KMT32B Magnetic Angle Sensor
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- Scot Hutchinson
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1 TDFN SO8 SM8 AMR Sensor with 80 period for the use at moderate field strengths high accuracy tiny TDFN package various packages available DESCRIPTION The KMT3B is a magnetic field sensor based on the anisotropic magneto resistance effect, i.e. it is sensing the magnetic field direction independently on the magnetic field strength for applied field strengths H>5 ka/m. The sensor contains two parallel supplied Wheatstone bridges, which enclose a sensitive angle of 45 degrees. A rotating magnetic field in the surface parallel to the chip (x-y plane) will deliver two independent sinusoidal output signals, one following a cos(α) and the second following a sin(α) function, α being the angle between sensor and field direction (see Figure ). FEATURES APPLICATIONS Contactless angular position Absolute and incremental angle measurement Design optimized linearity Motor motion control High accuracy Robotics Low cost, low power Camera positioning Self diagnosis feature Potentiometer replacement User has complete control over signal Position measurement in medical applications evaluation Attractive SMD packages Automotive (steering angle, torque) High rotational speed up to 30,000 rpm Extended operating temperature range (-40 C to +50 C, +60 C on request) Ideal for harsh environments due to magnetic sensing principle RoHS compliant (lead free) /6
2 CHARACTERISTIC VALUES Parameter Symbol Condition Min Typ Max Unit A. Operating Limits Max. supply voltage Vcc,max 0 V Max. current (single bridge) Icc,max 4 ma Operating temperature T op C Storage temperature T st C B. Sensor Specifications (T=5 C) Supply voltage Vcc 5 V Resistance (single bridge) R b Ω Output signal range V n /Vcc Condition A, B 6 0 mv/v Offset voltage Voff/Vcc Condition A, B mv/v Angular inaccuracy α Condition A, B deg Angular hysteresis αh Condition A, B 0. deg C. Sensor Specifications TC of amplitude TCSV Condition A, C %/K TC of resistance TCBR Condition A, C %/K TC of offset TCVoff Condition A, C µv/v/k Stress above one or more of the limiting values may cause permanent damage to the device. Exposure to limiting values for extended periods may affect device reliability. MEASUREMENT CONDITIONS Parameter Symbol Unit Condition Condition A: Set Up Conditions Ambient temperature T C T = 3±5 C (unless otherwise noted) Supply voltage Vcc V Vcc = 5 V Applied magnetic field H ka/m H = 5 ka/m Condition B: Sensor Specifications (T=5 C, 360 turn, H=5 ka/m, Vo max>0, Vo min<0) Output signal range V n /Vcc mv/v V n/vcc = (Vo max - Vo min)/vcc Offset voltage Voff/Vcc mv/v Voff = (Vo max + Vo min)/vcc Angular inaccuracy α deg α = MAX α 0-α max. angular difference between actual value α 0 and measured angle; offset voltage error contributions not included Angular hysteresis αh deg αh = MAX α left turn -α right turn max. angular difference between left and right turn /6
3 MEASUREMENT CONDITIONS Parameter Symbol Unit Condition Condition C: Sensor Specifications (T=-5 C, +5 C) Ambient temperatures T C T = -5 C, T 0 = +5 C, T = +5 C TC of amplitude TCSV %/K TC of resistance TCBR %/K TC of offset TCVoff (µv/v)/ K TCV = ( T TCR = ( T Vn Vn ( T ) ( ) T Vcc Vcc 00% T ) Vn ( T ) Vcc R( T ) R( T ) 00% T ) R( T ) Voff ( T ) Voff ( T ) TCVoff = ( T T ) BLOCK DIAGRAM Figure : Circuit Diagram The KMT3B magnetic field sensor is suited for high precision angle measurement applications under low field conditions (regularly H 0 = 5 ka/m, for example generated with reference magnet Magnetfabrik 5, mm distance. With reduced accuracy the applicable down to H 0 = 8 ka/m; beware of earth s magnetic field!). TYPICAL PERFORMANCE CURVES Vn/Vcc [mv/v] α=0 α direction of magnetic field X Y -5 α [deg] V (cos) V (sin) Figure : Characteristic curves for KMT3B 3/6
4 PACKAGES SM-8 SO-8 4/6
5 PACKAGES TDFN unit: mm The bottom plate is designated to be a heat sink. It has no electrical connection to any pin. The sensitive area is positioned in the center of the housing. RECOMMENDED SOLDER PAD LAYOUT FOR TDFN PIN ASSIGNMENT (DIE, SO8, SM8, TDFN) Pin Symbol Function -V o negative output bridge -V o negative output bridge 3 V cc positive supply voltage bridge 4 V cc positive supply voltage bridge 5 +V o positive output bridge 6 +V o positive output bridge 7 GND negative supply voltage bridge 8 GND negative supply voltage bridge SOLDER PROFILE Recommended solder reflow process according to IPC/JEDEC J-STD-00D (Pb-Free Process) 5/6
6 TAPE AND REEL PACKAGING INFORMATION Description Reel size Units/reel Pin orientation Note KMT3B/TD 7 3,000 Top-right of sprocket hole side KMT3B/SO 3,500 Top-left of sprocket hole side KMT 3B/SM 7,000 Top-right of sprocket hole side ORDERING CODE Device Package MOQ Part Number KMT 3B die wafer on request KMT 3B/SM SM-8 reel on request KMT 3B/SO SO-8 reel G-MRCO-05 KMT 3B/TD TDFN.5 x.5 reel G-MRCO-06 6/6
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