SGM48000/1/2 High Speed, Dual Power MOSFET Drivers

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1 SGM000// GENERAL DESCRIPTION The SGM000// ICs are matched dual-drivers. Unique circuit design provides very high speed drivers capable of delivering peak currents of A into highly capacitive loads. Improved speed and drive capability are enhanced by matched rise and fall delay times. These matched delays maintain the integrity of input-to-output pulse-widths to reduce timing errors and clock skew problems. Dynamic switching losses are minimized with non-overlapped drive techniques. The SGM000// are available in Green SOIC- and TDFN- -L packages. They operate over an ambient temperature range of -0 to +. FEATURES Improved Response Times Matched Rise and Fall Times Reduced Clock Skew between Dual Channels Low Output Impedance Output is at LOW under UVLO Protection High Noise Immunity Improved Clocking Rate Low Supply Current Wide Operating Voltage Range -0 to + Operating Temperature Range Available in Green SOIC- and TDFN- -L Packages APPLICATIONS Clock/Line Drivers CCD Drivers Ultra-Sound Transducer Drivers Power MOSFET Drivers Switch Mode Power Supplies Class D Switching Amplifiers Ultrasonic and RF Generators Pulsed Circuits REV. A

2 SGM000// PACKAGE/ORDERING INFORMATION MODEL PACKAGE DESCRIPTION SPECIFIED TEMPERATURE RANGE ORDER NUMBER PACKAGE MARKING PACKING OPTION SGM000 SOIC- -0 to + SGM000YSG/TR TDFN- -L -0 to + SGM000YTDEG/TR SGM 000YS XXXXX SYA XXXX Tape and Reel, 00 Tape and Reel, 000 SGM00 SOIC- -0 to + SGM00YSG/TR TDFN- -L -0 to + SGM00YTDEG/TR SGM 00YS XXXXX SV XXXX Tape and Reel, 00 Tape and Reel, 000 SGM00 SOIC- -0 to + SGM00YSG/TR TDFN- -L -0 to + SGM00YTDEG/TR SGM 00YS XXXXX SV9 XXXX Tape and Reel, 00 Tape and Reel, 000 NOTE: XXXX = Date Code. XXXXX = Date Code and Vendor Code. Green (RoHS & HSF): defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If you have additional comments or questions, please contact your SGMICRO representative directly. ABSOLUTE MAXIMUM RATINGS to V to V, to...-0.v to V CC + 0.V Combined Peak Output Current...A Junction Temperature...0 Package Thermal Resistance SOIC-, θ JA... /W TDFN- -L, θ JA... /W Storage Temperature Range...- to +0 Lead Temperature (Soldering, 0sec)...0 ESD Susceptibility HBM...000V MM...00V RECOMMENDED OPERATING CONDITIONS Supply Voltage Range...V to.v Operating Temperature Range...-0 to + OVERSTRESS CAUTION Stresses beyond those listed may cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational section of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. ESD SENSITIVITY CAUTION This integrated circuit can be damaged by ESD if you don t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DISCLAIMER reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time.

3 SGM000// PIN CONFIGURATIONS SGM000 (TOP VIEW) SGM000 (TOP VIEW) SOIC- TDFN- -L SGM00 (TOP VIEW) SGM00 (TOP VIEW) SOIC- TDFN- -L SGM00 (TOP VIEW) SGM00 (TOP VIEW) SOIC- TDFN- -L

4 SGM000// PIN DESCRIPTION TDFN- -L PIN SOIC- NAME FUTION,, No Connection. Input for Channel A. Non-inverting input in SGM000, inverting input in SGM00, and inverting input in SGM00. / is held LOW if is unbiased or floating. Ground. All signals referenced to this pin. / Output of Channel B. Supply Input. / Output of Channel A. Exposed Pad Input for Channel B. Non-inverting input in SGM000, inverting input in SGM00, and non-inverting input in SGM00. / is held LOW if is unbiased or floating. Exposed pad should be soldered to PCB board and connected to. FUTION TABLE SGM000 SGM00 SGM00 L L L L H H H L L H L H H L H H H L H L L H L L H H H H L L L H Floating Floating L L L L L L

