CERAMIC CAPACITOR CATALOGUE 2010/11

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1 Holy Stone Enterprise Co., Ltd. CERAMIC CAPACITOR CATALOGUE 2010/11

2 Introduction The Company Holy Stone Enterprise Company Ltd (Holy Stone) was established in June of 1981 as an agent and distributor of electronic components. In 1994, with technology and cooperation from a Japanese partner, Holy Stone began manufacturing multi-layer ceramic capacitors. Today, Holy Stone is recognized as an industry leader in application specific ceramic capacitors. Holy Stone integrates active and passive component distribution with significant manufacturing capabilities. Holy Stone s unique business model combines the service and inventory management strengths of a broad line distributor with the technical knowledge and world class pricing of a manufacturer. Holy Stone was founded by five engineers in Since this point, Holy Stone has maintained a focus and commitment to providing customers with innovative products and exceptional service. The result of that unwavering commitment is evident in Holy Stone s phenomenal growth (2009 revenues of US$412 million). Holy Stone also maintains a high profile on the Taiwan Stock Exchange, ranked in the top 100 companies and the leader among its peers. Manufacturing Facilities Holy Stone capacitors Are produced in a modern 40,000 square meter factory located in Lungtan, Taiwan. In addition to the Lungtan factory, Holy Stone has facilities in Dongguan and Wujiang China. The advanced materials research laboratory is located in Japan. The factory operating systems are certified to ISO-9001and ISO Sales and Support Locations Holy Stone administrative headquarters are located in Taipei, Taiwan. Holy Stone maintains sales and support offices in Kaohsiung Taiwan, Dongguan China and Shanghai China. Holy Stone Enterprise Company Ltd has subsidiary companies in North America and in Europe. Holy Stone International, located in Murrieta, California, U.S.A. is responsible for sales and technical support in the Americas. Holy Stone (Europe) Ltd, located in Norwich, England is responsible for sales and technical service for Europe. Holy Stone opened its Singapore office to service southeast Asia. Holy Stone also has a network of independent representatives, distributors and agents throughout the world. The Environment Holy Stone is committed to achieving and maintaining a healthy environment. Holy Stone is also among the first suppliers of halogen free epoxy coated capacitors. The factory is Certified to ISO and all standard products are designed and produced conforming to full RoHS compliance. Our Employees Holy Stone s success is measured by the satisfaction of our customers and share holders. Achieving that satisfaction is the result of the sum contribution of our employees. Those contributions come from all of our employees, whether they are engaged in administrative functions, manufacturing our goods or servicing our customers. Holy Stone strives to maintain a work environment that stimulates creativity, encourages enthusiasm and rewards results.

3 Contents CONTENTS Component Quick Reference Capacitor Availability Guide Products Series Technical Specifications Packing Information EIA Designations Precautionary Information Reducing Short Circuit Risks Super Term Coated Products for Surface Arc Prevention ROHS Compliant ISO Certifications

4 Component Quick Reference Product Series Application Page HVC series -- High Voltage Capacitors SCC series -- Safety Capacitors TCX series -- Trigger Capacitors LDC series -- Low Distortion Capacitors NCC series -- Normal Chip Capacitors HCC series -- High Capacitance MLCC-More than 1uF HCN series -- High Capacitance NP0 HCX series -- High Capacitance X7R SAC series -- Tip & Ring Capacitors HBC series -- Low-Loss High Frequency Snubber Capacitors HTC series -- X8R rated to +150 C LCC series -- Large Size MLCC Capacitors 1515 to 7565 SMC series -- Stacked MLCC Capacitors For Power Circuits (Backlight Inverter, DC to DC, ) For Isolation and Protection Circuits (UL,EN Class X2/Y3,X1/Y2) For DSC Strobe Circuits For Oscillation and Filter Circuits For Decoupling Circuits For Smoothing (DC to DC) and Decoupling Circuits For ADSL/XDSL (Replacement for Film Capacitor) For Input, Output Filters (DC to DC) For telephone line ringer circuits For High Frequency Lighting Ballasts For high temperature applications For Voltage Multipliers, Power circuit (DC-DC, Ballast, Snubber), Surge protection, Industrial control, For Power Circuits (Backlight Inverter, DC to DC, Surge protection )

5 Capacitance Availability Guide Standard MLCC Vdc v NP0 X7R 2.2uF 4.7uF X5R 100nF 1uF 10uF 22uF 47uF 100uF NP0 10V X7R 100nF 2.2F 4.7uF 10uF 10uF X5R 1uF 4.7uF 10uF 22uF 22uF NP0 3.3nF 10nF 27nF 47nF 120nF 16V X7R 100nF 2.2uF 2.2uF 4.7uF 22uF X5R 100nF 2.2uF 10uF 22uF 22uF NP0 3.3nF 10nF 10nF 22nF 47nF 25V X7R 10nF 1uF 1uF 2.2uF 10uF X5R 100nF 1uF 4.7uF 10uF 10uF NP0 35V X7R 470nF 1uF 4.7uF 2.2uF 10uF X5R 1uF 10uF NP0 470pF 3.3nF 10nF 10nF 22nF 47nF 82nF 50V X7R 10nF 100nF 330nF 1uF 2.2uF 4.7uF 4.7uF 10uF 6.8uF X5R 1uF NP0 270pF 1.2nF 6.8nF 10nF 18nF 56nF 56nF 68nF 100V X7R 18nF 100nF 470nF 2.2uF 2.2uF 2.2uF 4.7uF 4.7uF X5R NP0 270pF 1.2nF 5.6nF 8.2nF 12nF 47nF 47nF 56nF 200V X7R 47nF 100nF 470nF 1uF 1.5uF 2.2uF 2.2uF X5R NP0 270pF 1.2nF 5.6nF 8.2nF 12nF 47nF 47nF 56nF 250V X7R 47nF 100nF 470nF 1uF 1.5uF 2.2uF 2.2uF X5R NP0 680pF 2.2nF 3.9nF 1.8nF 8.2nF 39nF 39nF 47nF 500V X7R 22nF 56nF 100nF 39nF 220nF 270nF 470nF 470nF X5R NP0 2.2nF 3.9nF 1.8nF 8.2nF 27nF 27nF 33nF 630V X7R 33nF X5R NP0 1nF 1nF 1.2nF 6.8nF 12nF 12nF 15nF 1KV X7R 1nF 10nF 27nF 15nF 47nF 100nF 100nF 100nF X5R NP0 390pF 680pF 1.2nF 2KV X7R 1.5nF 2.7nF 3.3nF 10nF 18nF 18nF 18nF X5R NP0 39pF 1nF 1.2nF 1.2nF 3KV X7R 1.8nF 2.7nF X5R 4KV NP0 X7R 1nF X5R NP0 27pF 150pF 5KV X7R X5R - 3 -

6 Capacitance Availability Guide 250Vac Safety Capacitors SMD Capacitors Vdc X2/Y3 X1/Y2 X2 250Vrms NP0 2.2pF-1nF 250Vrms X7R 150pF-2.2nF 1nF-4.7nF 250Vrms NP0 2.2pF-150pF 2.2pF-330pF 2.2pF-680pF 2.2pF-1.2nF 250Vrms X7R 150pF-1nF 130pF-1nF 36pF-1nF 68pF-2.7nF 130pF-4.7nF 250Vrms NP0 250Vrms X7R 150pF-10nF 47nF-56nF Also available as Lead (Pb) free - 4 -

7 HVC Series - High Voltage Capacitors HVC Series High Voltage NP0 and X7R Capacitors Up to 5KV Holy Stone high voltage products are designed and manufactured to meet the general requirements of international standards. This product offering is well suited for commercial and industrial applications and includes NP0 (C0G) and X7R characteristics in sizes 0603 to 2225 and with working voltages up to 5KV. Features Special internal electrode design offer the highest voltage rating. Surface mount suited for solder wave and reflow soldering. High reliability. RoHS compliant. Applications. Suitable for LAN/WLAN interface, Back-Lighting Inverter, DC-DC Converters, Ballast, Modems & Power Supplies. Summary of Specifications Operating Temperature -55~+125 Rated Voltage 100Vdc to 5000Vdc Temperature Coefficient NP0 : ± 30ppm/, -55~+125 (EIA Class Ι ) X7R : ± 15%, -55~+125 (EIA Class Ⅱ ) Dissipation Factor NP0: Q 1000 ; X7R : D.F. 2.5% Insulation Resistance 10GΩ or 500/C Ω whichever is smaller Ageing NP0:0% ; X7R: Typically 1.0% per decade of time 100V V < 500V : 200% Rated Voltage Dielectric Strength 500V V < 1000V : 150% Rated Voltage 1000V V : 120% Rated Voltage How To Order C 1210 X 103 K 102 T X Product Code C : MLCC Multilayer Ceramic Capacitor Chip Size EX. : Dielectric N : NP0 X : X7R Capacitance Unit : pf 2R0 : 2.0pF 100 : : : Tolerance C : +/-0.25pF D : +/-0.50pF J : +/- 5% K : +/-10% M : +/-20% Rated Voltage 101 : 100Vdc 251 : 250Vdc 501 : 500Vdc 631 : 630Vdc 102 : 1000Vdc 202 : 2000Vdc 302 : 3000Vdc 402 : 4000Vdc 502 : 5000Vdc Packaging T : Tape & Reel B : Bulk Special Requirement O : Arc Prevention Coating X : Polymer Termination (Super Term) - 5 -

8 HVC Series - High Voltage Capacitors Dimensions BW L B W Capacitance Range NP0 100Vdc to 1KVdc Temperature Characteristic NP0 Size Rated Voltage 50V 100V 200V 250V 100V 200V 250V 500V 100V 200V 250V 500V 630V 1KV 100V 200V 250V 500V 630V 1KV 500V 630V 1KV 100V 200V 250V 500V 630V 1KV 100V 200V 250V 500V 630V 1KV 100V 200V 250V 500V 630V 1KV Consult HEC for thickness information T Unit : mm [inches] TYPE L W T (max) B (min) BW (min) ± ± [.063±.004] [.031 ±.004] [.039] [.016] [.006] ± ± [.079±.008] [.049±.008] [.057] [.028] [.008] ± ± [.126±.012] [.063±.008] [.071] [.059] [.012] ± ± [.126±.012] [.098±.008] [.102] [.063] [.012] ± ± [.181±.012] [.079±.008] [.087] [.098] [.012] ± ± [.181±.012] [.126±.012] [.118] [.098] [.012] ± ± [.181±.012] [.250±.016] [.118] [.098] [.012] ± ± [.220±.016] [.197±.016] [.118] [.137] [.012] ± ± [.220±.016] [.250±.016] [.118] [.137] [.012] Capacitance Range (pf) 2R0 3R3 3R9 5R0 8R B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B C C C D B B B B B B B B B B B B B B B B B B B B B B B B B B B C C C D B B B B B B B B B B B B B B B B B B B B B B B B B B B C C C D C C C C C C C C C C C C C C C C C C C C C C C C C C C C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/D B/D B/D D/E D/E D/E D/E D/E D/E D/E D/E D/E E B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/D B/D B/D D/E D/E D/E D/E D/E D/E D/E D/E D/E E C C C C C C C C C C C C C C C C C C D D D D/E D/E D/E D/E D/E C C C C C C C C C C C C C C C C C C D D D D/E D/E D/E D/E D/E D D D D D D D D D D D D D D E E E E E E E E E E E B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C C D D D D D/E D/E D/E D/E D/E E E C C C C C C C C C C C C C C C C C D D D D D/E D/E D/E D/E D/E E E C C C C C C C C C C C C C C C C D D D E E F F F C C C C C C C C C C C C C C C C D D D E E F F F D D D D D D D D D/E D/E D/E D/E D/E D/E D/E D D D D D D D D D D D D D D D D D D E E E E E E E E E E E E E E E D D D D D D D D D D D D D D D D D D E E E E E E E E E E E E F D D D D D D D D D D D D D D D D D D D/E D/E D/E D/E D/E E E E D D D D D D D D D D D D D D E E F F E/F E/F E/F F F/G F/G G D D D D D D D D D D D E D D D D D D D D D D D E E D D D D D D D D D D D D/E E F D E E E F F G G - 6 -

