Preface. Notebook Computer M570TU. Service Manual. Preface

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3 Preface Notebook omputer M0TU ervice Manual Preface I

4 Preface Notice The company reserves the right to revise this publication or to change its contents without notice. Information contained herein is for reference only and does not constitute a commitment on the part of the manufacturer or any subsequent vendor. They assume no responsibility or liability for any errors or inaccuracies that may appear in this publication nor are they in anyway responsible for any loss or damage resulting from the use (or misuse) of this publication. This publication and any accompanying software may not, in whole or in part, be reproduced, translated, transmitted or reduced to any machine readable form without prior consent from the vendor, manufacturer or creators of this publication, except for copies kept by the user for backup purposes. Preface Brand and product names mentioned in this publication may or may not be copyrights and/or registered trademarks of their respective companies. They are mentioned for identification purposes only and are not intended as an endorsement of that product or its manufacturer. Version.0 July 00 Trademarks Intel ore is a trademarks/registered trademarks of Intel orporation. is a trademark of R Labs, Inc. WOW technology is incorporated under license from R Labs, Inc. Other brand and product names are trademarks and./or registered trademarks of their respective companies. II

5 Preface bout this Manual This manual is intended for service personnel who have completed sufficient training to undertake the maintenance and inspection of personal computers. It is organized to allow you to look up basic information for servicing and/or upgrading components of the M0TU series notebook P. The following information is included: hapter, Introduction, provides general information about the location of system elements and their specifications. hapter, isassembly, provides step-by-step instructions for disassembling parts and subsystems and how to upgrade elements of the system. ppendix, Part Lists ppendix B, chematic iagrams ppendix, Updating the FLH ROM BIO Preface III

6 Preface IMPORTNT FETY INTRUTION Follow basic safety precautions, including those listed below, to reduce the risk of fire, electric shock and injury to persons when using any electrical equipment:. o not use this product near water, for example near a bath tub, wash bowl, kitchen sink or laundry tub, in a wet basement or near a swimming pool.. void using a telephone (other than a cordless type) during an electrical storm. There may be a remote risk of electrical shock from lightning.. o not use the telephone to report a gas leak in the vicinity of the leak.. Use only the power cord and batteries indicated in this manual. o not dispose of batteries in a fire. They may explode. heck with local codes for possible special disposal instructions.. This product is intended to be supplied by a Listed Power Unit ( Output 0V, minimum / dapter). Preface UTION lways disconnect all telephone lines from the wall outlet before servicing or disassembling this equipment. TO REUE THE RIK OF FIRE, UE ONLY NO. W OR LRER, TELEOMMUNITION LINE OR This omputer s Optical evice is a Laser lass Product IV

7 Preface F tatement (Federal ommunications ommission) You are cautioned that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a lass B digital device, pursuant to Part of the F Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Re orient or relocate the receiving antenna. Increase the separation between the equipment and receiver. onnect the equipment into an outlet on a circuit different from that to which the receiver is connected. onsult the service representative or an experienced radio/tv technician for help. Operation is subject to the following two conditions: Preface. This device may not cause interference. nd. This device must accept any interference, including interference that may cause undesired operation of the device. V

8 Preface F RF Radiation Exposure tatement:. This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.. This equipment complies with F RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 0 centimeters between the radiator and your body. Warning Use only shielded cables to connect I/O devices to this equipment. You are cautioned that changes or modifications not expressly approved by the manufacturer for compliance with the above standards could void your authority to operate the equipment. Preface VI

9 Preface Instructions for are and Operation The notebook computer is quite rugged, but it can be damaged. To prevent this, follow these suggestions:. on t drop it, or expose it to shock. If the computer falls, the case and the components could be damaged. o not expose the computer to any shock or vibration. o not place it on an unstable surface. o not place anything heavy on the computer.. Keep it dry, and don t overheat it. Keep the computer and power supply away from any kind of heating element. This is an electrical appliance. If water or any other liquid gets into it, the computer could be badly damaged. o not expose it to excessive heat or direct sunlight. o not leave it in a place where foreign matter or moisture may affect the system. on t use or store the computer in a humid environment. o not place the computer on any surface which will block the vents. Preface. Follow the proper working procedures for the computer. hut the computer down properly and don t forget to save your work. Remember to periodically save your data as data may be lost if the battery is depleted. o not turn off the power until you properly shut down all programs. o not turn off any peripheral devices when the computer is on. o not disassemble the computer by yourself. Perform routine maintenance on your computer. VII

10 Preface. void interference. Keep the computer away from high capacity transformers, electric motors, and other strong magnetic fields. These can hinder proper performance and damage your data.. Take care when using peripheral devices. Use only approved brands of peripherals. Unplug the power cord before attaching peripheral devices. Preface Power afety Warning Before you undertake any upgrade procedures, make sure that you have turned off the power, and disconnected all peripherals and cables (including telephone lines). It is advisable to also remove your battery in order to prevent accidentally turning the machine on. Power afety The computer has specific power requirements: Only use a power adapter approved for use with this computer. Your adapter may be designed for international travel but it still requires a steady, uninterrupted power supply. If you are unsure of your local power specifications, consult your service representative or local power company. The power adapter may have either a -prong or a -prong grounded plug. The third prong is an important safety feature; do not defeat its purpose. If you do not have access to a compatible outlet, have a qualified electrician install one. When you want to unplug the power cord, be sure to disconnect it by the plug head, not by its wire. Make sure the socket and any extension cord(s) you use can support the total current load of all the connected devices. Before cleaning the computer, make sure it is disconnected from any external power supplies (i.e. / adapter or car adapter). o not plug in the power cord if you are wet. o not use the power cord if it is broken. o not place heavy objects on the power cord. VIII

11 Preface Battery Precautions Only use batteries designed for this computer. The wrong battery type may explode, leak or damage the computer. o not remove any batteries from the computer while it is powered on. o not continue to use a battery that has been dropped, or that appears damaged (e.g. bent or twisted) in any way. Even if the computer continues to work with a damaged battery in place, it may cause circuit damage, which may possibly result in fire. Recharge the batteries using the notebook s system. Incorrect recharging may make the battery explode. o not try to repair a battery pack. Refer any battery pack repair or replacement to your service representative or qualified service personnel. Keep children away from, and promptly dispose of a damaged battery. lways dispose of batteries carefully. Batteries may explode or leak if exposed to fire, or improperly handled or discarded. Keep the battery away from metal appliances. ffix tape to the battery contacts before disposing of the battery. o not touch the battery contacts with your hands or metal objects. Battery isposal The product that you have purchased contains a rechargeable battery. The battery is recyclable. t the end of its useful life, under various state and local laws, it may be illegal to dispose of this battery into the municipal waste stream. heck with your local solid waste officials for details in your area for recycling options or proper disposal. Preface aution anger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer. iscard used battery according to the manufacturer s instructions. IX

12 Preface Related ocuments You may also need to consult the following manual for additional information: User s Manual on This describes the notebook P s features and the procedures for operating the computer and its ROM-based setup program. It also describes the installation and operation of the utility programs provided with the notebook P. Preface X

