Semiconductor Capabilities. Lab-to-Fab Solutions

Transcription

1 Semiconductor Capabilities Lab-to-Fab Solutions Analyze Detect Measure Control

2 Semiconductor Capabilities Lab-to-Fab Solutions Thermo Electron Corporation is the world leader in analytical instruments, and our reputation in spectroscopic solutions for materials and life science research, QA/QC and process controls is well established. Thermo has focused this expertise to develop lab-to-fab solutions for the semiconductor and microelectronics industry. You can rely on Thermo s history of proven semiconductor and microelectronics manufacturing solutions. In 1979, Thermo introduced the first FT-IR metrology tool, and we have also pioneered optical collimation of X-rays, creating microbeam XRF instruments designed for semiconductor-level measurements. Today, Thermo offers you solutions across a broad range of techniques, from state-of-art parallel angle-resolved XPS for online inspection of ultra-thin films to trace analysis of materials and chemicals used throughout the fab via ICP. In fact, Thermo provides reliable tools across this full range: Chromatography Elemental Analysis Environmental Monitoring Mass Spectrometry Microanalysis and Imaging Molecular Spectroscopy Temperature Control Compliance Test Solutions For a detailed description of Thermo s complete product line, visit Contents Plasma Mass Spectrometry for Contamination Control FT-IR Metrology Tools for Wafer Analysis ARXPS Ultra-thin Film Metrology Tool for 300 mm Wafers Microbeam XRF Thin Film Metrology System X-ray Microanalysis for SEM/EDS Raman Microspectroscopy Recirculating Chillers and Heat Exchangers ESD and Latch-up Test System

3 Plasma Mass Spectrometry for Contamination Control High Performance, High Resolution ICP-MS Thermo s Finnigan ELEMENT2 ICP-MS system is tailored for the short turnaround times demanded by today s semiconductor laboratory: Direct elemental analysis of almost every element in the periodic table including phosphor and sulphur in organic solvents, inorganic chemicals, silanes, and VPD samples Less than 0.1 ppt detection limits for a majority of elements No sample preparation other than dilution Robust technology to serve as a 24/7 production control tool Quadrupole ICP-MS The XSeries II quadrupole ICP-MS provides: Advanced interference removal capabilities (CCT ED ) Protective ion extraction optics for minimizing BECs for cone derived and easily ionized elements Suitable for the analysis of a majority of semiconductor-related chemicals with no sample prep other than dilution Cool plasma capability when desired XSeries II Quadrupole ICP-MS Finnigan ELEMENT2 High Resolution ICP-MS Photograph courtesy of Micron Technologies, Inc. Boise, Idaho USA High Resolution Glow Discharge Mass Spectrometry With Thermo s Finnigan ELEMENT GD, you can perform bulk analysis of conductive materials such as high purity sputtering targets or specialty alloys. The Element GD provides: Ultra-trace elemental analysis in solid conductive samples Ten minute sample turnaround time Analysis of high purity sputtering targets (Cu, Al, Ti, Ta, Co, Ni, W, Nb, and alloys) Finnigan ELEMENT GD High Resolution GD-MS ICP Analysis from Sand to Wafer Thermo offers the full range of ICP-MS instrumentation featuring advanced collision cell or magnetic sector field technology ideal for a range of applications in semiconductor, from UPW analysis, to analysis of VPD samples and direct analysis of inorganic or organic chemicals. The perfect match for every task in the semiconductor laboratory Thermo s ICP instrumentation guarantees short turnaround times to ensure prompt production support.