9 HVC Series - High Voltage Capacitors Capacitance Range NP0 100Vdc to 1KVdc cont. Temperature Characteristic NP0 Size 2225 Rated Voltage 100V 200V 250V 500V 630V 1KV Capacitance Range X7R 100Vdc to 1KVdc Capacitance Range (pf) 2R0 3R3 3R9 5R0 8R D D D Temperature Characteristic X7R Size Rated Voltage V 100V 200V V 500V 1KV 100V 200V 250V V 630V 1KV 100V 200V V 500V 1KV 500V KV 100V 200V V 500V 1KV 200V 250V V 1KV 200V 250V V 1KV 200V 250V V 1KV Consult HEC for thickness information Capacitance Range (pf) B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C D D D D B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C D D D D B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C C C C C C C C C C C C C C C B/C B/C B/C B/C B/C B/C B/C C C C C C C C C C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C C C C D E E E B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C C/D D/E D/E D/E B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C C/D D/E D/E D/E C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C D D D D D D D D D D D D D D D D D D D D D D D D D D E E D D D D D D D D D D D D D D D D D D D D D C C C C C C C C C C C C C C C C C C C C C D E E F G G C C C C C C C C C C C C D D D D D E E E F C C C C C C C C C C C C D D D D D E E E F D D D D D D E E E F F F F D D D D D E D D D D D D D D D D D D D D D D D D D E E E F F F D D D D D D D D D D D D D D D D D D D D D D D D D D D D D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E E E E E E F G D D D D D D D D D D D D D D D D D D D D D D D D D D D D D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E E E E F G D D D D D D D D D D D D D D D D D D D D D D D D D D D D D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E E E E F G D D D D D D D D D D D D D D D D D D D D D D D D D D D D E E E E E F F/G H H D D D D D D D D D D D D D D D D D D E E E E E E F F/G F/G F/G F/G D D D D D D D D D D D E E F H D D D D D D D D D D D E E F H E E E E E F G G H E E E E E E E/F F F G G H H D D D D D D D D D D D D D D D D D D D D E E E E E D D D D D D D D D D D D D D D D D D D D E E E E E D D D D D D D D D D D E E E D D D E E F F F F F F F F D D D D D D D D D D D D D D D D D E G D D D D D D D D D D D D D D D D D E G E E E E E E E E E F F E E E E E Thickness Specification Symbol Code S O A B C D E F G H Thickness(mm) 0.3± ± ± ± ± ± ± ± ± ±0.2 Other dimensions, capacitance values and voltage ratings are available on request. Please contact your local HEC office

10 HVC Series - High Voltage Capacitors Capacitance Range 2KV Temperature Characteristic NP0 Size Rated Voltage KV KV KV Capacitance Range (pf) 2R0 3R3 3R9 5R0 8R D D D D D D D D D D D D D D D/E D/E D/E E E E D D D D D D D D D D D D D D D D D D E/F E/F E/F E/F E/F E/F D D D D D D D E E F F F F F F F F Temperature Characteristic X7R Size Rated Voltage KV KV KV KV KV KV KV Capacitance Range (pf) D D D D D D D D D/E E E D D D D D D D D D E E E F G D D D D D D D D D D D D D D E F F D D D D D D D D D D E E F F F F F F G H E E E E F F F D D D D D D E E F F F F F E/F E/F Thickness Specification Symbol Code S O A B C D E F G H Thickness(mm) 0.3± ± ± ± ± ± ± ± ± ±0.2 Other dimensions, capacitance values and voltage ratings are available on request. Please contact your local HEC office. Capacitance Range 3KVdc to 5KVdc Temperature Characteristic NP0 Size Rated Voltage KV KV 5KV KV KV KV KV Capacitance Range (pf) 2R0 3R3 3R9 5R0 8R0 8R D D D D D D D D D D D E E E D D D D D D D D D D D D D D D D D D D E E E/F E/F E/F E/F E/F F F F F F F F F F F F F F F F F F D D D D D D D D D D D D E/F E/F E/F E/F E/F E/F E/F E/F E/F E/F F F G F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F Temperature Characteristic X7R Size Rated Voltage KV 4KV KV Consult HEC for thickness information D D D D D D D D D D D F F F D D D D D/E D/E D/E D/F D/F D/F D/F E F F F F F F F Capacitance Range (pf) Thickness Specification Symbol Code S O A B C D E F G H Thickness(mm) 0.3± ± ± ± ± ± ± ± ± ±0.2 Other dimensions, capacitance values and voltage ratings are available on request. Please contact your local HEC office

11 SCC Series - Safety Capacitors SCC Series Safety Capacitors rated to 250Vac X1/Y2, X2/Y3 & X2 The SCC series of X1/Y2, X2/Y3 & X2 safety capacitors are designed specifically for use in modem, facsimile, telephone and other electronic equipment. These parts are compliant to EN/IEC and UL standards. These capacitors are available in NP0 (C0G), SL and X7R dielectrics. Features Small size & high capacitance values. Suitable for reflow soldering. Surface mount. RoHS compliant and Lead (Pb) free option. Safety standard approval by EN/IEC and UL Certified to: TUV R , R & UL E TUV R & UL E for Lead (Pb) free. Safety Detail of Specifications Application Specially designed for use in modem, facsimile, telephone and other telecommunication equipment, electronic equipment for lightning and surge protection, EMI filtering and isolation. EN : 2001 EN : 2005 IEC : 2005 IEC : 1999 IEC : 2005 UL : nd edition Meets the electrical requirements and certification for equipment requiring class X1/Y2 and X2/Y3 devices. Component certified for equipment requiring IEC compliance Component certified for equipment requiring IEC-384 compliance TNV/SELV Isolation capacitors certified to UL How To Order SCC 1808 X 102 K 502 T S Product Code SCC : Safety approved MLCC Chip Size Dielectric N : NP0 X : X7R L : SL Capacitance Unit : pf 2R0 : 2.0pF 100 : : : Tolerance J : +/- 5% K : +/-10% M : +/-20% Class 202 : X2 302 : X2/Y3 502 : X1/Y2 602 : X1/Y2 for SCC2208N, SCC2211N, SCC2220N Packaging T : Tape & Reel B : Bulk Special Requirement S : Arc Prevention Coating X : Polymer Termination (SuperTerm) Z : Arc Prevention Coating & SuperTerm G : Lead (Pb) free - 9 -

12 SCC Series - Safety Capacitors Summary of Specifications Rated Voltage AC 250Vrms NP0 : < 30ppm/, -55~+125 (EIA Class Ι ) Temperature Coefficient SL: +350~ -1000ppm/ C -55~+85 C X7R : < ± 15%, -55~+125 (EIA Class Ⅱ) Capacitance Range See table below Quality and Dissipation Factor NP0/SL : Q 1000 ; X7R : D.F. 2.5% Climatic Category -55/125/21 Insulation Resistance 10GΩ Voltage Proof X Capacitor : Applied Voltage 1075Vdc(4.3Ur) Y Capacitor : Applied Voltage 1500Vac Impulse Y3 : 2.5KV (Compliant to IEC 60950) ; X2 : 2.5KV / Y2 : 5KV for three times Ageing NP0 : 0 % ; SL : 1.5% ; X7R : 1.0 % per decade hr, typical Application Example Circuit Tip & Ring Y Y TNV 1st X SELV 2nd X: Across The Line (Ex.: SCC1808N151K302T) Y : Line By Pass (Ex.: SCC2211X102K502T) Dimensions Unit : mm [inches] BW L B W T TYPE L W T (max) B (min) BW (min) ±0.3 [.181±.012] 2.00±0.2 [.079 ±.008] 2.20 [.087] 2.50 [.098] 0.20 [.008] ± ± [.181±.012] [.126±.012] [.102] [.098] [.008] ±0.4 [.220±.016] 5.70±0.4 [.220±.016] 5.70±0.4 [.220±.016] 6.80±0.4 [.280±.016] 2.00±0.2 [.079±.008] 2.80±0.3 [.110±.012] 5.00±0.4 [.197±.016] 6.35±0.4 [.197±.016] 2.20 [.087] 3.00 [.118] 3.00 [.118] 4.00 [.157] 4.00 [.157] 4.00 [.157] 4.00 [.157] 4.00 [.157] 0.30 [.012] 0.30 [.012] 0.30 [.012] 0.30 [.012]

13 SCC Series - Safety Capacitors Capacitance Range Class Size Temperature Characteristic Rated Voltage Certificated 1808 NP0 250Vrms TUV/UL X2/Y X7R 250Vrms TUV/UL 1812 X7R 250Vrms TUV 1808 NP0 250Vrms TUV/UL 1808 X7R 250Vrms TUV/UL 1812 X7R 250Vrms TUV/UL 2208 NP0 250Vrms TUV/UL X1/Y X7R 250Vrms TUV/UL 2211 NP0 250Vrms TUV/UL 2211 X7R 250Vrms TUV/UL 2220 NP0 250Vrms TUV/UL 2220 X7R 250Vrms TUV/UL X X7R 250Vrms TUV Capacitance Range (pf) 2R0 5R0 6R8 8R x x x x x x x x x x x x Capacitance Range Lead (Pb) free Class 1808 NP0 250Vrms TUV/UL X2/Y SL 250Vrms TUV/UL 1808 X7R 250Vrms TUV/UL 1812 X7R 250Vrms TUV/UL 1808 NP0 250Vrms TUV/UL 1808 X7R 250Vrms TUV/UL 1812 NP0 250Vrms TUV/UL 1812 X7R 250Vrms TUV/UL X1/Y NP0 250Vrms TUV/UL 2208 X7R 250Vrms TUV/UL 2211 NP0 250Vrms TUV/UL 2211 X7R 250Vrms TUV/UL 2220 NP0 250Vrms TUV/UL 2220 X7R 250Vrms TUV/UL Class X2 Size Size 2220 Temperature Characteristic Temperature Characteristic X7R Rated Voltage Rated Voltage 250Vrms Certificated Certificated TUV/UL Capacitance Range (pf) 2R0 5R0 6R8 8R x x x x x x x x x x x x X denotes values that have been tested to a rated voltage of 305Vac TUV test report number dated 27 th May

14 TCX Series - Trigger Capacitors for Strobe Circuits TCX Series Trigger Capacitors for Strobe Circuits The TCX series is specifically designed with a proprietary material for discharge applications such as strobe circuit applications. The unique properties of the X7E material and the design of the TCX series makes them suitable for any discharge application which requires the capacitor to have a good damping characteristic. This series is also suitable for applications requiring a minimum change in capacitance over temperature (T/C). The TCX series is offered in sizes 0805, 1206 and 1210 and at 350Vdc and 630Vdc. Features Excellent trigger characteristics. Low ESR & low tan δ. Excellent DC bias. Provide good damping characteristics results in more light. RoHS compliant. Applications Suitable for strobe trigger circuit in digital and electric cameras. Summary of Specifications Operating Temperature -55~+125 Rated Voltage 350Vdc and 630Vdc Temperature Coefficient X7E : ± 4.7%, -55~+125 (EIA Class II ) Capacitance Range 1.0nF to 100nF Dissipation Factor 1.0% max. at 1KHz 25 Insulation Resistance 10GΩ or 500/C Ω whichever is smaller (C in Farad) Dielectric Strength 350Vdc 650Vdc : 200% Rated Voltage : 150% Rated Voltage Capacitance Tolerance ± 5%, ± 10%, ± 20% Ageing 1.0% per decade hr, typical How To Order TCX 1206 C 223 K 631 T Product Code TCX : Trigger Capacitor Chip Size Dielectric C : X7E Capacitance Unit : pf 102 : : Tolerance J : +/- 5% K : +/- 10% M : +/- 20% Rated Voltage 351 : 350Vdc 631 : 630Vdc Packaging T : Tape & Reel B : Bulk

