Items Requirements Test Methods and Remarks 1. Operating Temperature Range 2. Storage Temperature Range 3. Terminal Strength.
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1 Solid Tantalum Chip Capacitors (TC& Series). Operating Temperature Range. Storage Temperature Range. Terminal Strength No removal or split of the termination or other defects shall occur. -55 to to +5 Solder the capacitor inductor to the testing jig (glass epoxy board shown as the left figure) using eutectic solder. Then apply a force in the direction of the arrow. 5N force Keep time: 0±s Speed:.0mm/s Chip F Mounting Pad. Resistance to Solder the capacitor to the test jig (glass epoxy board) Using a eutectic solder. Then apply a force in the direction shown as the following figure. : mm; Pressurizing Speed: 0.5mm/sec. Keep time: 0 sec. Unit: mm [inch] 0 0 R0 5[.77] 5[.77] : mm Φ Vibration Solder the capacitor to the testing jig (glass epoxy board shown as the following figure) using eutectic solder. The capacitor shall be subjected to a simple harmonic motion having total amplitude of.5mm, the frequency being varied uniformly between the approximate limits of 0 and 55 Hz. The frequency range from 0 to 55 Hz and return to 0 Hz shall be traversed in approximately minute. This motion shall be applied for a period of hours in each mutually perpendicular directions (total of 6 hours). Solder mask Cu pad Specifications subject to change without notice. Please check our website for latest information. Revised 0/05/5 Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 580 Tel: Fax: sunlord@sunlordinc.com
2 Solid Tantalum Chip Capacitors (TC& Series) 6. Solderability No visible mechanical Solder temperature: 0± Duration: sec Wetting shall be exceeded Solder: Sn/.0Ag/0.5Cu 95% coverage. Flux: 5% Resin and 75% ethanol in weight 7. Resistance to Soldering Heat 5 No visible mechanical Wetting shall exceed 95% coverage. Capacitance change: within ±5%. tanδ shall not exceed 50% of the initial I 0 change shall not Solder temperature: 60± Duration: 5 sec Solder: Sn/.0Ag/0.5Cu Flux: 5% Resin and 75% ethanol in weight 5 The chip shall be stabilized at normal condition for ~ hours 8. Temperature exceed the initial I 0 A. At -55 No visible mechanical Capacitance change: within -0%. tanδ shall not exceed 50% of the initial B. At 85 No visible mechanical Capacitance change: <0% tanδ shall not exceed 50% of the initial I 0 shall not exceed 0 I 0 C. At 5 No visible mechanical Capacitance change: <%. tanδ shall not exceed 50% of the initial I 0 shall not exceed.5 Drying 0 + min at 5 The chip shall be stabilized at normal condition for ~ hours after drying, and measured at 5 as initial data. The chip shall be measured at -55 After Step A, the chip shall cool to room temperature. Measure at 85. After Step B, the chip shall be measured at Thermal Shock Capacitance change: within ±5%. tanδ shall not exceed the initial I 0 shall not exceed the initial I 0. I 0. Temperature, Time (See the following figure) -55, 0± min 5, 0±min. Transforming interval: Max. 5min. Tested cycle: 5 cycles. 5 The chip shall be stabilized at normal condition for ~ hours Specifications subject to change without notice. Please check our website for latest information. Revised 0/05/5 Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 580 Tel: Fax: sunlord@sunlordinc.com
3 Solid Tantalum Chip Capacitors (TC& Series) 0. Moisture Resistance No visible mechanical Temperature: 0±. Relative Humidity: 90%~95%RH. Capacitance change: within ±0%. Duration: hours. The chip shall be stabilized at normal condition for ~ hours tanδ shall not exceed 50% of the initial I 0 shall not exceed I 0.. Life Test No visible mechanical Capacitance change: within±0%. tanδ shall not exceed the initial I 0 shall not exceed.5 Temperature: 85± ; Rated Voltage Duration: hours The chip shall be stabilized at normal condition for ~ hours I 0. Specifications subject to change without notice. Please check our website for latest information. Revised 0/05/5 Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 580 Tel: Fax: sunlord@sunlordinc.com
