Reliability Audit Program Q Performance. Douglas Blackwood

Transcription

1 Q Performance Douglas Blackwood

2 Table of Contents 1. LOOKUP TABLES Table1: Acronyms Table2: Manufacturing Site Codes 2. DESCRIPTION OF STRESS TESTS 3. ANALOG AND SENSORS 4. AUTOMOTIVE MICROCONTROLLERS 5. CELLULAR PRODUCTS GROUP 6. DIGITAL NETWORKS 7. MICROCONTROLLERS 8.. RADIO FREQUENCY 2

3 1. LOOKUP TABLES Table1: Acronyms AC DRB H3T H3TGB HAST HTB HTOL HTRB HTS PTHB SD SSOL TC THB THS TS Autoclave Data Retention Bake High Humidity High Temperature High Humidity High Temperature Gate Bias Highly Accelerated Stress Test High Temperature Bake High Temperature operating Life High temperature Reverse Bias High Temperature Stress Pressure Temperature Humidity Bias Solderability Steady State Operating Life Temperature Cycle Temperature Humidity Bias Temperature Humidity Storage Thermal Shock 3

4 Table2: Manufacturing Site Codes Site FSL-TJN-FM FSL-KLM-FM ATP2 ASECHUNG AITBATAM FSL-TLS-Fab FSL-EKB-Fab FSL-SND-Fab FSL-ATMC FSL-OHT-Fab FSL-TMP-Fab FSL-CHD-Fab TSMC3 TSMC4 UMCI UMC8E SEMIDI CSM CROLS2 Location Freescale Tianjin Final Manufacturing No.15, Xing Hua Avenue, Xiqing Economic Development Area, Tianjin , P.R.China Freescale Kuala Lumpur Final Manufacturing NO.2 Jalan SS 8/2, Free Industrial Zone, Sungai Way, Petaling Jaya, Selangor, Malaysia Amkor Technology Philippines 2 CORPORATE HEADQUARTERS, 1900 South Price Road, Chandler, AZ USA ASE GROUP Chung-Li 550,Chung-Hwa Road, Section 1, Chung-Li, 320, Taiwan, R.O.C Advanced Interconnect Technologies (Batam) Asia Regional Office, No. 1 Maritime Square, #09-80 Harbour Front Centre, Singapore Freescale Toulouse Fab 134 Avenue du General Eisenhower, BP 72329, Toulouse Cedex 1, France Freescale East Kilbride Fab Colvilles Road, East Kilbride, Glasgow, Scotland G75 0TG, UK Freescale Sendai Fab Ake-Dori, Izumi-Ku, Sendai-Shi , Japan Freescale Austin Technology and Manufacturing Centre 3501 Ed Bluestein Boulevard, Austin, Texas 78721, USA Freescale Oak Hill Fab 6501 William Cannon Drive West, Austin, Texas, 78735, USA Freescale Tempe Fab 2100 East Elliot Road, Tempe, Arizona 85284, USA Freescale Chandler Fab 1300 N Alma School Rd, Chandler AZ, 85224, USA Taiwan Semiconductor Manufacturing Company Limited Corporate Headquarters, No. 8, Li-Hsin Rd. VI, Hsinchu Science Park, Hsinchu, Taiwan , R. O. C. Taiwan Semiconductor Manufacturing Company Limited Corporate Headquarters, No. 8, Li-Hsin Rd. VI, Hsinchu Science Park, Hsinchu, Taiwan , R. O. C. United Microelectronics Corporation Singapore Worldwide Offices Headquarters, No. 3, Li-Hsin 2nd Road, Hsinchu Science Park, Hsinchu, Taiwan, R.O.C. United Microelectronics Corporation Taiwan Worldwide Offices Headquarters, No. 3, Li-Hsin 2nd Road, Hsinchu Science Park, Hsinchu, Taiwan, R.O.C. Semi-Dice Taiwan Chartered Semiconductor Manufacturing Ltd Corporate Office, 60 Woodlands Industrial Park, Street Two, Singapore Crolles2 Technology Alliance Freescale Semiconducteurs SAS Centre de Recherche Crolles 2, 870 Rue Jean Monnet, Crolles, France 4

