MULTILAYER CERAMIC CAPACITORS High Q / Low ESR Series (HH)

Transcription

1 . INTRODUCTION MLCC consists of a conducting material and electrodes. To manufacture a chip-type MT and achieve miniaturization, high density and high efficiency, ceramic condensers are used. WTC HH series MLCC is used at high frequencies generally have a small temperature coefficient of capacitance, typical within the ±30ppm/ C required for NP0 (C0G) classification and have excellent conductivity internal electrode. Thus, WTC HH series MLCC will be with the feature of low ER and high Q characteristics. 2. FEATURE a. High Q and low ER performance at high frequency. b. Quality improvement of telephone calls for low power loss and better performance. 3. APPLICATION a. Mobile telecommunication: Mobile phone, WLAN. b. RF module: Power amplifier, VCO. c. Tuners. 4. HOW TO ORDER HH 5 N 00 G 500 L T eries ize Dielectric Capacitance Tolerance Rated voltage Termination Packaging HH=High Q/ Low ER 5=0402 (005) 8=0603 (608) 2=0805 (202) N=NP0 (C0G) Two significant digits followed by no. of zeros. And R is in place of decimal point. eg.: R47=0.47pF 0R5=0.5pF R0=.0pF B=±0.pF C=±0.25pF D=±0.5pF F=±% G=±2% J=±5% Two significant digits followed by no. of zeros. And R is in place of decimal point. 60=6 VDC 250=25 VDC 500=50 VDC 0=00 VDC L=Ag/Ni/n T=7 reeled G= 3 reeled 00=0x0 0 =0pF ep, 03, 2008 /7

2 5. EXTERNAL DIMENION ize Inch (mm) L (mm) W (mm) T (mm)/ymbol M B (mm) L 0402 (005).00± ± ±0.05 N /-0.0 T 0603 (608).60± ± ± ±0.5 W M B M B 0805 (202) 2.00±0.5.25± ±0.0 A 0.50±0.20 Fig. The outline of MLCC 6. GENERAL ELECTRICAL DATA Dielectric NP0 ize 0402, : 0.5pF to 470pF Capacitance* 0603: 0.5pF to 3300pF 0805: 0.5pF to 50pF Cap 5pF: B (±0.pF), C (±0.25pF) Capacitance tolerance 5pF<Cap<0pF: C (±0.25pF), D (±0.5pF) Cap 0pF: F (±%), G (±2%), J (±5%) Rated voltage (WVDC) 6V, 25V, 50V, 00V Cap<30pF: Q C Q* Cap 30pF: Q 000 Insulation resistance at Ur 0GΩ Operating temperature -55 to +25 C Capacitance change ±30ppm Cap<2.2pF: 000mΩ@900±00MHz ER 2.2pF Cap 470pF: 500mΩ@900±00MHz Cap>470pF: 500mΩ@60±0MHz Termination Ni/n (lead-free termination) * Measured at the conditions of 25 C ambient temperature and 30~70% related humidity. Apply.0±0.2Vrms,.0MHz±0% for Cap 000pF and.0±0.2vrms,.0khz±0% for Cap>000pF. ep, 03, /7

3 7. CAPACITANCE RANGE DIELECTRIC NP0 IZE RATED VOLTAGE (VDC) pF (0R5) N N A A 0.6pF (0R6) N N A A 0.7pF (0R7) N N A A 0.8pF (0R8) N N A A 0.9pF (0R9) N N A A.0pF (R0) N N A A.2pF (R2) N N A A.5pF (R5) N N A A.8pF (R8) N N A A 2.2pF (2R2) N N A A 2.7pF (2R7) N N A A 3.3pF (3R3) N N A A 3.9pF (3R9) N N A A 4.7pF (4R7) N N A A 5.6pF (5R6) N N A A 6.8pF (6R8) N N A A 8.2pF (8R2) N N A A 0pF (00) N N A A 2pF (20) N N A A 5pF (50) N N A A 8pF (80) N N A A 22pF (220) N N A A 27pF (270) N N A A 33pF (330) N N A A 39pF (390) N N A A 47pF (470) N N A A 56pF (560) N N A A 68pF (680) N N A A 82pF (820) N N A A 00pF (0) N N A A 20pF (2) N N A A 50pF (5) N N A A 80pF (8) N N 220pF (22) N N 270pF (27) N 330pF (33) N 390pF (39) N 470pF (47) N 560pF (56) 680pF (68) 820pF (82),000pF (02),200pF (22),500pF (52),800pF (82) 2,200pF (222) 2,700pF (272) 3,300pF (332) Capacitance. The letter in cell is expressed the symbol of product thickness. 2. For more information about products with special capacitance or other data, please contact WTC local representative. ep, 03, /7