4 Solid Tantalum Chip Capacitors (TC Series). Operating Temperature Range -55 to +05. Storage Temperature Range -55 to +05. Terminal No removal or split of the Solder the capacitor inductor to the testing jig (glass epoxy board Strength termination or other defects shown as the left figure) using eutectic solder. Then apply a force shall occur. in the direction of the arrow. Case code and shear: Case Size Max. Shear (Kg) code B D V E Keep time: 0±s Speed:.0mm/s Chip F Mounting Pad. Resistance to Solder the capacitor to the test jig (glass epoxy board) Using a eutectic solder. Then apply a force in the direction shown as the following figure. : mm; Pressurizing Speed: 0.5mm/sec. Keep time: 0 sec. Unit: mm [inch] Φ.5 R Fig Fig Vibration Solder the capacitor to the testing jig (glass epoxy board shown as the following figure) using eutectic solder. The capacitor shall be subjected to a simple harmonic motion having total amplitude of.5mm, the frequency being varied uniformly between the approximate limits of 0 and 55 Hz. The frequency range from 0 to 55 Hz and return to 0 Hz shall be traversed in approximately minute. This motion shall be applied for a period of hours in each mutually perpendicular directions (total of 6 hours). Solder mask Cu pad Specifications subject to change without notice. Please check our website for latest information. Revised 0/05/5 Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 580 Tel: Fax: sunlord@sunlordinc.com
5 Solid Tantalum Chip Capacitors (TC Series) 6. Solderability No visible mechanical Solder temperature: 5± Duration: sec Wetting shall be exceeded Solder: Sn/.0Ag/0.5Cu 95% coverage. Flux: 5% Resin and 75% ethanol in weight The less 5% of area is permitted to contain a few defect,such as pinholes holes un-soaking or poor soaking area which do not gather together. 7. Resistance to Soldering Heat No visible mechanical Wetting shall exceed 95% coverage. Capacitance change: within ±0%. tanδ shall not exceed 50% of the initial 5 I 0 change shall not exceed Solder temperature: 60± Duration: 5 sec Solder: Sn/.0Ag/0.5Cu Flux: 5% Resin and 75% ethanol in weight 5 The chip shall be stabilized at normal condition for hours 8. Temperature the initial I 0 A. At -55 No visible mechanical Capacitance change: within ±0%. tanδ shall not exceed the initial B. At 5 No visible mechanical Capacitance change: within ±0% tanδ shall not exceed the initial I 0 shall not exceed I 0 C. At 85 No visible mechanical Capacitance change: within ±0% tanδ shall not exceed 0% of the initial I 0 shall not exceed 0 I 0. D. At 05 No visible mechanical Capacitance change: within ±0%. tanδ shall not exceed 50% of the initial 5 I 0 shall not exceed 0 I 0. Drying 0 + min at 05 The chip shall be stabilized at normal condition for hours after drying, and measured at 5 as initial data. The chip shall be measured at -55 After Step A, the chip shall be cooled to 85 and measured. After Step B, the chip shall be measured at 85. After Step C, the chip shall be measured at 05. Specifications subject to change without notice. Please check our website for latest information. Revised 0/05/5 Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 580 Tel: Fax: sunlord@sunlordinc.com
6 Solid Tantalum Chip Capacitors (TC Series) 8. Temperature E. At 5 After Step D, the chip shall be cooled to 5 and measured. No visible mechanical Capacitance change: within ±0% tanδ shall not exceed the initial Leakage current shall not exceed I Thermal Shock Capacitance change: Temperature, Time (See Fig.6..7) within -0%~+0%. -55, 0± min 05, 0±min. tanδ shall not exceed the Transforming interval: Max.5min. initial Tested cycle: 500cycles. Leakage current shall not exceed the initial I 0. 5 The chip shall be stabilized at normal condition for hours before ESR shall not exceed 00% of the initial 0. Moisture Resistance No visible mechanical Capacitance change: -5%~+5%. tanδ shall not exceed of the initial I 0 shall not exceed 5I 0. 5 ESR shall not exceed 00% of the initial. Life Test No visible mechanical Capacitance change: -0%~+0%. tanδ shall not exceed the initial I 0 shall not exceed I 0. 