Thermal Characterization of Packaged RFIC, Modeled vs. Measured Junction to Ambient Thermal Resistance
|
|
- Cory Franklin
- 6 years ago
- Views:
Transcription
1 Thermal Characterization of Packaged RFIC, Modeled vs. Measured Junction to Ambient Thermal Resistance Steven Brinser IBM Microelectronics Abstract Thermal characterization of a semiconductor device is the determination of the maximum junction temperature (Tjmax) of the die circuit during worst case operating conditions, as well as the thermal resistances of the semiconductor package alone, and attached on the second level to a Printed Circuit Board (PCB). The die junction temperature (Tj) is directly related to the life of the product, and is used in reliability calculations to rate the power on hours the product can produce during its life. The higher the circuit junction temperature during operation, the quicker product end of life will be reached. The maximum junction temperature of the die cannot exceed the maximum temperature specified in the technology's design and reliability specifications. In today's wireless market, devices are getting smaller in size and power dissipations are on the rise. This produces higher heat fluxes on the semiconductor die producing higher junction temperatures. The design of both the package that encapsulates the die and the printed circuit board it is attached to become instrumental in removing heat from the die. This is a study characterizing an RFIC silicon germanium (SiGe) die packaged in an exposed paddle QFN 20 lead package that is soldered to an assumed PCB. Thermal modeling done in ANSYS was correlated to measured results using a JEDEC compliant system for semiconductor packaging thermal measurements. The test system used for this study is a "Phase 10 Thermal Analyzer" from Analysis Tech in Wakefield, MA. Introduction In order to get a clear understanding and confidence in Finite Element Analysis (FEA) modeling results, it is necessary to physically test the device to compare results. This approach holds true for any product. For example, aircraft manufacturers will test bend an airplane wing from tip to fuselage until failure to measure maximum deflection, stress/strain, and location of failure. The test data taken is used to correlate to FEA stress models. The same approach is used in semiconductor thermal characterization. Careful attention to detail must be taken to ensure that the FEA model and device under test are as close to the same design as possible. This way we are comparing apples to apples. In this case, the semiconductor device will be installed in a cell phone or some type of wireless hand held product. A typical cell phone PCB design is assumed for both modeling and testing. This helps to simulate the thermal performance of the device in as close to actual operating conditions as possible. The JEDEC packaging standard states that PCB characteristics can have a dramatic impact on thermal measurements, greater than 60% variation on results. Due to this wide variability, JEDEC defined an industry-wide standard for the design of thermal test boards to keep results common. Modeling is also done using the specs for the JEDEC standard thermal test board. By having a common standard PCB, companies can compare one package with another for thermal performance, and not be concerned with the variability of PCB effects. The mistake that is often made is using this standardized junction to ambient data as actual operating conditions for the product, remember the 60% variation in results stated by JEDEC. To obtain results from this model, thermal boundary conditions are applied, in this case Natural Convection, and heat generating power is applied to very specific areas on the die. The junction temperature is solved for and used to calculate the junction to ambient thermal resistance, and junction to case thermal resistance. By knowing the thermal resistances, now Tj can be calculated for any ambient temperature, power level, or PCB temperature that the device will be subjected to during it's operating life. The FEA model also provides valuable data on the design of the PCB that will be used in the cell phone, and how it's design affects the thermal performance of the packaged semiconductor.
2 Terms and Nomenclature Figure 1 shows a side view of the model used in this study. The plastic mold compound that encapsulates the die has been removed for clarity. The die is epoxied to a copper leadframe, which is soldered to the top metal layer of the PCB. The QFN Package has a leadframe that is an "exposed paddle" design which provides a direct thermal path from die to PCB. The heat then flows through thermal vias in the PCB, which are copper plated through holes that connect to PCB internal metal planes that extend outward in the PCB. The thermal via connectivity to the copper planes acts as heat sink fins to dissipate the heat energy from the die. The heat energy then travels out of the PCB into the air where it is cooled. The thermal resistance from die through the package and PCB to the air is called the Junction to Ambient Thermal Resistance (Theta JA) and is measured in C/Watt. Tc is the Case Temperature and is located on the bottom surface of the leadframe. The Junction to Case Thermal Resistance (Theta JC) represents the thermal rating for the die and package only, omitting the PCB from the equation. The only factors affecting Theta JC are the die characteristics such as size, thickness, power mapping and the package thermal characteristics. Theta JC ( C/Watt) for a package/die will remain at a constant value regardless of the PCB design. The Theta JA however will vary with the design of the PCB. In some cases, the package will only represent 10% of the total Theta JA value with the PCB representing 90% of Theta JA. For this reason, the PCB becomes a very important component when specifying a Junction to Ambient Thermal Resistance for a Package. Figure 1 - QFN20 Package Soldered to Cell Phone PCB Tjmax Maximum Junction Temperature Tc Case Temperature Ta Ambient Temperature