5 2. DESCRIPTION OF STRESS TESTS Early Life Fail Rate (ELFR) - JESD22-A108 The purpose of this stress is to characterise the early failure rate portion of the bathtub curve. Devices used in this test are sampled directly after the standard production final test flow with no pre-screening. A dynamic electrical bias is applied to stimulate the device during the test in much the same way as HTOL below. High Temperature Operational Life Test (HTOL or HTRB) - JESD22-A108 This test is performed to accelerate failure mechanisms that are thermally activated through the application of temperature and the use of biased operating conditions. The temperature and voltage will vary with the product being stressed. However, the typical stress ambient is 125 C with the bias applied equal to or greater than the data sheet nominal value. All devices used in the HTOL test are sampled directly after final electrical test with no prior burn-in or other pre-screening unless called out in the normal production flow. Testing is performed with dynamic signal applied to the device for a typical duration of 1008hrs. Reject quantities at the test temperature are modified by the Chi_squared distribution function at 60%/90% confidence levels. The failure rates are then calculated and derated to the required temperature using the Arrhenius equation with a 0.54 ev activation energy assumed as an average for the failure mechanisms. Further details are given in the next section 'Calculation of Failure Rates'. Write/Erase Cycling (W/E) - JESD22-A117 This test is used to evaluate the effect of repeated programming and erasing excursions on EEPROM and FLASH devices without corruption of data. It is carried out at 125 C for EEPROM and 125 C for FLASH to the number of specified cycles per device. Program and erase times are according to data book. High Temperature Storage and Data Retention (HTS/DR) - JESD22 - A103 Used to determine the effect on the devices of long-term storage at the maximum specified temperature, also the data retention characteristics of EPROM, EEPROM and FLASH devices. In the case of EEPROM and FLASH devices this follows Write/Erase Cycling. Temperature Cycling (TC) - JESD22-A104 Temperature Cycling testing accelerates the effects of thermal expansion mismatch among the different components within a specific die and packaging system. During temperature cycling, devices are inserted into a cycling system and held at cold dwell temperature for the specified time. Following this cold dwell, the devices are transferred, mechanically, to the hot dwell chamber where they remain for the specified time. The system employs a circulating air environment to assure rapid stabilisation at the specified temperature. Thermal Shock (TS) - JESD22-A104 The objective of Thermal Shock is the same as for Temperature Cycling, however, thermal shock provides additional stress in the increased thermal conductivity of a liquid ambient. Temperature Humidity Bias (THB or H3TRB) - JESD22-A101 5

6 An environmental test performed at 85 C and a relative humidity of 85%To evaluate the resistance of the device to moisture-related failure mechanisms, such as corrosion. A static bias is applied in such a way as to maximise voltage potential gradients across the die while minimising device power dissipation. If moisture does penetrate the package and passivation, an electrolytic cell will be set up and corrosion will be rapid. Additionally, electricallyactivated failure mechanisms, i.e. dielectric breakdown can be encountered. Autoclave (AC) - JESD22-A102 A severe environmental (121 C, 100% Relative Humidity, 15psig) test to establish the integrity of the package and passivation in the presence of moisture and temperature. Pressure Temperature Humidity Stress (HAST) - JESD22-A110 This test is performed to accelerate the effects of moisture penetration with the dominant effect being corrosion. It detects similar failure mechanisms to THB but at a greatly accelerated rate. 6