4 8. PACKAGING DIMENION AND QUANTITY Unit: pieces ize Thickness (mm)/ymbol Paper tape 7 reel 3 reel ±0.05 N 0K 20K ±0.07 4K 5K ±0.0 A 4k 5k 9. ELECTRICAL CHARACTERITIC Q factor specification vs. pecific frequency 0000 Q value criteria vs. pecific frequency HH series, 0402 GHz 500MHz 00MHz 000 Q 00 0 Minimum (olid line) Typical (Broken line) Capacitance (pf) Fig. 2 Q factor specification vs. pecific frequency for 0402 Q factor specification vs. pecific frequency 0000 Q value criteria vs. pecific frequency HH series, 0603 GHz 500MHz 00MHz 000 Q 00 0 Minimum (olid line) Typical (Broken line) Capacitance (pf) Fig. 3 Q factor specification vs. pecific frequency for 0603 ep, 03, /7

5 Typical ER vs. Frequency 0402 "HH" series 0603 "HH" series 0 pf 00pF ER (ohm) 0. 5pF 0pF ER (ohm) 0. pf 4.7pF 0pF 68pF ,000 0, ,000 0,000 Fig. 4 ER vs. Frequency 0402 Fig. 5 ER vs. Frequency 0603 Typical Impedance vs. Frequency 0402 "HH" series 0603 "HH" series Impedance (ohm) pf 4.7pF Impedance (ohm) pf 0pF 00pF ,000 0, pF 68pF 0pF ,000 0,000 Fig. 6 Impedance vs. Frequency 0402 Fig. 7 Impedance vs. Frequency 0603 RF vs. Capacitance 0,000 eries Reasonant, Capacitance (pf) Fig. 8 RF vs. Capacitance ep, 03, /7

6 0. APPENDIXE Tape & reel dimensions Fig. 9 The dimension of paper tape ize Thickness N A ± ±0.05 B 0.2± ±0.05 T 0.60± ±0.05 K W 8.00± ±0.0 P ± ±0.0 0xP ± ±0.0 P 2.00± ±0.0 P ± ±0.05 D 0.55± ±0.05 D - - E.75± ±0.05 F 3.50± ±0.05 ize 0402, 0603 Reel size 7 3 C / /-0.2 W / /-0 A 78.0± ±.0 N 60.5±.0 00±.0 Fig. 0 The dimension of reel Description of customer label a. Customer name b. WTC order series and item number c. Customer P/O d. Customer P/N e. Description of product f. Quantity g. Bar code including quantity & WTC P/N or customer h. WTC P/N i. hipping date j. Order bar code including series and item numbers k. erial number of label ep, 03, /7

7 Constructions No. Name NP0 Ceramic material BaTiO 3 based 2 Inner electrode AgPd alloy 3 Inner layer Ag 4 Termination Middle layer Ni 5 Outer layer n (Matt) Fig. The construction of MLCC torage and handling conditions () To store products at 5 to 40 C ambient temperature and 20 to 70%. related humidity conditions. (2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life extension is needed. Cautions: a. Don t store products in a corrosive environment such as sulfide, chloride gas, or acid. It may cause oxidization of electrode, which easily be resulted in poor soldering. b. To store products on the shelf and avoid exposure to moisture. c. Don t expose products to excessive shock, vibration, direct sunlight and so on. Recommended soldering conditions The lead-free termination MLCCs are not only to be used on MT against lead-free solder paste, but also suitable against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and concentration of N 2 within oven are recommended. Fig. 2 Recommended IR reflow soldering profile for MT process with nagcu series solder paste. Fig. 3 Recommended wave soldering profile for MT process with nagcu series solder. ep, 03, /7