5 SGM000// ELECTRICAL CHARACTERISTICS (V CC = V, T A =, unless otherwise noted.) PARAMETER CONDITIONS MIN TYP MAX UNITS INPUT Input Signal High Threshold (V IH ) T A = -0 to +. V Input Signal Low Threshold (V IL ) T A = -0 to + 0. V Input Signal Hysteresis (V HYS ) T A = -0 to + 0. V Input Signal High Current (I IH ) Input Signal Low Current (I IL ) OUTPUT Inverting Input Current, X = V Non-Inverting Input Current, X = V 0 Inverting Input Current, X = 0V 0 Non-Inverting Input Current, X = 0V 0. μa μa Pull-Up Resistance (R OH ) Source Current = 00mA.. Ω Pull-Down Resistance (R OL ) Sink Current = -00mA.. Ω Peak Output Current (I PK ) Source Current, f = khz, C L =0.μF Sink Current, f = khz, C L =0.μF - A Continuous Output Current (I DC ) Source/Sink Current ±00 ma POWER SUPPLY Inputs Floating, SGM000.. Power Supply Current (I CC ) Inputs Floating, SGM00.9. Inputs Floating, SGM ma Operating Voltage Range (V CC ).. V Under-Voltage Lockout ON Threshold. V Under-Voltage Lockout Hysteresis 0. V SWITCHING CHARACTERISTICS Rise Time (t R ) C L = 000pF ns Fall Time (t F ) C L = 000pF ns Turn-On Delay Time (t D ) See Figure, Figure ns Turn-Off Delay Time (t D ) See Figure, Figure ns OVER-TEMPERATURE PROTECTION Thermal Shutdown Threshold 0 Thermal Shutdown Threshold Hysteresis

6 SGM000// TYPICAL PERFORMAE CHARACTERISTICS T A = +, V CC = V, C IN =.μf, C L = nf, unless otherwise noted.. Power Supply Current vs. Supply Voltage Inputs Floating. Power Supply Current vs. Temperature Inputs Floating Power Supply Current (ma) Power Supply Current (ma) Supply Voltage (V) Temperature ( ).0 Pull-Up Resistance vs. Supply Voltage Source Current = 00mA. Pull-Down Resistance vs. Supply Voltage Source Current = -00mA Pull-Up Resistance (Ω)..... Pull-Down Resistance (Ω) Supply Voltage (V) Supply Voltage (V)

7 SGM000// TYPICAL PERFORMAE CHARACTERISTICS T A = +, V CC = V, C IN =.μf, C L = nf, unless otherwise noted. Turn-On Delay Time t D (Non-Inverting) Turn-Off Delay Time t D (Non-Inverting) 0V/div V/div 0V/div V/div Time (0ns/div) Time (0ns/div) Rise Time t R (Non-Inverting) Fall Time t F (Non-Inverting) 0V/div V/div 0V/div V/div Time (0ns/div) Time (0ns/div) Turn-On Delay Time t D (Inverting) Turn-Off Delay Time t D (Inverting) 0V/div V/div 0V/div V/div Time (0ns/div) Time (0ns/div)

8 SGM000// TYPICAL PERFORMAE CHARACTERISTICS T A = +, V CC = V, C IN =.μf, C L = nf, unless otherwise noted. Rise Time t R (Inverting) Fall Time t F (Inverting) 0V/div V/div 0V/div V/div Time (0ns/div) Time (0ns/div) Quasi-Static Source Current Quasi-Static Sink Current C L = 0.μF I OUT C L = 0.μF I OUT A/div 0V/div V/div A/div 0V/div V/div Time (00ns/div) Time (00ns/div)

9 SGM000// TIMING TABLE V V Input.V Input.V 0 0 Non-Inverting Output 90% 0% Inverting Output 90% 0% t D t R t D t F t D t F t D t R Figure. Non-Inverting Input Driver Operation Figure. Inverting Input Driver Operation TEST CIRCUIT V CC C IN.μF Input Output C L 000pF Figure. Standard Test Configuration 9

10 SGM000// FUTIONAL BLOCK DIAGRAMS SGM000 00kΩ UVLO 00kΩ Figure. SGM000 Block Diagram SGM00 00kΩ UVLO 00kΩ Figure. SGM00 Block Diagram SGM00 00kΩ UVLO 00kΩ Figure. SGM00 Block Diagram 0

11 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SOIC- D e 0.. E E. b. RECOMMENDED LAND PATTERN (Unit: mm) L A A θ c A Dimensions In Millimeters Dimensions In Inches Symbol MIN MAX MIN MAX A A A b c D E E e. BSC 0.00 BSC L θ 0 0 TX

12 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS TDFN- -L D e N E L D E TOP VIEW k N N b BOTTOM VIEW.0 0. A A A SIDE VIEW RECOMMENDED LAND PATTERN (Unit: mm) Dimensions In Millimeters Dimensions In Inches Symbol MIN MAX MIN MAX A A A 0.0 REF 0.00 REF D D E E k 0.00 MIN 0.00 MIN b e 0.00 TYP 0.00 TYP L TX

13 PACKAGE INFORMATION TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS P P0 W Q Q Q Q Q Q B0 Q Q Q Q Q Q Reel Diameter P A0 K0 Reel Width (W) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Package Type Reel Diameter Reel Width W A0 B0 K0 P0 P P W Pin Quadrant SOIC Q TDFN- -L Q DD000 TX

14 PACKAGE INFORMATION CARTON BOX DIMENSIONS NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Reel Type Length Width Height Pizza/Carton (Option) DD000 TX

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