Approval sheet. WLBD1608 Chip Bead. *Contents in this sheet are subject to change without prior notice.
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1 WLBD1608 Chip Bead *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_ WLBD1608 Series_V4.0 Sep. 2016
2 FEATURES 1. Closed magnetic circuit. APPLICATIONS 1. Noise reduction for general signal and DC line for General electronic circuits. Ex:PCs Networking and Consumer electronics.. SHAPE and DIMENSION Chip Size A 1.60±0.15 B 0.80±0.15 C 0.80±0.15 D 0.30±0.20 Units: mm Ordering Information WL BD 1608 K1 U 300 T B Product Code Series Dimensions Series extension Tolerance Value Packing Code WL: Inductor BD: Chip Bead. 1.6 * 0.8 mm 1608 :EIA 0603 Refer to characteristic U: 25% 300 =30 OHM 301 =300 OHM T = 7" Paper Tape B:STD 152 =1500 OHM Page 2 of 8 ASC_ WLBD1608 Series_V4.0 Sep. 2016
3 Electrical Characteristics WLBD1608 series Walsin Part Number Impedance (Ω) Test Frequency (MHz) DC Resistance (Ω) max. Rated Current (ma) max. WLBD1608K1U300TB 30±25% WLBD1608K1U600TB 60±25% WLBD1608K1U121TB 120±25% WLBD1608K1U151TB 150±25% WLBD1608K1U221TB 220±25% WLBD1608K1U301TB 300±25% WLBD1608K1U471TB 470±25% WLBD1608K1U601TB 600±25% WLBD1608K1U102TB 1000±25% WLBD1608H1U152TB 1500±25% WLBD1608H1U202TB 2000±25% Page 3 of 8 ASC_ WLBD1608 Series_V4.0 Sep. 2016
4 Characteristic Curve WLBD1608K1U300TB WLBD1608K1U600TB WLBD1608K1U121TB WLBD1608K1U151TB WLBD1608K1U221TB WLBD1608K1U301TB WLBD1608K1U471TB B WLBD1608K1U601TB WLBD1608K1U102TB WLBD1608H1U152TB B WLBD1608H1U202TB B Page 4 of 8 ASC_ WLBD1608 Series_V4.0 Sep. 2016
5 Test condition & Requirements Item Performance Test Condition Operating Temperature -40~+125 (Including self-temperature rise) -- Transportation Storage Temperature Impedance (Z) Inductance (Ls) Q Factor DC Resistance Rated Current Temperature Rise Test -40~+125 (on board) Refer to standard electrical characteristics list Rated Current < 1A ΔT 20 Max Rated Current 1A ΔT 40 Max For long storage conditions, please see the Application Notice Agilent4291 Agilent E4991 Agilent4287 Agilent16192 Agilent 4338 DC Power Supply Over Rated Current requirements, there will be some risk 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Number of heat cycles: 1 Temperature ( C) Time (s) Temperature ramp/immersion and emersion rate Resistance to Soldering Heat Impedance:within±15% of initial value 260 ±5 (solder temp) 10 ±1 25mm/s ±6 mm/s Depth: completely cover the termination Solderability More than 95% of the terminal electrode should be covered with solder. 245 C 150 C Preheating Dipping Natural cooling 60 4±1 second second Preheat: 150,60sec. Solder: Sn96.5%-Ag3%-Cu0.5% Solder temperature: 245±5 Flux for lead free: Rosin. 9.5% Depth: completely cover the termination. Dip time: 4±1sec. Terminal strength Impedance:within±15% of initial value RDC:within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Component mounted on a PCB apply a force (>0805:1kg <=0805:0.5kg)to the side of a device being tested. This force shall be applied for seconds. Also the force shall be applied gradually as not to shock the component being tested. Bending Impedance:within±10% of initial value Shall be mounted on a FR4 substrate of the following dimensions:>=0805:40x100x1.2mm <0805:40x100x0.8mm Bending depth:>=0805:1.2mm <0805:0.8mm Duration of 10 sec for a min. Vibration Test Shock Impedance:within±15% of initial value Impedance:within±10% of initial value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Oscillation Frequency: 10~2K~10Hz for 20 minutes Equipment: Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations) Test condition: Type Peak Value (g s) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD Half-sine 11.3 Lead Half-sine 11.3 Page 5 of 8 ASC_ WLBD1608 Series_V4.0 Sep. 2016
6 Item Performance Test Condition Life test Load Humidity Thermal shock Appearance: no damage. Impedance: within±15%of initial value. Inductance: within±10%of initial value. Appearance: no damage. Impedance: within±15%of initial value. Inductance: within±10%of initial value. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Temperature: 125±2 (bead), 105±2 (Inductor)) Applied current: rated current. Duration: 1000±12hrs. Measured at room temperature after placing for 24±2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Humidity: 85±2%R.H. Temperature: 85±2. Duration: 1000hrs Min. with 100% rated current. Measured at room temperature after placing for 24±2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Condition for 1 cycle Step1: -40±2 30±5 min. Step2: 25±2 0.5min Step3: +125±2 30±5min. (Bead) Step3: +105±2 30±5min. (Inductor) Number of cycles: 500 Measured at room temperature after placing for 24±2 hrs. Insulation Resistance IR>1GΩ Chip Inductor Only Test Voltage:100±10%V for 30Sec. **Derating Curve Derating For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. Derated Current(A) A 5A 4A 3A 2A 1.5A 1A Environment Temperature+ Temperature( C) Soldering and Mounting L (mm) G (mm) H (mm) WLBD Page 6 of 8 ASC_ WLBD1608 Series_V4.0 Sep. 2016