3 Theta JA = (Tjmax - Ta) / Power Theta JC = (Tjmax - Tc) / Power The equations above are used to calculate the thermal resistances Theta JA and Theta JC. Temperatures are taken from the model at the die top surface for Tjmax, and on the bottom surface of the exposed paddle leadframe for Tc. The ambient air temperature is known, and used as a surface convection load. The power dissipation is also a known value, and is applied as a heat generating body load. ANSYS users should note that this is an internal surface in the model and a heat flux surface load could cause erroneous results due to its one directional heat flow. A body load will disperse the heat in all directions for internal surface loads according to the thermal conductivity and geometry of the materials. FEA Model Figure 2 shows the temperature gradients on the external surfaces of the package attached to the PCB. The QFN package is in the center of the PCB and is soldered to the top metal layer on the board, which is slightly larger in size than the package. The maximum temperature shown of C is on the top surface of the plastic mold compound of the package. The PCB has multi layers of metal with insulating dielectric material between layers. The Ta ambient air temperature was set to 70 C Natural Convection, and 1 Watt power dissipation is applied. All detailed model views that will be examined in this document are taken from this complete assembly model shown in Figure 2. The die, leadframe, thermal vias, inner PCB layers, epoxy and solder layers, etc., are all contained in the model below and are viewed in whatever combination provides us with the data being sought. Figure 2 - QFN20 attached to PCB
4 Figure 3 shows how the thermal vias are spreading the heat onto the inner layer of metal within the PCB. Both the mold compound and PCB dielectric materials have been removed for clarity. The inner layer was modeled as a solid volume, however it s thermal conductivity was reduced by the volumetric reduction of the metal as compared to the actual layer geometry. This averaging of thermal conductivity is an accepted practice and produces accurate results if estimated accurately. Figure 3 - Thermal Vias Spreading Heat from the package to PCB inner metal layer
5 Figure 4 shows the die epoxied to the leadframe. The Tjmax of C is shown on the die. By applying the power dissipation to specific areas on the die, the spreading resistance in the die can be viewed along with hot spots of maximum temperature, and uniformity of temperature on the die surface. Figure 4 - Die Epoxied to Leadframe, Tjmax of C Shown
6 Figure 5 shows the case temperature gradients on the bottom surface of the leadframe. Some leads are fused to the exposed paddle which helps with thermal spreading, however the maximum Tc is shown near the center of the exposed paddle. This Tcmax area of C is the main path of heat flow to the PCB. The range of case temperatures is viewed from Tcmin of C to Tcmax of C, and is used to calculate Theta JC for the package. When packages are specified for Theta JC, the average value is provided. In this case the Theta JCmin is C/W and Theta JCmax is 8.83 C/Watt. This QFN20 package and die is then specified at 7.57 C/Watt. This thermal resistance rating is based on the temperature drop per watt of the die, die attach epoxy, and leadframe. Theta JC will remain constant for this packaged assembly regardless of the PCB design as shown in Chart 1 in Model Results. Figure 5 - Case Temperature on Bottom of Leadframe Exposed Paddle and Leads
7 FEA Model Results Chart 1 and Table 1 show the results from the model shown. The model has 16 thermal vias in a 4 x 4 array connecting the top metal layer in the PCB that the package is soldered to, to a PCB inner metal layer and also a small sized metal layer on the back side of the PCB. Today's PCB Design Engineers are challenged in many ways. The area under the package is heavily populated with metal traces for electrical signaling, leaving very little space for thermal vias. Also plated through holes connecting to inner layers takes time and additional cost to manufacture. However at the same time thermal requirements must be satisfied for reliability qualification of the product. Chart 1 provides the PCB designer with the information that is needed to minimize the amount of thermal vias to meet thermal requirements. Theta JA and Tjmax are affected by the design of the PCB, and are decreasing in a nonlinear fashion with the increase of thermal vias in the PCB. This is due to the vias acting as resistors in parallel with the area of the vias as the variable being reduced. Notice that from 0 to 4 vias we see a 10 drop in Tjmax, where from 12 to 16 vias there is only a 0.83 drop in Tjmax. Theta JC is represented by the lower horizontal line in the graph. Notice that Theta JC for the package remains constant regardless of variation in PCB design, Tjmax, or Theta JA. This study is beneficial to compare packages with one another using Theta JC values, predict closely the thermal performance of the package under actual operating conditions, and provide PCB Design Engineers with valuable data to thermally optimize the design of their products. Chart 1 - PCB Design vs. Thermal Results 160 QFN20 4x4 Soldered to 4 Layer PCB 70 o C Ambient Tjmax (Deg C) Theta JA (Deg C/Watt) Theta JC min (Deg C/Watt) 50 Tjmax (Deg C) Theta JA (Deg C/Watt) Theta JC min (Deg C/Watt) No. of Thermal Vias in PCB Ground Pad
8 Table 1 - PCB Design vs. Thermal Results QFN20 4x4 mm Thermal Watts # Vias Through PCB Theta JA ( o C/Watt) Tjmax ( o o C Ambient Tcase ( o C) Theta JC ( o C/Watt) Test Measurement Methods The Electrical Test Method (ETM) used in this study conforms to JEDEC packaging standard methods for thermal testing and is widely used in the industry for testing Tjmax and Theta JA. For this study the thermal test board is identical in design to the cell phone PCB used for modeling. There are 16 thermal vias in the test board in an attempt to correlate to the FEA results for the 16 via model. For testing accuracy, the actual product's die packaged in QFN20 is soldered to the test board. Its leads are probed with a DC voltmeter to find a diode in the circuit suitable for testing. This diode is usually the substrate isolation diode that is present to separate circuit elements from each other. The method uses the junction voltage across the diode as a temperature sensitive electrical parameter. The diode is calibrated in a hot oil bath with a very small value of current to not introduce heating. The oil temperature is dropped at a slow rate and a linear relationship is established for junction voltage vs. temperature. The device under test is then put in an environmental fixture, for this study a still air box at room temperature was used, and the diode is powered to a chosen level. Because the diode is forward biased it acts as a temperature sensor and also the heating element. The heat is generated and sensed at the same location on the die producing a good estimate of the highest junction temperature internal to the chip. The testing system records all data taken from calibration, as well as ambient air temperature in the still air box or oven, thermocouples attached to the case or leads, and power level applied. The system then provides a Tjmax, Delta T, which is the temperature rise of the die above ambient air, and Theta JA of the package on board.
