8 Pin DFN Pb-Free Package
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1 PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code LH Body Size (mil/mm) 5X6X0.8mm Package Weight Site mg Package Weight Site mg Package Weight Site 3 B1: mg, B2: mg, B3: mg SUMMARY The 8 Pin DFN Pb-Free package is qualified at two assembly sites. Packages from different assembly sites may have different material composition. Cypress Ordering Part Numbers containing an X (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Amkor Technology Philippines (P3/P4) Package Qualification Report #s (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES s from Level A of the EIA/JIG/JGPSSI/EICTA Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Weight by mg PPM Cadmium and Cadmium Compounds 0 < 5.0 Hexavalent Chromium and its Compounds 0 <5.0 Lead and Lead Compounds 0 < 5.0 Mercury and Mercury Compounds 0 < 5.0 Polybrominated Biphenyls (PBB) 0 < 5.0 Polybrominated Diphenylethers (PBDE) 0 < 5.0 Analysis Report (Note 2) CoA-LH08- Amkor Philippines (P3/P4) Asbestos 0 0 As per MSDS Azo colorants 0 0 As per MSDS Ozone Depleting Substances 0 0 As per MSDS Polychlorinated Biphenyls (PCBs) 0 0 As per MSDS Polychlorinated Napthalenes 0 0 As per MSDS Radioactive Substances 0 0 As per MSDS Shortchain Chlorinated Paraffins 0 0 As per MSDS Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0 As per MSDS Tributyl Tin Oxide (TBTO) 0 0 As per MSDS Formaldehyde 0 0 As per MSDS Document No Rev. *I Page 1 of 12
2 B. MATERIAL COMPOSITION (Note 3) Purpose of Use Substance Composition CAS Number Weight by mg substance per Homogeneo us PPM %Weight of Substance per package Lead Frame Lead Finish Base External Plating Cu % 486, % Fe % 11, % Zn % % P % % Ni % % Pd % % Au-Ag % % Ag % 15, % Die Attach Adhesive Acrylates Trade Secret % 2, % Bismaleimide Trade Secret % % Ester Trade Secret % % Polymer Trade Secret % % Die Circuit Si % 108, % Wire Interconnect Au % 1, % Mold Compound Encapsulation Pd % % Solid Epoxy Resin Trade Secret % 42, % SiO % 327, % Package Weight (mg): % Total: Document No Rev. *I Page 2 of 12
3 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Lead Cadmium Cr VI Mercury PBB PBDE Analysis Report PPM PPM PPM PPM PPM PPM (Note2) Cover tape < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-COVT-R Tape & Reel Carrier tape < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-CART-R Plastic Reel < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PLRL-R Tray Tray < 2.0 < 2.0 < 2.0 < CoA-TRAY-R Shielding < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-SBAG R bag Moisture < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R Barrier bag Protective < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R Others Band Shipping < 10.0 < 4.0 < 4.0 < CoA-ABOX-R and Inner Box Dessicant < 10.0 < 2.0 < 2.0 < 1.0 < 3.0 < 3.0 CoA-DESS-R Bubble Pack < 2.0 < 2.0 < 2.0 < 2.0 < < 90.0 CoA-BUBP-R Document No Rev. *I Page 3 of 12
4 ASSEMBLY Site 2: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report #s (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES s from Level A of the EIA/JIG/JGPSSI/EICTA Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Weight by mg PPM Cadmium and Cadmium Compounds 0 < 5.0 Hexavalent Chromium and its Compounds 0 <5.0 Lead and Lead Compounds 0 < 5.0 Mercury and Mercury Compounds 0 < 5.0 Polybrominated Biphenyls (PBB) 0 < 5.0 Polybrominated Diphenylethers (PBDE) 0 < 5.0 Analysis Report (Note 2) CoA-LH08- ASET Asbestos 0 0 As per MSDS Azo colorants 0 0 As per MSDS Ozone Depleting Substances 0 0 As per MSDS Polychlorinated Biphenyls (PCBs) 0 0 As per MSDS Polychlorinated Napthalenes 0 0 As per MSDS Radioactive Substances 0 0 As per MSDS Shortchain Chlorinated Paraffins 0 0 As per MSDS Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0 As per MSDS Tributyl Tin Oxide (TBTO) 0 0 As per MSDS Formaldehyde 0 0 As per MSDS Document No Rev. *I Page 4 of 12