13 Preface Introduction...- Overview...- ystem pecifications...- External Locator - Top View with L Panel Open...- External Locator - Front & Rear View...- External Locator - Right & Left ide View...- External Locator - Bottom View...- Mainboard Overview - Top (Key Parts)...- Mainboard Overview - Bottom (Key Parts)...-0 Mainboard Overview - Top (onnectors)...- Mainboard Overview - Bottom (onnectors)...- isassembly...- Overview...- Maintenance Tools...- onnections...- Maintenance Precautions...- isassembly teps...- Removing the Battery...- Removing the Hard isk rive...- Removing the Optical (/V) evice...- Removing the ystem Memory (RM)...-0 Removing and Installing the Processor...- Removing the V ard...- Removing the Wireless LN Module...- Removing the TV Tuner ard...- Removing the Turbo Memory ard...- Removing the Bluetooth Module...- Removing the Keyboard...- Removing the Modem...-0 ontents Removing the Inverter Board... - Part Lists...- Part List Illustration Location... - Top with Fingerprint... - Top without Fingerprint... - Bottom... - L... - V ombo rive... - V uper-multi rive... - chematic iagrams...b- YTEM BLOK IRM...B- Penryn /...B- Penryn /...B- antiga / Host...B- antiga / PE...B- antiga / R...B- restline / POWER...B- antiga /...B- antiga / POWER...B-0 R O-IMM 0...B- R O-IMM...B- L,PU FN...B- IH-M / T...B- IH-M / PI,UB...B- IH-M / E FN...B- IH-M /...B- O, P BEEP, UB.0 & et...b- LOK ENERTOR,...B- PI-E LN RTL...B-0 Preface XI

14 Preface Preface R REER & JMB0... B- NEW R... B- KB-ITE IT... B- HMI... B- LE... B- ZLI OE L... B- UIO MP... B- R... B- RT, INV, M, BT, PWR... B- Power harger, IN... B-0 Power PU... B- Power.V/ 0.V... B- Power.V/.0V... B- Power V, V, Power /W... B- Power V/ V/.V/ V... B- Power VORE for Penryn PU... B- MINI R, IR... B- MXM PI-E TYPE-IV... B- Board to board ON... B- BUTTON BOR... B-0 LIK Board... B- Fingerprint Board... B- EBU Board... B- XII

15 : Introduction Introduction Overview This manual covers the information you need to service or upgrade the M0TU series notebook computer. Information about operating the computer (e.g. getting started, and the etup utility) is in the User s Manual. Information about drivers (e.g. V & audio) is also found in User s Manual. That manual is shipped with the computer. Operating systems (e.g. Windows XP, etc.) have their own manuals as do application software (e.g. word processing and database programs). If you have questions about those programs, you should consult those manuals. The M0TU series notebook is designed to be upgradeable. ee isassembly on page - for a detailed description of the upgrade procedures for each specific component. Please note the warning and safety information indicated by the symbol. The balance of this chapter reviews the computer s technical specifications and features..introduction Overview -

16 Introduction ystem pecifications Feature Processor Types Intel ore uo Processor (-pin) Micro-F-P Package, W P00 / P00 Intel ore uo Processor (-pin) Micro-F-P Package, W P00 pecification nm ( Nanometer) Process Technology MB On-die L ache & 0MHz FB.Hz /.Hz nm ( Nanometer) Process Technology MB On-die L ache & 0MHz FB.Hz.Introduction ore Logic Memory Intel ore uo Processor (-pin) Micro-F-P Package, W T00 Intel ore Extreme Mobile Processor (-pin) Micro-F-P Package, W X00 Intel(R) PM + IHM hipset Two 0 Pin O-IMM ockets upporting RIII (R) 00 MHz / 0 MHz Memory Expandable up to B nm ( Nanometer) Process Technology MB On-die L ache & 0MHz FB.Hz nm ( Nanometer) Process Technology MB On-die L ache & 0MHz FB.0Hz BIO One MB/ MB Flash ROM Phoenix BIO ecurity L Options ecurity (Kensington Type) Lock lot Fingerprint Reader Module (Factory Option) " WX (0 * 00) TFT L (lare Type) " WX (0 * 00) TFT L (Non lare Type) BIO Password " WUX (0 * 00) TFT L (lare Type) " WUX +(0 * 00) TFT L (lare Type) torage ard Reader One hangeable.mm(h) T Optical evice (/V) Type rive (see Optional on page - for drive options) Easy hangeable.". mm (h) T H Embedded -in- ard Reader (M/ M Pro/ / Mini / MM/ R MM/ M uo) Note: M uo/ Mini / R MM ards Require a P dapter - ystem pecifications

17 Introduction Feature Video ard Options NVII eforce 00M TX PI-E Video ard MXM-III MB R Video RM On Board M irectx 0.0 ompatible upports HP pecification NVII eforce 00M TX PI-E Video ard MXM-III MB R Video RM On Board M irectx 0.0 ompatible upports HP Video ard Options Note that card types, specifications and drivers are subject to continual updates and changes. heck with your service center for the latest details on video cards supported. udio Keyboard & Pointing evice Intel High efinition udio ompliant Interface tereo Enhanced ound ystem R WOW urround ound Technology Inside ound-blaster PRO ompatible Full ize Winkey Keyboard with Numeric Keypad /PIF igital Output Built-In Microphone * Built-In peakers (.W, Ω) One ub Woofer (W, Ω). channel supported Built-In TouchPad (croll Functionality Included).Introduction Expressard lot Expressard/() lot Interface Four UB.0 Ports One et Port (et/ub Port ombined) et supported in Windows Vista only: HI mode supports hot swapping IE mode does not support hot swapping One HMI (High-efinition Multimedia Interface) Port (supports. channel) with audio output One VI-Out Port (upports ual Link) One Headphone/peaker-Out Jack One Microphone-In Jack One /PIF Out Jack One Line-In Jack for udio Input One Mini-IEEE Port One RJ- Modem Jack One RJ- iga LN Jack One -In Jack One able (TV) ntenna (nalog/igital) Jack (Functions with Optional UB TV Tuner Module) One onsumer Infrared Transceiver (Functions with Optional UB TV Tuner Module) ystem pecifications -