9 Test Measurement Results Chart 2 shows actual test data taken on the modeled device on the assumed cell phone test board. Tjmax of the die is shown under 0.5 Watts of power and an ambient still air temperature of 23.4 C. The plot represents a temperature sensing time of 300us which is then linearly extrapolated back to time zero for the Tjmax reading of approximately 44 C. The system has already determined that steady state has been reached and is continuously sensing junction temperature for 300us at a time. Chart 3 shows Delta T for the same test. Readings here are between 20 C and 21 C. The system has calculated the Theta JA for this test and provides the number of 41.1 C/Watt. Theta JA becomes to common variable for comparing measured results and FEA modeled results. Chart 2 - Junction Temperature during Test
10 Chart 3 - Temperature Rise Above Ambient FEA Model Results Compared to Measured Results Table 2 compares the Theta JA between modeled and measures results on the same PCB. By getting an error of less than 3% between the two, a confidence level is gained assuring that the procedures for both modeling and testing are valid. With the 16 via model correlating so well to testing on a 16 via identical test board, the other data taken from the FEA model can be viewed as accurate such as the reduced thermal via data and Theta JC values. Table 2 Results Comparison Modeled FEA vs. Test Measurements Modeled vs. Measured Theta JA # Vias Through PCB Power Dissipation (Watts) Theta JA ( o C/Watt) % Error between modeled vs measured Theta JA Measured Tjmax ( o o C Ambient Modeled Tjmax ( o o C Ambient Modeled Measured Results % 44-45
11 Conclusion When modeling and testing packaged semiconductors for thermal performance, careful attention to product details, such as PCB design, and thermal boundary conditions are important for accuracy of results. Using the design specifications of the actual printed circuit board used during product operation will provide the most accurate thermal characterization of the device during operation, which is the goal. Standard test boards in the industry are used for package comparison only. Thermal performance during the product's actual operation will be significantly different, and can actually be controlled and optimized before the product is manufactured using simulations such as this. Theta JC can be accurately extracted from the convection model and is a very useful specification for comparing packages with one another. Theta JC is also useful for specifying a package's thermal performance by itself if no PCB has been designed yet. The trend in the industry lately has been to specify Theta JC for the package rather than a Theta JA on a standard test board. This way it becomes very clear that the thermal performance during operation is dependent on the PCB design that is installed in the wireless product. In most cases enough data on PCB specifications can be supplied and used to predict operating conditions. Thermal optimization studies of PCB designs can easily be done in ANSYS to meet thermal requirements as well as minimize manufacturing cost issues. Testing should always be done if possible to ensure that FEA modeling procedures are accurate. References Dr. John Sofia, Fundamentals of Thermal Resistance Measurement, 1995, Analysis Tech, Wakefield, MA Bernie Siegal, Elements of Device Thermal Characterization EIA/JESD51-1, JEDEC IC Thermal Measurement Method - ETM (Single Semiconductor Device) EIA/JESD51-2, JEDEC IC Thermal Test Method Environmental Conditions - Natural Convection-Still Air EIA/JESD51-3, JEDEC Low Effective Thermal Conductivity Test Board The author wishes to acknowledge Dr. Ephraim Flint and Paul Panaccione for their mentoring and support
Technical Notes. Introduction. PCB (printed circuit board) Design. Issue 1 January 2010
Technical Notes Introduction Thermal Management for LEDs Poor thermal management can lead to early LED product failure. This Technical Note discusses thermal management techniques and good system design.
More informationThermal Resistance Measurement
Optotherm, Inc. 2591 Wexford-Bayne Rd Suite 304 Sewickley, PA 15143 USA phone +1 (724) 940-7600 fax +1 (724) 940-7611 www.optotherm.com Optotherm Sentris/Micro Application Note Thermal Resistance Measurement
More informationIntegrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
EIA/JEDEC STANDARD Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) EIA/JESD51-2 DECEMBER 1995 ELECTRONIC INDUSTRIES ASSOCIATION ENGINEERING DEPARTMENT NOTICE
More informationThe Increasing Importance of the Thermal Management for Modern Electronic Packages B. Psota 1, I. Szendiuch 1
Ročník 2012 Číslo VI The Increasing Importance of the Thermal Management for Modern Electronic Packages B. Psota 1, I. Szendiuch 1 1 Department of Microelectronics, Faculty of Electrical Engineering and
More informationUnderstanding Thermal Characteristic of SOT-223 Package
Application Note Neil Nien AN044 January 2016 Understanding Thermal Characteristic of SOT-223 Package Abstract For power ICs, the thermal parameters of different packages should be compliant with different
More informationCHAPTER 6 THERMAL DESIGN CONSIDERATIONS. page. Introduction 6-2. Thermal resistance 6-2. Junction temperature 6-2. Factors affecting R th(j-a) 6-2
CHAPTER 6 THERMAL DESIGN CONSIDERATIONS page Introduction 6-2 Thermal resistance 6-2 Junction temperature 6-2 Factors affecting 6-2 Thermal resistance test methods 6-3 Test procedure 6-3 Forced air factors
More informationThermal Management of SMT LED Application Note
hermal Management of SM LED Application Note Introduction o achieve reliability and optimal performance of LED Light sources a proper thermal management design is necessary. Like all electronic components,
More informationA Guide to Board Layout for Best Thermal Resistance for Exposed Packages
A Guide to Board Layout for Best Thermal Resistance for Exposed Packages Table of Contents 1.0 Abstract... 2 2.0 Introduction... 2 3.0 DOE of PCB (Printed Circuit Board) Design... 2 4.0 Test Methodology...