7 3. Analog and Sensors 7

8 RESULTS SUMMARY BY PACKAGE LQFP 80 14*14*1.4P0.65 MAPBGA *12*0.8P0.8 MSL / 240 C TC 500 Cycles HTSL 504 Hours PQFN-EP 23 12*12*2.1 P.9 MSL 3 / 260 C TC 1000 Cycles HTOL 168 Hours PQFN-EP 24 12*12*2.1 P.9 MSL 3 / 260 C TC 500 Cycles HTOL 408 Hours PWR QFN 16 12*12*2.1P0.9 PWR QFN 36 12SQ*2.1P0.8 QFN 16 6*6*1.98 P1 QFN32EP 5SQ*1.0P0.5 SOIC ML MSL 3 / 245 C TC 500 Cycles BAKE 504 Hours MSL / 245 C TC 200 Cycles MSL 3 / 260 C UHST 96 Cycles MSL 3 / 260 C TC 500 Cycles MSL 3 / 260 C TC 500 Cycles

9 PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE AMKOR K1 KOREA KLMFM TJNFM Package Precon Stress Read Point Samples Qty Rej QFN 16 6*6*1.98 P1 MSL 3 / 260 C UHST 96 Cycles Package Precon Stress Read Point Samples Qty Rej LQFP 80 14*14*1.4P0.65 MSL / 240 C TC 500 Cycles Package Precon Stress PQFN-EP 24 12*12*2.1 P.9 Read Point Samples Qty Rej MSL 3 / 260 C TC 500 Cycles HTOL 408 Hours SOIC ML MSL 3 / 260 C TC 500 Cycles PWR QFN 36 12SQ*2.1P0.8 MSL / 245 C TC 200 Cycles PQFN-EP 23 12*12*2.1 P.9 MSL 3 / 260 C TC 1000 Cycles HTOL 168 Hours QFN32EP 5SQ*1.0P0.5 MSL 3 / 260 C TC 500 Cycles MAPBGA *12*0.8P0.8 PWR QFN 16 12*12*2.1P0.9 HTSL 504 Hours MSL 3 / 245 C TC 500 Cycles BAKE 504 Hours

10 RESULTS SUMMARY BY STRESS TEST BAKE Techcode Device Read Point Samples Qty Rej % Rej O060APTS SC33984CPNAR2 504 Hours U065PTXD SC33984CPNAR2 504 Hours HTOL Techcode Device Read Point Samples Qty Rej % Rej C027TXXQ MC10XS4200FKR2 168 Hours F045BXXS MC06XS3517AFKR2 408 Hours F045CXXS MC20XS4200FKR2 168 Hours HTSL Techcode Device Read Point Samples Qty Rej % Rej H013LHTQ SC900892VLR2 504 Hours TC Techcode Device Read Point Samples Qty Rej % Rej C027TXXQ SC901524EPR2 500 Cycles XTMS3NXS MC33888PNBR2 200 Cycles MC33981BPNAR2 500 Cycles O060APTS MC10XS3535PNAR2 500 Cycles SC900740PNAR Cycles MC33981BPNAR2 500 Cycles U065PTXD MCZ33689DEWR2 500 Cycles SC111525AFB Cycles UHST Techcode Device Read Point Samples Qty Rej % Rej C027TXXQ SX2531WT1 96 Cycles O150MWXS MMA6210KWR2 96 Cycles C027TXXT MMA5124WR2 96 Cycles SX2531WT1 96 Cycles

11 RESULTS SUMMARY BY FABRICATION FACILITY ATMC H013LHTQ HTSL 504 Hours CHDFAB HTOL 168 Hours C027TXXQ TC 500 Cycles UHST 96 Cycles C027TXXT UHST 96 Cycles OHTFAB F045BXXS HTOL 408 Hours O060APTS TC 1000 Cycles O150MWXS UHST 96 Cycles F045CXXS HTOL 168 Hours TLSFAB XTMS3NXS TC 200 Cycles Cycles O060APTS BAKE 504 Hours TC 500 Cycles U065PTXD BAKE 504 Hours TC 500 Cycles