5 ESR shall not exceed the initial. Surge Voltage No visible mechanical Capacitance change: -0%~+0%. tanδ shall not exceed the initial Leakage current shall not Fig.6..7 Temperature: 60±. Relative Humidity: 90%~95%RH. Duration: hours. The chip shall be stabilized at normal condition for hours before Temperature: 85± ; Rated Voltage Duration: hours The chip shall be stabilized at normal condition for hours before Temperature:05± ; ΩResistance,.Rated Voltage; 000cycles. 5 exceed I 0. ESR shall not exceed the initial Specifications subject to change without notice. Please check our website for latest information. Revised 0/05/5 Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 580 Tel: Fax: sunlord@sunlordinc.com
7 Solid Tantalum Chip Capacitors (TC Series) Item Requirements Test Methods and Remarks 6.. Terminal Strength shear shear Solder the capacitor to the test board(glass epoxy board shown in Fig. 6..-),then apply a force in the direction as Fig. 6..-; Fig.6..- Case code and shear: Case Size Max. Shear (Kg) code B C D V E Keep time:0±sec; speed:.0mm/sec 6.. Resistance to unit:mm Φ.5 Solder the capacitor to the test jig (glass epoxy board shown in Tab. 5-) Using a eutectic solder. Then apply a force in the direction shown in Fig. 6..-~Fig : mm; Pressurizing Speed: 0.5mm/sec. Keep time: 0 sec. 0 0 R0 00 Fig Fig Vibration Cu pad Solder mask Fig.6..- Solder the capacitor to the testing jig (glass epoxy board shown in Fig.6..-) using eutectic solder. The capacitor shall be subjected to a simple harmonic motion having total amplitude of.5mm, the frequency being varied uniformly between the approximate limits of 0 and 55 Hz. The frequency range from 0 to 55 Hz and return to 0 Hz shall be traversed in approximately minute. This motion shall be applied for a period of hours in each mutually perpendicular directions (total of 6 hours). 6.. Solderability Wetting shall exceed 95% coverage. The less 5% of area is permitted to contain a few defect,such as pinholes holes un-soaking or poor soaking area which do not gather together. Solder temperature: 5± Duration: sec. Solder: Sn/.0Ag/0.5Cu Flux: 5% Resin and 75% ethanol in weight Resistance to Soldering Heat Wetting shall exceed 95% coverage. Capacitance change: within ±0%. tanδ shall not exceed 50% of the initial 5 Leakage current change shall not exceed Solder temperature: 60± Duration: 5 sec. Solder: Sn/.0Ag/0.5Cu Flux: 5% Resin and 75% ethanol in weight. 5 The chip shall be stabilized at normal condition for hours before the initial I 0. Specifications subject to change without notice. Please check our website for latest information. Revised 0/05/5 Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 580 Tel: Fax: sunlord@sunlordinc.com
8 Solid Tantalum Chip Capacitors (TC Series) Item Requirements Test Methods and Remarks 6..6 Temperature properties 6..7 Thermal Shock A. At -55 Capacitance change: within±0%. tanδ shall not exceed the initial B. At 5 Capacitance change: within ±0% tanδ shall not exceed the initial Leakage current shall not exceed I 0. C. C. At 85 Capacitance change: within ±0% tanδ shall not exceed 0% of the initial Leakage current shall not exceed 0 I 0. D. At 05 Capacitance change: within ±0%. tanδ shall not exceed 50% of the initial Leakage current shall not exceed 0 I 0. E. At 5 Capacitance change: within ±0% tanδ shall not exceed the initial Leakage current shall not exceed I 0. Capacitance change: within -0%~+0%. tanδ shall not exceed the initial Leakage current shall not exceed the initial I 0. ESR shall not exceed 00% of the initial Drying 0 + min at 05 The chip shall be stabilized at normal condition for hours after drying, and measured at 5 as initial data. The chip shall be measured at -55. After Step A, the chip shall be cooled to 5 and measured. After Step B, the chip shall be measured at 85. After Step C, the chip shall be measured at 05. After Step D, the chip shall be cooled to 5 and measured. Temperature, Time (See Fig.6..7) -55, 0± min 05, 0±min. Transforming interval: Max.5min. Tested cycle: 500cycles. 5 The chip shall be stabilized at normal condition for hours before 6..8 Moisture Resistance Capacitance change:-5%~+5%. tanδ shall not exceed of the initial Leakage current shall not exceed 5I 0. 5 ESR shall not exceed 00% of the initial Fig.6..7 Temperature: 60±. Relative Humidity: 90%~95%RH. Duration: hours. The chip shall be stabilized at normal condition for hours before Specifications subject to change without notice. Please check our website for latest information. Revised 0/05/5 Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 580 Tel: Fax: sunlord@sunlordinc.com
