o Part Numbering Chip Coils (SMD) (Part Number) 331 y o!0
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1 o Prt umering Chip Coils (SD) (Prt umer) LQ q w 32 e r t 331 y K u 2 i 3 L o!0 qprodut ID Produt ID LQ wstruture G P W edimensions (LgW) B K Chip Coils Struture onolithi Type (Air-ore Coil) Winding Type (Ferrite Core) onolithi (Ferrite Core) Film Type Winding Type (Air-ore Coil) Dimensions (LgW) 0.6g0.3mm g0.5mm 1.6g0.8mm 2.0g1.25mm 2.0g1.5mm 3.2g1.6mm 3.2g2.5mm 3.3g3.3mm 4.5g3.2mm 5.7g5.0mm 6.3g6.3mm rapplitions nd Chrteristis D F T A D C S tctegory S Series LQG LQ LQP LQW LQ EIA Applitions nd Chrteristis onolithi Air-ore for Resonnt Ciruit for Choke (Low-urrent DC Power Supplies) for Choke (DC Power Supplies) Film Type Film Type (Low DC Resistne Type) igh Q Type (UF-SF) igh Q Type (VF-UF) for Resonnt Ciruit for Resonnt Ciruit (Coting Type) for Choke for Choke (Coting Type) for Choke (gnetilly Shielded Type) for igh-frequeny Resonnt Ciruit Ctegory Stndrd Type yindutne Expressed y three figures. The unit is miro-henry (µ). The first nd seond figures re signifint digits, nd the third figure expresses the numer of zeros whih follow the two figures. If there is deiml point, it is expressed y the pitl letter "R". In this se, ll figures re signifint digits. If indutne is less thn 0.1µ, the indutne ode is expressed y omintion of two figures nd the pitl letter "", nd the unit of indutne is nno-henry (n). The pitl letter "" indites the unit of "n", nd lso expresses deiml point. In this se, ll figures re signifint digits. uindutne Tolerne B C D G J K S W ifetures Stndrd Type 3 Low DC Resistne 5 Low Profile Type *1 : Exept LQ21 series *2 : Exept LQ32/LQ3K series Stndrd Type igh-q/ Low DC Resistne Stndrd Type Low DC Resistne Eletrode Sn LF Solder Indutne Tolerne ±0.1n ±0.2n ±0.5n ±2% ±3% ±5% ±10% ±20% ±30% ±0.3n ±0.05n Fetures Series oeletrode Led (P) Free LQG/LQP/LQW/LQ* 1 /LQ* 2 LQW15A/LQW18A/LQW2B LQ21 LQ32C LQ32C/LQ32/LQ3KS LQ32C LQ32C/LQ3KS Series LQG18/LQP03T/LQWppA/LQ LQG15/LQP (Exept LQP03T) LQWpp/LQ Continued on the following pge.
2 Continued from the preeding pge. (Prt umer) LQ q w 32 e r t 331 y K u 2 i 3 L o!0!0pkging Pkging Series K L B J D Plsti Tping (ø330mm Reel) Plsti Tping (ø180mm Reel) Bulk Pper Tping (ø330mm Reel) Pper Tping (ø180mm Reel) *1 Exept LQ43C/LQ66S *2 LQ21D(22-47µ)/LQ21F(4.7-47µ)/LQ21( µ) only. *3 LQ21D( - 10µ)/LQ21F( - 2.2µ)/LQ21( µ) only. *4 Exept LQP15T LQ*1 /LQWpp/LQ31F/LQ21*2 LQ/LQWpp/LQ31F/LQ21*2 All series LQW18A/LQG/LQ18/LQ21*3 /LQP*4 LQWppA/LQG/LQ18/LQ21*3 /LQP
3 inimum Quntity nd 8mm Width Tping Dimension 2.0± ± ±0.1 ø ±0.1 LQG15, LQP15/18 LQP03T/15T, LQW15A 3.5± ±0.2 LQG15 LQP03T LQP15T LQP15 LQP18 LQW15A Pper Tpe Prt umer LQ21 ( µ) LQ21D (1-10µ) LQ21F (1-2.2µ) LQG18 LQ18 LQW18A_00 LQW18A_10 Pper Tpe Prt umer Dimensions (in mm) inimum QTY. (ps.) ø180mm reel ø330mm reel Bulk mx / mx Diretion of feed 0.69 (5.1n, 7.5n, 10n, 13n exlud) 0.66 (5.1, 7.5, 10, 13, 16~22n) 0.64 (24n~) ø ± ± ±0.05 Diretion of feed Dimensions (in mm) mx. 3.5± ± ±0.3 (2.75) 1 0.2,, LQW2B 1 : 0.3 <Plsti> inimum QTY. (ps.) ø180mm reel ø330mm reel <Pper> Bulk Plsti Tpe Prt umer LQ21 ( µ) LQ21D (22-47µ) LQ21F (4.7-47µ) LQ31F LQ31/31C/31, LQW31 LQW2B LQ32, LQ32C_33/_23 LQ32C_53 Dimensions (in mm) inimum QTY. (ps.) ø180mm reel ø330mm reel Bulk (in mm) Continued on the following pge.