12 RESULTS SUMMARY BY DEVICE TYPE MC06XS3517AFKR2 MC10XS3535PNAR2 MC10XS4200FKR2 MC20XS4200FKR2 MC33888PNBR2 F045BXXS HTOL 408 Hours O060APTS TC 500 Cycles C027TXXQ HTOL 168 Hours F045CXXS HTOL 168 Hours XTMS3NXS TC 200 Cycles MC33981BPNAR2 MCZ33689DEWR2 MMA5124WR2 MMA6210KWR2 SC111525AFB317 XTMS3NXS TC 500 Cycles U065PTXD TC 500 Cycles U065PTXD TC 500 Cycles C027TXXT UHST 96 Cycles O150MWXS UHST 96 Cycles U065PTXD TC 500 Cycles SC33984CPNAR2 SC900740PNAR2 SC900892VLR2 O060APTS BAKE 504 Hours U065PTXD BAKE 504 Hours O060APTS TC 1000 Cycles H013LHTQ HTSL 504 Hours

13 SC901524EPR2 C027TXXQ TC 500 Cycles SX2531WT1 C027TXXQ UHST 96 Cycles C027TXXT UHST 96 Cycles

14 4. Automotive Microcontrollers 14

15 RESULTS SUMMARY BY PACKAGE LQFP 48 7*7*1.4P0.5 HTOL 1008 Hours LQFP SQ1.4P0.5 C90 MAPBGA *17*0.8P1.0 TSSOP *6.5*1.P.65 DRB 1008 Hours HTOL 1008 Hours HTSL 1008 Hours MSL 3 / 260 C TC 500 Cycles TSSOP *5*1.0P0.65 TSSOP *9.7*0.9P.65 MSL 3 / 260 C TC 1100 Cycles HTOL 408 Hours MSL / 260 C TC 1100 Cycles

16 PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE AMKOR P1 PHILIPPINES Package Precon Stress TSSOP *5*1.0P0.65 MSL 3 / 260 C TSSOP *9.7*0.9P.65 MSL / 260 C TC TC Read Point 1100 Cycles Samples Qty Rej HTOL 408 Hours Cycles TSSOP *6.5*1.P.65 MSL 3 / 260 C TC 500 Cycles KLMFM Package Precon Stress DRB LQFP SQ1.4P0.5 C90 HTOL Read Point 1008 Hours 1008 Hours Samples Qty Rej TJNFM Package Precon Stress LQFP 48 7*7*1.4P0.5 HTOL MAPBGA *17*0.8P1.0 HTSL Read Point 1008 Hours 1008 Hours Samples Qty Rej

17 RESULTS SUMMARY BY STRESS TEST DRB Techcode Device Read Point Samples Qty Rej % Rej H009FXXQ SPC5604BF2MLL Hours HTOL Techcode Device Read Point Samples Qty Rej % Rej H009FXXQ SC667051MLL 1008 Hours E025FXXQ S9S08SC4E0MTGR 408 Hours U050FXXD S908GZ60H0CFAER 1008 Hours H009FHXQ SC667051MLL 1008 Hours HTSL Techcode Device Read Point Samples Qty Rej % Rej SC560004MVF92R Hours H013FHL6 SC560006MMG92R 1008 Hours TC Techcode Device Read Point Samples Qty Rej % Rej S9S08SG16E1VTJR 500 Cycles E025FXXQ SP117018MTGR 1100 Cycles U050FXXD SC100690VDRER 1100 Cycles

18 RESULTS SUMMARY BY FABRICATION FACILITY ATMC DRB 1008 Hours H009FXXQ HTOL 1008 Hours H009FHXQ HTOL 1008 Hours HTSL 1008 Hours H013FHL6 PRECON CHDFAB HTOL 408 Hours E025FXXQ 500 Cycles TC 1100 Cycles U050FXXD TC 1100 Cycles TSMC FAB2 U050FXXD HTOL 1008 Hours

19 RESULTS SUMMARY BY DEVICE TYPE S908GZ60H0CFAER S9S08SC4E0MTGR S9S08SG16E1VTJR SC100690VDRER SC560004MVF92R2 U050FXXD HTOL 1008 Hours E025FXXQ HTOL 408 Hours E025FXXQ TC 500 Cycles U050FXXD TC 1100 Cycles H013FHL6 HTSL 1008 Hours SC560006MMG92R HTSL 1008 Hours H013FHL6 PRECON SC667051MLL SP117018MTGR SPC5604BF2MLL6 H009FXXQ HTOL 1008 Hours H009FHXQ HTOL 1008 Hours E025FXXQ TC 1100 Cycles H009FXXQ DRB 1008 Hours