9 Solid Tantalum Chip Capacitors (TC Series) Item Requirements Test Methods and Remarks 6..9 Life Test 6..0 Surge Voltage Capacitance change: -0%~+0%. tanδ shall not exceed the initial Leakage current shall not exceed I 0. 5 ESR shall not exceed the initial Capacitance change: -0%~+0%. tanδ shall not exceed the initial Leakage current shall not exceed I 0. 5 ESR shall not exceed the initial Temperature: 85± ; Rated Voltage Duration: hours The chip shall be stabilized at normal condition for hours before Temperature:05± ; ΩResistance,.Rated Voltage; 000cycles. Specifications subject to change without notice. Please check our website for latest information. Revised 0/05/5 Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 580 Tel: Fax: sunlord@sunlordinc.com
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MLCC MLCC CONTENT (MLCC) E STANDARD NUMBER... 3 STRUCTURE... 4 ORDERING CODE... 4 GENERAL PURPOSE FOR SMARTPHONE... 5 CLASS II: HIGH DIELECTRIC CONSTANT TYPE... 6 X5R Series... 6 TEST SPEC.... 7 PACKAGE...
Surface Mount Multilayer Chip Capacitors
FEAURES Ultra stable class 1 dielectric Four standard sizes High capacitance per unit volume Supplied in tape on reel For high frequency applications Ni-barrier with 100 % tin terminations RoHS COMPLIAN
Chip tantalum capacitors (Fail-safe open structure type)
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Specification of V-PORT XXXX-X-V05 Series
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Multilayer Ceramic Capacitors High Capacitance Series
Applications: Description: MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization, high density and high efficiency, ceramic condensers are used.
Features Instant light (less than 100ns) Lead free reflow soldering RoHS compliant Cool beam, safe to the touch
ProLight PM2G-1LYE-WSL 1W 370nm + 400nm Power LED Technical Datasheet Version: 1.3 Features Instant light (less than 100ns) Lead free reflow soldering RoHS compliant Cool beam, safe to the touch Typical
S SERIES X1/Y2 SAFETY CAPACITOR SPEC
FEATURES - Peak Impulse Surge: 5,000 VDC - Dielectric withstand strength: 1,500VAC PART NUMBER DESCRIPTION 1808 S 302 N 100 J C E Size Series Rated Voltage Dielectric Capacitance Tolerance Termination
Product Data Sheet PD-0037-B
Product Data Sheet PD-0037-B 3M Shielded Compact Ribbon (SCR) Connector 3M Shielded Compact Ribbon (SCR) Boardmount Right Angle 36110-2220 XX 3 Electronic Solutions Division Page: 1 of 12 Table of Contents
Shielded SMT Power Inductor SPRI2D10P Series
Part : SPRI2D10P SERIES Version : AD Page : 1 / 6 Feature Shielded SMT Power Inductor SPRI2D10P Series Low profile, low Rdc, and high current handling capacities. Magnetically shielded structure that ensures
Conductive Polymer Capacitors
CONDUCTIVE POLYMER CHARACTERISTICS Conductive Polymer Capacitors ITEM CONDITIONS SPECIFICATION Rotational temperature test High-temperature endurance life test Capacitors are placed in an oven with a specific
POE INTERNATIONAL CORPORATION. SPECIFICATION OF MULTI-LAYER RADIAL-LEADED TYPE CAPACITOR Ver: 8 Page: 1
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Ceramic PTC Thermistor: PPL Series
Features. RoHS compliant 2. Leaded type 3. Voltage rating: 270V ac ~500V ac 4. Resistance range:0~000ω 5. Stable over a long time 6. Operating temperature range: -20 ~ +85 C (V=V max ) -40 ~ +25 C (V=0)
MULTILAYER CERAMIC CAPACITORS Low Profile Series 0402 to 1210 Sizes X7R, X5R & Y5V Dielectrics Halogen Free & RoHS Compliance
MULILAYER CERAMIC CAPACIORS Low Profile Series 0402 to 1210 Sizes X7R, X5R & Y5V s Halogen Free & RoHS Compliance *Contents in this sheet are subject to change without prior notice. Page 1 of 9 ASC_ Low
Approval sheet. WLBD2012 Chip Bead. *Contents in this sheet are subject to change without prior notice.