4 Continued from the preeding pge. inimum Quntity nd 12mm Width Plsti Tping Dimension 8.0± ± ±0.1 d,, ø ± ±0.1 (4.75) 12.0±0.3 Diretion of feed Plsti Tpe Prt umer Dimensions (in mm) d inimum QTY. (ps.) ø180mm reel ø330mm reel LQ3KS LQ43() LQ43C LQ55D LQ66S (in mm)
5 1. Stndrd Lnd Dimensions A high Q vlue is hieved when the PCB eletrode lnd pttern is designed so tht it does not projet eyond the hip oil eletrode. Lnd Pttern Solder Resist (in mm) Series Stndrd Lnd Dimensions LQG15 LQG18 LQ18 LQ21/21D/21F LQ31F LQP03T LQP15/15T LQP18 Prt umer LQG15 LQG LQ18 Flow Reflow LQ21/21D/21F LQ31F LQP03T LQP15/15T LQP LQW15A LQW18A LQW2B LQW31 LQ31/31C/31 d Prt umer d LQ31/31C/31 LQW31 LQW2B LQW18A LQW15A If mounted t 2.5 (2.0) mm intervls s indited in the digrm, ttention should e pid to potentil mgneti oupling effets when using the oil s resontor. LQ32 LQ32C LQ3KS LQ43 LQ43 LQ43C LQ55D LQ66S min. 2.0 min. (LQW15A/18A) Continued on the following pge.
6 Continued from the preeding pge. 2. Stndrd Soldering Conditions (1) Soldering method Chip oils n e flow or reflow soldered. Plese ontt urt regrding other soldering methods. As for LQG, LQP, LQW15A/18A, LQ3KS/55D/66S series, plese use reflow soldering. (2) Soldering Temperture nd Time Solder within the temperture nd time omintions indited y the slnted lines in the following grphs. If soldering is repeted, plese note tht the llowed time is the umulted time. Solder : Use 60A, 63A(JIS Z 3282) or equivlent. Use solder pste equivlent to 60A for LQP03T/15/15T/18 nd LQG15/18. Flux : Use rosin-sed flux, ut not strongly idi flux (with hlorine ontent exeeding 0.2wt%). Do not use wter-solule flux. Allowle Flow Soldering Temperture nd Time Temperture ( C) Temperture ( C) LQ18 LQ21/21D/21F LQ31F 200 LQW2B/31 LQ31/31C/31 LQ32/32C/ LQ43/43/43C Time (s) Allowle Reflow Soldering Temperture nd Time LQW2B/31 LQ31 LQ43 LQG18 Solder : 60A Solder : 60A LQG15, LQ18 LQ21/21D/21F LQP03T/15/15T/18 LQ31F LQW15A/18A LQ31/31C LQ32/32C LQ3KS LQ43/43C LQ55D/66S Time (s) (3) Stndrd Soldering Conditions Flow Soldering Temperture ( C) Grdul ooling Preheting (in ir) Soldering (in ir) 240 C One minute min. 3s. mx. Reflow Soldering Temperture ( C) Preheting (in ir) Soldering 230 C One minute min. 10s. mx.* LQG, LQP : 20s. mx. Grdul ooling (in ir) Continued on the following pge.