18 Introduction Feature Mini-ard lots Power Management One Mini-ard lot for Wireless LN Module One Mini-ard lot for TV Tuner Module One Mini-ard lot for Intel Turbo Memory Module upports PI.0 pecification ommunication Built-In K M Modem with V.0 & V. ompliant Built-In igabit Ethernet LN Bluetooth.0 + ER (Enhanced ata Rate) Module (Factory Option) Wireless Module Options: Intel WiFi Link 00 (0. a/g/n) Wireless LN Mini- ard Module Intel WiFi Link 00 (0. a/g/n) Wireless LN Mini- ard Module.Introduction Power Environmental pec Physical imensions & Weight Full Range / dapter Input: 00-0V, 0-0Hz Output: 0V,.0 (0 Watts) Temperature Operating: - Non-Operating: -0-0 mm (w) * 0.mm (d) *. -.mm (h) ell mart Lithium-Ion Battery Pack, 00mH Relative Humidity Operating: 0% - 0% Non-Operating: 0% - 0% round kg (+/- %) with ell Battery Optional Optical rive Module Options: TV Tuner Module with Mini-ard, UB Interface V/-RW ombo T rive Module V ual (uper Multi) T rive Module Blu-Ray T rive Module Wireless Module Options: Intel WiFi Link 00 (0. a/g/n) Wireless LN Mini- ard Module Intel WiFi Link 00 (0. a/g/n) Wireless LN Mini- ard Module (Factory Option).M or.0m Pixel UB P amera Module (Factory Option) Fingerprint Reader Module Intel Turbo Memory (Robson) Module (B) (Factory Option) Bluetooth.0 + ER (Enhanced ata Rate) Module - ystem pecifications

19 Introduction External Locator - Top View with L Panel Open Figure Top View. Optional Built-In P amera. L. Hot Key Buttons. Power Button. Keyboard. TouchPad and Buttons. Fingerprint Reader Module (optional). LE Indicators. Built-In Microphone.Introduction External Locator - Top View with L Panel Open -

20 Introduction Figure Front & Rear Views External Locator - Front & Rear View.Introduction. L Latches. Line-In Jack. Headphone-Out Jack. Microphone-In Jack. /PIF-Out Jack. LE Indicators. Infrared & onsumer Infrared Transceiver. Vent. HMI-Out Port 0. VI-Out Port. ombined et/ UB Port. UB.0 Port. -In Jack Overheating Front Rear To prevent your computer from overheating make sure nothing blocks the vent/fan intakes while the computer is in use. - External Locator - Front & Rear View

21 Introduction External Locator - Right & Left ide View Right Left 0 Figure Right & Left ide View. Expressard/ () lot. -in- ard Reader. * UB.0 Ports. Mini-IEEE Port. RJ- Phone Jack. RJ- LN Jack. able (TV) ntenna Jack (Enabled With TV Tuner Only). peaker. ecurity Lock lot 0. Optical evice rive Bay. Emergency Eject Hole.Introduction External Locator - Right & Left ide View -

22 Introduction External Locator - Bottom View Figure Bottom View.Introduction. Vent. Battery. Battery Release Latch. Optical evice Release Latches. omponent Bay over. onsumer Infrared Transceiver. ub Woofer Overheating To prevent your computer from overheating make sure nothing blocks the vent/fan intakes while the computer is in use. - External Locator - Bottom View

23 Introduction Mainboard Overview - Top (Key Parts) Figure Mainboard Top Key Parts. ITE ITE. outh Bridge. lock enerator ILPR. LN RTL. R WOW udio Processor.Introduction Mainboard Overview - Top (Key Parts) -

24 Introduction Figure Mainboard Bottom Key Parts Mainboard Overview - Bottom (Key Parts).Introduction. PU ocket (no PU installed). North Bridge. V ocket. zalia odec L. udio mp. P0. H onnector. Memory lots R o-imm. Modem ocket. Bluetooth able onnector 0. Miniard ocket (TV Tuner ard). Miniard PIe ocket (Wireless Lan Module). Miniard ocket (Intel Turbo Memory ard) 0-0 Mainboard Overview - Bottom (Key Parts)

25 Introduction Mainboard Overview - Top (onnectors) Figure Mainboard Top onnectors. LE able onnector. able onnector. Inverter Board able onnector. peaker-left able onnector. Keyboard able onnector. TouchPad able onnector. peaker-right able onnector. Mic able onnector. RT Battery able onnector.introduction Mainboard Overview - Top (onnectors) -

26 Introduction.Introduction Figure Mainboard Bottom onnectors. HMI Port. VI-Out Port. ombined et/ UB Port. -In Jack. Battery onnector. L able onnector. O onnector. Line-In Jack. Headphone Jack 0. Microphone Jack. /PIF-Out Jack. peaker onnector. V Fan onnector. Fan onnector. -in- ard Reader onnector. Mini-IEEE Port. RJ- Jack. RJ- Jack. able ntenna Jack Mainboard Overview - Bottom (onnectors) 0 - Mainboard Overview - Bottom (onnectors)

27 isassembly : isassembly Overview This chapter provides step-by-step instructions for disassembling the M0TU series notebook s parts and subsystems. When it comes to reassembly, reverse the procedures (unless otherwise indicated). We suggest you completely review any procedure before you take the computer apart. Procedures such as upgrading/replacing the RM, device and hard disk are included in the User s Manual but are repeated here for your convenience. To make the disassembly process easier each section may have a box in the page margin. Information contained under the figure # will give a synopsis of the sequence of procedures involved in the disassembly procedure. box with a lists the relevant parts you will have after the disassembly process is complete. Note: The parts listed will be for the disassembly procedure listed ONLY, and not any previous disassembly step(s) required. Refer to the part list for the previous disassembly procedure. The amount of screws you should be left with will be listed here also. Information.isassembly box with a will also provide any possible helpful information. box with a contains warnings. n example of these types of boxes are shown in the sidebar. Warning Overview -

28 isassembly NOTE: ll disassembly procedures assume that the system is turned OFF, and disconnected from any power supply (the battery is removed too). Maintenance Tools The following tools are recommended when working on the notebook P:.isassembly M Philips-head screwdriver M. Philips-head screwdriver (magnetized) M Philips-head screwdriver mall flat-head screwdriver Pair of needle-nose pliers nti-static wrist-strap onnections onnections within the computer are one of four types: Locking collar sockets for ribbon connectors Pressure sockets for multi-wire connectors Pressure sockets for ribbon connectors Board-to-board or multi-pin sockets To release these connectors, use a small flat-head screwdriver to gently pry the locking collar away from its base. When replacing the connection, make sure the connector is oriented in the same way. The pin side is usually not indicated. To release this connector type, grasp it at its head and gently rock it from side to side as you pull it out. o not pull on the wires themselves. When replacing the connection, do not try to force it. The socket only fits one way. To release these connectors, use a small pair of needle-nose pliers to gently lift the connector away from its socket. When replacing the connection, make sure the connector is oriented in the same way. The pin side is usually not indicated. To separate the boards, gently rock them from side to side as you pull them apart. If the connection is very tight, use a small flat-head screwdriver - use just enough force to start. - Overview