WLBD2012 Chip Bead *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_ WLBD2012 Series_V5.0 Jun. 2017 FEATURES 1. Closed magnetic circuit. APPLICATIONS 1. Noise reduction
Approval sheet. WLBD1005 Chip Bead. *Contents in this sheet are subject to change without prior notice.
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WLPN Series Shielded SMD Power Inductors
WLPN404018 Series Shielded SMD Power Inductors *Contents in this sheet are subject to change without prior notice. Page 1 of 11 ASC_WLPN404018 Series_V2.0 Oct. 2016 Features 1. Close magnetic loop with
Approval sheet. WLBD1608 Chip Bead. *Contents in this sheet are subject to change without prior notice.
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WLPN Series Shielded SMD Power Inductors
WLPN505020 Series Shielded SMD Power Inductors *Contents in this sheet are subject to change without prior notice. Page 1 of 9 ASC_WLPN505020 Series_V0.0 Dec. 2016 1R0 Approval sheet Features 1. Close
M SERIES ULTRA HIGH Q CAPACITOR SPEC
FEATURES: - Ultra High-Q and low ESR - Extended working range for wireless products - Extended battery life of portable devices PART NUMBER DESCRIPTION 42 M 25 N R1 B C T Size Series Rated Voltage (VDC)
ACX Advanced Ceramic X
LF 1608 Series Multilayer Chip Low-Pass Filters ACX Features Monolithic structure replacing one inductor and three capacitors. Applications 0.8-6GHz wireless communication systems, including DECT / PACS
CHIP FERRITE INDUCTORS
CHIP FERRITE INDUCTORS Features. Perfect for high density surface mount applications since magnetic shield dliminates crosstalk. 2. Highly reliable in wide temperature and humidity range. Superior Q characteristics
Jun-2012 Rev A
Design Objective 108-57912 01-Jun-2012 Rev A MINI USB CONNECTOR, RECEPTACLE, VERTICAL, DIP, B TYPE 1. SCOPE 1.1. Contents This specification covers the performance, tests and quality requirements for the
WLPN Series Shielded SMD Power Inductors
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Ⅰ. SCOPE: This specification applies to the Pb Free high current type SMD Common mode filter for MCM-2M-SERIES PRODUCT INDENTIFICATION MCM - 2M - 70 2 3 Product Code 2 Dimensions Code 3 Impedance Code
AD Scope: Its specification applies to Radial Series Ceramic Capacitor. 2.How to order: CODE
1 1. Scope: Its specification applies to Radial Series Ceramic Capacitor. 2.How to order: CODE U AD10 R 102 K T Rated Voltage CodeT = 25 VDC U = 50 VDC Size Code : refer to the description in 3 Dielectric
Chip tantalum capacitors (Fail-safe open structure type)
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Approval sheet. WLBD0603 Chip Bead. *Contents in this sheet are subject to change without prior notice.
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SuperTan Extended (STE) Capacitors, Wet Tantalum Capacitors with Hermetic Seal
SuperTan Extended () Capacitors, Wet Tantalum Capacitors with Hermetic Seal FEATURES SuperTan Extended () represents a major breakthrough in wet tantalum capacitor Available technology. Its unique cathode
SURFACE MOUNT MONOLITHIC CHIP CAPACITORS COG AND TEMPERATURE COMPENSATING TYPES GRM36/39/40/42-6/42-2/43-2/44-1 Series
COG AND TEMPERATURE COMPENSATING TYPES GRM36/39/40/42-6/42-2/43-2/44-1 Series FEATURES Miniature size No Polarity Nickel Barrier Termination Standard highly resistant to metal migration Uniform dimensions
MULTILAYER CERAMIC CAPACITORS Safety Certified X2 Series 1808 to 2220 Sizes NP0 & X7R Dielectrics Halogen Free & RoHS Compliance
ULTILAYER CERAIC CAPACITORS Safety Certified X2 Series 1808 to 2220 Sizes NP0 & X7R Dielectrics Halogen ree & RoHS Compliance *Contents in this sheet are subject to change without prior notice. Page 1
This specification covers the requirements for product performance, test methods and quality assurance provisions of FG Terminal.