More informationMemory Thermal Management 101
Memory Thermal Management 101 Overview With the continuing industry trends towards smaller, faster, and higher power memories, thermal management is becoming increasingly important. Not only are device
More informationSEMICONDUCTOR THERMAL MEASUREMENT PROCEDURE
SEMICONDUCTOR TERMAL MEASUREMENT PROCEDURE The following general procedure is equally applicable to either JEDEC or SEMI thermal measurement standards for integrated circuits and thermal test die. 1. Determine
More informationThermal Calculation for Linear Regulator
Linear Regulator Series Thermal Calculation for Linear Regulator The loss in linear regulators increases as the difference between the input and output voltages increases. Since most of the loss is converted
More informationTEST METHOD FOR STILL- AND FORCED-AIR JUNCTION-TO- AMBIENT THERMAL RESISTANCE MEASUREMENTS OF INTEGRATED CIRCUIT PACKAGES
SEMI G38-0996 N/A SEMI 1987, 1996 TEST METHOD FOR STILL- AND FORCED-AIR JUNCTION-TO- AMBIENT THERMAL RESISTANCE MEASUREMENTS OF INTEGRATED CIRCUIT PACKAGES 1 Purpose The purpose of this test is to determine
More informationComponent & Board Level Cooling.
> Component & Board Level Cooling www.resheji.com (C) Flomerics Ltd 2002 Section Title Components PCBs Packages Interface Materials Heat Sinks Thermoelectric Coolers Heat Pipes Printed Circuit Boards
More informationTECHNICAL INFORMATION
TECHNICAL INFORMATION THERMAL MANAGEMENT OF SURFACE MOUNTED TANTALUM CAPACITORS Ian Salisbury AVX-Kyocera Group Company Paignton, England TQ4 7ER Abstract: This paper covers thermal management of surface
More informationSemiconductor Thermal Resistance Standards versus Real Life. Bernie Siegal Thermal Engineering Associates, Inc.
Semiconductor Thermal Resistance Standards versus Real Life Bernie Siegal Thermal Engineering Associates, Inc. bsiegal@thermengr.com Overview Introduction Objective Temperature vs. Thermal Current Standard
More informationAN An Analysis for Power Dissipation of LDO Application with High Power. Hawk Chen. Thermal topology of LDO: Introduction:
An Analysis for Power Dissipation of LDO Application with High Power Hawk Chen When an LDO is operating, its on-chip devices dissipate power as a heat way. Heat flow from a higher to a lower temperature
More informationMIL-STD-883E METHOD THERMAL CHARACTERISTICS
THERMAL CHARACTERISTICS 1. PURPOSE. The purpose of this test is to determine the thermal characteristics of microelectronic devices. This includes junction temperature, thermal resistance, case and mounting
More informationUnderstanding Integrated Circuit Package Power Capabilities
Understanding Integrated Circuit Package Power Capabilities INTRODUCTION The short and long term reliability of s interface circuits, like any integrated circuit, is very dependent on its environmental
More informationThermal Characterization and Simulation of a fcbga-h device
Thermal Characterization and Simulation of a fcbga-h device Eric Ouyang, Weikun He, YongHyuk Jeong, MyoungSu Chae, SeonMo Gu, Gwang Kim, Billy Ahn STATS ChipPAC Inc Mentor Graphics Company Email: eric.ouyang@statschippac.com;
More informationUnderstanding Integrated Circuit Package Power Capabilities
Understanding Integrated Circuit Package Power Capabilities INTRODUCTION The short and long term reliability of National Semiconductor s interface circuits like any integrated circuit is very dependent
More informationBoundary Condition Dependency
Boundary Condition Dependency of Junction to Case Thermal Resistance Introduction The junction to case ( ) thermal resistance of a semiconductor package is a useful and frequently utilized metric in thermal
More informationan alternative approach to junction-to-case thermal resistance measurements
an alternative approach to junction-to-case thermal resistance measurements Bernie Siegal Thermal Engineering Associates, Inc. Introduction As more and more integrated circuits dissipate power at levels
More informationEffective Thermal Management of Crystal IS LEDs. Biofouling Control Using UVC LEDs
Biofouling Control Using UVC LEDs OCTOBER 10, 2017 Effective Thermal Management of This application note describes the thermal management concepts and guidelines for the proper use of Crystal IS UVC LEDs.
More informationReliability Qualification Report
Reliability Qualification Report SGA-5263Z Products Qualified by Similarity SGA-4563Z/4463Z/4363Z/4263Z/4163Z SGA-3563Z/3463Z/3363Z/3263Z SGA-2463Z/2363Z/2263Z/2163Z SGA-1263Z/1163Z SGA-0363Z/0163Z SGA-8343Z
More informationTHERMAL ANALYSIS AND OPTIMIZATION OF THERMAL PAD THICKNESS FOR TRANSISTOR MOUNTING IN FOR CPU S
ISSN Number (online): 2455-4650 THERMAL ANALYSIS AND OPTIMIZATION OF THERMAL PAD THICKNESS FOR TRANSISTOR MOUNTING IN FOR CPU S S. Balakrishnan *, M. Manikandan *Corresponding Author Department of Mechanical
More informationLednium Series Optimal X OVTL09LG3x Series
(10-watts,120 Viewing Angle) x x x x x Revolutionary 3-dimensional packaged LED source Robust energy-efficient design with long operating life Low thermal resistance (2.5 C/W) Exceptional spatial uniformity
More informationTools for Thermal Analysis: Thermal Test Chips Thomas Tarter Package Science Services LLC
Tools for Thermal Analysis: Thermal Test Chips Thomas Tarter Package Science Services LLC ttarter@pkgscience.com INTRODUCTION Irrespective of if a device gets smaller, larger, hotter or cooler, some method