5 Lead Frame Lead Finish Die Attach B. MATERIAL COMPOSITION (Note 3) Purpose of Use Base material External Plating Adhesive Substance Composition CAS Number Weight by (mg) substance per Homogeneous material PPM substance per package Copper , Iron , Zinc Phosphorus Nickel , Palladium Gold Epoxy Resin , Phenol Resin Trade Secret , SiO2 Filler Trade Secret Acrylic Copolymer Trade Secret , Die Circuit Silicon , Wire Interconnect Copper Mold Compound Encapsulation Epoxy Resin A Trade Secret , Epoxy Resin B Trade Secret , Phenol Resin Trade Secret , Carbon Black , Silica Fused , Package Weight (mg): % Total: Document No Rev. *I Page 5 of 12
6 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Lead Cadmium Cr VI Mercury PBB PBDE Analysis Report PPM PPM PPM PPM PPM PPM (Note2) Cover tape < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-COVT-R Tape & Reel Carrier tape < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-CART-R Plastic Reel < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PLRL-R Tray Tray < 2.0 < 2.0 < 2.0 < CoA-TRAY-R Shielding < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-SBAG R bag Moisture < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R Barrier bag Protective < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R Others Band Shipping < 10.0 < 4.0 < 4.0 < CoA-ABOX-R and Inner Box Dessicant < 10.0 < 2.0 < 2.0 < 1.0 < 3.0 < 3.0 CoA-DESS-R Bubble Pack < 2.0 < 2.0 < 2.0 < 2.0 < < 90.0 CoA-BUBP-R Document No Rev. *I Page 6 of 12
7 ASSEMBLY Site 3: UTAC ( UTL Bangkok ) Package Qualification Report #s , , (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES s from Level A of the EIA/JIG/JGPSSI/EICTA Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Weight by mg PPM Cadmium and Cadmium Compounds 0 < 5.0 Hexavalent Chromium and its Compounds 0 <5.0 Lead and Lead Compounds 0 < 5.0 Mercury and Mercury Compounds 0 < 5.0 Polybrominated Biphenyls (PBB) 0 < 5.0 Polybrominated Diphenylethers (PBDE) 0 < 5.0 Analysis Report (Note 2) CoA-LH08- UTL Bangkok Asbestos 0 0 As per MSDS Azo colorants 0 0 As per MSDS Ozone Depleting Substances 0 0 As per MSDS Polychlorinated Biphenyls (PCBs) 0 0 As per MSDS Polychlorinated Napthalenes 0 0 As per MSDS Radioactive Substances 0 0 As per MSDS Shortchain Chlorinated Paraffins 0 0 As per MSDS Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0 As per MSDS Tributyl Tin Oxide (TBTO) 0 0 As per MSDS Formaldehyde 0 0 As per MSDS Document No Rev. *I Page 7 of 12
8 Lead Frame Internal Plating Lead Finish Die Attach B1. MATERIAL COMPOSITION (Note 3) Purpose of Use Base material Wire plating External Plating Substance Composition CAS Number Weight by (mg) substance per Homogeneous material PPM substance per package Cu Cr Sn Zn Ag SN , Ag Octahydro- 4,7methano1Hindenediyl Adhesive Exo-1,7, trimethylbicyclo Isobornyl acrylate Bis (alpha.alpha Dimett Die Circuit Silicon Wire Interconnect Copper Pd Mold Compound Encapsulation Silica Fused Epoxy Resin Trade Secret Phenol Resin Trade Secret Carbon Black Package Weight (mg): % Total: Document No Rev. *I Page 8 of 12