7 Continued from the preeding pge. (4) Reworking with Soldering Iron Preheting t 150 C for 1 minute is required. Do not diretly touh the ermi element with the tip of the soldering iron. The reworking soldering onditions re s follows: Soldering iron power output : 30W mx. Temperture of soldering iron tip : 280 C Dimeter of soldering iron end : 3.0mm mx. Soldering time : within 3 s 3. ounting Instrutions (1) Lnd Pttern Dimensions Lrge lnds redue Q of the mounted hip. Also, lrge protruding lnd res (ordered y lines hving dimensions '' nd 'd' shown elow) use floting nd eletrode lehing. Lnd Solder Resist d (2) gneti Coupling Sine some hip oils re onstruted like n open mgneti iruit, nrrow sping etween oils my use mgneti oupling. The LQG nd LQ LQ3KS/66S series hve mgnetilly shielded struture. The struture mkes their oupling oeffiient smller thn tht of onventionl hip oils. gneti Coupling (3) PCB Wrping PCB should e designed so tht produts re not sujeted to the mehnil stress used y wrping the ord. Produts should e loted in the sidewys diretion (Length:<) to the mehnil stress. Poor exmple Good exmple (4) Amount of Solder Pste Exessive solder uses eletrode orrosion, while insuffiient solder uses low eletrode onding strength. Adjust the mount of solder pste so tht solder is pplied s shown on the right. o Stndrd thikness of solder pste LQP/LQG/LQ/LQW_A : 100 to 150µm LQ/LQW_ : 200 to 300µm LQ_C/D/// LQW_ LQ_S LQP/LQG/LQ LQW_A Continued on the following pge.
8 Continued from the preeding pge. (5) Amount of Adhesive If too muh dhesive is pplied, then it my overflow into the lnd or termintion res nd yield poor solderility. In ontrst, if insuffiient dhesive is pplied, or if the dhesive is not suffiiently hrdened, then the hip my eome dethed during flow soldering. Apply the dhesive in ordne with the following onditions: LQ_C/// LQW_ Prt umer LQ18 LQ21/21D/21F LQ31F LQW2B LQ31/31C/31 LQW31 LQ32/32C LQ43() LQ43C LQP/LQG/LQ Typil Applition Amount (in:mg) R-8153RA F Clening The following onditions should e oserved when lening hip oils: (1) Clening Temperture : 60 C mx. (40 C mx. for lohol lening gents) (2) Ultrsoni Output : 20W/l mx. Durtion : 5 minutes mx. Frequeny : 28 to 40kz Cre should e tken not to use resonne of the PCB nd mounted produts. (3) Clening gent The following lening gents hve een tested on individul omponents. Evlution in omplete ssemly should e done prior to prodution. ) Alohol lening gents Isopropyl lohol (IPA) ) Aqueous lening gents Surfe tive gent (Clen Thru 750 *1) igh grde lohol (Pine Alph ST-100S *1) ydroron (Tehno Clener 375) Alkline Sponifier (Aqu Clener 210SEI *2) LQ, LQ_S series : Aqueous gents should not e used euse they my use qulity deteriortion. *1 LQ series : Surfe tive gent nd high grde lohol n e used. *2 lener should e diluted to 15% using deionized wter. (4) Ensure tht flux residue is ompletely removed. Component should e thoroughly dried fter queous gents hve een removed with deionized wter. For dditionl lening methods, plese ontt urt.
9 Chip Coils Reommended onversion tle ex. Winding Type for igh-frequeny Prt umer LQ3154K01K Reommended Prt umer LQ3154K03K Type P/ Reommended P/ Film Type for igh-frequeny LQP18 _ 00 LQP18 _ 02 LQW2B _ 01 LQW2B _ 03 Winding Type for igh-frequeny LQW2B _ 11 LQW2B _ 13 LQW31 _ 01 LQW31 _ 03 LQ31 _ 01 LQ31 _ 03 LQ31 _ 01 LQ31 _ 03 Winding Type for Generl use LQ32 _ 21 LQ32 _ 23 LQ43 _ 01 LQ43 _ 03 LQ43 _ 01 LQ43 _ 03 LQ31C _ 01 LQ31C _ 03 LQ32C _ 11 LQ32C _ 33 Winding Type for Choke LQ32C _ 21 LQ32C _ 23 gneti Shielded Type For Choke LQ32C _ 51 LQ32C _ 53 LQ43C _ 01 LQ43C _ 03 LQ3KS _ 21 LQ3KS _ 23 Winding Type for Choke LQ55D _ 01 LQ55D _ 03 gneti Shielded Type For Choke nd Lrge Current LQ66S _ 01 LQ66S _ 03
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