DESIGN OBJECTIVES The product described in this document has not been fully tested to ensure conformance to the requirements outlined below. Therefore AMP Ltd makes no representation or warranty, express
SPECIFICATIONS. Endrich Bauelemente Vertriebs GmbH. Thick film chip thermistor TATEYAMA KAGAKU IND. CO., LTD. 1 / 7. Customer. Code No.
Customer Endrich Bauelemente Vertriebs GmbH 1 /7 SPECIFICATIONS Code No. Type: TFT6G(2.00mm1.25mm) (Sn Plating) TFT3G(1.60mm0.80mm) (Sn Plating) TFT16G(1.00mm0.50mm) (Sn Plating) If you find herein anything
Tantalum Capacitor ( SCM Series )
Tantalum Capacitor ( SCM Series ) The product is the Ultra-Miniaturization size tantalum chip capacitors. J case gives approximately 50% greater mounting efficiency than conventional P case General Features
APPLICATIONS Wireless communication equipment and various types of general electronic equipment; Other electronic equipment including HDDs and ODDs.
WIRE WOUND CHIP FERRITE INDUCTORS FEATURES ature size, suitable for SMT; Using terminal electrode structure to restrain the parasitic component effect quite caused by lead; low DC resistance, high current
This specification applies to the Pb Free high current type SMD inductors for
SCOPE: This specification applies to the Pb Free high current type SMD inductors for PRODUCT INDENTIFICATION MSCDRI - 4012X - 100 M 1 2 3 4 1 Product Code 2 Dimensions Code 3 Inductance Code 4 Tolerance
Blower Motor 3P Connector
1. Scope Blower Motor P Connector 1.1 Content This specification covers the requirements for product performance, test methods and quality assurance provisions of Blower Motor P connector. Applicable product
APR 10 Rev. A
1. Introduction 1.1 Testing was performed on the DDR SODIMM SOCKET 200P to determine if it meets the requirement of Product Specification, 108-78628 1.2 Scope This report covers the electrical, mechanical
CHIP FERRITE BEADS. Features. Applications. Ordering Information. Shape and Dimensions
CHIP FERRITE BEADS Features 1. Effective for suppressing noise at high frequency, from several MHz to several hundreds MHz. 2. Chip type is suited for preventing the abnormal oscillation in high frequency
ACX Advanced Ceramic X
LF 2012 Series Multilayer Chip Low-Pass Filters Features Monolithic structure replacing two inductors and five capacitors. RoHS compliant Applications 0.8-6GHz wireless communication systems, including
CD series Ceramic Disc Capacitor
CD series Ceramic Disc Capacitor Part Number CD 471 Y5P K 500 R B - 05 25 D05 1 2 3 4 5 6 7 8 9 10 1 Type: CD= Ceramic DISC Capacitor 2 Capacitance Value Value 6.8pF 12pF 470pF 2200pF 100nF Code 6P8 120
Shielded Power Inductors TL- 4020SG Series (4.0 x 4.0 x 2.1mm)
Shielded Power Inductors TL- 42SG Series (4. x 4. x 2.1mm) FEATURES Low DCR and excellent current handling 4. x 4. mm footprint; 2.1 mm maximum height Operating temperature range: 4 C to +125 C with Irms
*Contents in this sheet are subject to change without prior notice.
MULTILAYER CERAMIC CAPACITORS Automotive Capacitor Arrays Series (MY) Qualified to 4 x 0402, 4 x 0603 Sizes NP0 & X7R Dielectrics Halogen Free & RoHS Compliance *Contents in this sheet are subject to change
Epoxy-coated Solid Electrolytic Tantalum Capacitors (LEAD FREE) TCR Series (LEAD FREE)
1. Scope This specification applies to. 2. