PCB Depaneling With Lasers Comparison of Laser to Other Depaneling Methods

Transcription

1 PCB Depaneling With Lasers Comparison of Laser to Other Depaneling

2 Josh Brown Marketing Development Representative Follow Watch the video recording here 2

3 Topics 1. comparison 2. CO 2 v. UV lasers 3. Other applications/capabilities of lasers 3

4 Sales Arguments, Advantages Method Comparison Method Hand Cut Stress to Part Miniaturization Cost Reduction Versatility Fine Features Burring, Debris & Damage Equipment Cost Tooling Cost Yield Throughput Versatility o Routing Die Cut Dicing Saw UV Laser CO 2 Laser o o - o o o + o/+ - o - o - o o - o - o o ++ + o/+ o - + o/

5 Stress to Part 5

6 Stress-Analysis 3,000 ue Dicing Saw Mechanical Router 600 ue Stress Increase Laser Cutting 6

7 Finer Features 1 mm 5.5 cm 7

8 Finer Features Method Tooling Cut Widths Hand Cut Routing Die Cut Dicing Saw UV CO 2 Not good! 1 mm 1 mm 0.5 mm 25 um 120 um 8

9 Finer Features 3.2mm 9

10 Debris Undesirable because Contaminate boards Cleaning/maintenance equipment Airborne Carbonization (CO 2 ) 10

11 Equipment Costs Method Equipment Cost Hand Cut + Routing Die Cut Dicing Saw o o o UV - CO 2-11

12 Tooling Costs Method Tool Tool Cost Lead Time Hand Cut Scissors/ Pizza Cutter + Days Routing Bits - Days/weeks Die Cut Custom Die - Weeks Dicing Saw Blades o Days/weeks UV n/a + n/a CO 2 n/a + n/a 12

13 Yield 13

14 Throughput: UV Laser 14

15 Cutting Speed Comparison Method FR4 (mm) Polyimide um 125 um Routing 1-25 mm/s - - Dicing Saw - 50 mm/s n/a n/a UV Laser 12.5 mm/s 5.36 mm/s 2.31 mm/s 0.88 mm/s 70 mm/s 95 mm/s CO mm/s 65 mm/s 40 mm/s 25 mm/s = no data 1. Duck, Allen. Depaneling: a study in yield and productivity. AllBusiness.com. 15

16 Carbonization: UV Laser 1.5 mm 0.35 mm 16

17 Versatility: Design Freedom Change a contour Adjust a feature 17

18 Versatility: Design Freedom 18

19 Versatility: Materials FR4 Polyimide Teflon Ceramics Aluminum, Brass, Copper PET Beryllium Copper 19

20 Versatility: Multiple Materials Rigid Flex Connector 20

21 Laser Depaneling CO 2 v. UV 21

22 CO 2 vs UV - Cutting Polyimide (Kapton ) 125 micron CO 2 Effective cutting speed: 860 mm/s Kerf: 120 μm Passes: 4 UV Effective cutting speed: 95 mm/s Kerf: 30 μm Passes: 1 22

23 CO 2 vs UV - Cutting FR4 CO 2 Taper Angle: 10 Kerf: µm Material Thickness: max 1.6mm UV Taper Angle: ~0 Kerf: µm Material Thickness: max 0.8mm 23

24 Comparison Actual Cut Width Cutting Speed (125 um, PI) Burning/ Damage Max Recommended Board Thickness Material Variety UV ~30 um 95 mm/s Infrequent, very little 0.8 mm Very good CO 2 ~120 um 860 mm/s Consistently present 1.6 mm Limited 24

25 Other Applications/Capabilities 25

26 Application Resist Structuring Cutting Drilling Skiving 26

27 UV Laser Systems ~69 (1750 mm) MicroLine 6000 System 27

28 Automation Options 28

29 MicroLine Family ML 6120 S ML 6120 P ML 1120 S ML 1120 P 29

30 Conclusion Big advantages of UV: Precision Quality of cuts Surgical nature no stress Versatility Note: board thickness recommendation 0.8mm, but can go higher 30

31 Q&A For more information after the presentation, please contact: Mirela Orlowski Sales Engineer (503) ǀ 31

32 Sales Arguments, Advantages Method Comparison Method Stress to Part Miniaturization Cost Reduction Versatility Fine Features Burring, Debris & Damage Equipment Cost Tooling Cost Yield Throughput Versatility Hand Cut o Routing o o - o o o + o/+ Die Cut - o - o - o + - Dicing Saw - o - o - o + - UV Laser o ++ CO 2 Laser + o/+ o - + o/ Back

33 Fiducial Recognition Decrease errors/rejects Improved accuracy and speed 33

34 System Features Drift minimized high end scanner Substrate is fixed, scanning on the fly Telecentric f-theta lens Mechanical z axis Integrated camera system with auto focus function Field of view on request (5.5 mm x 4.5 mm) Integrated illumination Integrated, selective exhausting Higher dynamics, less weight, faster speed/processing Better price/performance ratio compared to XYtable 34

35 System Specifications Working Area MicroLine 6000 S 610 mm x 457 mm x 50 mm (24 x 18 x 2 ) MicroLine 6000 P 610 mm x 533 mm x 50 mm (24 x 21 x 2 ) System Accuracy ± 20 µm Repetition Accuracy (x/y) ± 2 µm Laser Source Diode pumped SSL (5W) Wavelength 355 nm Laser Class Laser class 1 Power Supply 400 V / 3 Ph / 50 / 60 Hz Power Consumption ~ 1.5 kva Compressed Air 6 bar (90 psi) Air Consumption ~ 0.5 l / min Weight ~ 1,900 kg (4,200 lb) 35