Wavelength-Specific Reflections A Decade of EUV Mask Inspection Research

Transcription

1 Wavelength-Specific Reflections A Decade of EUV Mask Inspection Research Kenneth Goldberg, Iacopo Mochi Lawrence Berkeley National Laboratory 1

2 The main things you need to know EUV reticle Samsung

3 1999 Motorola Full field patterned EUVL mask Two Motorola microprocessor die with 130 nm ground rules 80 mm 160 mm 200 mm Absorber patterned on Mo/Si multilayers on a Si substrate From: Scott Hector, Freescale 3

4 2000 Intel (Yan, Zhang, et al.) From: Chris Walton, LLNL 4

5 Defects: Can we find them all? 488 nm 266 nm 13.4 nm EUV light penetrates deeply into the resonant ML structure. 488-nm and 266-nm light barely reaches below the surface. I(z) Field intensity vs. depth Absorber pattern and defects also have different, λ-specific optical properties 8 bi-layers 3 bi-layers depth [nm] 5

6 Different types of defects pose a challenge Non-Actinic Inspection Surface Particles Phase Defects less difficult Pattern Defects more difficult Organic Contamination Incomplete Repairs Actinic Inspection Surface Particles Phase Defects Pattern Defects Organic Contamination Incomplete Repairs direct image measurement means uniform difficulty 6

7 The main things you need to know Visible-light inspection 7

8 14+ years of EUV-wavelength ( actinic ) mask inspection EUV LLC/LBNL Lucent NTT MIRAI SEMATECH/LBNL U. Hyogo Exitech U. Bielefeld U. Hyogo Future... Bridge Tool INVENT/CNSE SEMATECH/LBNL MIRAI/Selete Hanyang U. / Pohang SEMATECH / LBNL 8

9 Disclaimer Dates are approximate. My sincere apologies to any actinic mask inspection / imaging project, or researchers, that I missed. 9

10 2000 EUV LLC / LBNL (Bokor group) BF DF From: Jeff Bokor, UC Berkeley / LBNL 10

11 2001 EUV LLC / VNL / LBNL (Bokor group) more DF less DF First group to... Perform actinic inspection with sensitivity to sub-100-nm defects. Describe differences between BF and DF: investigate using multiple means. Find actinic-only defects. From: Jeff Bokor, UC Berkeley / LBNL 11

12 2001 EUV LLC / VNL / LBNL (Bokor group) From: Jeff Bokor, UC Berkeley / LBNL 12

13 2001 EUV LLC / VNL / LBNL (Bokor group) Proposed high-speed tool From: Jeff Bokor, UC Berkeley / LBNL 13

14 1999 Bell Labs / Lucent (Spector, Wood, et al.) EIPBN 1999; Spector, JVST B 17(6), From: Steven Spector, Lincoln Laboratories 14

15 1999 Bell Labs / Lucent (Spector, Wood, et al.) EIPBN 1999; Spector, JVST B 17(6), From: Steven Spector, Lincoln Laboratories 15

16 1999 Bell Labs / Lucent (Spector, Wood, et al.) Spector, JVST B 17(6), From: Steven Spector, Lincoln Laboratories 16

17 1999 Bell Labs / Lucent (Spector, Wood, et al.) Q: First group to propose a uniformity scanner for EUV?? 1.5-inch square area undulator beam EIPBN 1999; Spector, JVST B 17(6), From: Steven Spector, Lincoln Laboratories 17

18 (1995) 2000 NTT Mirau Inspection Microscope (Haga, et al.) EUV MIM x EIPBN 2000; Haga, JVST B 18(6),

19 (1995) 2000 NTT Mirau Inspection Microscope (Haga, et al.) EIPBN 2000; Haga, JVST B 18(6),

20 (1995) 2000 NTT Mirau Inspection Microscope (Haga, et al.) absorber mask phase-shift mask 0.8 µm lines 0.8 µm lines 1.0 µm lines EIPBN 2000; Haga, JVST B 18(6),