29 isassembly Maintenance Precautions The following precautions are a reminder. To avoid personal injury or damage to the computer while performing a removal and/or replacement job, take the following precautions:. on't drop it. Perform your repairs and/or upgrades on a stable surface. If the computer falls, the case and other components could be damaged.. on't overheat it. Note the proximity of any heating elements. Keep the computer out of direct sunlight.. void interference. Note the proximity of any high capacity transformers, electric motors, and other strong magnetic fields. These can hinder proper performance and damage components and/or data. You should also monitor the position of magnetized tools (i.e. screwdrivers).. Keep it dry. This is an electrical appliance. If water or any other liquid gets into it, the computer could be badly damaged.. Be careful with power. void accidental shocks, discharges or explosions. Before removing or servicing any part from the computer, turn the computer off and detach any power supplies. When you want to unplug the power cord or any cable/wire, be sure to disconnect it by the plug head. o not pull on the wire.. Peripherals Turn off and detach any peripherals.. Beware of static discharge. Is, such as the PU and main support chips, are vulnerable to static electricity. Before handling any part in the computer, discharge any static electricity inside the computer. When handling a printed circuit board, do not use gloves or other materials which allow static electricity buildup. We suggest that you use an anti-static wrist strap instead.. Beware of corrosion. s you perform your job, avoid touching any connector leads. Even the cleanest hands produce oils which can attract corrosive elements.. Keep your work environment clean. Tobacco smoke, dust or other air-born particulate matter is often attracted to charged surfaces, reducing performance. 0. Keep track of the components. When removing or replacing any part, be careful not to leave small parts, such as screws, loose inside the computer. Power afety Warning Before you undertake any upgrade procedures, make sure that you have turned off the power, and disconnected all peripherals and cables (including telephone lines). It is advisable to also remove your battery in order to prevent accidentally turning the machine on..isassembly leaning o not apply cleaner directly to the computer, use a soft clean cloth. o not use volatile (petroleum distillates) or abrasive cleaners on any part of the computer. Overview -

30 isassembly isassembly teps The following table lists the disassembly steps, and on which page to find the related information. PLEE PERFORM THE IEMBLY TEP IN THE ORER INITE..isassembly To remove the Battery:. Remove the battery page - To remove the H:. Remove the battery page -. Remove the H page - To remove the Optical evice:. Remove the battery page -. Remove the Optical device page - To remove the ystem Memory:. Remove the battery page -. Remove the system memory page - 0 To remove the Processor:. Remove the battery page -. Remove the processor page -. Install the processor page - To remove the Wireless LN Module:. Remove the battery page -. Remove the WLN module page - To remove the TV Tuner ard:. Remove the battery page -. Remove the TV Tuner ard page - To remove the Turbo Memory ard:. Remove the battery page -. Remove the Turbo Memory ard page - To remove the Bluetooth Module:. Remove the battery page -. Remove the Bluetooth Module page - To remove the Keyboard:. Remove the battery page -. Remove the keyboard page - To remove the V ard:. Remove the battery page -. Remove the V ard page - To remove the Modem:. Remove the battery page -. Remove the H page -. Remove the Optical device page -. Remove the system memory page - 0. Remove the processor page - - isassembly teps

31 isassembly. Remove the V ard page -. Remove the WLN module page -. Remove the TV Tuner ard page -. Remove the Bluetooth Module page - 0. Remove the keyboard page -. Remove the Modem page - 0 To remove the Inverter Board:. Remove the battery page -. Remove the inverter board page -.isassembly isassembly teps -

32 isassembly Figure Battery Removal a. lide latch at point towards the unlock symbol and hold it in place. b. Lift the battery out. Removing the Battery. Turn the computer off, and turn it over.. lide latch towards the unlock symbol and hold it in place, and lift the battery up and out of the battery bay. a. b..isassembly. Battery - Removing the Battery

33 isassembly Removing the Hard isk rive The hard disk drive is mounted in a removable case and can be taken out to accommodate other." serial (T) hard disk drives with a height of.mm (h). Follow your operating system s installation instructions, and install all necessary drivers and utilities (as outlined in hapter of the User s Manual) when setting up a new hard disk. Hard isk Upgrade Process. Turn off the computer, and turn it over and remove the battery (page - ).. Locate the component bay cover and remove screws -.. Remove the bay cover.. The hard disk assembly will be visible at point on the mainboard. Figure H ssembly Removal a. Remove the screws. b. Remove the cover and locate the H. a. 0 b..isassembly. omponent Bay over crews Removing the Hard isk rive -

34 isassembly Figure H ssembly Removal (cont d.). Remove screws - from the hard disk cover.. lide the hard disk assembly in the direction of the arrow.. arefully remove the hard disk assembly in the direction of the arrow (Figure d).. Remove screws 0 - and lift the H shielding plate up from the hard disk.. Reverse the process to install a new hard disk(s)..isassembly c. Remove screws and slide the H module in the direction of the arrow d. Remove the H module. e. Remove the screws and lift the shielding plate up from the H. c. e. 0. H hielding Plate. H d. crews - Removing the Hard isk rive

35 isassembly Removing the Optical (/V) evice. Turn off the computer, turn it over and remove the battery (page - ).. lide latch towards the unlock symbol and hold it in place.. lide latch (while still holding latch in place) in the direction indicated by the arrow in order to push the optical device out of the computer.. Restart the computer to allow it to automatically detect the new device. a. Figure Optical evice Removal a. lide latch at point towards the unlock symbol and hold it in place. Then slide the optical device out of the computer at point..isassembly. Optical evive Removing the Optical (/V) evice -

36 isassembly.isassembly Figure RM Module Removal a. Locate the memory socket. b. Pull the release latch(es). c. Remove the module(s). ontact Warning Be careful not to touch the metal pins on the module s connecting edge. Even the cleanest hands have oils which can attract particles, and degrade the module s performance. Removing the ystem Memory (RM) The computer has two memory sockets for 0 pin mall Outline ual In-line Memory Modules (O-IMM) supporting RII (R) Up to 00/0 MHz. The main memory can be expanded up to B. The O-IMM modules supported are MB, MB, 0MB and 0MB RIII Modules. The total memory size is automatically detected by the POT routine once you turn on your computer. Memory Upgrade Process. Turn off the computer, turn it over and remove the battery (page - ) and the component bay cover (page - ).. The RM module(s) will be visible at point on the mainboard.. ently pull the two release latches ( & ) on the sides of the memory socket in the direction indicated by the arrows (Figure b). a. b. c.. RM Module. The RM module(s) will pop-up (Figure c), and you can then remove it.. Pull the latches to release the second module if necessary.. Insert a new module holding it at about a 0 angle and fit the connectors firmly into the memory slot.. The module will only fit one way as defined by its pin alignment. Make sure the module is seated as far into the slot as it will go. O NOT FORE IT; it should fit without much pressure.. Press the module in and down towards the mainboard until the slot levers click into place to secure the module.. Replace the bay cover and the screws (see page - ). 0. Restart the computer to allow the BIO to register the new memory configuration as it starts up. - 0 Removing the ystem Memory (RM)

37 isassembly Removing and Installing the Processor Processor Removal Procedure. Turn off the computer, turn it over and remove the battery (page - ) and the component bay cover (page - ).. The PU heat sink will be visible at point on the mainboard.. Loosen screws,,, (Figure b) the reverse order as indicated on the label.. arefully lift the heat sink B (Figure c) up and off the computer. Figure Processor Removal a. Locate the heat sink. b. Loosen the screws in the reverse order indicated. c. Remove the heat sink. a. b. c. B.isassembly B. Heat ink Removing and Installing the Processor -