15 TCX Series -Trigger Capacitors for Strobe Circuits Characteristics Trigger Voltage (Vp) Damping (Trigger) Properties TCX/1206/223K/630V X7R/1206/223K/630V Time (µs) Voltage (V) R-C Charge Curv e TCX/1206/223K/630V X7R/1206/223K/630V Time (sec.) Application Example Circuit DSC Strobe Circuit Trigger Cap. + - Dimensions BW L B W T Unit : mm [inches] TYPE L W T (max) B (min) BW (min) ±0.2 [.079±.008] 1.25±0.2 [.049 ±.008] 1.45 [.057] 0.70 [.028] 0.20 [.008] ± ± [.126±.012] [.063±.008] [.071] [.059] [.012] ±0.3 [.126±.012] 2.50±0.2 [.098±.008] 1.80 [.071] 1.60 [.063] 0.30 [.012] Capacitance Range Dielectric Characteristic X7E Size Voltage V V 630V V Capacitance Range C C C C C C C C C C C C C C C D D D C C C C D D D E E D D D D D D D E E E D D D D D D D E E Symbol Code S O A B C D E F G H Thickness(mm) 0.3± ± ± ± ± ± ± ± ± ±0.2 Other dimensions, capacitance values and voltage ratings are available. Please contact HEC

16 LDC Series - Low Distortion Capacitors LDC Series Low Distortion Capacitors NP0/X7R Hybrid Features Small size & high capacitance. Ultra stable T/C for a Class ll. Excellent bias, high temperature stability & low tan δ. High breakdown voltage. Replacement for film capacitors. RoHS compliant. Application Suitable for telecommunication (ADSL modem), power (inverter for oscillation circuit) & audio circuits. Summary of Specifications Operating Temperature -55~+125 Rated Voltage 25V and 50Vdc Temperature Coefficient X7E : ± 4.7%, -55~+125 (EIA Class II ) Capacitance Range 1nF ~ 270nF For 50V : 1.2% max. at 1KHz 25 Dissipation Factor For 25V : 2.0% max. at 1KHz 25 Insulation Resistance 10GΩ or 500/C Ω whichever is smaller Dielectric Strength 250% Rated Voltage for 5 50mA max. current Capacitance Tolerance ± 5%, ± 10%, ± 20% Ageing 1.0% per decade hr, typical How To Order LDC 1206 C 103 K 025 T Product Code LDC : Low Distortion Capacitor Chip Size Dielectric C : X7E Capacitance Unit : pf 102 : : Tolerance J : +/- 5% K : +/- 10% M : +/- 20% Rated Voltage 025 : 25Vdc 050 : 50Vdc Packaging T : Tape & Reel B : Bulk

17 LDC Series - Low Distortion Capacitors Characteristics dc/c (%) Temperature Capacitance Coefficient X7R 1206/103 LDC 1206/103 (ohm) Impedance/ESR & Frequency Z - LDC/1206/103 Z - Film Cap 1206/103 ESR - LDC/1206/103 ESR - Film Cap /1206/ Temperature Temperature Frequency (MHz) Application FILTER 6.8nF 1 50Ω 50Ω 2 6.8nF Example Circuit 1.8nF 100R 4.7nF 819R 316R 100R 1.8nF Dimensions BW L B W T Unit : mm [inches] TYPE L W T (max) B (min) BW (min) ± ± [.063±.004] [.031 ±.004] [.035] [.016] [.006] ± ± [.079±.008] [.049 ±.008] [.057] [.028] [.008] ± ± [.126±.012] [.063±.008] [.071] [.059] [.012] ± ± [.126±.012] [.098±.008] [.071] [.063] [.012] ± ± [.181±.012] [.126±.012] [.087] [.098] [.012] ± ± [.220±.016] [.197±.016] [.087] [.137] [.012] Capacitance Range Dielectric Characteristic X7E Size Rated Voltage V V V 50V V V V Capacitance Range B B B B B B B B B B B B B C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C D D D D D D D D D D Symbol Code S O A B C D E F G H Thickness(mm) 0.3± ± ± ± ± ± ± ± ± ±0.2 Other dimensions, capacitance values and voltage ratings are available. Please contact HEC

18 NCC Series - Normal Chip Capacitors NCC Series Normal Chip Capacitors NP0, X7R, X5R,Y5V Standard Multilayer Ceramic Chip Capacitors (MLCCs) are available in a full range of sizes and temperature coefficients, with voltage ratings from 6.3V to 50V. Features Surface mount suited for wave and reflow soldering. Small size and high reliability. Excellent in high frequency characteristic. RoHS compliant. Application Suitable for general electronics circuit, telecommunications, personal computers and peripheral, power circuit & mobile application etc. Summary of Specifications Operating Temperature Rated Voltage Temperature Coefficient Dissipation Factor Insulation Resistance Ageing Dielectric Strength -55 C~+125 for NP0 and X7R: -55 C ~+85 C for X5R: -30 C~+85 C for Y5V 6.3Vdc to 50Vdc NP0 : ± 30ppm/, -55 C~+125 (EIA Class Ι) X7R : ± 15%, -55 C~+125 (EIA Class Ⅱ) X5R : ± 15%, -55 C~+85 (EIA Class Ⅱ) Y5V: +22%/-82%, -30 C ~ +85 C (EIA Class Ⅱ) NP0 : More than 30pF: Q 1000 (0.001) 30pF and below : Q C (C=pF) X7R, X5R and Y5V: please see table 1 on page 39 for details 10GΩ or 500/C Ω whichever is smaller NP0:0% ; X7R/X5R: typically 1.0% and Y5V 7% per decade of time 250% rated voltage Dimensions BW L How To Order B W T TYPE L W T (max) B (min) BW (min) ± ± [.024±.001] [.011 ±.001] [.013] [.008] [.004] ± ± [.039±.002] [.020 ±.002] [.022] [.012] [.006] ± ± [.063±.004] [.031 ±.004] [.035] [.016] [.006] ± ± [.079±.008] [.049 ±.008] [.057] [.028] [.008] ± ± [.126±.012] [.063±.008] [.071] [.059] [.012] C 0402 B 104 M 010 T Product Code C : MLCC Multilayer Ceramic Capacitor Chip Size Dielectric N : NP0 X : X7R B : X5R Y : Y5V Capacitance Unit : pf 102 : : : Tolerance C : +/- 0.25pF D : +/- 0.50pF F : +/- 1% G : +/- 2% J : +/- 5% K : +/- 10% M : +/- 20% Z : +80/-20% Rated Voltage 007 : 6.3Vdc 010 : 10Vdc 016 : 16Vdc 025 : 25Vdc 050 : 50Vdc Packaging T : Tape & Reel B : Bulk

19 NCC Series - Normal Chip Capacitors Capacitance Range Dielectric Characteristic NPO Size Rated Voltage V V V Capacitance Range (pf) 0R5 1R0 1R5 2R0 3R0 4R0 5R0 6R0 7R0 8R0 9R O O O O O O O O O O O O O O O O O O O O O B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B Dielectric Characteristic X7R Size Rated Voltage 10V 16V 25V 50V 16V 25V 50V 16V 25V 50V 16V 25V 50V Capacitance Range (pf) O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B D D D B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B D D B B B B B B B B B B B B B B B B B B B B B B B B B B B B B C D B B B C D B B B C D B B B C D Dielectric Characteristic Y5V Size Rated Voltage 10V 16V 16V 25V 50V 16V 25V 50V 16V 25V 50V Capacitance Range O O O B B B B B B B B B B B B B B B B B B B B B B B B B Dielectric Characteristic X5R Size Rated Voltage V 6.3V 10V V 25V 6.3V 10V V 25V Capacitance Range (pf) S O O O O O O O O O O O O O O O O O O O O O B B B B B B B B B B B B B B B B B B B B B Symbol Code S O A B C D E F G H Thickness(mm) 0.3± ± ± ± ± ± ± ± ± ±0.2 Other dimensions, capacitance values and voltage ratings are available. Please contact HEC

20 HCC Series - High Capacitance MLCC HCC Series High Capacitance MLCC - 1uF and above Features Surface mount, suited for wave and reflow soldering. High reliability. Small size and high capacitance value. Excellent high frequency characteristics. RoHS compliant. Summary of Specifications Application Ideal for smoothing and decoupling circuits Suitable for DC-DC converter, personal computer and peripherals, telecommunication and general electronic equipment Operating Temperature Rated Voltage Temperature Coefficient Dissipation Factor : Insulation Resistance Ageing Dielectric Strength -55 C~+125 for X7R: -55 C ~+85 C for X5R: -30 C~+85 C for Y5V 6.3Vdc to 50Vdc X7R : ± 15%, -55 C~+125 (EIA Class Ⅱ) X5R : ± 15%, -55 C~+85 (EIA Class Ⅱ) Y5V: +22%/-82%, -30 C ~ +85 C (EIA Class Ⅱ) X7R, X5R and Y5V: Please see table 1 on page 39 for details 10GΩ or 500/C Ω whichever is smaller X7R/X5R: Typically 1.0% and Y5V 7% per decade of time 250% Rated Voltage Dimensions BW L B W T TYPE L W T (max) B (min) BW (min) ± ± [.039±.002] [.020 ±.002] [.022] [.012] [.006] ± ± [.063±.004] [.031 ±.004] [.035] [.016] [.006] ± ± [.079±.008] [.049 ±.008] [.057] [.028] [.008] ± ± [.126±.012] [.063±.0108 [.071] [.059] [.012] ±0.30 [.126±.012] 4.60±0.3 [.181±.012] 5.7±0.40 [.220±.016] 2.50±0.20 [.098±.008] 3.20±0.3 [.126±.012] 5.00±0.40 [.197±.016] 2.60 [.102] 3.00 [.118] 3.00 [.118] 1.60 [.063] 2.50 [.098] 3.50 [.137] How To Order C 0805 B 106 M 010 T 0.30 [.012] 0.30 [.012] 0.30 [.012] Product Code C : MLCC Multilayer Ceramic Capacitor Chip Size Dielectric X : X7R B : X5R Y : Y5V Capacitance Unit : pf 105 : : : Tolerance J : +/- 5% K : +/- 10% M : +/- 20% Z : +80/-20% Rated Voltage 007 : 6.3Vdc 010 : 10Vdc 016 : 16Vdc 025 : 25Vdc 035 : 35Vdc 050 : 50Vdc Packaging T : Tape & Reel B : Bulk

21 HCC Series - High Capacitance MLCC Capacitance Range X7R (X) Series Size Code VDC 6.3V 10V 16V 25V 6.3V 10V 16V 25V 10V 16V 25V 35V 50V 16V 25V 35V 50V 35V 35V 105 1uF B B B B D D D D D E E D D D D F F uF B B B D D D E E E F F F uF D D E E F F F uF E F F G X5R (B) Series Size Code VDC 6.3V 10V 6.3V 10V 16V 25V 6.3V 10V 16V 25V 6.3V 10V 16V 25V 35V 50V 6.3V 10V 16V 25V 35V 50V 105 1uF O O B B B B D D D D D E E uF O B B B D D D D E E E E E/F F D uF B B D D D D E E E E F F F uF B D D D E E E E F F F F uF D D E E E G G G uF E E uF G Y5V (Y) Series Size Code VDC 6.3V 10V V 16V 25V 6.3V 10V 16V 25V 50V 10V 16V 25V 35V 50V 6.3V 10V 16V 25V 35V 105 1uF O O B B B B B D uF B B B D D D uF B B D D D D D uF D D D D E E E E E uF D D E F F 50V Symbol Code S O A B C D E F G H Thickness(mm) 0.3± ± ± ± ± ± ± ± ± ±0.2 Other dimensions, capacitance values and voltage ratings are available. Please contact HEC

22 HCN Series - High Capacitance NP0 HCN Series High Capacitance NP0-1nF and above Features Small size & high capacitance. Suitable for wave and reflow soldering. Excellent characteristics and tight tolerance. Excellent bias, high temperature stability & low tan δ. Replace film capacitors. RoHS compliant. Application Suitable for ADSL filter circuits, cable modem and coupling circuits, general telecommunications use, power (inverter for oscillation circuit) and audio circuits. Summary of Specifications Operating Temperature -55~+125 Rated Voltage 16V to 50Vdc Temperature Coefficient NP0 : 30ppm/, -55~+125 (EIA Class Ι ) Capacitance Range 1nF ~ 220nF Dissipation Factor Q 1000 at 1KHz 20 Insulation Resistance 10GΩ or 500/C Ω whichever is smaller (C in Farad) Dielectric Strength 250% rated voltage for 5 50mA max. current Ageing 0% per decade hr How To Order C 1206 N 103 J 025 T Product Code C : MLCC Multilayer Ceramic Capacitor Chip Size Dielectric N : NP0 Capacitance Unit : pf 102 : : : Tolerance F : +/- 1% G : +/- 2% J : +/- 5% Rated Voltage 016 : 16Vdc 025 : 25Vdc 050 : 50Vdc Packaging T : Tape & Reel B : Bulk