More informationStacked Chip Thermal Model Validation using Thermal Test Chips
Stacked Chip Thermal Model Validation using Thermal Test Chips Thomas Tarter Package Science Services ttarter@pkgscience.com Bernie Siegal Thermal Engineering Associates, Inc. bsiegal@thermengr.net INTRODUCTION
More informationAN829. PolarPAK Thermal Impedance (Rth) vs. Heat Sink Assembly Clamping Torque. Vishay Siliconix. By Kandarp Pandya
PolarPAK Thermal Impedance (Rth) vs. Heat Sink Assembly Clamping Torque By Kandarp Pandya INTRODUCTION PolarPAK, the innovative power MOSFET package from, provides enhanced thermal performance, especially
More information5.0mm x 5.0mm SURFACE MOUNT LED LAMP. Descriptions. Features. Package Dimensions
5.0mm x 5.0mm SURFACE MOUNT LED LAMP Part Number: AAAF5051XQR412ZXS-C1 Cool White ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Suitable for all SMT assembly
More informationAOS Semiconductor Product Reliability Report
AOS Semiconductor Product Reliability Report AO4466/AO4466L, rev B Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 49 Mercury Drive Sunnyvale, CA 948 U.S. Tel: (48) 83-9742 www.aosmd.com Jun
More informationPlastic Package Device Thermal Resistance
Introduction Plastic Package Device Thermal Resistance This document discusses the thermal characteristics of Macronix plastic packaged devices in order to help system designers avoid exceeding the maximum
More informationSolid Tantalum Chip Capacitors TANTAMOUNT, Low Profile, Conformal Coated, Maximum CV
Solid Tantalum Chip Capacitors TANTAMOUNT, Low Profile, Conformal Coated, Maximum CV FEATURES New case size offerings. 2mm height Terminations: Tin (2) standard. Low ESR 8mm, 12mm tape and reel packaging
More information5W HI-POWER LED SPECIFICATION
5W HI-POWER LED SPECIFICATION HPB8b-49K5xWHBx Drawn by Checked by Approved by RoHS Conformity DATE:2011/2/11 REV:A HUEY JANN High Power 5W LED is made of GaInN chips with precise package technique which
More informationSuper Bright LEDs, Inc.
Package Dimensions Notes: 1.All dimensions are in millimeters 2.Tolerances unless dimensions ±0.25mm Absolute Maximum Ratings (Ta=25 ) Parameter Symbol Rating Unit Forward Current I F 700 ma Reverse Voltage
More informationThermal Interface Materials (TIMs) for IC Cooling. Percy Chinoy
Thermal Interface Materials (TIMs) for IC Cooling Percy Chinoy March 19, 2008 Outline Thermal Impedance Interfacial Contact Resistance Polymer TIM Product Platforms TIM Design TIM Trends Summary 2 PARKER
More informationEVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet High Power LED 1W
Technical Data Sheet High Power LED 1W Features Feature of the device: small package with high efficiency View angle: 130. High light flux output: more than 34lm@350mA. ESD protection. Soldering methods:
More informationEHP-A07/UB01-P01. Technical Data Sheet High Power LED 1W
Technical Data Sheet High Power LED 1W Features feature of the device: small package with high efficiency View angle: 120. high luminous flux output: more than 9lm@350mA. ESD protection. soldering methods:
More informationApplication Note Thermal Design for the AWB, AWM and AWT series of Power Amplifier Modules Rev 0
Application Note Thermal Design for the AWB, AWM and AWT series of Power Amplifier Modules Rev 0 Relevant products AWT6264 AWT6283 AWM6268 AWB Series PAs General Description ANADIGICS AWB, AWM, and AWT
More informationHLMP-1600, HLMP-1601, HLMP-1620, HLMP-1621 HLMP-1640, HLMP-1641, HLMP-3600, HLMP-3601 HLMP-3650, HLMP-3651, HLMP-3680, HLMP-3681
HLMP-16, HLMP-161, HLMP-162, HLMP-1621 HLMP-16, HLMP-161, HLMP-36, HLMP-361 HLMP-365, HLMP-3651, HLMP-368, HLMP-3681 T 1 3 / (5 mm), T-1 (3 mm), 5 Volt, 12 Volt, Integrated Resistor LED Lamps Data Sheet
More informationBrighter and Cooler. 95CRI Luna 200. Best Lumen / Watt LED Flip Chip COB Module
Best Lumen / Watt LED Flip Chip COB Module Brighter and Cooler High Efficacy & Lower Thermal Resistance Luna 200 Chip on Board is a high-performance LED module based on patented DBR Flip Chips and unique
More informationAOS Semiconductor Product Reliability Report
AOS Semiconductor Product Reliability Report AO64/AO64L, rev C Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 49 Mercury Drive Sunnyvale, CA 948 U.S. Tel: (48) 83-9742 www.aosmd.com Mar 8,
More informationEHP-AX08EL/UB01H-P01/B7B8/F3
Data Sheet Features Feature of the device: Small package with high efficiency Typical wavelength: 465nm Typical view angle: 150 Typical light flux output: 17 lm @ 350mA. ESD protection. Soldering methods:
More informationThermal Evaluation of Two Die Stacked FBGA Packages
Thermal Evaluation of Two Die Stacked FBGA Packages Krishnamoorthi. S, W.H. Zhu, C.K.Wang, H.B. Tan and Anthony Y.S. Sun Packaging Analysis and Design Center United Test and Assembly Center Ltd 5 Serangoon
More informationEVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet High Power LED 1W (Preliminary)
Features Feature of the device: small package with high efficiency Typical color temperature: 3500 K. Typical view angle: 120. Typical light flux output: 33 lm @ 350mA ESD protection. Soldering methods:
More informationBrighter and Cooler. Luna 160. Best Lumen / Watt LED Flip Chip COB Module
Best Lumen / Watt LED Flip Chip COB Module Brighter and Cooler High Efficacy & Lower Thermal Resistance Luna 160 Chip on Board is a high-performance LED module based on patented DBR Flip Chips and unique