38 isassembly Figure Processor Removal (cont d) d. Turn the release latch to unlock the PU. e. Lift the PU out of the socket.. Turn the release latch towards the unlock symbol to release the PU.. arefully (it may be hot) lift the PU up and out of the socket (Figure e). d. e..isassembly Unlock aution The heat sink, and PU area in general, contains parts which are subject to high temperatures. llow the area time to cool before removing these parts.. PU - Removing and Installing the Processor

39 isassembly Processor Installation Procedure. Insert the PU, pay careful attention to the pin alignment, it will fit only one way (O NOT FORE IT!), and turn the release latch B towards the lock symbol (Figure b).. Remove the sticker (Figure c) from the heat sink.. Insert the heat sink as indicated in Figure c.. Tighten screws - in the order indicated on the label.. Replace the component bay cover and tighten the screws (page - ). a. c. d. Figure Processor Installation a. Insert the PU. b. Turn the release latch towards the lock symbol. c. Remove the sticker from the heat sink and insert the heat sink. d. Tighten the screws..isassembly b. B B. PU. Heat ink Removing and Installing the Processor -

40 isassembly Figure V ard Removal a. Locate the V card. b. Remove the screws c. Remove the V heatsink. d. Remove the screws. e. Pull the plastic holder in the direction of the arrow. f. Lift the V card out of the socket. Removing the V ard. Turn off the computer, turn it over and remove the battery (page - ), and the component bay cover (page - ).. The V card(s) will be visible at point on the mainboard.. Remove screws,,, (Figure b) the reverse order as indicated on the label.. arefully lift the V heatsink B up and off the V card.. Remove screws,, (Figure c) the reverse order as indicated on the label.. arefully grip the plastic holder and lift the video card up and off the socket E.. Reverse the process to install the new V ard. a. c. e..isassembly B f. b. d. B. V Heatsink. V ard crews E - Removing the V ard

41 isassembly Removing the Wireless LN Module. Turn off the computer, turn it over and remove the battery (page - ) and the component bay cover (page - ).. The Wireless LN module will be visible at point on the mainboard.. arefully disconnect cables -, and then remove screw.. The Wireless LN module (Figure 0c) will pop-up, and you can remove it. a. c. Figure 0 Wireless LN Module Removal a. Locate the WLN. b. isconnect the cables and remove the screw. c. The WLN module will pop up. d. Remove the WLN module. b. d. Note: Make sure you reconnect the antenna cable to + socket (Figure 0b)..isassembly. Wireless LN Module crew Removing the Wireless LN Module -

42 isassembly Figure TV Tuner ard Removal a. Locate the TV Tuner card. b. isconnect the cable and remove the screw. c. The TV Tuner card will pop up. d. Remove the TV Tuner card. Removing the TV Tuner ard. Turn off the computer, turn it over and remove the battery (page - ) and the component bay cover (page - ).. The TV Tuner card will be visible at point on the mainboard.. arefully disconnect cables, and then remove screw.. The TV Tuner card (Figure c) will pop-up, and you can remove it. a. c..isassembly d. b.. TV Tuner ard crew - Removing the TV Tuner ard

43 isassembly Removing the Turbo Memory ard. Turn off the computer, turn it over and remove the battery (page - ) and the component bay cover (page - ).. The turbo memory card will be visible at point on the mainboard.. Remove screw from the module.. The turbo memory card (Figure c) will pop-up, and you can remove it. a. c. Figure Turbo Memory ard Removal a. Locate the turbo memory card. b. Remove the screw. c. The turbo memory card will pop up. d. Remove the turbo memory card..isassembly b. d.. Turbo Memory ard crew Removing the Turbo Memory ard -

44 isassembly Figure Bluetooth Module Removal a. Locate the Bluetooth module. b. isconnect the cable and the connector from the bluetooth module. c. Lift the Bluetooth module out. Removing the Bluetooth Module. Turn off the computer, turn it over, and remove the battery (page - ) and the component bay cover (page - ).. The Bluetooth module will be visible at point on the mainboard.. isconnect the cable and carefully separate the Bluetooth Module from the connector (Figure b).. Lift the Bluetooth Module (Figure c) up and off the computer. a. c..isassembly b.. Bluetooth Module - Removing the Bluetooth Module

45 isassembly Removing the Keyboard. Turn off the computer, and remove the battery (page - ).. Press the five keyboard latches at the top of the keyboard to elevate the keyboard from its normal position (you may need to use a small screwdriver to do this).. arefully lift the keyboard up, being careful not to bend the keyboard ribbon cable (Figure b).. isconnect the keyboard ribbon cable from the locking collar socket.. arefully lift up the keyboard (Figure c) off the computer. Figure Keyboard Removal a. Press the five latches to release the keyboard. b. Lift the keyboard up and disconnect the cable from the locking collar. c. Remove the keyboard. a. b. c. d. Re-Inserting the Keyboard When re-inserting the keyboard firstly align the five keyboard tabs at the bottom (Figure d) at the bottom of the keyboard with the slots in the case..isassembly Keyboard Tabs. Keyboard Removing the Keyboard -

46 isassembly Figure Modem Removal a. Remove the screws from the keyboard shielding plate. b. Lift the shielding plate off the computer. c. isconnect the connectors. d. isconnect the connectors and remove the screws. Removing the Modem. Turn off the computer, turn it over and remove the battery (page - ), hard disk (page - ), optical device (page - ), RM (page - 0), PU (page - ), V card (page - ), wireless LN (page - ), TV Tuner (page - ), Bluetooth (page - ) and keyboard (page - ).. Remove screws - from the keyboard shielding plate.. Lift the keyboard shielding plate off the computer.. arefully disconnect connectors ( - ) and turn the computer over.. isconnect connectors ( - ) and remove screws 0 - from the bottom case (Figure d) and remove screws - from the rear of the computer. a. c. 0.isassembly b. d Keyboard hielding Plate crews 0-0 Removing the Modem

47 isassembly. arefully lift the top case (Figure e) up and off the computer.. Remove screws - from the mainboard.. Lift the mainboard 0 (Figure g) up and off the bottom case and turn over the mainboard.. Remove screws - from the modem and disconnect cable. 0. Lift the modem (Figure i) up and off the computer. e. h. f. i. Figure Modem Removal (cont d) e. Lift the top case off the computer. f. Remove the screws. g. Lift the mainboard off the bottom case. h. Remove the screws and disconnect the cable. i. Lift the modem off the computer..isassembly g. 0. Top ase 0. Mainboard. Modem crews Removing the Modem -