23 HCN Series - High Capacitance NP0 Characteristics dc/c (ppm) Temperature Capacitance Coefficient Temperature( ) NPO-1812/683 Film-1812/683 Ohm Z/ESR & Frequency Z- MLCC- NPO 1812/683 ESR-MLCC NPO 1812/ Z- Film Cap 1812/ ESR- Film Cap 1812/ Frequency (KHz) Application Rx Filter Dimensions 1.5nF 1.5nF Capacitance Range 1 2 Dielectric Characteristic NPO BW L Example Circuits Size nF 6.8nF 1.8nF 1.8nF 3.3nF 4.7nF 18nF 4.2KR 680uH 680uH 680uH B 1.8nF W Voltage 16V 25V 50V 16V 25V 50V 16V 25V 50V 16V 25V 50V 16V 25V 50V T 3.3nF 4.2KR 100nF Tx Filter R 348R 1.5nF 560pF 680uH 680uH 560pF 2.7nF 4.75KR 4.75KR Unit : mm [inches] TYPE L W T (max) B (min) BW (min) / / [.063+/-.004] [.031+/-.004] [.039] [.016] [.006] ± ± [.079±.008] [.049 ±.008] [.055] [.028] [.008] ± ± [.126±.012] [.063±.008] [.071] [.059] [.012] ± ± [.126±.012] [.098±.008] [.087] [.063] [.012] ± ± [.181±.012] [.126±.012] [.087] [.157] [.008] Capacitance Range B B B B B B B B B B B B B B B B B B B B B B B B B C/D D D D D D D D D B B B B C/D D D D D D D D D B B B B C/D D D D D D D D D B B B B B B B B B B B B B D D D D E B B B B B B B B B C D D D B B B B B B B B B C D D E C C C C C C C C C C C C C D D D D D E E E C C C C C C C C C C C C C D E E F C C C C C C C C C C C C C D E E F D D D D D D D D D D D D D D D D E E E E F F F F F F D D D D D D D D D D D D D D D D E E E E F D D D D D D D D D D D D D D D D E E E E F Symbol Code S O A B C D E F G H Thickness(mm) 0.3± ± ± ± ± ± ± ± ± ±0.2 Other dimensions, capacitance values and voltage ratings are available. Please contact HEC

24 HCX Series - High Capacitance X7R HCX Series High Capacitance X7R - 100nF and above Features Rated working voltage of 50V and 100Vdc. Small size & high capacitance. Excellent bias, high temperature stability & low tan δ. Low ESR and excellent ripple current characteristics RoHS compliant Application DC-DC converters (filter) Industrial controls Power supplies Surge protection Summary of Specifications Operating Temperature -55~+125 Rated Voltage 50V to 100Vdc Temperature Coefficient X7R : ± 15% at -55~+125 (EIA Class II ) Capacitance Range 100nF ~ 10uF Dissipation Factor 2.5% max. at 1KHz 25 Insulation Resistance 10GΩ or 500/C Ω whichever is smaller (C in Farad ) 50V : 250% rated voltage for 5 50mA max. current Dielectric Strength 100V :200% rated voltage for 5 50mA max. current Capacitance Tolerance ± 10%, ± 20% Ageing 1.0% per decade hr, typical How To Order C 1210 X 225 K 101 T X Product Code C : MLCC Multilayer Ceramic Capacitor Chip Size Dielectric X : X7R Capacitance Unit : pf 102 : : : Tolerance K : +/- 10% M : +/- 20% Rated Voltage 050 : 50Vdc 101 : 100Vdc Packaging T : Tape & Reel B : Bulk Special Requirement O : Arc Prevention Coating X : Flexible Termination (Super Term)

25 HCX Series - High Capacitance X7R Characteristics Application Example Circuit DC-DC Converter Filter Isolation Transformer Dimensions BW L B W T Unit : mm [inches] TYPE L W T (max) B (min) BW (min) ± ± [.126±.012] [.098±.008] [.102] [.063] [.012] ± ± [.181±.012] [.126±.012] [.118] [.098] [.012] ± ± [. 181±.012] [.250±.016] [.118] [.137] [.012] ± ± [.220±.016] [.197±.016] [.118] [.137] [.012] ± ± [.220±.016] [.250±.016] [.118] [.137] [.012] Capacitance Range Size Code WVDC 50V 100V 50V 100V 50V 100V 50V 100V 50V 100V nF C C D D/E D D nF C C D D/E D D nF C C D D/E D D nF C C D D/E D D nF C C D E D D E E D D nF D D D E D D E E D D nF D E D E D D E E D D 105 1uF D F D E D D F F D E uF F F E F E F F F D F uF G G E G E F F F E F uF F F F F E F uF H F F F E F uF G F uF H G Symbol Code S O A B C D E F G H Thickness(mm) 0.3± ± ± ± ± ± ± ± ± ±0.2 Other dimensions, capacitance values and voltage ratings are available. Please contact HEC

26 SAC Series -Tip & Ring Capacitors SAC Series Tip & Ring Capacitors Telephone lines use a DC voltage of 48 volts and pass the subscriber s AC signal pulse of 15 to 25Hz at 70 to 90Vrms. These MLCC Tip & Ring capacitors replace bulky leaded film capacitors and offer excellent frequency response, low ESR and improved temperature characteristics. Ideal for telecommunication and modem applications. Features Small size & high capacitance. Suitable for wave and reflow soldering. Surface mount. Low ESR characteristics & improved temperature performance. RoHS compliant. Summary of Specifications Operating Temperature X7R : -55~+125, Y5U : -30~+85 Rated Voltage 250Vdc Temperature Coefficient Y5U : +22 /-56 %, -30~+85 (EIA Class II ) X7R : ± 15%, -55~+125 (EIA Class II ) Y5U :10nF ~ 1.0uF Capacitance Range X7R :180pF ~ 2.2uF Dissipation Factor Y5U : D.F. 4.0% ; X7R : D.F. 2.5% Insulation Resistance 10GΩ or 500/C Ω whichever is smaller Dielectric Strength 200% rated voltage for 5 50mA max. current Ageing Y5U: 4.0 %; X7R: 1.0 % per decade hr, typical How To Order C 1812 X 474 M 251 T Product Code C : MLCC Multilayer Ceramic Capacitor Chip Size Dielectric X : X7R E : Y5U Capacitance Unit : pf 103 : : Tolerance K : +/- 10% M : +/- 20% Rated Voltage 251 : 250Vdc Packaging T : Tape & Reel B : Bulk

27 SAC Series - Tip & Ring Capacitors Dimensions BW L B W T Unit : mm [inches] TYPE L W T (max) B (min) BW (min) ± ± [.079±.008] [.049 ±.008] [.043] [.028] [.008] ± ± [.126±.012] [.063±.008] [.071] [.059] [.012] ± ± [.126±.012] [.098±.008] [.102] [.063] [.012] ± ± [.181±.012] [.126±.012] [.118] [.098] [.012] ± ± [.220±.016] [.197±.016] [.118] [.137] [.012] Characteristics Capacitance Change (%) Temperature Capacitance Coef f icient X7R 1812/474 Y5U 1812/ Temperature (C) (ohm) X7R Impedance/ESR & Frequency X7R 1812/474 -Z X7R 1812/474 -ESR Y5U 1812/474 -Z Y5U 1812/474 -ESR Frequency (KHz) Application Example Circuit Subscribers AC Signal Ring Ring Tip 0.47uF Tip -48Vdc 200ms/DIV Capacitance Range Dielectric Characteristic Size Voltage V V X7R V V V Y5U V Symbol Code S O A B C D E F G H Thickness(mm) 0.3± ± ± ± ± ± ± ± ± ±0.2 Other dimensions, capacitance values and voltage ratings are available. Please contact HEC Capacitance Range B/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/C D D D B/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CC/DD/ED/ED/E C C C C C C C C C C D D D D D D D D D D/ED/ED/ED/ED/ED/ED/ED/E E E E F G E E E E E E E E E F H D D D D D D D D D D D D D E E E E F G

28 HBC Series - Low-Loss, High Frequency Snubber Capacitors HBC Series Low-Loss, High Frequency Snubber Capacitors Features Low stable ESR at high frequency. Ultra stable NP0 performance. Suitable for solder wave and reflow soldering. ROHS compliant. High peak to peak voltage capability. Application High frequency pulse circuits. Lighting ballast snubber circuits. DC-DC converters. High dv/dt rating. Summary of Specifications Operating Temperature -55~+125 Rated Voltage 500V and 630Vdc Temperature Coefficient ± 30ppm at -55~+125 Capacitance Range 10pF ~ 2700pF Dissipation Factor 0.1% max. at 1MHz 25 Insulation Resistance 10GΩ Dielectric Withstanding 1.5 WVDC for 5 sec Capacitance Tolerance F, G, J, K Ageing None Piezo Effects None dv/dt rating >6KV/µ second How To Order HBC 1206 N 100 J 501 T Product Code HBC : Low-loss High Frequency Capacitors Chip Size Dielectric N : NP0 Capacitance Unit : pf 100 : : : Tolerance F : ±1% G : ±2% J : ± 5% K : ±10% Rated Voltage 501 : 500Vdc 631 : 630Vdc Packaging T : Tape & Reel B : Bulk

29 HBC Series - Low-Loss, High Frequency Snubber Capacitors Characteristics Peak to Peak Voltage To convert a DC voltage rating to maximum peak to peak voltage a conversion factor of 1.25 : 1 should be Used. For example : 500VDC rating = 500/1.25 = 400V peak to peak voltage where peak to peak is defined as below. AC Voltage Pulsed Voltage 0V DC + AC Voltage DC + Pulsed Voltage 0V = peak to peak voltage Dimensions BW B T Unit : mm [inches] TYPE L W T (max) B (min) BW (min) ± ± ± ± L W Capacitance Range Dielectric Characteristic NP0 Size Voltage V V V V Capacitance Range Other dimensions, capacitance values and voltage ratings are available. Please contact HEC

30 HTC Series- High Temperature Capacitors HTC Series High Temperature Capacitors X8R rated to +150 C Features Rated voltages from 25V to 250V. Stable temperature coefficient at temperatures up to 150 C. Near zero loss of capacitance at peak temperature (see chart). Fully RoHS compliant. Available with flexible termination (Super Term) to minimize mechanical / thermal stress effects. Applications Suitable for automotive, oil exploration (drilling and logging) and other demanding high temperature environments and applications. Instrumentation and other equipment circuit operating at high temperatures. Summary of Specifications Operating Temperature -55~+150 Rated Voltage 25V ~ 250Vdc Temperature Coefficient X8R : ± 15%, -55~+150 (EIA Class II ) Capacitance Range 180pF ~ 390nF Dissipation Factor 2.5 % max. at 1KHz 25 Insulation Resistance 100GΩ or 1000/C Ω whichever is smaller at 25 Dielectric Strength < 200V : 250% rated voltage for 5 50mA max. current 200~500V : 150% rated voltage for 5 50mA max. current Capacitance Tolerance ± 5%, ± 10%, ± 20% Ageing 2.0% per decade hr, typical How To Order HTC 1206 H 103 K 025 T X Product Code Chip Size Dielectric Capacitance Unit : pf Tolerance Rated Voltage Packagin g Special Requirement HTC : High Temperature Capacitor X8R 102: : J : +/- 5% K : +/- 10% M : +/- 20% 025:25Vdc 050:50Vdc 101:100Vdc 251:250Vdc T : Tape & Reel B : Bulk X:Super Term O:Arc Prevention Coating

31 HTC Series - High Temperature Capacitors Characteristics X8R-1206 / 100nF dc/c (%) Dimensions BW L B W T Unit : mm [inches] TYPE L W T (max) B (min) BW (min) ± ± [.063±.004] [.031 ±.004] [.039] [.016] [.006] ± ± [.079±.008] [.049 ±.008] [.057] [.028] [.008] ± ± [.126±.012] [.063±.008] [.071] [.059] [.012] ± ± [.126±.012] [.098±.008] [.071] [.063] [.012] Capacitance Range Temperature Characteristic X8R Size Rated Voltage 25V 50V 25V 50V 100V 250V 25V 50V 100V 250V 25V 50V 100V 250V Capacitance Range (pf) Other dimensions, capacitance values and voltage ratings are available. Please contact HEC