More informationAgilent HLMP-CW18, HLMP-CW19, HLMP-CW28, HLMP-CW29, HLMP-CW38, HLMP-CW39 T-1 3/4 Precision Optical Performance White LED Data Sheet
Agilent HLMP-CW18, HLMP-CW19, HLMP-CW28, HLMP-CW29, HLMP-CW38, HLMP-CW39 T-1 3/4 Precision Optical Performance White LED Data Sheet Description These Super Bright Precision Optical Performance LED lamps
More informationYJ-BC-270H-G01 High CRI LED
YJ-BC-270H-G01 PRODUCT: HIGH CRI CHIP ON BOARD LED FEATURES: 27 mm 27 mm x 0.5 mm chip-on-board LED Φ19 mm light emission surface 120 emission angle 95 min Ra DESCRIPTION Yuji LED s BC270H series high
More informationEHP-AX08EL/GT01H-P03/5063/Y/N13
Data Sheet Features Feature of the device: Small package with high efficiency Typical color temperature: 5650 K. Typical viewing angle: 140 Typical light flux output: 160 lm @700mA. ESD protection. Soldering
More informationMODEL NAME : LLDMWW0-15K*0*A
Eagle Eye (Outdoor LED Module) Application Note MODEL NAME : LLDMWW0-15K*0*A RoHS Compliant HALOGEN FREE (30)-4022 1 / 16 CONTENTS 1. Product Description 3/16 2. Specifications 2.1. Chromaticity Bins for
More informationLUXEON Power Light Sources
Application Brief AB05 Thermal Design Using LUXEON Power Light Sources Introduction LUXEON Power Light Sources provide the highest light output with the smallest footprint of any Light Emitting Diodes
More informationPeltier Application Note
Peltier Application Note Early 19th century scientists, Thomas Seebeck and Jean Peltier, first discovered the phenomena that are the basis for today s thermoelectric industry. Seebeck found that if you
More informationSpecification SPW08F0D
Specification SPW08F0D Drawn SSC Approval Customer Approval SPW08F0D 1. Description 2. Absolute Maximum Ratings 3. Electro Optical Characteristics 4. Characteristic Diagram 5. Reliability 6. CIE Chromaticity
More informationTHERMAL PERFORMANCE EVALUATION AND METHODOLOGY FOR PYRAMID STACK DIE PACKAGES
THERMAL PERFORMANCE EVALUATION AND METHODOLOGY FOR PYRAMID STACK DIE PACKAGES Krishnamoorthi.S, *W.H. Zhu, C.K.Wang, Siew Hoon Ore, H.B. Tan and Anthony Y.S. Sun. Package Analysis and Design Center United
More informationNew Functions. Test mode and Specimen failure. Power cycle test system with thermal analysis capability using structure function.
using structure function. (1) Page 1/5 Test mode and failure There are two modes in a power cycle test: Tj Power cycle that changes the junction temperature (Tj Temperature) inside of the power semiconductor
More informationXZCW24X109S PRELIMINARY SPEC. Features. 3.5x2.8 mm SMD CHIP LED LAMP. Part Number:
PRELIMINARY SPEC Features ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Single color. Suitable for all SMT assembly and solder process. Available on tape and reel.
More informationDesign Guidelines for SFT Chipsets Assembly
Design Guidelines for SFT Chipsets Assembly SFT-10 SFT-16 SFT-20 Table of Contents 1. Design Guidelines 2 1.1 Electrical Insulation 2 1.2 Thermal Management 3 2. Available Reference Designs for Thermal
More informationA Quick PCB Thermal Calculation for Power Electronic Devices with Exposed Pad Packages
A Quick PCB Thermal Calculation for Power Electronic Devices with Exposed Pad Packages APPLICATION NOTE INTRODUCTION Thermal design of PCBs in electronic systems is critical to maintain device operating
More informationThermal Measurement and Simulation of the Component Rework Profile Temperature
Thermal Measurement and Simulation of the Component Rework Profile Temperature J.T. Nurminen Oulu University of Applied Sciences, School of Engineering, Oulu, Finland janne.nurminen@osao.fi Abstract In
More informationHONOURTEK Delux Array Series HRA0303 Preliminary
HONOURTEK Delux Array Series HRA0303 Preliminary Product Data Sheet HRA0303 Product Introduction The Delux Series LED Array products deliver high quality light with Delux lighting-class reliability. This
More informationHeat Sinks and Component Temperature Control
Lecture Notes Heat Sinks and Component Temperature Control Heat Sinks - 1 Need for Component Temperature Control All components, capacitors, inductors and transformers, and semiconductor devices and circuits
More informationAgilent HLMP-FWxx 5mm Extra Bright Flat Top InGaN White LED Lamps. Data Sheet
Agilent HLMP-FWxx 5mm Extra Bright Flat Top InGaN White LED Lamps. Data Sheet HLMP-FW66, HLMP-FW67 Description These high intensity white LED lamps are based on InGaN material technology. A blue LED die
More informationApplications. Application Note. Kingbright
ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Part Number: KADS-8072SY9Z4S Super Bright Yellow Features High efficient lightsource. Designed for high current operation.
More informationHONOURTEK Delux Array Series HRA0407 Preliminary
Copyright 2018 HONOURTEK,INC.ALL RIGH TS RESERVED HONOURTEK Delux Array Series HRA0407 Preliminary Product Data Sheet HRA0407 Product Introduction The Delux Series LED Array products deliver high quality
More informationLM34 Precision Fahrenheit Temperature Sensors
1 Precision Fahrenheit Temperature Sensors 1 Features 3 Description 1 Calibrated Directly in Degrees Fahrenheit The series devices are precision integratedcircuit temperature sensors, whose output voltage
More informationSCB10H Series Pressure Elements PRODUCT FAMILY SPEFICIFATION. Doc. No B
PRODUCT FAMILY SPEFICIFATION SCB10H Series Pressure Elements SCB10H Series Pressure Elements Doc. No. 82 1250 00 B Table of Contents 1 General Description... 3 1.1 Introduction... 3 1.2 General Description...