48 isassembly.isassembly Figure Inverter Board Removal a. Remove the screws and unsnap the L front panel module from the back. b. Remove the screw and discharge the remaining power from the inverter board and lift the board up slightly. c. isconnect the cables from the inverter. d. Remove the inverter. Removing the Inverter Board. Turn off the computer, and remove the battery (page - ).. Remove any rubber covers, screws - (Figure a), then run your finger around the middle of the frame to carefully unsnap the L front panel module from the back.. ischarge the remaining system power (see Inverter Power Warning below).. Remove screw (Figure b) from the inverter, and carefully lift the inverter board up slightly.. isconnect cables 0 & (Figure c) from the inverter, then remove the inverter (Figure d) from the top case assembly. a. b. c. 0. L Front Panel. Inverter Board crews Inverter Power Warning In order to prevent a short circuit when removing the inverter it is necessary to discharge any remaining system power. To do so, press the computer s power button for a few seconds before disconnecting the inverter cable. d. - Removing the Inverter Board

49 ppendix :Part Lists Part Lists This appendix breaks down the M0TU series notebook s construction into a series of illustrations. The component part numbers are indicated in the tables opposite the drawings. Note: This section indicates the manufacturer s part numbers. Your organization may use a different system, so be sure to cross-check any relevant documentation. Note: ome assemblies may have parts in common (especially screws). However, the part lists O NOT indicate the total number of duplicated parts used. Note: Be sure to check any update notices. The parts shown in these illustrations are appropriate for the system at the time of publication. Over the product life, some parts may be improved or re-configured, resulting in new part numbers..part Lists -

50 Part Lists.Part Lists Table - Part List Illustration Location Part List Illustration Location The following table indicates where to find the appropriate part list illustration. Part M0TU Top with Fingerprint page - Top without Fingerprint page - Bottom page - L page - V ombo rive page - V uper- Multi rive page - - Part List Illustration Location

51 Part Lists Top with Fingerprint 無鉛 ( 減肉 ) 無鉛 Figure - Top with Fingerprint.Part Lists 無鉛無鉛無鉛無鉛 黑 無鉛 無鉛無鉛無鉛無鉛 鴻富鴻富 無鉛無鉛 無鉛 無鉛 鴻富鴻富 無鉛無鉛 無鉛無鉛無鉛無鉛無鉛無鉛 Top with Fingerprint -

52 Part Lists Top without Fingerprint.Part Lists Figure - Top without Fingerprint 無鉛 ( 減肉 ) 無鉛無鉛無鉛無鉛 無鉛 無鉛 無鉛 無鉛 無鉛 鴻富 無鉛 無鉛 無鉛 鴻富 鴻富 無鉛 無鉛 無鉛無鉛無鉛無鉛無鉛含背膠 ) 無鉛無鉛 - Top without Fingerprint

53 Part Lists Bottom 無鉛無鉛無鉛無鉛惠貿無鉛無鉛 海華 無鉛 無鉛無鉛無鉛無鉛無鉛無鉛 無鉛 同美 無鉛 凱碩 Ω Ω Ω 無鉛無鉛無鉛無鉛無鉛無鉛無鉛無鉛無鉛無鉛無鉛無鉛無鉛無鉛無鉛無鉛無鉛無鉛無鉛 Figure - Bottom.Part Lists 無鉛 無鉛 無鉛 無鉛 無鉛 無鉛 華力 無鉛 無鉛 藍天 互億 無鉛 無鉛無鉛無鉛無鉛無鉛無鉛無鉛無鉛 惠貿 無鉛 無鉛無鉛無鉛無鉛無鉛無鉛無鉛無鉛 硬度 無鉛 Bottom -

54 Part Lists L.Part Lists Figure - L 無鉛無鉛無鉛 ( 色號 0)( 無鉛 ) ( 墊高 0.MM) 無鉛無鉛無鉛無鉛無鉛無鉛 無鉛無鉛無鉛 ( 增加破孔 ) ( 墊高 0.MM) 無鉛 無鉛 無鉛無鉛無鉛無鉛 銀 無鉛 無鉛無鉛無鉛銀 )( 無鉛 ) 中性 無鉛 ( 變更鋁箔無鉛 ( 變更鋁箔 ) 無鉛 無鉛 華力 無鉛 無鉛 銀白 無鉛 無鉛 無鉛 - L

55 Part Lists V ombo rive Figure - V ombo rive.part Lists 無鉛 無鉛 無鉛 軌道處加肉無鉛 V ombo rive -

56 Part Lists V uper-multi rive.part Lists Figure - V uper-multi rive 無鉛無鉛無鉛無鉛 軌道處加肉無鉛 - V uper-multi rive

57 ppendix B:chematic iagrams chematic iagrams This appendix has circuit diagrams of the M0TU notebook s PB s. The following table indicates where to find the appropriate schematic diagram. iagram - Page iagram - Page iagram - Page YTEM BLOK IRM - Page B - IH-M / E FN - Page B - Power harger, IN - Page B - 0 Penryn / - Page B - IH-M / - Page B - Power PU - Page B - Penryn / - Page B - O, P BEEP, UB.0 & et - Page B - Power.V/ 0.V - Page B - antiga / Host - Page B - LOK ENERTOR, - Page B - Power.V/.0V - Page B - antiga / PE - Page B - PI-E LN RTL - Page B - 0 Power V, V, Power /W - Page B - antiga / R - Page B - R REER & JMB0 - Page B - Power V/ V/.V/ V - Page B - restline / POWER - Page B - NEW R - Page B - Power VORE for Penryn PU - Page B - antiga / - Page B - KB-ITE IT - Page B - MINI R, IR - Page B - antiga / POWER - Page B - 0 HMI - Page B - MXM PI-E TYPE-IV - Page B - R O-IMM 0 - Page B - LE - Page B - Board to board ON - Page B - R O-IMM - Page B - ZLI OE L - Page B - BUTTON BOR - Page B - 0 L,PU FN - Page B - UIO MP - Page B - LIK Board - Page B - IH-M / T - Page B - R - Page B - Fingerprint Board - Page B - IH-M / PI,UB - Page B - RT, INV, M, BT, PWR - Page B - EBU Board - Page B - Table B - chematic iagrams Version Note The schematic diagrams in this chapter are based upon version -P-M0-00. If your mainboard (or other boards) are a later version, please check with the ervice enter for updated diagrams (if required). B.chematic iagrams B-

58 chematic iagrams YTEM BLOK IRM BUTTOM BOR BOTTOM POWER BOTTOM LE LEVO M0TU ystem Block iagram YV,YV,V,V,V,V M Power,.V B.chematic iagrams heet of YTEM BLOK IRM LIK BOR FINER PRINTER BOR IR INT. K/B M0RU 0 MHz E IT E MBU THERML ENOR a MRT FN LOK EN. ILPR. MHz HMI VI LV MXM-IV V UHTER R LP. KHz MRT BTTERY T-0 PI-E x MHz PROEOR Penryn ufp ocket P NORTH BRIE Intel antiga ball FB X MI OUTH BRIE IHM B FB /00/0 MHz. KHz UB.0 PIE R RM OKET O-IMM0 RIII 00/0 MHz YTEM MBU ZLI LINK MHz O-IMM 00 MHz RJ- ZLI M MOULE M ONN. Mini R Mini R Mini R OKET OKET OKET UB UB UB WLN TV Robson UIO&MOEM BOR LINE IN NEW R UB.0V,.0VM,.V.V,VTT_MEM,.V V,V,.VM VORE VIN, V,VB R PIF OUT ZLI OE L LN MI IN RELTEK RTL RJ- HP OUT UIO MP. P0 MHz R REER IN JMB0 MM//M/M Pro INT. PK IEEE. MHz e-t T H T O UB BT UB UB0 UB UB UB Finger Printer UB0, Hot Key & lick onnector MHz B - YTEM BLOK IRM