20 5. Cellular Products Groups 20

21 RESULTS SUMMARY BY PACKAGE LQFP *14*1.4P0.5 AC 96 Hours TC 200 Cycles

22 PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE KLMFM Package Precon Stress LQFP *14*1.4P0.5 Read Point Samples Qty Rej AC 96 Hours TC 200 Cycles

23 RESULTS SUMMARY BY STRESS TEST AC Techcode Device Read Point Samples Qty Rej % Rej I100XXXS MC68HC11FL0AFR2 96 Hours TC Techcode Device Read Point Samples Qty Rej % Rej I100XXXS MC68HC11FL0AFR2 200 Cycles

24 RESULTS SUMMARY BY FABRICATION FACILITY SNDFAB AC 96 Hours I100XXXS TC 200 Cycles

25 RESULTS SUMMARY BY DEVICE TYPE MC68HC11FL0AFR2 AC 96 Hours I100XXXS TC 200 Cycles

26 6. Digital Networks 26

27 RESULTS SUMMARY BY PACKAGE FCPBGA SQ3.55P1.0 PRECON TC 1000 Cycles FTBGA *37*1.7P1.27 PBGA *23*1.22P1.27 MSL 4 / 245 C TC 500 Cycles Cycles MSL 4 / ---- TH 1008 Hours HTSL 1008 Hours HTOL 72 Hours PBGA *25*1.2P1.27 PRECON TC 500 Cycles TBGA *35*1.5P1.0 PRECON MSL 3 / 260 C UHST 264 Hours

28 PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE IBM CANADA KLMFM Package Precon Stress FCPBGA SQ3.55P1.0 Package Precon Stress FTBGA *37*1.7P1.27 MSL 4 / ---- MSL 4 / 245 C TBGA *35*1.5P1.0 MSL 3 / 260 C Read Point Samples Qty Rej PRECON TC TH TC HTSL 1000 Cycles Read Point 1008 Hours Samples Qty Rej Cycles Cycles Hours PRECON UHST 264 Hours PBGA *23*1.22P1.27 HTOL 72 Hours PBGA *25*1.2P1.27 PRECON TC 500 Cycles

29 RESULTS SUMMARY BY STRESS TEST HTOL Techcode Device Read Point Samples Qty Rej % Rej C016HXXT MPC852TVR100A 72 Hours HTSL Techcode Device Read Point Samples Qty Rej % Rej H013HXX6 MPC8270ZUUPEA 1008 Hours TC Techcode Device Read Point Samples Qty Rej % Rej H004HQWA MPC8569EVTAUNLB Precon Cycles H013HXX6 MPC8270ZUUPEA 500 Cycles Cycles C032XXXT MPC860SRCZQ50D4 Precon Cycles TH Techcode Device Read Point Samples Qty Rej % Rej H013HXX6 MPC8270ZUUPEA 1008 Hours UHST Techcode Device Read Point Samples Qty Rej % Rej Precon H013HQX6 MPC8349EVVAJFB 264 Hours

30 RESULTS SUMMARY BY FABRICATION FACILITY ATMC H013HQX6 PRECON UHST 264 Hours HTSL 1008 Hours H013HXX6 TC 500 Cycles Cycles TH 1008 Hours C016HXXT HTOL 72 Hours GF FAB7 SGP PRECON H004HQWA TC 1000 Cycles OHTFAB PRECON C032XXXT TC 500 Cycles

31 RESULTS SUMMARY BY DEVICE TYPE MPC8270ZUUPEA HTSL 1008 Hours H013HXX6 TC 500 Cycles Cycles TH 1008 Hours MPC8349EVVAJFB MPC852TVR100A H013HQX6 PRECON UHST 264 Hours C016HXXT HTOL 72 Hours MPC8569EVTAUNLB PRECON H004HQWA TC 1000 Cycles MPC860SRCZQ50D4 PRECON C032XXXT TC 500 Cycles