7 Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk Lead Free Solder re-flow Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C) Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. Preheat circuit and products to 150 Never contact the ceramic with the iron tip Use a 20 watt soldering iron with tip diameter of 1.0mm 350 tip temperature (max) 1.0mm tip diameter (max) Limit soldering time to 4~5sec. Packaging Specification Reel Dimension A Type A(mm) B(mm) C(mm) D(mm) 2± ±0.5 R x8mm 9.0±0.5 60±2 13.5± ±2 D B C R R0.5 7 x12mm 13.5±0.5 60±2 13.5± ±2 7"x8mm 7"x12mm Tape Dimension / 8mm Material of taping is paper E:1.75±0.1 E:1.75±0.1 F:3.5±0.1 F:3.5±0.05 P2:2±0.1 P0:4±0.1 P0:4±0.1 P P D: D: A0 A0 B0 B0 W:8.0±0.1 W:8.0±0.3 Ko Ko t t Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) WLBD ± / ± ± ±0.05 Page 7 of 8 ASC_ WLBD1608 Series_V4.0 Sep. 2016
8 Top cover tape F 165 to180 The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions Base tape Room Temp. ( ) Room Humidity (%) Room atm (hpa) Tearing Speed mm/min 5~35 45~85 860~ Products meet IPC/JEDEC J-STD-020D standard-msl, level 1. Quantity per reel :4K pcs / reel Page 8 of 8 ASC_ WLBD1608 Series_V4.0 Sep. 2016
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LF 2012 Series Multilayer Chip Low-Pass Filters Features Monolithic structure replacing two inductors and five capacitors. RoHS compliant Applications 0.8-6GHz wireless communication systems, including
100 pf to 47µF RoHS compliant & Halogen free
Product Specification August 7, 2017 V.4 DATA SHEET SURFACE MOUNT MULTILAYER CERAMIC CAPACITORS General purpose class II X6S 4 V TO 50 V 0 pf to 47µF RoHS compliant & Halogen free 2 SCOPE This specification
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Prosperity Dielectrics Co., Ltd. 1 ACS-1045 Rev15
1. DESCRIPTION MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization, high density and high efficiency, ceramic condensers are used. WTC high
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MLCC APPLICATION GUIDE
MLCC APPLICATION GUIDE 1/10 No. Process Condition 1 Operating Condition (Storage) 1) The capacitor must be stored in an ambient temperature between 5 ~ 40 with a relative humidity of 20 ~ 70%. The products
*Contents in this sheet are subject to change without prior notice.
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rightek (Europe) Limited 1. MECHNICL & DIMENSIONS (UNIT: mm) 4R7 3R3 壮嘉雯 SPECIFICTION C a b c HF COMPLINT 7.6 Max 6.8 Max 3.2Max D 2.9±0.5 E 1.6±0.5 2.5 ref 3.7 ref 3.5 ref PC Pattern c Equivalent Circuit
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MLCC MLCC CONTENT (MLCC) E STANDARD NUMBER... 3 STRUCTURE... 4 ORDERING CODE... 4 GENERAL PURPOSE FOR SMARTPHONE... 5 CLASS II: HIGH DIELECTRIC CONSTANT TYPE... 6 X5R Series... 6 TEST SPEC.... 7 PACKAGE...
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1. INTRODUCTION General Purpose Multilayer capacitors supplied in bulk or tape & reel package are ideally suitable for thick film hybrid circuits and automatic surface mounting on any printed circuit boards.
RS INDUSTRY LIMITED. RS Chip Single ESD Suppressor APPROVAL SHEET. Customer Information. Part No. : Model No. : COMPANY PURCHASE R&D
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33 rightek (Europe) Limited 1.MEHNIL & DIMENSIONS 33 SPEIITION D E E D a (UNIT: mm) 6.±.2 E b c H OMPLINT 6.±.2 4.5±.1 2.6±.4 1.7±.3 8.5MX 2.ref 2.ref 6.2ref a b a c P Layout P Layout 2.ELETRIL REQUIREMENTS
SPECIFICATION. TEST INSTRUMENTS CH-1062A LCR METER CH-502BC IMPEDANCE METER I-sat 2.7 typ Amps 90% L0 CH-3302 LCR METER + CH-1320 BIAS Irms ΔT 40
C rightek (Europe) Limited SPECIFICTION HF COMPLINT 1.MECHNICL & DIMENSIONS (UNIT: mm) C 10.0max J D 5.0ref 151 E F 2.0ref 7.6ref J 17.5max a 2.9ref b 7.0ref c 5.4ref REMRK CIRCUIT c S F a b a PC Layout
PREJECTION INDUSTRIAL CORP. 百泉工業股份有限公司
: 1 OF 11 1. Features High performance (Isat) realized by metal dust core. Performance low resistance,high current rating. Low loss realized with low DCR. Frequency range : up to (1.0 MHz). 100% lead (pb)
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WW12C, WW08C, WW06C, WW04C, WW02C ±5%, ±1%, ±0.5% Low ohm chip resistors ( power ) Size 1206, 0805, 0603, 0402, 0201 *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_WWxxC_V05
Microwave Multilayer SMD Ceramic Capacitor 0201 to 0805 Sizes (6.3V to 500V), NP0 Dielectric, (MCRF)Series
Description: MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization, high density and high efficiency, ceramic condensers are used. WTC RF series