59 chematic iagrams Penryn / H_ TB#0 H _ RE Q# [ :0 ] PU _ T L REF H _ # [ : ] H _ # [ : ] H_ TB# H _ 0M # H_ F E RR # H _ IN NE # H_ TP L K# H _ INT R H_ N MI H _ M I# H_ TH RM _ H_ TH RM _ H_ TO _ M H_ TI_ M.0V R _0 R._%_0 R0 _0 R R._%_0._%_0 R._%_0 R _0. V R K_ 0 H _ # H _ # H _ # H _ # H _ # H _ # H _ # H _ # 0 H _ # H _ # H _ # H _ # H _ # H _ # H _ REQ # 0 H _ REQ # H _ REQ # H _ REQ # H _ REQ # H _ # H _ # H _ # H _ # 0 H _ # H _ # H _ # H _ # H _ # H _ # H _ # H _ # H _ # H _ # 0 H _ # H _ # H _ # H _ # H _ # H _ BPM _# H _ BPM _0# H _ T O _M H _ T I_ M H _I ERR # H _P REQ # H _P RO H OT # H _T M H _T I H _ BPM _# Z00 H _T K H _T R T # IT P_ BRT# J L L K M N J N P P L P P R M K H K J L Y U R W U Y U R T T W W Y U V W B V B M N T V B F U []# []# []# []# []# Pen ry n R ROUP_ 0 R ROUP_ []# []# [0 ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# TB[0]# RE Q[0 ]# RE Q[ ]# RE Q[ ]# RE Q[ ]# RE Q[ ]# [ ]# [ ]# [ ]# [0 ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [0 ]# [ ]# [ ]# [ ]# [ ]# [ ]# TB[]# 0M# FER R# IN N E# TP LK # LINT0 LINT M I# R V[0 ] R V[0 ] R V[0 ] R V[0 ] R V[0 ] R V[0 ] R V[0 ] R V[0 ] R V[0 ] I H REERVE XP/ITP INL ONTROL # BNR # BPR I# EF ER # R Y # BY # B R0 # IERR # I NIT # LO K# R EET# R [0 ]# R [ ]# R [ ]# TR Y # HIT# H ITM # BPM [0 ]# BPM [ ]# BPM [ ]# BPM [ ]# PR Y # PREQ # T K T I TO TM TR T # BR # THERML PR O H OT# TH ER M THE RM THER MTR IP# *0.u_V _0 H LK B LK[0] B LK[] H E F. V H F E 0 B H F F E B B B 0 B H _ IER R# H _ BPM 0# H _ BPM # H _ BPM # H _ BPM # H _ PR Y # H _ PRE Q# H _ T K H _ T I H _ T O H _ T M H _ T RT # IT P_ BR T # H _ PRO HO T# H _ T HER M H _ T HER M * 0.u_V_0 R 0 Q * O 0 Z0 R * 0 K _ 0 Z0 H _ # H _B NR # H _B PRI# H _ EF ER # H _ R Y # H _ BY # H _B R0 # H _IN IT # H _L O K# H _ PU RT # H _R # 0 H _R # H _R # H _T R Y # H _H IT # H _H IT M# If PROHOT# is routed between PU, IMVP and MH, pull-up resistor has to be ohm? %. If not use, pull-up resistor has to be ohm? % Layout Note: Within.0" of the PU 00// R * 00K_0 PM _ TH RM T RIP #, LK _ PU _B L K LK _ PU _B L K# *0_0 Z0 R *0_0 H _ TH ER M EVT 00//0 R * 00 K_ 0 *0U_0V_0 0mils V_ TH R M U V + R *0K_0 H _#[:0] H_ # 0 H_ # H_ # H_ # H_ # H_ # H_ # H_ # H_ # H_ # H_ # 0 H_ # H_ # H_ # H_ # H_ # H _ T BN # 0 H_ TBP# 0 H _ IN V# 0 H _#[:0] H_ # H_ # H_ # H_ # H_ # 0 H_ # H_ # H_ # H_ # H_ # H_ # H_ # H_ # H_ # H_ # 0 H_ # H _ T BN # H_ TBP# H _ IN V# R *K_0 P U_ TET R0 *K_0 P U_ TET Z 0 0 *0.u_XR _0 P U_ TET Z 0 Z 0 Z 0, PU_ B EL 0, PU_ B EL, PU_ B EL Layout note: Zo= ohm, 0."max for TLREF PU_ T LR EF R K_%_0 TH E R M L ERT R *0_0 R K_%_0 R 0 * 0 _0 V R. K _ 0 V_THR M _R,, PM _TH R M#_R R.K _0 E F E F E E K J J H F K H J H H N K P R L M L M P P P T R L T N L M N F F B B.0V U B [0 ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ 0 ]# [ ]# [ ]# [ ]# [ ]# [ ]# T BN [0] # T BP[0 ]# INV [0 ]# [ ]# [ ]# [ ]# [ ]# [ 0 ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ 0 ]# [ ]# T BN [] # T BP[ ]# INV [ ]# T LR EF TET TET TET TET TET TET TET B EL [0 ] B EL [ ] B EL [ ] Pe nry R * 0 K _ 0 n T RP 0 T RP MI T RP T RP *0.u_V_0 [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ 0 ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# T BN [ ]# TB P[ ]# IN V[ ]# [ ]# [ ]# [ 0 ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ ]# [ 0 ]# [ ]# [ ]# [ ]# T BN [ ]# TB P[ ]# IN V[ ]# O MP [0] O MP [] O MP [] O MP [] PR T P# P L P# PW R # P W R OO LP# P I# R U Y PM_TH RM #,, Y B V V V T U U Y W Y W W B Y U E B B 0 E F E F E F 0 E B E H _ # H _ # H _ # H _ # H _ # H _ # H _ # H _ # H _ # 0 H _ # H _ # H _ # H _ # H _ # H _ # H _ # H _ # H _ # H _ # 0 H _ # H _ # H _ # H _ # H _ # H _ # H _ # H _ # H _ # H _ # 0 H _ # H _ # H _ # OM P0 OM P OM P OM P O MP 0 O MP O MP O MP R._%_0 H _#[:0] H _ T BN # H _TBP# H _ IN V# H _#[:0] H _ T BN # H _TBP# H _ IN V# H _ PR T P#,, H _ PL P# H _ PW R# H _ PW R H _ PU L P# P I# Layout note: OMP0, OMP: 0." Max, Zo=. Ohms OMP, OMP: 0." Max, Zo= Ohms Best estimate is mils wide trace for outer layers and mils wide trace if on internal layers. R. _%_0 R._%_0 R._%_0 heet of Penryn / B.chematic iagrams H_TI ircult:. ohm check 0 ohm TH ERM _RT# TH E R M_ R T # Q * N 0 0 H _ TH ER M Layout Note: Route H_THERM and H_THERM on same layer. 0 mil trace on 0 mil spacing p _ 0V _0 - N a Layout Note: Near to Thermal I T L K??? V?? thermal I???? M0 Mbus = h - Mbus = h,,,,,,,,,,,,,0,,,,,,,,,,,,,,,0,,,,,,,0,,,,,,,,,,,,,.0v.v.v V M _ THER M, M _ THER M, Penryn / B -