21 2004 Patent Underwood, Perrera, Naulleau Zoneplate microscope for masks 21

22 2005 Patent Goldberg US 6,963,395 CCD spatially filtered EUV source Mask a cheap, low-resolution, point-projection microscope for mask-blank inspection very high efficiency finds ML-coating errors, and large particles sees diffraction/shadow from any large-scale defect 22

23 2006 MIRAI Tool Tezuka, JJAP 45 (6B) 2006 a great paper! 23

24 2006 MIRAI Tool Tezuka, JJAP 45 (6B)

25 2006 MIRAI Tool 150 µm Hoya mask with bump-type buried phase-defects 25

26 2006 SEMATECH / LBNL Defect-Inspection Tool Goldberg, JVSTB 24 (6)

27 2006 SEMATECH / LBNL Defect-Inspection Tool Goldberg, JVSTB 24 (6)

28 2006 SEMATECH Berkeley Mask Inspection Tool BF DF 150 µm Goldberg, JVSTB 24 (6)

29 2004 EUVM (Kinoshita, et al.) From: T. Terasawa, Selete From: T. Terasawa, Selete 29

30 2006 EUVM (Kinoshita, et al.) Goldberg, SPIE 6921,

31 2006 EUVM (Kinoshita, et al.) Goldberg, SPIE 6921,

32 2005 Exitech RIM-13, Reticle Imaging actinic Microscope Booth, SPIE 5751,

33 2005 Exitech RIM-13, Reticle Imaging actinic Microscope 10x Booth, SPIE 5751,

34 2005 Exitech RIM-13, Reticle Imaging actinic Microscope x 10x Booth, SPIE 5751,

35 2005 Exitech RIM-13, Reticle Imaging actinic Microscope x Source: AIXUV (xenon gas discharge pinched plasma lamp) Illumination: Köhler σ = selectable 10x Booth, SPIE 5751,

36 2005 Exitech RIM-13, Reticle Imaging actinic Microscope x R. R. I. I. P. P Source: AIXUV (xenon gas discharge pinched plasma lamp) Illumination: Köhler σ = selectable 10x 36

37 2007 Coherent Scattering Microscope (Kinoshita et al.) (almost) no optics can reach high NA reconstruct entire through-foc. series mathematically Kishimoto, JVSTB 27 (6)

38 2007 Coherent Scattering Microscope (Kinoshita et al.) Harada, EIPBN Kishimoto, JVSTB 27 (6)

39 2007 Coherent Scattering Microscope (Kinoshita et al.) Harada, EIPBN Kishimoto, JVSTB 27 (6)

40 2006 At-wavelength PEEM Microscope (Kleineberg, et al.) EUV illumination PEEM e optics for imaging Neuhäusler, Appl. Phys. Lett. 88 (2006) Kleineberg, SPIE 6151 (2006) 40

41 2006 At-wavelength PEEM (Kleineberg, et al.) Kleineberg, SPIE 6151 (2006) 41

42 2007 At-wavelength PEEM (Kleineberg, et al.) Lin, Optics Letters 32 (13) (2007) 42

43 2007 EUV MiMICS (Denbeaux et al.) Denbeaux, EUVL Symposium 2007 Fan, SPIE 7271,

44 2007 EUV MiMICS (Denbeaux et al.) Denbeaux, EUVL Symposium

45 2007 EUV MiMICS (Denbeaux et al.) Denbeaux, EUVL Symposium

46 2008 SEMATECH Berkeley Actinic Inspection Tool (AIT) Goldberg, SPIE 7122,

47 2008 SEMATECH Berkeley Actinic Inspection Tool (AIT) hp: 100 nm (25 4x) hp: 125 nm (31 4x) AIT (EUV) images 500 nm 500 nm Goldberg, EIPBN 2009; JVSTB 27 (6)

