TURBO 2 ULTRAAST HIGH VOLTAGE RECTIIER Table 1: Main Product Characteristics I (AV) Up to 2 x A V RRM 6 V T j 175 C V (typ).95 V t rr (max) 55 ns EATURES AND BENEITS Ultrafast switching Low reverse current Low thermal resistance Reduces switching & conduction losses A2 K A2 TO-2AB T K K K A2 TO-247 W DESCRIPTION The STTH3L6, which is using ST Turbo 2 6V technology, is specially suited for use in switching power supplies, and industrial applications, as rectification and discontinuous mode PC boost diode. A2 D 2 PAK G Table 2: Order Codes Part Number T W Marking T W Part Number G STTH3L6GG-TR Marking G G Table 3: Absolute Ratings (limiting values, per diode) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 6 V I (RMS) RMS forward voltage 3 A I (AV) Average forward current δ =.5 Tc = 14 C Tc = 125 C Per diode Per device 15 3 A Tc = 1 C Tc = 1 C Per diode Per device I SM Surge non repetitive forward current tp = ms sinusoidal 13 A T stg Storage temperature range -65 to + 175 C T j Maximum operating junction temperature 175 C 4 September 4 REV. 1 1/8
Table 4: Thermal Resistance Symbol Parameter Value (max). Unit R th(j-c) Junction to case Per diode 1.7 C/W Total 1.15 R th(c) Coupling.6 C/W When the diodes 1 and 2 are used simultaneously: Tj(diode 1) = P(diode 1) x R th(j-c) (Per diode) + P(diode 2) x R th(c) Table 5: Static Electrical Characteristics (per diode) Symbol Parameter Test conditions Min. Typ Max. Unit I R * Reverse leakage current T j = 25 C V R = V RRM 15 µa T j = 15 C 4 4 V ** orward voltage drop T j = 25 C I = 15A 1.55 V T j = 15 C.95 1.2 Pulse test: * tp = 5 ms, δ < 2% ** tp = 38 µs, δ < 2% To evaluate the conduction losses use the following equation: P =.94 x I (AV) +.17 I 2 (RMS) Table 6: Dynamic Characteristics (per diode) T j = 25 C I = 3A 1.76 T j = 15 C 1.15 1.45 Symbol Parameter Test conditions Min. Typ Max. Unit t rr Reverse recovery T j = 25 C I =.5A Irr =.25A I R =1A 55 ns time I = 1A di /dt = 5 A/µs V R =3V 6 85 I RM t fr V P Reverse recovery current orward recovery time orward recovery voltage T j = 125 C I = 15A V R = 4V di /dt = A/µs 8.5 12 A T j = 25 C I = 15A di /dt = A/µs V R = 1.1 x V max 3 ns T j = 25 C I = 15A di /dt = A/µs V R = 1.1 x V max 3. V 2/8
igure 1: Conduction losses versus average forward current (per diode) 24 22 18 16 14 12 8 6 4 2 P(W) δ =.5 δ =.1 δ =.2 δ =.5 I (AV) (A) δ=tp/t δ = 1 2 4 6 8 12 14 16 18 T tp igure 2: orward voltage drop versus forward current (per diode) 9 8 7 6 5 4 3 I M(A) T j=15 C (typical values) T j=15 C (maximum values) V M(V) T j=25 C (maximum values)..5 1. 1.5 2. 2.5 3. igure 3: Relative variation of thermal impedance junction to case versus pulse duration igure 4: Peak reverse recovery current versus di /dt (typical values, per diode) 1..9.8.7.6.5.4 Z th(j-c) /Rth(j-c) 35 3 25 15 I RM(A) V R=4V I =.5 x I(AV) I =2 x I(AV).3.2.1. Single pulse t (s) p δ=tp/t 1.E-3 1.E-2 1.E-1 1.E+ T tp 5 5 15 25 3 35 4 45 5 igure 5: Reverse recovery time versus di /dt (typical values, per diode) igure 6: Reverse recovery charges versus di /dt (typical values, per diode) 8 7 t (ns) rr V R=4V 18 16 Q (nc) rr V R=4V I =2 x I(AV) 6 14 5 4 3 I =2 x I(AV) I =.5 x I(AV) 8 6 I =.5 x I(AV) 4 5 15 25 3 35 4 45 5 3 4 5 3/8