60 chematic iagrams Penryn / B.chematic iagrams heet of Penryn / BR # V OR E 0 0 B B B0 B B B B B B0 0 0 E E E0 E E E E E E0 F F F0 F F F F F F0 0 0 B 0 B0 B B B B B U V [ 00] V [ 00] V [ 00] V [ 00] V [ 00] V [ 00] V [ 00] V [ 00] V [ 00] V [ 00] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 00] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 00] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 00] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 00] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 00] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] V [ 0] Penry n V [0] V [0] V [00] V [0] V [0] V [0] V [0] V [0] V [0] V [0] V [0] V [0] V [00] V [0] V [0] V [0] V [0] V [0] V [0] V [0] V [0] V [0] V [00] V [0] V [0] V [0] V [0] V [0] V [0] V [0] V [0] V [0] V [00] V P[ 0] V P[ 0] V P[ 0] V P[ 0] V P[ 0] V P[ 0] V P[ 0] V P[ 0] V P[ 0] V P[ 0] V P[ ] V P[ ] V P[ ] V P[ ] V P[ ] V P[ ] V [ 0] V [ 0] VI[0] VI[] VI[] VI[] VI[] VI[] VI[] V EN E VEN E B0 B 0 E E0 E E E E E E0 F F0 F F F F F F0 V J K M J K M N N R R T T V W B F E F E F E F E VO RE VO RE 00// VT ; 0mils R 0 00_%_0 V H_ VI 0 H_ VI H_ VI H_ VI H_ VI H_ VI H_ VI V EN E V ENE 0mils R R * K_% _0 TR *0K(00) /_ost down.0 V_ V P 0U_0V_0.V V EN E VEN E /_ost down. 0 V P U_ T MP_ E N Layout note: Near pin B, 0.0u_0V_0 Layout note: L 0_0 + 0u_V_B R V _ TL R EF _ T RL 00_% _0 Route VENE and VENE traces at.ohm with 0 mil spacing. Place PU and P within inch of PU. U P V[00] V [0] P V[00] V [0] P V[00] V [0] R V[00] V [0] R V[00] V [0] R V[00] V [0] R F V[00] V [0] T B V[00] V [0] T V[00] V [00] B T B V[00] V [0] T V[0] V [0] B U B V[0] V [0] U V[0] V [0] B U V[0] V [0] B U B V[0] V [0] V V[0] V [0] V V[0] V [0] V V[0] V [0] V V[0] V [00] W V[00] V [0] W V[0] V [0] W V[0] V [0] W V[0] V [0] Y V[0] V [0] Y V[0] V [0] Y V[0] V [0] Y V[0] V [0] V[0] V [0] V[0] V [0] V[00] V [] V[0] V [] V[0] V [] V[0] V [] E V[0] V [] V[0] V [] E E V[0] V [] B E V[0] V [] B V[0] V [] E B E V[0] V [0] B V[00] V [] E B E V[0] V [] B E V[0] V [] B V[0] V [] F B F V[0] V [] B V[0] V [] F F V[0] V [] F V[0] V [] V[0] V [] F F V[0] V [0] V[00] V [] F F V[0] V [] V[0] V [] V[0] V [] V[0] V [] V[0] V [] H V[0] V [] V[0] V [] H H V[0] V [] H V[0] V [0] V[00] V [] J J V[0] V [] V[0] V [] J J V[0] V [] E K V[0] V [] E V[0] V [] K E K V[0] V [] E V[0] V [] K E L V[0] V [] E L V[0] V [0] E V[00] V [] L E L V[0] V [] E V[0] V [] M M V[0] V [] F V[0] V [] M F M V[0] V [] F N V[0] V [] F V[0] V [] N F N V[0] V [] F V[0] V [0] N F P V[00] V [] V[0] V [] F V [] Penry n R V _ R V _ H _ BPM _ # V O RE 0U _0V_0 V OR E * U_.V _0 V O RE u_.v_0 V O RE * u _. V _ 0 V O RE *0.0u_0V_0 *0U_0V_0 0U_0V_0 U _. V _ 0 U _.V _0 *u_.v_0 u _. V _ 0 u_.v_0 u_.v_0 *0.u_0V _0 PLE NER PU * 0U _0V_0* 0 U _ 0 V _ 0 0U_0V_0 U _.V_0 U_.V_0 U _.V_0 u_.v_0 u_.v_0 * u_.v_0 u _. V _ 0 u_.v_0 u_. V _0 0 * 0. u_0v_0 0.u_0V_0 *0.u_0V_0 0U _0V_0 0 U _ 0 V _ 0 0 U _ 0 V _ 0 0 U _ 0 V _ 0 0 * U_.V _0U_.V_0 U _.V _0 U _.V _0 + 0u_V_ V OR E 0.0u_0V_0 V OR E 0.0u_0V_0 0. u_0v_0.0v_v P + 0.u_0V_0 0.u_0V_0 0.u_0V_0 0.u_0V_0 0.0u_0V_0 * 0 u _. V _.0V_V P 0 0. u_0v_0 0.u_0V_0 0.u_0V_0 0.0u_0V_0 0.0u_0V_0 +VP =.0V (0.V~.0V) 0. 0 u _ 0 V _ 0 EMI 0.0u_0V_0 V_THR M *0u_0V_0 H_ THR M _ H_ THR M _ Layout Note: 000p Near to Thermal I U R *0 _ 0 Z00 V + *000p_0V_0 Z00 R *0 _ 0 - N *a TH ERM LE RT T LK Layout Note: Route H_THRM_ and H_THERM on same layer. 0 mil trace on 0 mil spacing. V_THR M_R,, PM _TH RM #_R M _TH ER M, M _TH ER M, TLREF_TR L Quad ore PU Thermal I..V.0V R *0K_0 Z00 R * 0 K_ 0 B R * 0 K _ 0 Z00 EQ * N 0 P U_ T L RE F Q * N 0 0.0V R *K_% _0 R *K_% _0 H_ T O _ M H_ T I _M BR# H_BPM _# RV _ RV _ RV _ T L RE F _ T RL R *0 _ 0 R *0 _ 0 R 0 *0 _ 0 R *0 _ 0 R *0 _ 0 R *0 _ 0 R *0 _ 0 R *0 _ 0.0V /_ost down Z00 R *._% _0,,,,,,,,,, V VO RE,,,,,,,,,0,,,,,,,0,,,.V,,,,,,,.V,,,,,,.0V V OR E B - Penryn /