32 LCC Series - Large Size MLCC Capacitors LCC Series Large Size NP0 & X7R MLCC Capacitors 50V 8KV Features Optimized internal design offers the highest possible voltage rating up to 8KVdc. Capacitance range from 470pF - 33uF and case sizes from Available with proprietary surface coating for arc prevention Available with flexible termination (Super Term) to minimize the effects of mechanical stress. High reliability screening is available. Pd/Ag, 100% Sn and 90/10 Sn/Pb terminations available. RoHS compliant. Summary of Specifications Operating Temperature -55~+125 Rated Voltage 50Vdc to 8KVdc Temperature Coefficient NP0 : ± 30ppm/, -55~+125 (EIA Class Ι ) X7R : ± 15%, -55~+125 (EIA Class Ⅱ ) Capacitance Range NP0 :100pF to 820nF ; X7R :1000pF to 33uF Dissipation Factor NP0 : Q 1000 ; X7R : D.F. 2.5% Insulation Resistance 10GΩ or 500/C Ω whichever is smaller (C in Farad ) Ageing NP0:0% ; X7R: 1.0 % per decade of time V 500V : 200% rated voltage Dielectric Strength 500V V < 1000V : 150% rated voltage V 1000V : 120% rated voltage How To Order Applications. Voltage multipliers Power supplies DC-DC converters Surge protection Industrial control circuits Isolation Ballast Snubber Custom applications C 2520 X 103 K 102 T N S X Product Code C: MLCC Multilayer Ceramic Capacitor Chip Size EX.: Dielectric Ex.: N: NP0 X: X7R Capacitance Unit : pf Ex.: 100: : : Tolerance Ex.: C:+/-0.25pF D:+/-0.50pF J:+/- 5% K:+/-10% M:+/-20% Rated Voltage Ex.: 050:50Vdc 251:250Vdc 631:630Vdc 102:1000Vdc Packaging Ex.: T: Tape & Reel W: Waffle Pack B: Bulk Termination Ex.: S:Solderable Ag P:Pd/Ag N: 100% Sn Plated W:90/10 Sn/Pb Plated Testing Requirement Ex.: S: Standard Electrical H: Hi-Reliability Special Requirement Ex.: Blank: Standard O: Arc Prevention Coating X: Flexible Termination (Super Term) Z: Arc Prevention and SuperTerm

33 LCC Series-Large Size Multilayer Ceramic Chip Capacitors Dimensions BW L B W T Unit : mm [inches] TYPE L W T (max) B (min) BW (min) ± ± [.15±.020] [.15 ±.020] [.126] [.059] [.012] ± ± [.25±.020] [.20±.020] [.126] [.157] [.012] ± ± [.35±.020] [.30±.020] [.200] [.217] [.012] ± ± [.36±.020] [.40±.020] [.200] [.236] [.012] ± ± [.45±.020] [.40±.020] [.200] [.295] [.012] ± ± [.55±.020] [.50±.020] [.200] [.354] [.012] ± ± [.65±.020] [.60±.020] [.200] [.453] [.012] ±0.50 [.750±.020] 16.5±0.50 [.65±.020] 5.00 [.200] [.551] 0.30 [.012] Capacitance Range Size Dielectric Capacitance maximum 50V 100V 200V 500V 1KV 2KV 3KV 4KV 5KV 8KV NPO X7R NPO X7R NPO X7R NPO X7R NPO X7R NPO X7R NPO X7R NPO X7R All values are capacitance EIA codes. Other dimensions, capacitance values and voltage ratings are available. Please contact HEC. *Soldering and handling precautions: Large ceramic capacitors are more prone to thermal and mechanical cracks. To minimize mechanical cracks, capacitors have to be handled carefully in the original waffle pack container, carrier tape or other suitable container. Care must be taken that ceramic chips do not come into contact with one another causing chip outs, cracks or other mechanical damage. The recommended method for soldering large chips is reflow soldering. Wave soldering and manual soldering are not recommended. Ceramic capacitors should be preheated to within 50 C of the peak soldering temperature and then use a maximum 2 C/second ramp rate for both heating and cooling. A sudden increase or decrease in temperature during soldering may cause internal thermal cracks. Available Options: HEC offers flexible termination (Super Term) for very large chips to minimize mechanical cracks due to board flexing. To minimize the potential for surface arcing in higher voltage applications, HEC offers the option of a proprietary surface coating. Pure tin terminated / ROHS compliant products are offered as standard, however, lead (Pb) content plated termination is also available. Pd/Ag termination is also available as an option for hybrid circuits and other applications

34 SMC Series - Stacked MLCC Capacitors SMC Series Stacked MLCC Capacitors Features Stacked designs offer the high capacitance similar to tantalum but with the advantage of very low ESR. J, L and N leaded configurations provide mechanical and thermal stress relief. Capacitance values up to 34µF Voltages from 50V to 1000V. Available in NP0 and X7R dielectrics. HIREL screening available. RoHS compliant. Application Power supplies DC-DC converters Surge protection Industrial control circuits Snubbers Filtering, smoothing and decoupling applications HIREL applications Custom applications Summary of Specifications Operating Temperature -55 to +125 Rated Voltage Temperature Coefficient of Capacitance Capacitance Range Dissipation Factor Insulation Resistance Aging Dielectric Withstand Voltage Tolerance 50Vdc to 1000Vdc NPO : ± 30ppm/, -55 to +125 (EIA Class Ι ) X7R : ± 15%, -55 to +125 (EIA Class Ⅱ ) NPO: 1.0nF to 400nF X7R : 27nF to 34uF NPO : Q 1000 at 1KHz X7R : 2.5%max. at 1KHz 10GΩ or 500/C Ω whichever is smaller NPO : 0%, X7R : 2.5% per decade of time V 50V ; 250% Rated Voltage 100V V <500V ; 200% Rated Voltage 500V V <1KV ; 150% Rated Voltage 1000V = 120% Rated Voltage ± 1% & ± 2% tolerances are only available in NPO How To Order SMC 49 J X 224 K 501 T H 01 Product Code SMC: Commercial Size Switchmode Stack Capacitor Stack and Size The first digit : # of chips in stack Second Digit: Chip Size 5 : : : : : 2225 Lead Configuration Ex.: J : J Lead for h=0.070 L : L Lead for h=0.070 N : Straight Lead P : J Lead for h=0.045 S : L Lead for h=0.045 Material Ex.: N : NPO X : X7R Capacitance (pf) Ex.: 103 : 10x : 22x : 47x10 5 Tolerance Ex.: F : +/-1.0% G : +/-2.0% J : +/-5.0% K : +/- 10% M : +/- 20% Rated Voltage Ex.: 050 : 50Vdc 101 : 100Vdc 201 : 200Vdc 501 : 500Vdc 102 : 1000Vdc Packaging Ex.: T : Tape & Reel W : Waffle pack Special test Requirement Ex.: S : Standard electrical test H : Hi-Rel Testing Special Requirement Blank : No special requirement 01~99 : Customer special requirement

35 SMC Series - Stacked MLCC Capacitors Dimensions 1210 Size 1812 Size 2220 Size 1825/2225 J Type 1825/2225 L Type 1825/2225 N Type

36 SMC Series - Stacked MLCC Capacitors Unit : mm [inches] EIA Size Code Size Code L 3.80 Max 3.80 Max 5.50 Max 5.50 Max 6.50 Max 6.50 Max 5.35±0.50 W (max.) H (max.) S P h* (Typical) h* (P/S Type) LL** (min.) t # of leads per side [.150 Max] 2.90 [.114] 2.15 [.083] 1.65±0.50 [.065±.020] 1.30 Max [.051 Max] 2.25±0.1 [.089±.004] [.150 Max] 2.90 [.114] 4.30 [.165] 1.65±0.50 [.065±.020] 1.30 Max [.051 Max] 2.25±0.1 [.089±.004] [.217 Max] 4.00 [.157] 2.10 [.083] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.30 Max [.051 Max] 0.50±0.05 [.020±.002] [.217 Max] 4.00 [.157] 4.20 [.165] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.30 Max [.051 Max] 0.50±0.05 [.020±.002] [.256 Max] 5.50 [.217] 2.10 [.083] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.30 Max [.051 Max] 2.54 [.100] 0.50±0.10 [.020±.004] [.256 Max] 5.50 [.217] 4.20 [.165] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.30 Max [.051 Max] 2.54 [.100] 0.50±0.10 [.020±.004] [.210±.020] 6.85 [.270] 2.54 [.100] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 5.35±0.50 [.210±.020] 6.85 [.270] 5.08 [.200] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] EIA Size Code Size Code L 5.35± ± ± ± ± ± ±0.50 W (max.) H (max.) S P h* (Typical) h* (P/S Type) LL** (min.) t # of leads per side [.210±.020] 6.85 [.270] 7.62 [.300] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] * h varies depends on the lead style. See lead configuration above ** LL Applies only to straight (N) leads Capacitance Range EIA Chip Size [.210±.020] 6.85 [.270] [.400] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] [.210±.020] 6.85 [.270] 12.7 [.500] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] [.250±.020] 6.85 [.270] 2.54 [.100] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] [.250±.020] 6.85 [.270] 5.08 [.200] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] [.250±.020] 6.85 [.270] 7.62 [.300] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] [.250±.020] 6.85 [.270] [.400] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 6.35±0.50 [.250±.020] 6.85 [.270] [.500] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] Size Code NPO Maximum Capacitance X7R Maximum Capacitance 50V 100V 200V/250V 500V 1000V 50V 100V 200V/250V 500V 1000V 15 (1 Cap) (2 Cap) (1 Cap) (2 Cap) (1 Cap) (2 Cap) (1 Cap) (2 Cap) (3 Cap) (4 Cap) (5 Cap) (1 Cap) (2 Cap) (3 Cap) (4 Cap) (5 Cap) Other stacked configuration with other sizes, capacitance values and voltage rating sare available. Please contact HEC. *Soldering And Handling Precautions: The recommended method for soldering large capacitors is reflow soldering. Wave soldering and manual soldering are not recommended. Ceramic capacitors should be preheated to within 50ºC of the peak soldering temperature and then use a maximum of 2º/second ramp rate for both heating and cooling. A sudden increase or decrease in temperature during soldering may cause internal thermal cracking

37 Technical Specifications Specifications & Test Conditions Item Specification Test Conditions Operating Temperature Char. NP0(N) SL (L) X5R (B) X7R (X) X8R (H) X7E (C) X6S (S) Y5V (Y) Operating Temp. -55 ~ +125 C -55 C~+125 C -55 C~ +85 C -55 C~ +125 C -55 C~+150 C -55 C~+125 C -55 C~+105 C -30 C~ +85 C Visual No abnormal exterior appearance Visual Inspection Capacitance Within the specified tolerance Char. Frequency Voltage NP0/SL Quality Factor ClassⅠ(NP0/SL): More Than 30pF : Q 1000 C 100pF 1MHz±10% 1.0±0.2Vrms 30pF & Below: Q C (C:Cap., pf) C>100pF 1KHz±10% Dissipation Factor ClassⅡ(X7R/X5R/X8R/X6S/Y5V): Please see table 1 for details ClassⅡ(X7E: Maximum 1% 1KHz±10% 1.0±0.2Vrms Perform a heat temperature at 150±5 for 30min. then place at room temp. for 24±2hr. Insulation Resistance 10,000MΩ or 500/C Ω whichever is smaller for rated voltage>10v and greater 100/C Ω for rated voltage 10V. X1/Y2 and X2/Y3: 10GΩ min Applied voltage : rated voltage Charge time : 60±5 sec. Charge-discharge current shall be less than 50mA current. Applied voltage: 500V charge time 60 sec Dielectric Withstand Voltage (DWV) (Unless otherwise stated on product descriptions) Temperature Capacitance Coefficient No dielectric breakdown or mechanical breakdown X1/Y2 and X2/Y3 Char. Temp. Range Cap. Change NP0(N) -55 C~+125 C ± 30ppm/ SL (L) -55 C~+85 C +350/ -1000ppm/ C X7R (X) -55 C~ +85 C ± 15% X5R (B) -55 C~ +125 C ± 15% X8R (H) -55 C~+150 C ± 15% X5E (C) -55 C~ +85 C ± 4.7% X6S (S) -55 C~+105 C ± 22% Y5V (Y) -30 C~ +85 C +22/-82% V 50V : 250% rated voltage 100V V < 500V : 200% rated voltage 500V V < 1000V : 120% rated voltage Voltage applied for 1~5 sec. Current is limited to less than 50mA X Capacitor : Applied voltage 1075Vdc(4.3Ur) Y Capacitor: Applied Voltage 1500Vac For 1 Min. Current limited to less than 50mA ClassΙ: [C2-C1/C1(T2-T1)] 100% ClassⅡ: (C2-C1)/C1 100% T1:Standard temperature(25 ) T2:Test temperature C1:Capacitance at standard temperature C2:Capacitance at test temperature Adhesive Strength of Termination No indication of peeling shall occur on the terminal electrode. 5N f A 5N f ( 0.5Kg f) pull force shall be applied for 10±1 sec

