Quality & Reliability Quarterly Report Q3, 2018

Transcription

1 Quality & Reliability Quarterly Report Q3, 2018 Page 1 of 7

2 1. Quality/Reliability monitoring test items and conditions Flash Quarterly reliability monitor results Quality Validation & Early Life Failure Rate Non-Volatile Memory Cycling Endurance Test Data Retention Test Non-Volatile Memory Program/ Erase Endurance, Data Retention and Operation Life Test High Temperature Operating Life and High Temperature Storage Life Test Pre-Condition Test / Pressure Cooker Test / Temperature Cycling Test / Highly Accelerated Temperature and Humidity Stress Test XtraRom Quarterly reliability monitor results Quality Validation & Early Life Failure Rate High Temperature Operating Life and High Temperature Storage Life Test Pre-Condition Test / Pressure Cooker Test / Temperature Cycling Test / Highly Accelerated Temperature and Humidity Stress Test Electrostatic Discharge Sensitivity Test Page 2 of 7

3 1. Quality/Reliability monitoring test items and conditions: Test Item Test Method Test Conditions QV (Quality Validation) ELFR (Early Life Failure Rate) NVCE (Non-Volatile Memory Cycling Endurance) LTDR (NVM Low Temperature Retention and Read Disturb) HTDR (High Temperature Data Retention) HTOL (High Temperature Operating Life) HTSL (High Temperature Storage Life) PC (Pre-conditioning) JESD86 JESD22-A108 and JESD74 JESD47 JESD22-A117 JESD47 JESD22-A117 JESD47 JESD22-A117 JESD22-A108 JESD85 Per datasheet, at high/room/cold temperatures Typical Sample Size (units) All samples 125 o C, Vcc(max), 48 hrs 2000 Half samples at 25 o C, half samples at max operating Temperature, 1K/10K/100K Program/Erase cycles. For flash products only. 25 o C, Vcc(max), 168hrs/500hrs. For flash products only. 125 o C, 10hrs/100hrs or equivalent stress time per lifetime model. For flash products only. 125 o C, Vcc(max), 168hrs/500hrs/1000hrs Product with P/E cycle pre-conditioning) 77 Automotive Product: Sum of sample size for HTDR, LTDR, and HTOL Automotive Product:77 JESD22-A o C, 168hrs/500hrs/1000hrs 77 JESD22-A113 TCT(-65 o C to 150 o C) 10 cycles, IR reflow 3 cycles, HTSL 125 o C 24hrs, 30 o C/60%RH 192hrs (MSL 3) All SMD samples before TCT, PCT, HAST TCT (Temperature Cycle Test) PCT (Pressure Cooker Test) HAST (Highly Accelerated Temperature and Humidity Stress Test) ESD (Electro-Static Discharge) JESD22-A o C 150 o C (condition C), 200/500 cycles JESD22-A o C, 100%RH, 2 atm, 96hrs 77 JESD22-A o C, 85% RH, 33.3 psia, Vcc(max), 96hrs 77 JS (HBM) JS (CDM) NTD: 1000V or till failure HBM: 500~2000V or till failure CDM : 750 or till failure Optional test in response to specific customer 77 3 Page 3 of 7

4 2. Flash Quarterly reliability monitor results: 2-1. Quality Validation & Early Life Failure Rate : QV ELFR 0.15 µm MX29F400C µm MX29LV160D MX25L12845E MX25L3206E µm MX25U1635E MX29GL256E *2 *2 MX25L3206E *2 *2 MX25L12835F MX25L12835F nm MX25R8035F MX25R8035F MX30LF1G08AA MX29GL128F *2 *2 MX25L25645G nm MX25L25645G *2 *2 MX25U51245G *2 *2 36 nm MX30LF1G18AC MX30LF4G18AC *2 *2 *2 : No ELFR test, the samples are only used for QV and NVCE test Non-Volatile Memory Cycling Endurance Test : NVCE@25 C NVCE@85 C 0.15 µm MX29F400C µm MX29LV160D MX25L12845E µm MX25L3206E MX25U1635E MX25L12835F MX25L12835F nm MX25R8035F MX25R8035F MX30LF1G08AA nm MX25L25645G nm MX30LF1G18AC Page 4 of 7

5 2-3. Data Retention Test : LTDR@25 C 500hrs HTDR@125 C 100hrs 0.13 µm MX29LV160D MX25L12845E µm MX25L3206E MX25U1635E MX25L12835F MX25L12835F nm MX25R8035F MX25R8035F MX30LF1G08AA nm MX25L25645G nm MX30LF1G18AC Non-Volatile Memory Program/ Erase Endurance, Data Retention and Operation Life Test (For Automotive a. High Temperature HTDR@150 C HTOL@125 C NVCE@105 C 500hrs 1000hrs SS Reject MX29GL256E µm MX25L3206E nm MX29GL128F MX25L25645G nm MX25U51245G *1 *1 *1 *1 *1 *1 HTDR@150 C HTOL@125 C NVCE@105 C 100hrs 1000hrs SS Reject 36 nm MX30LF4G18AC b. Low Temperature NVCE@25 C LTDR@25 C 1000hrs 0.11 µm MX29GL256E MX25L3206E nm MX29GL128F nm MX25L25645G MX25U51245G *1 *1 *1 *1 36 nm MX30LF4G18AC *1: Means the test is on going. The results will be updated next quarter. Page 5 of 7

6 2-5. High Temperature Operating Life and High Temperature Storage Life Test: HTOL 1000hrs HTSL 1000hrs 0.15 µm MX29F400C µm MX29LV160D MX25L12845E µm MX25L3206E MX25U1635E MX25L12835F MX25L12835F nm MX25R8035F MX25R8035F MX30LF1G08AA nm MX25L25645G nm MX30LF1G18AC Pre-Condition Test / Pressure Cooker Test / Temperature Cycling Test / Highly Accelerated Temperature and Humidity Stress Test: Tech. EPN Code PC TCT 500cycles PCT 96hrs HAST 96hrs 0.15 µm MX29F400C µm MX29LV160D MX25L12845E µm MX25L3206E MX25U1635E MX25L12835F MX25L12835F nm MX25R8035F MX25R8035F MX30LF1G08AA nm MX25L25645G nm MX30LF1G18AC Page 6 of 7

7 3. XtraROM Quarterly reliability monitor results: 3-1. Quality Validation & Early Life Failure Rate: QV ELFR 65 nm MX23J4GC0TC nm MX23J16GL0TC High Temperature Operating Life and High Temperature Storage Life Test: HTOL 1000hrs HTSL 1000hrs 65 nm MX23J4GC0TC nm MX23J16GL0TC Pre-Condition Test / Pressure Cooker Test / Temperature Cycling Test / Highly Accelerated Temperature and Humidity Stress Test: Tech. EPN Code PC TCT 500cycles PCT 96hrs HAST 96hrs 65 nm MX23J4GC0TC nm MX23J16GL0TC Electrostatic Discharge Sensitivity Test: Mode Classification SS Reject 2.0 KV 6 0 HBM 2.5 KV nm MX23J4GC0TC 3.0 KV 6 0 CDM 0.75 KV 6 0 NTD 1.0 KV KV 3 0 HBM 2.5 KV nm MX23J16GL0TC CDM 0.75 KV 6 0 NTD 1.0 KV 9 0 Page 7 of 7