igure 7: Reverse recovery softness factor versus di /dt (typical values, per diode) igure 8: Relative variations of dynamic parameters versus junction temperature 1.6 1.4 1.2 S factor I< 2 xi(av) V R=4V 1.4 1.2 S factor 1. 1..8.8 QRR.6.4.6.4 trr IRM V R=4V Reference:.2. 5 15 25 3 35 4 45 5.2. T ( C) j 25 5 75 125 igure 9: Transient peak forward voltage versus di /dt (typical values, per diode) 12 11 9 8 7 6 5 4 3 2 1 V P(V) 5 15 25 3 35 4 45 5 igure : orward recovery time versus di /dt (typical values, per diode) 26 24 2 18 16 14 1 8 6 4 t (ns) fr V R=1.1 x V max. 3 4 5 igure 11: Junction capacitance versus reverse voltage applied (typical values, per diode) igure 12: Thermal resistance junction to ambient versus copper surface under tab (epoxy R4, e CU =35µm) (D 2 PAK) C(p) =1MHz V OSC=3mVRMS T j=25 C 8 7 R th(j-a) ( C/W) 6 5 4 3 V (V) R 1 S CU(cm²) 5 15 25 3 35 4 4/8
igure 13: TO-247 Package Mechanical Data L L5 1 V V V2 (x3) H G = = 2 3 4 L2 L1 L3 Dia. L4 M D A E DIMENSIONS RE. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 4.85 5.15.191.3 D 2. 2.6.86.2 E.4.8.15.31 1. 1.4.39.55 1 3..118 2 2..78 3 2. 2.4.78.94 4 3. 3.4.118.133 G.9.429 H 15.45 15.75.68.6 L 19.85.15.781.793 L1 3.7 4.3.145.169 L2 18.5.728 L3 14. 14.8.559.582 L4 34.6 1.362 L5 5.5.216 M 2. 3..78.118 V 5 5 V2 6 6 Dia. 3.55 3.65.139.143 5/8
igure 14: D 2 PAK Package Mechanical Data L L2 L3 E G B2 B A C2 D C A2 M * R V2 * LAT ZONE NO LESSTHAN 2mm DIMENSIONS RE. Millimeters Inches Min. Max. Min. Max. A 4.4 4.6.173.181 2.49 2.69.98.6 A2.3.23.1.9 B.7.93.27.37 B2 1.14 1.7.45.67 C.45.6.17.24 C2 1.23 1.36.48.54 D 8.95 9.35.352.368 E..4.393.49 G 4.88 5.28.192.8 L 15. 15.85.59.624 L2 1.27 1.4.5.55 L3 1.4 1.75.55.69 M 2.4 3..94.126 R.4 typ..16 typ. V2 8 8 igure 15: D 2 PAK oot Print Dimensions (in millimeters) 16.9.3 5.8 1.3 8.9 3.7 6/8
igure 16: TO-2AB Package Mechanical Data L2 2 1 G1 H2 Dia G L5 L9 L6 L4 A C D M E L7 DIMENSIONS RE. Millimeters Inches Min. Max. Min. Max. A 4.4 4.6.173.181 C 1.23 1.32.48.51 D 2.4 2.72.94.7 E.49.7.19.27.61.88.24.34 1 1.14 1.7.44.66 2 1.14 1.7.44.66 G 4.95 5.15.194.2 G1 2.4 2.7.94.6 H2.4.393.49 L2 16.4 typ..645 typ. L4 13 14.511.551 L5 2.65 2.95.4.116 L6 15.25 15.75.6.6 L7 6. 6.6.244.259 L9 3.5 3.93.137.154 M 2.6 typ..2 typ. Diam. 3.75 3.85.147.151 Table 7: Ordering Information Ordering type Marking Package Weight Base qty Delivery mode T T TO-2AB 2.23 g 5 Tube G G D 2 PAK 1.48 g 5 Tube G-TR G D 2 PAK 1.48 g Tape & eel W W TO-247 4.46 g 5 Tube Epoxy meets UL94, V Cooling method: by conduction (C) Recommended torque value:.8 m.n. (TO-2PAC) /.55 m.n. (TO-2AB) Maximum torque value: 1. m.n. (TO-2PAC) /.7 m.n. (TO-2AB) Table 8: Revision History Date Revision Description of Changes 7-Sep-4 1 irst issue 7/8
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