9 Lead Frame Lead Finish Die Attach B2. MATERIAL COMPOSITION (Note 3) Purpose of Use Substance Composition CAS Number Weight by (mg) substance per Homogeneous material PPM substance per package Cu , Base material Cr , Sn , Zn , External Ag , External Plating Sn Epoxy Resin A Trade Secret Epoxy Resin B Trade Secret , Adhesive Phenol Resin Trade Secret , SiO2 Filler Trade Secret , Acrylic Copolymer Trade Secret , Die Circuit Silicon , Wire Interconnect Au , Mold Compound Encapsulation Silica Fused , Epoxy Resin Trade Secret , Phenol Resin Trade Secret , Carbon Black Package Weight (mg): % Total: Document No Rev. *I Page 9 of 12
10 B3. MATERIAL COMPOSITION (Note 3) Purpose of Use Substance Composition CAS Number Weight by (mg) substance per Homogeneous PPM substance per package Lead Frame Lead Finish Base External Plating Zinc Ferrous Phosphorus Copper Nickel Gold Silver Palladium Die Attach Adhesive Silver Exo-1,7,7 trimethylbicyclo Isobornyl Acrylate Octahydro- 4,7methano1Hindenediyl 2-(3,4- Epoxycyclohexyl) ethyltrimethoxysilane Die Circuit Silicon Wire Mold Compound Interconnect Encapsulation Copper Palladium Silica Fused Epoxy Resin Phenol Resin Trade secret Trade secret Carbon Black Package Weight (mg): %Total Document No Rev. *I Page 10 of 12
11 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Lead Cadmium Cr VI Mercury PBB PBDE Analysis Report PPM PPM PPM PPM PPM PPM (Note2) Cover tape < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-COVT-R Tape & Reel Carrier tape < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-CART-R Plastic Reel < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PLRL-R Tray Tray < 2.0 < 2.0 < 2.0 < CoA-TRAY-R Shielding < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-SBAG R bag Moisture < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R Barrier bag Protective < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R Others Band Shipping < 10.0 < 4.0 < 4.0 < CoA-ABOX-R and Inner Box Dessicant < 10.0 < 2.0 < 2.0 < 1.0 < 3.0 < 3.0 CoA-DESS-R Bubble Pack < 2.0 < 2.0 < 2.0 < 2.0 < < 90.0 CoA-BUBP-R Document No Rev. *I Page 11 of 12
12 Document History Page Document Title: 8 Pin DFN PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: Rev. ECN No. Orig. of Description of Change Change ** MAHA/ New document JVP *A MAHA Expressed the data for substance weight, % weight per homogeneous material, and % weight per package in four decimal places. Deleted the information for tubes from Table II. DECLARATION OF PACKAGING INDIRECT MATERIALS. *B VFR Added PMDD for Site 2 ASE (G) Copper wire qual. Reference QTP # *C JARG Updated the material composition table on Assembly Site 1 to reflect 4 decimal places on values. *D YUM Added assembly site name in the assembly heading in site 1 and 2. Changed assembly code to assembly site name in the in site 1 and 2. *E MLA Added assembly site 3, UTAC, Thailand. *F MRB Changed CAS # from proprietary on assembly site 1 and on assembly site 2 to Trade Secret. DCON *G DPT Removed distribution: web and posting: none from the document history page. Add B1 and B2 for site 3 package weight identification. Added Package weight and QTP# in site 3 and material composition in item B2 for site 3. SLLO Updated Cypress logo *H DPT Update package name from 8L to 8 Pin in document title, header and Body. Update Package weight site 3 for B2 from 74.54mg to mg. *I CMG Added B3 package weight on Site 3. Added B3 Composition on Assembly Site 3. B3 Assembly Site 3 is qualified per QTP# Document No Rev. *I Page 12 of 12
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