48 2008 SEMATECH Berkeley Actinic Inspection Tool (AIT) SEM native defects found on a full-field EUV mask EUV SEM images AIT (EUV) images LaFontaine, Global Foundries 1 µm 48

49 2008 SEMATECH Berkeley Actinic Inspection Tool (AIT) SEM native defects found on a full-field EUV mask EUV SEM images AIT (EUV) images LaFontaine, Global Foundries 1 µm 49

50 2008 SEMATECH Berkeley Actinic Inspection Tool (AIT) SEM native defects found on a full-field EUV mask EUV SEM images AIT (EUV) images LaFontaine, Global Foundries 1 µm 50

51 2009 MIRAI 2 (Actinic Dark-Field Inspection Tool) 26x imaging 0.1 < NA < 0.25 Terasawa, 2009 Lithography Workshop 51

52 2009 MIRAI 2 (Actinic Dark-Field Inspection Tool) scanning Terasawa, 2009 From: Lithography T. Terasawa, Selete Workshop 52

53 2009 MIRAI 2 (Actinic Dark-Field Inspection Tool) Terasawa, 2009 From: Lithography T. Terasawa, Selete Workshop 53

54 late-2009 Hanyang AIMS and CSM (Ahn, et al.) x-ray CCD (Field Spectrum Measurement) photo diode: EUV reflectivity m easurement pin hole fast shutter dual Zr filter / quardruple P D PAL 11B SR Bending Light ellipsometry 6 mask X-Y axis movement CSM Low-res. AIMS Mask contamination Mask pattern imaging position : 6 degree injection Mask contamination position: EUV acceleration EUV reflectivity Carbon thickness - real time measurement Mass Spectroscopy Residual Gas Analysis Lee, 2009 Int l From: EUVL T. Terasawa, Workshop Selete 54

55 late-2009 Hanyang AIMS and CSM (Ahn, et al.) Soft x-ray CCD Zoneplate-based AIMS EUV inlet port Multi-layer mirror Gauge port Photo diode Condensing mirror Manipulator for Photo diode Zone plate View port Sample Manipulator for zone plate Stage Pumping port Vibration damper Lee, 2009 Int l From: EUVL T. Terasawa, Workshop Selete 55

56 2009: Past, Current, and Future Projects EUV LLC/LBNL Lucent NTT MIRAI SEMATECH/LBNL U. Hyogo Exitech U. Bielefeld U. Hyogo Future... (proposal) Bridge Tool INVENT/CNSE SEMATECH/LBNL MIRAI/Selete Hanyang U. / Pohang SEMATECH / LBNL 56

57 2009: Where can I buy an EUV mask inspection, imaging tool? 6/30/ The high- volume manufacturing (HVM) solutions needed for 22 nm manufacturing do not exist, and funding is a big problem.... Bryan Rice Director of lithography SEMATECH Mask blank inspection tooling has no commercial suppliers who have committed to building the tool, Rice said, with identical challenges in mask defect review and mask pattern inspection. 57

58 2009: Where can I buy an EUV mask inspection, imaging tool? 6/30/ The high- volume manufacturing (HVM) solutions needed for 22 nm manufacturing do not exist, and funding is a big problem.... Bryan Rice Director of lithography SEMATECH Mask blank inspection tooling has no commercial suppliers who have committed to building the tool, Rice said, with identical challenges in mask defect review and mask pattern inspection. Barack Obama, U.S. President YES, WE CAN! Let s build an actinic Bridge Tool to fill the gap! 58

59 Special Thanks to: Vivek Bakshi, Hiroo Kinoshita, Jeff Bokor, Seongtae Jeong, Chris Walton, Scott Hector, Steve Spector, Yoshihiro Tezuka, Tsuneo Terasawa, Jinho Ahn, Bruno LaFontaine, Pei-Yang Yan, Ulf Kleineberg, and the members of their teams! 59