38 Technical Specifications Specifications & Test Conditions Item Specification Test Conditions Resistance to Flexure of Substrate No mechanical damage or capacitance change more than the following table. Char. NP0(N)/SL(L) X7R (X) X5R (B) X8R (H) X7E (C) X6S (S) Y5V (Y) Capacitance Change ± 5.0% of initial value ± 12.5% of initial value ± 12.5% of initial value ± 12.5% of initial value ± 12.5% of initial value ± 12.5% of initial value ± 30.0% of initial value The board should bend 1.0mm with a rate of 1.0 mm/sec. R230 Bending Limit 45±1mm C Meter 45±1mm Solderability More than 90% of the termination surface should be soldered so the metal part does not come out or dissolve. Solder Temperature : 245±5 Dip Time : 5 ± 0.5 sec. Immersing Speed : 25±10% mm/s Solder : H63A Flux :Rosin Preheat : At 80~120 For 10~30sec. Resistance to Soldering Heat Appearance Capacitance No mechanical damage shall occur ClassⅠ(NP0): Within 2.5% or ±0.25pF whichever is larger of initial value ClassⅡ: Char. Cap. change X5R(B) ±7.5% of initial value X7R(X) ±7.5% of initial value X8R (H) ±7.5% of initial value X7E (C) ±7.5% of initial value X6S (S) ±7.5% of initial value Y5V(Y) ±20% of initial value ClassⅡ capacitor shall be set for 48± 4 hours at room temperature after one hour heat treatment at /-10 before initial measuring. Preheat : at 150±10 C for 60~120sec. Dip : solder temperature of 260±5 Dip Time : 10 ± 1sec. Immersing Speed : 25±10% mm/s Solder : H63A Flux : Rosin Measure at room temperature after cooling for ClassⅠ: 24 ± 2 Hours ClassⅡ: 48 ± 4 Hours Q / Tanδ Insulation Resistance To satisfy the specified initial value To satisfy the specified initial value Temperature Cycle Appearance Capacitance Q / Tanδ No mechanical damage shall occur ClassⅠ(NP0): Within 2.5% or ±0.25pF whichever is larger of initial value Char. Cap. change X5R(B) ±7.5% of initial value X7R(X) ±7.5% of initial value X8R(H) ±7.5% of initial value X7E(C) ±7.5% of initial value X6S(S) ±7.5% of initial value Y5V(Y) ±20% of initial value To satisfy the specified initial value ClassⅡ capacitor shall be set for 48±4 hours at room temperature after one hour heat treatment at /-10 before initial measuring. Capacitor shall be subjected to five cycles of the temperature cycle as following: Step Temp.( ) Time(min) 1 Min Rated Temp.+0/ Max Rated Temp.+3/ Measure at room temperature after cooling for ClassⅠ: 24 ± 2 Hours ClassⅡ: 48 ± 4 Hours Insulation Resistance To satisfy the specified initial value

39 Technical Specifications Specifications & Test Conditions Item Specification Test Conditions Humidity Appearance Capacitance Q Class Ι Tanδ ClassⅡ Insulation Resistance No mechanical damage shall occur ClassⅠNP0(N)/SL(L): Within 5.0% or ±0.5pF whichever is larger of initial value ClassⅡ: Char. Cap. change X5R(B) X7R(X) X8R(H) X7E(C) X6S(S) Y5V(Y) ClassⅡ capacitor shall be set for 48±4 hours at room temperature after one hour heat treatment at /-10 before initial measure. Temperature : 40± 2 Relative humidity : 90 ~95%RH Test Time : /-0 hr ±12.5% of initial value ±12.5% of initial value Measure at room temperature after cooling for ±12.5% of initial value ClassⅠ: 24 ± 2 Hours ±12.5% of initial value ClassⅡ: 48 ± 4 Hours ±12.5% of initial value ±30% of initial value 30pF & over : Q to 30pF : Q C 30pF & below: Q C Please see table 1 for details 1,000MΩ or 50/C Ω whichever is smaller for rated voltage>10v and greater 10/C Ω for rated voltage 10V. (C in Farad) Damp Heat/ Steady State Appearance Capacitance Q Class Ι Tanδ ClassⅡ No mechanical damage shall occur ClassⅠ(NP0)/SL(L): Within 7.5% or ±0.75pF whichever is larger of initial value ClassⅡ: Char. Cap. change X5R(B) ±12.5% of initial value X7R(X) ±12.5% of initial value X8R(H) ±12.5% of initial value X7E(C) ±12.5% of initial value X6S(S) ±12.5% of initial value Y5V(Y) ±30% of initial value 30pF & Over : Q to 30pF : Q C 30pF & Below: Q C Please see table 1 for details ClassⅡ capacitors applied DC voltage of the rated voltage is applied for one hour at maximum Operating temperature ±3 then shall be set for 48±4 hours at room temperature and the initial measurement shall be conducted. Applied Voltage :Rated Voltage Temperature : 40±2 Relative humidity : 90 ~95%RH Test time : /-0Hr Current applied : 50 ma Max. Measure at room temperature after cooling for ClassⅠ: 24 ± 2 Hours ClassⅡ: 48 ± 4 Hours Insulation Resistance 500MΩ or 25/C Ω whichever is smaller for rated voltage>10v and greater 5/C Ω for rated voltage 10V. (C in Farad)

40 Technical Specifications Specifications & Test Conditions Item Specification Test Conditions High Temperature Load (Life Test) Appearance Capacitance Q Class Ι No mechanical damage shall occur ClassⅠ(NP0)/SL(L): Within 5.0% or ±0.5pF whichever is larger of initial value ClassⅡ: Char. Cap. change X5R(B) ±12.5% of initial value X7R(X) ±12.5% of initial value X8R(H) ±12.5% of initial value X7E(C) ±12.5% of initial value X7R(S) ±12.5% of initial value Y5V(Y) ±30% of initial value 30pF & Over : Q to 30pF : Q C 30pF & Below: Q C ClassⅡ Capacitors : The applied DC test voltage is applied for one hour at maximum operating temperature ±3, then left to stabilize for 48±4 hours at room temperature before the initial measurement is taken. Applied voltage : please see HEC specification data sheet. Temperature : max. operating temperature Test Time : /-0Hr Current applied : 50 ma max. Measure at room temperature after cooling for ClassⅠ: 24 ± 2 hours ClassⅡ: 48 ± 4 hours Tanδ ClassⅡ Please see table 1 for details Insulation Resistance 1,000MΩ or 50/C Ω whichever is smaller. For rated voltage>10v and greater 10/C Ω for rated voltage 10V. (C in Farad) Vibration Appearance No mechanical damage shall occur Capacitance Q / Tanδ Within the specified tolerance To satisfy the specified initial value Solder the capacitor on P.C. board. Vibrate the capacitor with an amplitude of 1.5mm P-P changing the frequencies from 10Hz to 55Hz and back to 10Hz in about 1 min. Repeat this for 2 hours each in 3 perpendicular directions

41 Technical Specifications Table 1 Dielectrics: X5R, X7R, X8R, X7E, X6S Tanδ Size Rated Voltage Capacitance Range -Initial -Vibration -Resistance to solder heat -Temperature Cycle -Humidity -Damp Heat/Steady state -High Temperature Loading DC 6.3V C 0.01µF 5.0% 7.5% C=0.1µF 15.0% 25.0% DC 10V C 0.01µF 5.0% 7.5% DC 16V C 2.2nF 3.5% 7.5% 2.2nF<C 3.3nF 5.0% 7.5% DC 25V C 2.2nF 2.5% 5.0% DC 50V C 1.0nF 2.5% 5.0% DC 6.3V C 0.22µF 10.0% 15.0% C 0.47µF 15.0% 25.0% DC 10V C 0.1µF 5.0% 7.5% 0.1µF<C 1µF 15.0% 25.0% DC 16V C 0.22µF 5.0% 7.5% DC 25V C 0.1µF 3.5% 7.5% DC 50V C 3.9nF 2.5% 5.0% DC 4V C 10µF 15.0% 25.0% C<1µF 7.5% 12.5% DC 6.3V 1µF C<2.2µF 10.0% 15.0% 2.2µF C<4.7µF 10.0% 15.0% C 4.7µF 15.0% 25.0% C<1µF 5.0% 7.5% DC 10V 1µF C<2.2µF 7.5% 12.5% C 2.2µF 10.0% 15.0% C 0.1µF 3.5% 7.5% DC 16V C<1µF 5.0% 7.5% C 1µF 7.5% 12.5% C 0.1µF 3.5% 7.5% DC 25V 0.1µF<C 0.47µF 5.0% 7.5% C>0.47µF 7.5% 12.5% DC 50V C<0.1µF 2.5% 5.0% C 0.1µF 3.5% 7.5% DC 4V C 10µF 15.0% 25.0% C 3.3µF 7.5% 12.5% DC 6.3V C 4.7µF 10.0% 15.0% C 10µF 15.0% 25.0% C 2.2µF 5.0% 7.5% DC 10V 2.2µF<C 4.7µF 10.0% 15.0% C>4.7µF 2.5% 5.0% C 0.47µF 2.5% 5.0% DC 16V 0.47µF<C 1µF 5.0% 7.5% 1µF<C 4.7µF 10.0% 15.0% C>04.7µF 15.0% 25.0% DC 25V C 0.47µF 3.5% 7.5% 0.47µF<C 4.7µF 10.0% 15.0% DC 50V C 0.033µF 2.5% 5.0% 0.033µF<C 0.47µF 3.5% 7.5%

42 Technical Specifications Table 1 cont. Dielectrics: X5R, X7R, X8R, X7E, X6S Dielectric: Y5V Size Rated Voltage Capacitance Range -Initial -Vibration -Resistance to solder heat -Temperature Cycle Tanδ -Humidity -Damp Heat/Steady state -High Temperature Loading DC 6.3V C<10µF 10.0% 15.0% C 10µF 15.0% 25.0% DC 10V C 10µF 5.0% 7.5% C>10µF 10.0% 15.0% C<4.7µF 5.0% 7.5% DC 16V 1206 C 4.7µF 10.0% 15.0% C 2.2µF 3.5% 7.5% DC 25V 2.2µF<C 4.7µF 5.0% 7.5% 4.7µF<C 10µF 10.0% 15.0% DC 50V C 0.22µF 2.5% 5.0% 0.22µF<C 1µF 3.5% 7.5% DC 6.3V C 47µF 10.0% 15.0% 47µF<C 100µF 15.0% 25.0% C 10µF 5.0% 7.5% DC 10V 10µF<C 22µF 10.0% 15.0% 22µF<C 47µF 15.0% 25.0% 1210 DC 16V C 10µF 5.0% 7.5% 10µF<C 47µF 15.0% 25.0% DC 25V C 10µF 5.0% 7.5% 10µF<C 22µF 15.0% 25.0% DC 35V C<4.7µF 5.0% 7.5% C 4.7µF 10.0% 15.0% DC 50V C 1µF 3.5% 7.5% DC 6.3V All Capacitance 10.0% 15.0% DC 10V 10.0% 15.0% DC 16V 5.0% 7.5% 1812 DC 25V 5.0% 7.5% DC 25V 2.5% 5.0% DC 35V 2.5% 5.0% DC 50V 2.5% 5.0% 2220 All Voltages All Capacitance 2.5% 5.0% Size Rated Voltage Capacitance Range -Initial -Vibration -Resistance to solder heat -Temperature Cycle Tanδ -Humidity -Damp Heat/Steady state -High Temperature Loading 0201 DC 6.3V All Capacitance 20.0% 30.0% 0402 DC 10V All Capacitance 20.0% 30.0% DC 16V All Capacitance 12.5% 20.0% DC 25V All Capacitance 9.0% 11.0% DC 25V All Capacitance 5.0% 7.5% DC 50V All Capacitance 5.0% 7.5%

