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1 SMD ransient ltage Suppressr r ESD Prtectin rmsa MS List List... Package utline... 1 eatures... Mechanical data... Maximum ratings... Electrical characteristics... ating and characteristic curves... 3 Pinning infrmatin... 4 Marking... Suggested slder pad layut Packing infrmatin... 5 eel packing... 6 Suggested thermal prfiles fr sldering prcesses... 6 High reliability test capabilities Page 1 Dcument D ssued Date evised Date evisin Page.

2 SMD ransient ltage Suppressr r ESD Prtectin rmsa MS Surface Munt Uni-Directinal S r ESD Prtectin Dide eatures Small bdy utline dimensins Lw bdy height Stand ff vltage: 3.3,5.0,7.0,1,15 Peak pwer up t 00 8 x 0us Pulse Lw leakage espnse time is typically < 1 ns Prvide transient prtectin: E (ESD) level 4 E (E) 40 (5/50ns) E (Surge) (8/0us) Lead-free parts meet HS requirments. Suffix "-H" indicates Halgen-free part, ex.esd5z3.3-h pplicatins ellular phnes Prtable devices Digital cameras Pwer supplies Mechanical data Epxy:UL94-0 rated flame retardant ase : Mlded plastic, SD-53L erminals : Slder plated, slderable per ML-SD-750, Methd 06 Plarity : ndicated by cathde band Munting Psitin : ny Weight : pprximated 0.00 gram Package utline 0.035(0.90) 0.08(0.70) 1(1.30) 0.043(1.10) 0.067(1.70) 9(1.50) SD-53L 0.014(0.35) 0.009(0.5) 0.007(0.0) 0.00() Dimensins in inches and (millimeters) 0.08(0.70) 0.00(0.50) Maximum ratings (at =5 unless therwise nted) tal pwer dissipatin Electrstatic discharge PMEE NDNS Symbl alue UN Lead slder temperature-maximum Peak pulse pwer (tp = 8/0us) E air discharge E cntact discharge ESD vltage Per human bdy mdel ESD 16 k Electrstatic discharge E E secnd duratin L 60 Maximum junctin temperature J +150 Strage temperature range -55~+150 SG perating temperature range Electrical characteristics (at =5 unless therwise nted, = 0.9 =10m fr all types) WM (u) ()@ ()(Nte 1) PP() ()(Nte 1) P PK (p) J Part N. (Nte ) PP=5.0 (Nte 1) (W) =0 and PP (Nte 1) f=1mhz Max. Max. Min. Max. Max. Max. Max. yp. ESD5Z ESD5Z ESD5Z Nte 1. Surge current wavefrm per ig.1. is measured with a pulse test current at an ambient temperature f 5. P PP ESD P 00 ±15 ±8 W k -40~+15 ESD5Z ESD5Z Page Dcument D ssued Date evised Date evisin Page.

3 SMD ransient ltage Suppressr r ESD Prtectin rmsa MS ypical characteristics (at =5 unless therwise nted) WM PP Uni-Directinal S : lamping PP PP : Maximum everse Peak Pulse urrent WM : Maximum Wrking Peak everse vltage : Maximum everse Leakage : reakdwn : est urrent : rward urrent : rward : = 0 and f = 1MHz J ating and characteristic curves () Page 3 Dcument D ssued Date evised Date evisin Page.

4 SMD ransient ltage Suppressr r ESD Prtectin rmsa MS pplicatin Nte Electrstatic discharge (ESD) is a majr cause f failure in electrnic system. ransient ltage Suppressrs (S) are an ideal chice fr ESD prtectin. hey are capable f clamping the incming transient t a lw enugh level such that damage t the prtected semicnductr is prevented. Surface munt S ffers the best chice fr minimal lead inductance. hey serve as parallel prtectin elements, cnnected between the signal lines t grund. s the transient rise abve the perating vltage f the device, the S becmes a lw impedance path diverting the transient current t grund. he ESD5Z Series is the ideal bard evel prtectin f ESD senditive semicnductr cmpnents. he tiny SD-53L package allws design flexibility in the design f high density bards where the space is at a premium. his enables t shrten the ruting and cntributes t hardening against ESD. Pinning infrmatin Pin Simplified utline Symbl Pin1 Pin cathde ande 1 1 Marking ype number ESD5Z3.3 ESD5Z5.0 ESD5Z7.0 ESD5Z1 ESD5Z15 Marking cde ZE Z ZH ZM ZN Suggested slder pad layut Dimensins in inches and (millimeters) PKGE SD-53L 0.03 (0.80) 0.04 (0.60) (1.10) Page 4 Dcument D ssued Date evised Date evisin Page.

5 SMD ransient ltage Suppressr r ESD Prtectin rmsa MS Packing infrmatin P0 d P1 E W P D D1 D W1 unit:mm tem Symbl lerance SD-53L arrier width arrier length arrier depth Sprcket hle d " eel utside diameter 7" eel inner diameter eed hle diameter Sprcket hle psitin Punch hle psitin Punch hle pitch Sprcket hle pitch Embssment center verall tape thickness ape width eel width D D1 D E P P0 P1 W W Nte:Devices are packed in accr dance with E standar S-481- and specificatins listed abve. Page 5 Dcument D ssued Date evised Date evisin Page.

6 SMD ransient ltage Suppressr r ESD Prtectin eel packing rmsa MS MPNEN NNE EEL N PPX. PKGE EEL SZE EEL SPNG X X D, SZE N GSS WEGH (pcs) (m/m) (pcs) (m/m) (m/m) (m/m) (pcs) (kg) SD-53L 7" 3, , *13* *57*387 40, Suggested thermal prfiles fr sldering prcesses 1.Strage envirnment: emperature=5 ~40 Humidity=55% ± 5%.eflw sldering f surface-munt devices P p ritical Zne L t P amp-up L smax L smin emperature ts Preheat amp-dwn 5 t5 t Peak 3.eflw sldering ime Prfile eature Sldering nditin verage ramp-up rate(l t P) <3 /sec Preheat -emperature Min(smin) 150 -emperature Max(smax) 00 -ime(min t max)(t s) 60~10sec smax t L -amp-upate <3 /sec ime maintained abve: -emperature( L) 17 -ime(t L) 60~60sec Peak emperature( P) 55-0/ + 5 ime within 5 f actual Peak emperature(t P) 10~30sec amp-dwn ate <6 /sec ime 5 t Peak emperature <6minutes Page6 Dcument D ssued Date evised Date evisin Page.

7 SMD ransient ltage Suppressr r ESD Prtectin rmsa MS High reliability test capabilities tem est nditins eference 1. Slder esistance at 60± 5 fr 10± sec. MEHD-031. Slderability at 45± 5 fr 5 sec. ML-SD-0 MEHD High emperature everse ias =MN*80% at =150 fr 168 hrs. J MEHD Pressure ker 15P at =11 fr 4 hrs. SG JESD emperature ycling -55 t +15 dwelled fr 30 min. and transferred fr 5min. ttal 10 cycles. MEHD Humidity at =85, H=85% fr 1000hrs. MEHD High emperature Strage Life at 175 fr 1000 hrs. MEHD Page 7 Dcument D ssued Date evised Date evisin Page.

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