4 Semiconductor Capabilities FT-IR Metrology Tools for Wafer Analysis Product Profile Dedicated spectroscopic technique from the experts in Fourier transform infrared, Nicolet ECO FT-IR metrology tools support: Monitoring of BPSG, PSG, SiN, SiON, TEOS for various molecular parameters (hydrogen levels, hydroxide levels, oxygen/nitrogen levels, fluorine levels) Monitoring of low-k dielectric films (SiLK, FOx, Z3MS ) Determining of levels substitution carbon and interstitial oxygen Determining thickness of SOI and MEMS devices Ready for Lab-to-Fab Productivity High sensitivity and precision support tighter tolerances in your process with greater confidence in your measurements Automatic optical alignment (eliminates operator-dependent adjustments) Seamless transfer of recipes from instrument to instrument Compliant with SEMI S2 and S8 standards (Nicolet ECO 3000) Nicolet ECO/RS Wafer Profiling System Nicolet ECO 3000 FT-IR Metrology Tool Nicolet ECO 2000 FT-IR Metrology Tool Fourier Transform Infrared Spectroscopy Used for both research and routine analysis, FT-IR is an ideal, non-destructive technique for the measurement and characterization of silicon wafers. Most commonly used high-resistivity epitaxial layers are transparent to infrared radiation, making FT-IR a preferred method for epitaxial layer film thickness measurements. The advantages of FT-IR in measuring PSG dielectrics is that boron, phosphorus and glass thicknesses can be simultaneously determined in a relatively fast (one minute), non-contact procedure. While other methods are available to investigate concentrations of elemental oxygen and elemental carbon in silicon wafers, FT-IR determines the molecular levels of interstitial oxygen (O i ) and substitutional carbon (C s ) in silicon wafers. 300 mm Wafer Application on Nicolet ECO 300 FT-IR Metrology Tool

5 ARXPS Ultra-thin Film Metrology Tool for 300 mm Wafers Product Profile The Theta 300XT provides accurate chemical distribution profiles through stacks. Uniquely, these profiles are non-destructive and so preserve the chemical state information that determines the film s electrical characteristics. Uses patented Parallel Angle-resolved X-ray Photoelectron Spectroscopy (PARXPS) Collects angle-resolved XPS spectra over a 60 angular range, in parallel, without tilting the wafer Produces whole wafer maps of thickness and composition on films up to 10 nm thick Volume production supported by pattern recognition capability Non-destructively measures dose, purity, distribution, thickness, uniformity, chemical composition and percentage coverage Fully automated material handling system with twin loadports Automated operation allows full fab host integration, SECS-GEM communications, simple recipe based user interface and automatic report generation Supports all relevant Semi standards Theta 300XT with Twin Loadports Parallel ARXPS The Theta 300XT is a major advance in the characterization of ultra-thin films. The new fully automated Theta 300XT manages the transition of new gate dielectrics and other thin structures from development to production. Patented Theta technology allows data from every angle to be collected in parallel in a single measurement. This allows Theta 300XT to provide non-destructive depth profiles throughout an ultra-thin film stack. Typical applications include: high-k, low-k, barrier/ seed, shallow implants, partial coverage, STI passivation, metal gate, self assembled monolayer and strained Si.

6 Semiconductor Capabilities Microbeam XRF Thin Film Metrology Systems Product Profile The MicroXR XRF metrology system is a family of microbeam XRF tools designed for the elemental characterization of thin films and coating thicknesses. Thermo offers a range of configurations tailored to specific application measurements, and process control models. MicroXR metrology system benefits include: Revolutionary optical collimation delivers an intense X-ray beam as small as 20 µm Highly accurate and reproducible micropositioning technology Patented Vacuum Conduit technology leaves sample in atmosphere for fast sampling handling while maintaining vacuum conditions in the X-ray paths (generation and detection) for ultimate resolution and sampling Full line of X-ray detection options including electrically cooled Si(Li) and silicon drift detector (SDD) Optimized for 24/7 operation (Console and Wafer Handler) Vibration-free floor standing design (Console) Standardized form factors for wafer handling options Wafer handler systems BOLTS-compatible and fully GEMS/SECS complaint MicroXR Wafer Handling System MicroXR Console Model Microbeam X-ray Fluorescence MicroXR uses a unique combination of collimated X-ray technology and traditional energy dispersive X-ray fluorescence (EDXRF) to create a non-contact, nondestructive metrology technique microbeam XRF ideally suited for the measurement of metal film layers. MicroXR metrology instruments measure the thickness and composition of up to five layers of deposited metals simultaneously, from angstrom to micron thickness ranges. Typical applications include: metal film stacks, wafer bump and underbump metallurgy, data interconnects, circuit substrates, leadframes, chip carriers and package metallurgy, and hard disks and thin film magnetic heads. MicroXR Benchtop Model

