent Gate = 8 These Devices are Pb Free and are RoHS Compliant NV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Q00 Qualified and PPAP Capable SC 88/SOT 33/SC 70 DF SUFFIX CASE 49B TSOP DT SUFFIX CASE 38G MARKING DIAGRAMS M M M M M IN A OUT Y M M = Device Code = Date Code* = Pb Free Package GND IN A OUT Y2 (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. PIN ASSIGNMENT Figure. Pinout (Top View) IN A OUT Y IN A2 OUT Y2 Pin Function IN A 2 GND 3 IN A2 4 OUT Y2 5 OUT Y Figure 2. ogic Symbol FUNCTION TABE A Input H Y Output H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Semiconductor Components Industries, C, 202 June, 202 Rev. 9 Publication Order Number: N27WZU04/D
2 MAXIMUM RATINGS Symbol Characteristics Value Units DC Supply Voltage 0.5 to +7.0 V V I DC Input Voltage 0.5 V I V V O DC Output Voltage 0.5 to +7.0 V I IK DC Input Diode Current V I < GND 50 ma I OK DC Output Diode Current V O < GND V O > ma I O DC Output Sink Current ±50 ma I CC DC Supply Current per Supply Pin ±00 ma I GND DC Ground Current per Ground Pin ±00 ma T STG Storage Temperature Range 5 to +50 C P D JA Power Dissipation in Still Air SC 88, TSOP 200 Thermal Resistance SC 88, TSOP 333 mw C/W T ead Temperature, mm from Case for 0 s 20 C T J Junction Temperature under Bias +50 C V ESD I atchup ESD Withstand Voltage Human Body Model (Note ) Machine Model (Note 2) Charged Device Model (Note 3) > 2000 > 200 N/A atchup Performance Above and Below GND at 85 C (Note 4) ±500 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. Tested to EIA/JESD22 A4 A. 2. Tested to EIA/JESD22 A5 A. 3. Tested to JESD22 C0 A. 4. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Units Supply Voltage Operating Data Retention Only V I Input Voltage V V O Output Voltage (High or OW State) V T A Operating Free Air Temperature C t/ V Input Transition Rise or Fall Rate = 2.5 V ± 0.2 V = 3.0 V ± 0.3 V = 5.0 V ± 0.5 V V ma V ns/v 2
3 DC EECTRICA CHARACTERISTICS Symbol Parameter Condition (V) T A = 25 C 55 C T A 25 C Min Typ Max Min Max V IH High evel Input Voltage.5 to V 2.3 to V I ow evel Input Voltage.5 to V V OH V O High evel Output Voltage V IN = V I 2.3 to I OH = 00 A.5 to V V IN = GND I OH = 3 ma ow evel Output Voltage V IN = V IH I OH = 4 ma I OH = ma I OH = 8 ma I OH = 2 ma I OH = ma I O = 00 A.5 to V V IN = IO = 3 ma I O = 4 ma I O = ma I O = 8 ma I O = 2 ma I O = ma I IN Input eakage Current V IN = 5.5 V or GND 0 to 5.5 ±0. ±.0 A I OFF I CC Power Off eakage Current Maximum Quiescent Supply Current V IN = 5.5 V or 0 0 A V OUT = 5.5 V V IN = 5.5 V or GND A Î AC EECTRICA CHARACTERISTICS t R = t F = 2.5 ns; C = 50 pf; R = 500 ÎÎÎÎÎÎÎÎÎÎ T A = 25 C ÎÎÎÎÎÎÎ 55 C T A 25 C ÎÎ ÎÎÎÎ SymbolÎÎÎÎÎÎÎ Parameter ÎÎÎÎÎÎÎ Condition ÎÎÎÎ (V) ÎÎÎÎ Min ÎÎ Typ ÎÎÎÎ Max ÎÎÎÎ Min ÎÎÎÎ Max ÎÎ Units t ÎÎÎÎ PH Propagation Delay R t PH ÎÎÎÎÎ = M, C = 50 pf.8 ± ns ÎÎÎÎ Input A to Y ÎÎÎÎÎÎÎÎÎÎ (Figure 3 and 4) R ÎÎÎÎÎÎÎ = M, C = 5 pf 2.5 ± ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ R = M, C = 5 pf 3.3 ± ÎÎÎÎ R = 500, C = 50 pf ÎÎÎÎ R = M, C = 5 pf 5.0 ± ÎÎÎÎ R = 500, C = 50 pf ÎÎÎÎ CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Units C IN Input Capacitance = 5.5 V, V I = 0 V or 7 pf C OUT Output Capacitance = 5.5 V, V I = 0 V or 8 pf C PD Power Dissipation Capacitance (Note 5) 0 MHz, = 5.5 V, V I = 0 V or 25 pf 5. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I CC(OPR) = C PD f in + I CC. C PD is used to determine the no load dynamic power consumption; P D = C PD V 2 CC f in + I CC. Units 3
4 A or B 50% GND t PH t PH Y 50% PROPAGATION DEAYS t R = t F = 2.5 ns, 0% to 90%; f = MHz; t W = 500 ns Figure 3. Switching Waveforms PUSE GENERATOR DUT R T C R C = 50 pf or equivalent (includes jig and probe capacitance) R = R = 500 or equivalent R T = Z OUT of pulse generator (typically 50 ) Figure 4. Test Circuit ORDERING INFORMATION N27WZU04DFT2G Device Package Shipping SC 88 / SOT 33 / SC 70 (Pb Free) 3000 / Tape & Reel NV27WZU04DFT2G* SC 88 / SOT 33 / SC 70 (Pb Free) 3000 / Tape & Reel N27WZU04DTTG TSOP (Pb Free) 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D. *NV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Q00 Qualified and PPAP Capable. 4
5 PACKAGE DIMENSIONS SC 88/SC70 /SOT 33 CASE 49B 02 ISSUE W D e NOTES:. DIMENSIONING AND TOERANCING PER ANSI Y4.5M, CONTROING DIMENSION: INCH B 0 OBSOETE, NEW STANDARD 49B 02. H E E b P 0.2 (0.008) M E M MIIMETERS DIM MIN NOM MAX A A A3 b C D E e 0.5 BSC H E INCHES MIN NOM MAX REF REF BSC A3 A C A SODERING FOOTPRINT* SCAE 20: mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. 5
6 PACKAGE DIMENSIONS TSOP CASE 38G 02 ISSUE U E NOTE 5 e 0.05 A D b E A c H M DETAI Z DETAI Z 2 GAUGE PANE C SEATING PANE NOTES:. DIMENSIONING AND TOERANCING PER ASME Y4.5M, CONTROING DIMENSION: MIIMETERS. 3. MAXIMUM EAD THICKNESS INCUDES EAD FINISH. MINIMUM EAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIA. 4. DIMENSIONS D AND E DO NOT INCUDE MOD FASH, PROTRUSIONS, OR GATE BURRS. MOD FASH, PROTRUSIONS, OR GATE BURRS SHA NOT EXCEED 0.5 PER SIDE. DIMENSIONS D AND E ARE DETERMINED AT DATUM H. 5. PIN ONE INDICATOR MUST BE OCATED IN THE INDICATED ZONE. MIIMETERS DIM MIN NOM MAX A A b c D E E e BSC M 0 0 RECOMMENDED SODERING FOOTPRINT* X X PITCH DIMENSIONS: MIIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, C (SCIC). SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBICATION ORDERING INFORMATION ITERATURE FUFIMENT: iterature Distribution Center for ON Semiconductor P.O. Box 53, Denver, Colorado 8027 USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order iterature: For additional information, please contact your local Sales Representative N27WZU04/D
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