32 7. Microcontrollers 32

33 RESULTS SUMMARY BY PACKAGE LQFP 64 10*10*1.4P0.5 MAPBGA *19*.8P.8 PDIP 28 PDIP 40 HTSL 504 Hours Hours MSL 3 / 260 C UHST 264 Hours TC 500 Cycles TC 500 Cycles PLCC 52 QFP 64 14*14*2.2P0.8 QFP44 10*10*2.0P0.8 SOIC 20W HTOL 1008 Hours HTSL 1008 Hours MSL 3 / 260 C TC 1000 Cycles MSL 3 / 260 C TC 900 Cycles MSL 3 / 260 C TC 1000 Cycles SOIC 28W MSL 3 / 260 C TC 500 Cycles MSL / 260 C TC 500 Cycles

34 PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE ASE CL TAIWAN Package Precon Stress SOIC 20W MSL 3 / 260 C TC Read Point 1000 Cycles Samples Qty Rej KLMFM Package Precon Stress QFP 64 14*14*2.2P0.8 MSL 3 / 260 C TC HTOL PLCC 52 HTSL Read Point 1000 Cycles 1008 Hours 1008 Hours Samples Qty Rej TJNFM Package Precon Stress Read Point Samples Qty Rej QFP44 10*10*2.0P0.8 MSL 3 / 260 C TC 900 Cycles SOIC 28W LQFP 64 10*10*1.4P0.5 HTSL MSL / 260 C TC 500 Cycles MSL 3 / 260 C TC 500 Cycles Hours Hours MAPBGA *19*.8P.8 MSL 3 / 260 C UHST 264 Hours PDIP 28 TC 500 Cycles PDIP 40 TC 500 Cycles

35 RESULTS SUMMARY BY STRESS TEST HTOL Techcode Device Read Point Samples Qty Rej % Rej I120JXXS SC109953FNER 1008 Hours I120EJXS MC68711E20CFNE Hours HTSL Techcode Device Read Point Samples Qty Rej % Rej MC9S08AC60CPUE 504 Hours E025FXXQ MC9S08JM60CLH 1008 Hours SC116009ACLH 504 Hours I120EJXS MC68711E20CFNE Hours TC Techcode Device Read Point Samples Qty Rej % Rej MC705C8ACPE 500 Cycles MC705JJ7CDWER 1000 Cycles I120EXXS MC705JP7CPE 500 Cycles MC705P6ACDWE 500 Cycles SC667171MDWER 500 Cycles E025FXXQ MC9S08AW60CFUER 1000 Cycles U050FXXD MC908GP32CFBE 900 Cycles UHST Techcode Device Read Point Samples Qty Rej % Rej H009HLX6 SCIMX31LCVMF4CR2 264 Hours

36 RESULTS SUMMARY BY FABRICATION FACILITY CHDFAB I120EXXS TC 500 Cycles Cycles Hours HTSL E025FXXQ 1008 Hours TC 1000 Cycles U050FXXD TC 900 Cycles I120JXXS HTOL 1008 Hours I120EJXS HTOL 1008 Hours HTSL 1008 Hours SNDFAB I120EXXS TC 500 Cycles U050FXXD TC 900 Cycles TSMC FAB 12 H009HLX6 UHST 264 Hours

37 RESULTS SUMMARY BY DEVICE TYPE MC68711E20CFNE2 MC705C8ACPE MC705JJ7CDWER MC705JP7CPE MC705P6ACDWE MC908GP32CFBE MC9S08AC60CPUE MC9S08AW60CFUER MC9S08JM60CLH SC109953FNER SC116009ACLH SC667171MDWER SCIMX31LCVMF4CR2 I120EJXS HTOL 1008 Hours HTSL 1008 Hours I120EXXS TC 500 Cycles I120EXXS TC 1000 Cycles I120EXXS TC 500 Cycles I120EXXS TC 500 Cycles U050FXXD TC 900 Cycles E025FXXQ HTSL 504 Hours E025FXXQ TC 1000 Cycles E025FXXQ HTSL 1008 Hours I120JXXS HTOL 1008 Hours E025FXXQ HTSL 504 Hours I120EXXS TC 500 Cycles H009HLX6 UHST 264 Hours