7 X-ray Microanalysis for SEM/EDS Product Profiles The NORAN System SIX X-ray microanalysis system offers: A complete X-ray analyzer system for your electron microscope designed for Spectral Imaging data collection and analysis Most accurate automatic element ID software for defect review tools and general spectral analysis Highest resolution X-ray detectors: CryoCooled for LN-detector performance without the LN SuperDry II electrically cooled detector UltraDry silicon drift detector Quick and easy sample surveying tools using point-and-shoot COMPASS and Xphase compositional analysis software for automatic determination and location of compounds Thermo s MAXray Parallel Beam Spectrometer features: Exclusive hybrid X-ray focusing optic producing a parallel beam of x-rays, providing an intensity gain of up to 50 times over traditional WDS analysis Elemental analysis of K, L, or M lines in the range of 100 ev to 10 kev at FESEM or SEM currents of pa. High element sensitivity and high resolution for precise qualitative analysis Accurate, high spatial resolution x-ray maps and linescans U.S. Patent #6,584,413 and #6,675,106 U.S. Patent #5,926,522 NORAN System SIX X-ray Microanalysis System Nicolet Almega XR Raman Microspectroscopy Useful for routine analysis in production environments, or for defect/failure analysis, Raman spectroscopy requires minimal sample preparation. Raman is particularly adept in the analysis of molecular structure and geometries. Raman can identify many carbon-based compounds (inorganic and organic) that SEM/EDS is unable to analyze, such as photoresists and polymers. The Nicolet Almega XR dispersive Raman microspectrometer provides a very small excitation laser spot size at the sample. Combining small spot optics with the use of an integral confocal aperture and patented* instrument alignment provides spatial resolution down to 1 micron and depth-profile capabilities in a easy to use walk-up microscope. * U.S. Patent #6,661,509

8 Recirculating Chillers and Heat Exchangers Thermo s NESLAB recirculating chillers and heat exchangers maintain precise temperature control of critical components, insuring process stability and minimizing total cost of ownership. With our chillers and heat exchanger product lines, as well as our instruments, Thermo has more than 75 years of industry experience. Our temperature control products are designed to meet the demanding productivity requirements of the semiconductor industry, resulting in minimal water usage and energy consumption, long-term reliable operation, and backwards compatibility with original equipment supplied by other manufacturers. Thermo provides worldwide factory support and compliance with SEMI and other industry standards for these products. Typical Applications in Semiconductor Processes Dry etch plasma (e.g., Microwave) Wet etch Dry deposition (e.g., CVD, SACVD, PVD) Wet deposition (e.g., ECP) Ion implantation Plasma asher Planarization Components Chamber walls Cathodes Domes Upper/lower electrodes Chucks/disks Ozone generators Cleaning baths and plating tanks RF power supplies For information about Thermo s complete line of temperature control products, go to In addition to these offices, Thermo Electron Corporation maintains a network of representative organizations throughout the world. Australia analyze.au@thermo.com Austria analyze.at@thermo.com Belgium analyze.be@thermo.com Canada analyze.ca@thermo.com China analyze.cn@thermo.com France analyze.fr@thermo.com Germany analyze.de@thermo.com India analyze.in@thermo.com Italy analyze.it@thermo.com Japan analyze.jp@thermo.com Netherlands analyze.nl@thermo.com Scandinavia analyze.se@thermo.com South Africa analyze.sa@thermo.com Spain analyze.es@thermo.com Switzerland analyze.ch@thermo.com UK analyze.uk@thermo.com USA analyze.us@thermo.com ESD and Latch-up Test System Thermo s KeyTek ZapMaster MK.2 SE enables rapid, high yield testing of complex high-pin count IC devices for electrostatic discharge (ESD) and Latch-Up susceptibility from design through post-production qualification. The ZapMaster MK.2 Test System features: HBM, MM and Latch-Up testing to all relevant industry standards High pin count relay-based operation, up to 768 pins Test speeds accelerated by a factor of 10 Lowest in-use cost For information about Thermo s complete line of ESD and Latch-up Test Systems, go to Thermo Electron Corporation. All rights reserved. SiLK is a trademark of Dow Chemical Company. Z3MS and FOx are trademarks of Dow Corning. All other trademarks are the property of Thermo Electron Corporation and its subsidiaries. Specifications, terms and pricing are subject to change. Not all products are available in all countries. Please consult your local sales representative for details. BR51005_E 12/05M