More informationNext-Generation Packaging Technology for Space FPGAs
Power Matters. Next-Generation Packaging Technology for Space FPGAs Microsemi Space Forum Russia November 2013 Raymond Kuang Director of Packaging Engineering, SoC Products Group Agenda CCGA (ceramic column
More informationT h e rm i s t o r s
Data Pack E Issued March 00 - T h e rm i s t o r s NTC thermistors The R S range of NTC thermistors includes standard tolerance negative temperature coefficient thermistors, a range of small close tolerance
More informationComponent Thermal Characterization: Transient to Steady State
Component Thermal Characterization: Transient to Steady State Dr. John W. Sofia October, 2011 Analysis Tech, Inc. (781)245-7825 email: info@analysistech.com www.analysistech.com This page is intentionally
More informationHeat Transfer and Flow Simulation in PCB
Logic Fruit Technologies White Paper 806, 8 th Floor, BPTP Park Centra, Sector 30, Gurgaon. Pin: 122001 T: +91-124-4117336 W: http://www.logic-fruit.com Heat Transfer and Flow Simulation in PCB By: Sagar
More informationProduct Brief. Mid-Power LED Series. Product Data Sheet. Enabling the best lm/w in Mid Power Range. STW8Q14D (Cool, Neutral, Warm) RoHS
Enabling the best lm/w in Mid Power Range Mid-Power LED - 5630 Series STW8Q14D (Cool, Neutral, Warm) RoHS Product Brief Description This White Colored surface-mount LED comes in standard package dimension.
More informationEHP-A23/RGB33-P01/TR. Data Sheet. Materials. High Power LED 1W. 1 of 12 Release Date: :11:33.0 Expired Period: Forever
Data Sheet Features Feature of the device: Small package with high efficiency Typical view angle: 120. ESD protection. Soldering methods: SMT Grouping parameter: Brightness, Forward Voltage and wavelength.
More information1. Packaging Outline Dimensions Specifications ) Absolute Maximum Ratings (Ta=25 C)... 4
Table of contents 1. Packaging Outline Dimensions... 3 2. Specifications... 4 1) Absolute Maximum Ratings (Ta=25 C)... 4 2) Typical Electro-Optical Characteristics (Ta=25 C)... 5 3. Product Code & Ranks...
More informationMP6901 MP6901. High Power Switching Applications. Hammer Drive, Pulse Motor Drive and Inductive Load Switching. Maximum Ratings (Ta = 25 C)
TOSHIBA Power Transistor Module Silicon Epitaxial Type (Darlington power transistor in ) High Power Switching Applications. Hammer Drive, Pulse Motor Drive and Inductive Load Switching. Industrial Applications
More informationTRENDS IN LEVENSDUURTESTEN VOOR MICRO-ELEKTRONICA PLOT CONFERENTIE
TRENDS IN LEVENSDUURTESTEN VOOR MICRO-ELEKTRONICA PLOT CONFERENTIE JEROEN JALINK 8 JUNI 2016 MICROELECTRONICS RELIABILITY 54 (2014) 1988 1994 Contents Introduction NXP Package form factor Failure mechanism
More informationLM35 Precision Centigrade Temperature Sensors
LM35 Precision Centigrade Temperature Sensors General Description The LM35 series are precision integrated-circuit temperature sensors, whose output voltage is linearly proportional to the Celsius (Centigrade)
More informationRoHS. Specification CUD8AF1C. 서식 Rev: 00
Specification RoHS CUD8AF1C 1 [ Contents ] 1. Description 2. Outline dimensions 3. Characteristics of CUD8AF1C 4. Characteristic diagrams 5. Binning & Labeling 6. Reel packing 7. Recommended solder pad
More informationc. VH: Heating voltage between the collector and emitter.
TERMAL IMPEDANCE MEASUREMENTS FOR INSULATED GATE BIPOLAR TRANSISTORS (DELTA GATE-EMITTER ON VOLTAGE METOD) 1. Purpose. The purpose of this test method is to measure the thermal impedance of the IGBT under
More informationHEAT TRANSFER THERMAL MANAGEMENT OF ELECTRONICS YOUNES SHABANY. C\ CRC Press W / Taylor Si Francis Group Boca Raton London New York
HEAT TRANSFER THERMAL MANAGEMENT OF ELECTRONICS YOUNES SHABANY C\ CRC Press W / Taylor Si Francis Group Boca Raton London New York CRC Press is an imprint of the Taylor & Francis Group, an informa business
More informationEVERLIGHT ELECTRONICS CO.,LTD.