38 8. Radio Frequency 38

39 RESULTS SUMMARY BY PACKAGE NI-1230S HTRB 1008 Hours NI-780HS-4 NI-880S HTOL 504 Hours HTRB 1008 Hours HTRB 1008 Hours OM780-2 PLASTICS TC 500 Cycles MSL 3 / 260 C THB 504 Hours PLD-1.5 PWR QFN 16 5*5*2.1P0.8 PWR QFN 24 8*8*2.1P0.8 TO-272 WB-16 MSL 3 / 260 C TC 500 Cycles THB 504 Hours HTRB 1008 Hours HTOL 1008 Hours HTRB 1008 Hours HTRB 1008 Hours

40 PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE ASE KR KOREA Package Precon Stress PWR QFN 24 8*8*2.1P0.8 HTRB Read Point 1008 Hours Samples Qty Rej KLMFM Package Precon Stress NI-880S HTRB TO-272 WB-16 HTRB PWR QFN 16 5*5*2.1P0.8 HTOL OM780-2 PLASTICS MSL 3 / 260 C NI-1230S HTRB NI-780HS-4 PLD-1.5 MSL 3 / 260 C Read Point 1008 Hours 1008 Hours 1008 Hours Samples Qty Rej TC 500 Cycles THB 504 Hours Hours HTOL 504 Hours HTRB 1008 Hours TC 500 Cycles THB 504 Hours HTRB 1008 Hours

41 RESULTS SUMMARY BY STRESS TEST HTOL Techcode Device Read Point Samples Qty Rej % Rej MMG3004N 1008 Hours P200JWXD MMG3004NT Hours L035ATXD MRF8P20140WHSR3 504 Hours HTRB Techcode Device Read Point Samples Qty Rej % Rej L035AHXD MW7IC2240NBR Hours MW7IC915NT Hours L035HXXD MRF8S9260HSR Hours L037AHXD MW6S004NT Hours L035ATXD MRF8P20140WHSR Hours MRF8S21200HSR Hours TC Techcode Device Read Point Samples Qty Rej % Rej L035HXXD MRF8S9170NR3 500 Cycles L037AHXD MW6S004NT1 500 Cycles THB Techcode Device Read Point Samples Qty Rej % Rej L035HXXD MRF8S9170NR3 504 Hours L037AHXD MW6S004NT1 504 Hours

42 RESULTS SUMMARY BY FABRICATION FACILITY OHTFAB L035AHXD HTRB 1008 Hours HTRB 1008 Hours L035HXXD TC 500 Cycles THB 504 Hours HTRB 1008 Hours L037AHXD TC 500 Cycles THB 504 Hours L035ATXD HTOL 504 Hours HTRB 1008 Hours WIN P200JWXD HTOL 1008 Hours

43 RESULTS SUMMARY BY DEVICE TYPE MMG3004N MMG3004NT1 P200JWXD HTOL 1008 Hours P200JWXD HTOL 1008 Hours MRF8P20140WHSR3 MRF8S21200HSR6 L035ATXD HTOL 504 Hours HTRB 1008 Hours L035ATXD HTRB 1008 Hours MRF8S9170NR3 MRF8S9260HSR3 L035HXXD TC 500 Cycles THB 504 Hours L035HXXD HTRB 1008 Hours MW6S004NT1 MW7IC2240NBR1 MW7IC915NT1 HTRB 1008 Hours L037AHXD TC 500 Cycles THB 504 Hours L035AHXD HTRB 1008 Hours L035AHXD HTRB 1008 Hours