43 Technical Specifications Table 1 cont. Dielectric: Y5V Size Rated Voltage Capacitance Range -Initial -Vibration -Resistance to solder heat -Temperature Cycle Tanδ -Humidity -Damp Heat/Steady state -High Temperature Loading DC 6.3V All Capacitance 20.0% 30.0% C<1µF 7.0% 10.5% DC 10V C 1µF 16.0% 25.0% C 2.2µF 20.0% 30.0% DC 16V C<1µF 7.0% 10.5% C 1µF 16.0% 25.0% C 0.1µF 5.0% 7.5% DC 25V C<1µF 7.0% 10.5% C 1µF 12.5% 20.0% DC 50V C<0.1µF 5.0% 7.5% C 0.1µF 7.0% 10.5% DC 6.3V All Capacitance 20.0% 30.0% DC 10V C 4.7µF 12.5% 20.0% C 10µF 20.0% 30.0% C 1µF 7.0% 10.5% DC 16V 1µF C<4.7µF 10.0% 15.0% C 4.7µF 12.5% 20.0% DC 25V C<1µF 7.0% 10.5% C 1µF 10.0% 15.0% DC 50V C<1µF 5.0% 7.5% C 1µF 10.0% 15.0% DC 10V C 1.0µF 12.5% 20.0% C 2.2µF 20.0% 30.0% C<1µF 7.0% 10.5% DC 16V 1µF C<10µF 10.0% 15.0% C 10µF 12.5% 20.0% C<1µF 5.0% 7.5% DC 25V 1µF C<4.7µF 7.0% 10.5% C 4.7µF 10.0% 15.0% C 10µF 12.5% 20.0% DC 35V C 2.2µF 7.0% 10.5% DC 50V C<1µF 5.0% 7.5% C 1µF 7.0% 10.5% DC 6.3V All Capacitance 20.0% 30.0% DC 10V All Capacitance 20.0% 30.0% DC 16V All Capacitance 12.5% 20.0% C<1µF 7.0% 10.5% DC 25V C 10µF 10.0% 15.0% 10µF<C 22µF 12.5% 20.0% DC 35V C 10µF 10.0% 15.0% DC 50V All Capacitance 7.0% 10.5% DC 6.3V All Capacitance 20.0% 30.0% DC 10V All Capacitance 20.0% 30.0% DC 16V All Capacitance 12.5% 20.0% DC 25V All Capacitance 10.0% 15.0% DC 35V All Capacitance 10.0% 15.0% DC 50V All Capacitance 10.0% 15.0%

44 Packing Information Multilayer Ceramic Chip Capacitor Bulk Packing Standard packing 10Kpcs/pack. Special customer requirements considered. Tape Packing Paper Tape Top Cover Tape Embossed Tape Top Cover Tape Carrier Tape Embossed Carrier Tape Bottom Cover Tape Trailer Section 40mm min. Chip Section Leader Section 20mm min. Drawing Direction 400mm min. Material And Quantity ( 180mm) Chip Size Dimension (mm) 180mm reel (EIA Code) L W T Paper Tape Plastic Tape T ,000 pcs/reel N/A T ,000 pcs/reel N/A T ,000 pcs/reel N/A T ,000 pcs/reel N/A 0.9< T 1.25 N/A 3,000 pcs/reel T ,000 pcs/reel N/A 0.9< T 1.25 N/A 3,000 pcs/reel T>1.25 N/A 2,000 pcs/reel T 1.25 N/A 3,000 pcs/reel T>1.25 N/A 2,000 pcs/reel T 1.25 N/A 3,000 pcs/reel T>1.25 N/A 2,000 pcs/reel T 2.20 N/A 1,000 pcs/reel T>2.20 N/A 700 pcs/reel T 2.20 N/A 700 pcs/reel T>2.20 N/A 400 pcs/reel T 2.20 N/A 1,000 pcs/reel T 2.20 N/A 1,000 pcs/reel T>2.20 N/A 700 pcs/reel T 2.20 N/A 1,000 pcs/reel T>2.20 N/A 700 pcs/reel T 2.20 N/A 700 pcs/reel T>2.20 N/A 400 pcs/reel NA:Not Available -42 -

45 Packing Information Dimensions of Tape Specification Paper Tape Pitching Hole I Chip Cavity B A F G H t C D E Unit:mm A 0.37± ± ± ± ± ±0.2 B 0.67± ± ± ± ± ±0.2 C 4.00± > D 2.0± > E 2.00± > 4.00± > F 1.75± > G 3.5± > H 8.00± > I / > t 1.1 max > Embossed Tape Pitching Hole I Chip Cavity B A F G H J t O C D E Unit:mm A 1.5± ± ± ± ± ± ± ± ± ±0.2 B 2.3± ± ± ± ± ± ± ± ± ±0.2 C 4.0±0.1 D 2.0±0.05 E 4.0± ±0.1 F 1.75±0.1 G 3.5± ±0.05 H 8.0± /-0 I /-0 J 3.0 max. 4.0 max. t 0.3 max. O 0.15 min

46 Packing Information Reel Dimension Unit:mm r E C D B 0402 to to 2220 A 382 max. 178±0.2 B 50 min. 60±0.2 C 13±0.5 13±0.5 D 21±0.8 21±0.8 E 2.0± ±0.5 W 10± ±0.3 t 2.0±0.5 17±1.4 r A W t Bulk Cassette Packing 10mm 53.3mm mm mm mm 6.8±0.1mm 8.8±0.1mm 12.0±0.1mm Cassette Packing Unit:mm Chip Size Length 1.00± ± ±0.20 Width 0.50± ± ±0.20 Thickness 0.50± ± ±0.10 Quantity 50,000pcs 15,000pcs 10,000pcs mm mm 19.0mm 110±0.7 mm 5.0mm Cover Tape Peel Off Force 165 to 180 Peel direction Top Tape Bottom Tape The peel off force of cover tape is 5 to 70 grams in the direction of the arrow

47 EIA Designations EIA Designations For Class Ι Dielectrics Coefficient of capacitance (ppm/ ) 0.0 C 1.0 M 1.5 P 2.2 R 3.3 S 4.7 T 7.5 U Multiplier applicable to column Ex.: C0G 0±30ppm/ U2J Negative 750±120ppm/ Tolerance of temp. coeff.(ppm/ ) 30 G 60 H 120 J 250 K 500 L 1000 M 2500 N For Class Π Dielectrics Low Temp. Symbol -55 X -30 Y +10 Z High Temp. Symbol Ex.: X7R -55 ~ +125 ±15% Y5V -30 ~ %/-82% Max. % C Symbol ±1.0% A ±1.2% B ±2.2% C ±3.3% D ±4.7% E ±7.5% F ±10.0% P ±15.0% R ±22.0% S +22% /-33% T +22% /-56% U +22% /-82% V Temperature Coefficient Performance Class EIA Symbol Dielectric Code Temperature Range( ) Capacitance Change Reference Temperature Ι NP0 N -55 ~ ±30 ppm/ 25 SL L -25 ~ /-1000 ppm/ 25 Π X7R X -55 ~ +125 ±15% 25 X7E C -55 ~ +125 ±4.7% 25 X5R B -55 ~ +85 ±15% 25 Y5V Y -30 ~ /-82% 25 Y5U E -30 ~ /-56% 25 Z5U Z +10 ~ /-56% 25 Dielectric Material Ageing Rate Ageing Rate NP0: 0 X7R/X5R : 1 ~ 4 % /decade Y5V : 6~10 % /decade After performing de-ageing at 150±5 for 30 minutes and placement at room temperature for 48 hours

48 Precautionary Information Construction of Board Pattern Improper circuit layout and pad/land size may cause poor solder joints between the component and the PC board. Insufficient solder may create weak joints and excessive solder may increase the potential of mechanical or thermal cracks within the ceramic capacitor. Therefore we recommend the solder pad/land size to be as shown in the following table: 1. Size and recommended land dimensions for reflow soldering C B Capacitor E D A Slit Land Solder Resistor EIA Code Chip (mm) Land (mm) L W A B C D E ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ Mechanical strength varies according to the location of the chip capacitors on the P.C. board. Design the layout of the PCB in such a way as to minimize stress imposed on the components upon flexing the boards during depanelization or other processes. e perforation c slit b Component layout close to the edge of the board or the depanelization line is not recommended. Susceptibility to stress is in the order of: a>b>c and d>e a d Mounting 1. Sometimes cracking can be caused by the impact load of the pick and place nozzle. In the pick and place operation, if the low dead point is too low, excessive stress is applied to component. This may cause cracks in the ceramic capacitor, it is therefore recommended to move the low dead point of the nozzle to a higher level to minimize board warpage and stress on the components. Nozzle pressure should be adjusted to 1N to 3N (static load) during the pick and place operation. Excessive Stress Warping of Board Warping of Board Nozzle Crack PCB Support pin 2. Amount of Adhesive a b a Example : 0805 & 1206 a 0.2mm min. b 70 ~ 100 μm c Do not touch the solder land c c

49 Precautionary Information Handling after chip mounting 1. Proper handling of the PCB is recommended since excessive bending and twisting of the PCB may induce mechanical stress and cause internal cracking of the capacitor. High potential of cracking Low potential of cracking Bending Twist 2. There is a potential of cracking if the board is warped due to excessive load from the check pin. Bad Good Support Pin Check pin Check pin 3. Examples of PCB de-panelization jigs: The outline of a PCB breaking jig is shown below. It is recommended when dividing or breaking PCBs that they are held near the jig where no bending will occur. In this way there will be no compressive stress applied to the components or capacitors on the PCB. Do not hold the PCB at a position which is far away from the jig. Tensile stress may cause the capacitors to crack. PCB V-groove PCB splitting jig Poor Dividing Load Direction Load Direction Recommend Dividing Load Direction PCB V-groove Chip Component Load Direction Chip Component

50 Precautionary Information Soldering 1. Wave Soldering Most components are wave soldered with solder at 230 to 250 C. Adequate care must be taken to prevent the potential of thermal cracks in the ceramic capacitors. Refer to the soldering methods below for optimum soldering benefits. For SMC range see special recommendations on page 34. Temperature ( C) Recommended wave soldering profile Soldering Pre-heating T Cooling Soldering Method Change in Temp.( ) 1206 and Under T 100~130 max to 1812 T 70~100 max 2220 and greater Not recommended 120seconds or more 60seconds or more 2 to 3 sec. To optimize the result of soldering, proper preheating is essential: 1) Preheat temperature is too low a. Flux flows too easily b. Possibility of thermal cracks 2) Preheat temperature is too high a. Flux deteriorates even when oxide film is removed b. Causes warping of the circuit board c. Loss of reliability in chips and other components Cooling Condition: Natural cooling using air is recommended. Forced cooling should be avoided. However if the chips are dipped into a solvent for cleaning, the temperature difference (ΔT ) between the solvent and the chips must be less than 100 C. 2. Reflow Soldering Preheating to the reflow temperature is recommended to decrease the potential of thermal cracking in the components. The recommended heating rate depends on the size of component, however it should not exceed 3 C/Sec. Recommend reflow profile for lead-free soldering temperature profile (MIL-STD-202G #210F) Soldering Pre-heating Cooling Temperature ( C) 260max. 217 T 260 C max./ 10 sec. Soldering Method Change in Temp.( ) 1206 and Under T and Over T 130 Number of soldering cycles : 2 (max.) 150 C /60sec. Min. 70 to 90 sec

