RoHS/RoHS2 Statement

Transcription

1 Page 1 of 5 RoHS/RoHS2 Statement Date: November 13 th, 2012 Dear Valued Customer: Thin Film Technology, an ISO 9001 and registered company, manufactures and sells passive electronic components. This letter outlines the current RoHS/RoHS2 compliance status for the products that we manufacture and distribute. Some of the products that we currently manufacture are utilizing RoHS/RoHS2 exemption 7a for high melting temperature solders. While these products are still considered fully RoHS/RoHS2 compliant, they can not be considered totally lead free. This is outlined in the tables below. Some product lines that we manufacture are also still available in non-rohs compliant form whereas the component terminations are still utilizing SnPb solder. The availability of these products is outlined in the tables below. Some products are shown in more than one table. For these products, the RoHS/RoHS2 compliant parts will have a -C at the end of the part number. Products which are RoHS/RoHS2 Compliant and Lead Free (Comply to Directive 2011/65/EU): Chip Resistor Chip Power Resistors Chip Attenuator Chip Inductor Resistor Networks Power Splitters Electrical Filters Signal Integrity Products Series (first 2-4 digits of the MPN part numbers): CR, EL, KL, PRL, RL, RN73, RR, RT CFA, CPA PAT, ATT, ATV, HPA, RAT HPL B2, B4, BRJZ, RA, RN, RM, S1, S2, S3, S4, S6 PS FL EF, XO CL, HE Products which are RoHS/RoHS2 Compliant and utilizing RoHS/RoHS2 exemption 7a (Comply to Directive 2011/65/EU): Series (first 2 digits of the MPN part numbers): DS, DL, GL Products which are still available as non-rohs Compliant: Resistor Networks Electrical Filters Signal Integrity Products Series (first 2-4 digits of the MPN part numbers): BR02 BR03, BR04, SR FL XO CL, DL, DS, HE, GL

2 Page 2 of 5 Products and Packaging Materials Free of Certain Banned Substances This document certifies on behalf of Thin Film Technology Corporation that, except for lead or other noted exceptions, to the best of Thin Film Technology's knowledge the substances listed below are not present in Thin Film Technology's products or packaging materials. ozone depleting substances mercury or mercury compounds (1) cadmium or cadmium compounds(1) hexavalent chromium(1) lead (1) (2) polybrominated biphenyls (pbbs) and diphenyl oxides/ethers (PBDOs/PBDEs) polychlorinated biphenyls (PCBs) and terphenyls (PCTs) and naphthalenes chlorinated aliphatic and aromatic compounds, including pentachlorophenol and related compounds organo-tin compounds asbestos azo compounds ethylene glycol ethers and related compounds formaldehyde phthalates PVC tetrabromobisphenol A FR720 radioactive substances The following tables represent examples of chemicals from the above list that are used in TFT's Industry. Mercury or mercury compounds (1) Mercury Hg Mercury (I) Chloride Hg2Cl2 Mercury (II) Chloride HgCl2 Cadmium or cadmium compounds(1) Cadmium Cd Cadmium alloys Cadmium oxide CdO Cadmium chloride CdCl3 Cadmium sulfide CdS Cadmium nitrate Cd(NO3)2

3 Page 3 of 5 Hexavalent chromium(1) Chromium (VI) oxide; Chromium trioxide CrO3 Potassium Chromate K2CrO4 Calcium Chromate CaCrO4 Strontium Chromate SrCrO4 Barium Chromate BaCrO4 Lead Chromate; chrome yellow PbCrO4 Zinc Chromate , ; ZnCrO4 Sodium dichromate; sodium Potassum dichromate; potassium Ammonium dichromate; potassium Na2Cr2O K2Cr2O (NH4)2Cr2O7 Zinc dichromate; zinc -- ZnCr2O7 Lead (1) (2) Lead; metal Pb Sn/Pb Solder & Lead Frame Lead / Tin Alloy -- Pb-Sn Sn/Pb Solder, Lead Frame, Sn/ Pb Spheres Lead (II) oxide PbO Lead (IV) oxide PbO2 Lead (II, IV) oxide Pb3O4 Lead (II) fluoride PbF2 Lead fluoroborate Pb(BF4)2 Lead fluosilicate PbSiF6 Lead hydroxcarbonate (PbCO3)2Pb(OH)2 Lead (II) Sufate , PbSO4 Lead oxide sulfate Pb4SO7 Lead antimonite Pb3(SbO4)2 Lead Chromate; chromate yellow PbCrO4 Lead molybdate PbMoO4

4 Page 4 of 5 Polybrominated biphenyls (pbbs) and diphenyl oxides/ethers (PBDOs/PBDEs) Polybromodiphenyl ether; polybromodiphenyloxide; polybrominated buphenyl ethers; PBDE; PBDO; PBBE -- C12H10-xBrxO Decabromodiphenyl ether; decabromodiphenyloxide; DBDPE; DBOPO Octabromodiphenyl ether; octabromodiphenyloxide Hexabromodiphenyl ether; hexabromodiphenyloxide Pentabromodiphenyl ether; pentabromodiphenyloxide C12Br10O C12H2Br8O C12H4Br6O C12H5Br5O Polybrominated biphenyls; PBB e.g C12H10-xBrx Polychlorinated biphenyls (PCBs) and terphenyls (PCTs) and naphthalenes PCB; polychlorinated biphenyls C12H10-xClx Polychlorinated naphthalenes -- C12H8-xClx (x = = 3) Trichloronapthalenes C10H5Cl3 Tetrachloronapthalenes C10H4Cl4 Pentachloronapthalenes C10H3Cl5 Octachloronapthalens C10Cl8 Short Chained Chlorinated paraffins C10-13, Cl > 50 wt% e.g Organo-tin compounds Triphenyl tin N,N'- dimethyldithiocarbomate (C6H5)3Sn(CH3)2NCS2 Tributyl tin sulfamate (C4H9)3SnSO3NH2 Tributyl tin chloride (C4H9)3SnCl Asbestos Asbestos ; ;

5 Page 5 of 5 Ethylene glycol ethers and related compounds Diethylene glycol ethyl ether acetate Triethylene glycol monomethyl ether Passivation Material Marking Ink Formaldehyde Formaldehyde; formalin; formicaldehyde; formol HCHO Marking Ink Color Coding Ink(5) PVC PVC and PVC Blends; Polyvinylchloride and polivinylchloride blands. e.g Antimony compounds Antimony Sb Antimony Trioxide Sb2O3 (or Sb4O6) Molding Puck(3) & Gold Coating Powder(4) Notes: 1. Naturally occurring and may be a trace impurity. To date, not detected at a 5 ppm method detection limit. See Note (2). 2. Standard products contain lead as an intentionally added constituent. Refer to table on page 2. Packaging materials and lead free products do not. 3. Present in small quantities in the part numbers beginning with GL 4. Present in small quantities in the part numbers beginning with DS 5. Present in small quantities only in DS1L5DJ010C part (3-pin SIP delay line) Any questions related to Thin Film Technology s compliance to the RoHS/RoHS2 directive can be directed to: Kevin Weber or Tim Goertzen (507) (507) x25 kweber@thin-film.com tgoertzen@thin-film.com Sincerely, Kevin Weber Kevin Weber Environmental Compliance Coordinator