Technical Data Sheet High Power LED 0.5W (Preliminary) Features Feature of the device: small package with high efficiency Typical view angle: 120 Typical color temperature: 3500 K. ESD protection. Soldering
More informationHIGH POWER LED TSLG-WF7060-A07
HIGH POWER LED High Power LED Features Feature of the device Small package with high efficiency Color coordinates: x=0.33, y=0.33 according to CIE 1931 Typical color temperature: 5600 K View angle: 120
More informationData Sheet. HLMP-4700 T-1 3 / 4 (5 mm), T-1 (3 mm), Low Current LED Lamps HLMP-4700, HLMP-4719, HLMP-4740 HLMP-1700, HLMP-1719, HLMP-1790
HLMP-4700 T-1 3 / 4 (5 mm), T-1 (3 mm), Low Current LED Lamps Data Sheet HLMP-4700, HLMP-4719, HLMP-4740 HLMP-1700, HLMP-1719, HLMP-1790 Description These tinted diffused LED lamps are designed and optimized
More informationAPCPCWM_ :WP_ WP_ RoHS. Specification. SSC-SZ5-P series. Document No. : SSC- QP
Specification RoHS SSC-SZ5-P series 1 Technical Z-Power LED Data X10490 Sheet Description SZ5-P series The Z-Power series is designed for high current operation and high flux output applications. It incorporates
More informationZ-POWER LED Series. Technical Datasheet for F50380 SEOUL SEMICONDUCTOR
SEOUL SEMICONDUCTOR ZPOWER LED Series Technical Datasheet for F50380 ZPower series is designed for high current operation and high flux output applications. ZPower LED's thermal management perform exceeds
More informationMIL-STD-750D METHOD THERMAL RESISTANCE MEASUREMENTS OF GaAs MOSFET's (CONSTANT CURRENT FORWARD-BIASED GATE VOLTAGE METHOD)
TERMAL RESISTANCE MEASUREMENTS OF GaAs MOSFET's (CONSTANT CURRENT FORWARD-BIASED GATE VOLTAGE METOD) 1. Purpose. The purpose of this test method is to measure the thermal resistance of the MESFET under
More informationData Sheet. HLMP-D150 T-1 3 /4 (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps HLMP-D150/D155, HLMP-K150/K155
HLMP-D150 T-1 3 /4 (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps Data Sheet HLMP-D150/D155, HLMP-K150/K155 Description These solid state LED lamps utilize newly developed
More informationAA2214VRBXS/A-TR-AMT 2.2 x 1.4 mm Surface Mount LED Lamp
2.2 x 1.4 mm Surface Mount LED Lamp DESCRIPTIONS The source color devices are made with InGaN Light Emitting Diode Electrostatic discharge and power surge could damage the LEDs It is recommended to use
More informationSEOUL SEMICONDUCTOR CO., LTD.
SEOUL SEMICONDUCTOR ZPOWER LED Series Technical Datasheet for X92050 ZPower series is designed for high current operation and high flux output applications. Furthermore, its thermal management characteristic
More information2 Input NAND Gate L74VHC1G00
Input NAND Gate The is an advanced high speed CMOS input NAND gate fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining
More informationSpecification LR521. Drawn Approval Approval. Rev. 05 December 서식번호 : SSC-QP (Rev.00)
Specification LR521 SSC Customer Drawn Approval Approval 1. Features Contents 2. Absolute Maximum Ratings 3. Electric-Optical Characteristics 4. Reliability Tests 5. Characteristic Diagrams 6. Color &
More informationLM50 SOT-23 Single-Supply Centigrade Temperature Sensor
SOT-23 Single-Supply Centigrade Temperature Sensor General Description The LM50 is a precision integrated-circuit temperature sensor that can sense a 40 C to +125 C temperature range using a single positive
More informationP8D1 P8D1. Features. Applications. Power UV LED Series is designed for high current operation and high flux output applications.
P8D1 Power UV LED Series is designed for high current operation and high flux output applications. P8D1 Features Super high Flux output and high Luminance Furthermore, its thermal management characteristic
More informationIX4340NE. Automotive Grade 5-Ampere, Dual Low-Side MOSFET Driver INTEGRATED CIRCUITS DIVISION. Features. Description. Applications
Automotive Grade -Ampere, Dual Low-Side MOSFET Driver Features AEC-Q100 qualified Two independent drivers, each capable of sourcing and sinking A V to 20V supply voltage range AEC-Q100 Grade 1-0 C to +12
More informationRoHS. Specification CUD8DF1A. Drawn Approval Approval. 서식 Rev: 00
Specification RoHS CUD8DF1A SVC Customer Drawn Approval Approval 1 [ Contents ] 1. Description 2. Outline dimensions 3. Characteristics of CUD8DF1A 4. Characteristic diagrams 5. Binning & Labeling 6. Reel
More information[ ] Sensors for Temperature Measurement, and Their Application 2L R 1 1 T 1 T 2
Sensors for Temperature Measurement, and Their Application In today s market, it is very rare to see electronic equipment that has not undergone extensive thermal evaluation, either by measurement or simulation.
More informationASMT-QYBG / ASMT-QYBH / ASMT-QYBJ 0.5W Warm White Power PLCC4 Surface Mount LED Datasheet
ASMT-QYBG / ASMT-QYBH / ASMT-QYBJ 0.5W Warm White Power PLCC4 Surface Mount LED Datasheet CAUTION: Static sensitive device. Please observe appropriate precautions during handling and processing. Description
More informationLednium Series Optimal X (10-watts,120 Viewing Angle)
(10-watts,120 Viewing Angle) Revolutionary 3-dimensional packaged LED source Robust energy-efficient design with long operating life Low thermal resistance (2.5 C/W) Exceptional spatial uniformity Available
More informationP8D137. Features. Applications. Power UV LED Series is designed for high current operation and high flux output applications. Super high Flux output
P8D137 Power UV LED Series is designed for high current operation and high flux output applications. P8D137 Features Super high Flux output and high Luminance Furthermore, its thermal management characteristic
More informationSpecification SSC-SZ5M
Specification SSC- RoHS (Rev.02_120103) SSC Customer Drawn Approval Approval 1 SSC- [ Contents ] 1. Description 2. Full code of SZ5-M series 3. Outline dimension 4. Characteristics of SZ5-M series 5. Characteristic
More informationELEC 3908, Physical Electronics, Lecture 18. The Early Effect, Breakdown and Self-Heating
ELEC 3908, Physical Electronics, Lecture 18 The Early Effect, Breakdown and Self-Heating Lecture Outline Previous 2 lectures analyzed fundamental static (dc) carrier transport in the bipolar transistor
More information