51 Precautionary Information 3. Hand Soldering Sudden temperature changes in ceramic capacitors will result in a temperature gradient within the component and may therefore cause internal thermal cracking. In general a hand soldering method is not recommended particularly on sizes 2220 and over, unless proper preheating and handling precautions are taken. Care must also be taken not to touch the ceramic body of the capacitor with the tip of soldering iron. The soldering iron tip should always be placed on to the solder pad. For SMC range see special recommendations on page 34. Temperature ( C) T Soldering Method Change in Temp.( ) 1206 and Under T and Over T 130 Within 5 seconds. How to Solder Repair by Solder Iron 1) Selection of the soldering iron tip The required temperature of the soldering iron for any type of repair depends on the type of the tip, the substrate material and the solder land size. 2) Recommended solder iron condition a.) Preheat the substrate to 60 C to 120 C on a hot plate. Note that due to the heat loss, the actual setting of the hot plate may have to be higher (for example 100 C to 150 C). b.) Soldering iron power should not exceed 30 W. c.) Soldering iron tip diameter should not exceed 3mm. d.) Temperature of the iron tip should not exceed 350 C and the process should be finished within 5 seconds (refer to MIL-STD-202G). e.) Do not touch the ceramic body with the tip of solder iron. Direct contact of the soldering iron tip to the ceramic body may cause thermal cracks. f.) After soldering, products should be allowed to cool naturally in air. Storage Capacitors should be stored where temperature and relative humidity do not exceed 40 C and 70%RH. We recommend capacitors be used within 12 months from the date of manufacturing. Products should be stored in the original packaging and should not be removed from the outer polyethylene bag until just before usage. If the packaging is open, seal it as soon as possible or keep it in a desiccant with a desiccation agent

52 Eliminating Mechanical Cracking Super Term Internal MLCC cracking can result in serious failure modes. If ceramic capacitors are subjected to severe mechanical stress, a bending crack may occur. This crack can run through two or more electrodes of opposing polarity and result in a short circuit. Typical bending cracks are shown below. In the worst case scenario, these short circuits may lead to the MLCC overheating and catastrophic failure. Super Term Advantages Flexible Termination Layer incorporated Reduce Cracking due to Mechanical Stress Typical Applications are power circuit input and output filtering, smoothing Ag/Cu Plating-Ni Plating-Sn Solder PCB Bending force Crack Standard termination construction may result in cracking during PCB bending, vibration, Depanelizing, etc. Actual Examples: Failure Mode Type 1 Surface View Crack running through at least two electrodes. Cross Section View Failure Mode Type 2 (wetting greater than 2/3 of thickness) Crack The failure mode results from PCB bending forces. These cracks may not be visible on the MLCC surface. Cross sectional analysis is required to determine these internal cracks. Crack Crack MLCC cracking frequently occurs during the circuit board depanelizing process. The root cause is knife (blade) vibration during the process. Top View Cross Section View

53 Eliminating Mechanical Cracking Super Term Holy Stone has developed the Super Term Series (TX suffix in the part number), which incorporates a flexible layer in the termination structure. This construction effectively absorbs external forces, reduces the incidence of cracking and improves overall product reliability. Super Term product applications include : high temperature automotive, power circuits and other critical end products with extreme processing conditions. Super Term TX Product Ag/Cu Flexible Layer Plating-Ni Plating-Sn Solder Bending PCB force Crack Prevention Reliability/Durability Comparison Failure Rate (a) Thermal Shock Comparison ( 0805/X7R) Normal Thermal Shock SuperTerm Cycles Thermal shock test on standard termination results in inception of failure at 500 cycles. Super Term TX Series reliability improves to over 3000 cycles. (b) Substrate Flexure Comparison ( 0805/X7R) Failure Rate Normal Thermal Shock SuperTerm Cycles Bending test on Super Term shows an improvement of about 5.0 mm bend vs. an average of about 2.0 mm. for standard termination. Polymer Ag No cracking apparent in the ceramic During destructive bending tests, the PCB is subjected to bending until capacitor failure. With Super Term there is no cracking damage in the ceramic. Super Term effectively prevents ceramic body cracking during extreme mechanical stress as simulated by this test. Plating : Sn Plating : Ni Glass Ag Polymer Ag Super Term failures resulting from destructive bending test tend to occur in the OPEN mode and not short circuit mode typical of standard termination failures. The Super Term material is a polymer silver material and can be seen in the above photo

54 Coated Products for Surface Arc Prevention MLCC Arc Prevention for Hi-Pot Testing Due to the open and porous nature of the surface of the X7R dielectric, moisture and/or dirt which will have a lower resistance than the dielectric grains, can become entrapped in the surface. Dirt can also include any flux residues as a result of the soldering process. This dirt/flux as well as becoming entrapped into the surface will, in itself, attract additional moisture onto the surface thus reducing the surface resistance and the voltage at which arcing occurs. Surface arcing or flashover at worst can cause equipment failure during isolation testing and, in addition, will leave a carbon track on the surface which can lead to eventual failure of the capacitor. Arc Prevention Increases voltage at which arcing occurrs Passed IEEE VAC or 2250VDC Typical Applications for telecommunication devices(ieee802.3) in LAN interface, Ballast Holy Stone has developed an Arc Prevention coating process that coats the surface of the dielectric without encroaching onto the termination material. This coating makes the surface of the dielectric non porous and prevents moisture and dirt becoming trapped thus reducing the surface resistance and the arcing voltage of the capacitor. It has been shown that the arcing voltage can be increased by up to 65% on soldered parts by using the Holy Stone Arc Prevention Coating. Typical surface arcing on X7R MLCC is from termination-totermination (shown in polarized light) NP0 & X7R Material Characteristic Comparison Item NP0 X7R Dielectric Constant 30 ~ ~ 4000 I. Resistance >10 13 Ω >10 11 Ω B.D. Voltage 70~80 Vdc/um 40~50 Vdc/um Grain Size < 500nm 900nm ~ 1500nm Grain Size (x8000) Porosity (x1000) The different grain shape and size will lead to different grain density after sintering. The grain size of NP0 dielectric is smaller than that of X7R resulting a denser and less porous structure. Surface porosity will trap dirt, flux and moisture causing the surface resistance to dramatically decrease. Low surface resistance will cause the arcing voltage to reduce, possibly leading to failure of the capacitor or equipment during isolation testing. Using the Holy Stone Arc Prevention coating effectively makes the surface of X7R dielectric similar to that of NP

55 Coated Products for Surface Arc Prevention Creepage distance v.s. Arcing Voltage Recommended Solder Pad Design Capacitor C Land Solder Dam 3.2mm Solder Ball Solder balls reduce the creepage distance between terminations and thus reduce the arcing voltage B A EIA Code Chip (mm) Land (mm) L W A B C ± ± ~ ~ ~ ± ± ~ ~ ~ ± ± ~ ~ ~ ± ± ~ ~ ~ ± ± ~ ~ ~4.8 Distance between terminations also has a direct effect on the arcing voltage. The greater the distance (chip size) the higher this voltage will be. Solder pad design will have a significant effect on the arcing of high voltage capacitors. Above is our recommended solder pad land design or each chip size. Arc Prevention Coating. The application of the Arc Prevention coating, which is a high insulation resistance material, coats the surface of the dielectric with a smooth and non porous layer that prevents moisture entering the surface pours and also aids cleaning post soldering. The following diagrams show the difference between coated and non coated X7R components. Surface Comparison Item Before After Porosity (x1000) Surface Appearance of non coated and coated product. High Voltage Test Comparison Failure Rate (%) Normal Type Coated Product High Voltage Test Voltage (Vdc) The coating reduces the porosity of the X7R surface and provides a smooth surface which help prevent surface arcing. The maximum Hi-pot test level may be increased by >1000Vdc after coating with both unsoldered and soldered components. Using the Holy Stone Arc Prevention coating increases the surface arcing voltage of X7R capacitors to almost that of an equivalent NP0 part, however the higher dielectric constant of X7R allows for higher capacitance values to be achieved in any given case size. The Holy Stone Arc Prevention coating provides a total solution to the harmful effects of surface arcing

56 RoHS Compliant Description: MLCC, Ceramic Disc Capacitors: NP0, SL, X7R, X5R, X6S, X7E, Y5V and Y5U dielectrics. Basic Construction/Homogenous Material : (a) Standard Type Solder Metal (b) X Type: Super Termination (Option) Solder Metal Barrier External Electrodes Inner Electrodes Barrier Polymer Electrodes External Electrodes Inner Electrodes Ceramic Body Ceramic Body Multi-layer Ceramic Chip capacitors are homogenous devices manufactured from materials that cannot be mechanically disjointed into different materials. Multi-layer Ceramic Chip products : Standard sizes are fully RoHS compliant. Group Series RoHS Status Cadmium Hexavalent Chromium Lead * Mercury PBBs PBDE Limit <0.01% <0.01% <0.1% <0.01% <0.01% 0.01% MLC Family Surface Mount Products NCC,HCC,VAC,RFC, HCX, SMC, LCC Available TCX,LDC, HTC Available HCN,SAC SCC, Available / * HVC NP0 Available / * X7R Available / * * Pb in internal ceramic insert exempt from RoHS annex 7 to Article 4.1 RoHS Status Lead-Free Status / MSL level External plating : 100% Matte Sn as standard. Pb-free reflow & wave solder compliant, MSL=1 Reflow : 260 max recommended. Wave : 260 max recommended, Wave & reflow profile refer to HEC recommended solder profile. Part Number Designation: RoHS compliant : No change to P/N (Generally no change to P/N, but available Pb-free : No change to P/N as P/N prefix at customer request) Product marking : (available at customer request, highlighted or marked on reel and container) Pb free : Pb free refer to JEDEC&IPC Std

57 ISO Certifications ISO Certifications Plant Certificated Date Organization Registration No. Taipei HQ/Lung Tan Factory ISO 9001: ,Mar.,2002 BVQI TW08098Q Taipei HQ/Lung Tan Factory ISO 14001: ,May,2003 BVQI Dongguan Manufacturing ISO 9001: Dec.,2003 BVQI TW08098Q Taipei HQ/Lung Tan Factory QS 9000 : Oct.,2004 BVQI ISO 9001:2000 ISO 14001:1996 QS 9000:

58 MEMO

59 A Partner You Can Trust Worldwide Sales Contacts Location in Taiwan Taipei HQ / 台北總公司台北市內湖區環山路二段 62 號 1 樓 1FL, No. 62, Sec. 2, Huang Shan Rd., Nei Hu Dist., Taipei, Taiwan, R.O.C. Tel: Fax: Zip code: 114 Kaohsiung Sales Office / 高雄分公司高雄市前鎮區一心一路 239 號 8 樓之一 8FL-1, No.239, Yi-Hsin 1st. Road, Chien Chen Dist., Kaohsiung, Taiwan, R.O.C. Tel: Fax: Zip code: 806 Lungtan Plant / 龍潭生產事業處桃園縣龍潭鄉烏林村工五路 90 巷 56 號 No.56, Lane 90, Kung Wu Road, Wu Lin Village, Lung Tan Hsiang, Tao Yuan County, Taiwan, R.O.C. Tel: Fax: Zip code: 325 Location in China Shanghai Sales Office / 上海分公司上海市延安西路 1160 号首信银都大厦 16 楼 16F, Shouxinyindu Building, 1160 YanAn (W) Road, Shanghai, China. Tel: Fax: Zip Code: Dongguan Plant / 東莞廠廣東省東莞市塘廈鎮蛟乙塘村寶石工業區 Baoshi Industrial Area, Jiaoyitang Tangxia Town, Dongguan Guangdong, China. Tel: Fax: Zip code: Suzhou Sales Office / 蘇州分公司蘇州市新區鄧尉路 9 號潤捷廣場 1 棟 208 室 Room 208, Building 1 Runjie Plaza, No.9 Dengwel Road, Suzhou New Area, China Tel: Fax: Zip code: Hong Kong Office / 香港分公司香港九龍灣宏開道 15 號九龍灣工業中心 726 室 Room 726, Kowloon Bay Industrial Center, 15 Wang Hoi Road, Kowloon Bay, Hong Kong. Tel: Fax: Location in Singapore Holy Stone Holdings Co., Ltd. Blk 7 Kallang Place #03-04,Singapore Tel : (65) Fax: (65) Location in USA Holy Stone International Jefferson Ave. Suite H Murrieta, CA, 92562, USA Tel : Fax: Website: http// info@holystonecaps.com Location in Europe Holy Stone (Europe) Ltd. Henderson Business Centre, Unit 24, Ivy Road, Norwich, Norfolk, NR5 8BF, United Kingdom Tel: +44 (0) Fax: +44 (0) Website: http// sales@holystonecaps.com 禾伸堂企業股份有限公司 Holy Stone Enterprise Co., Ltd. Edition

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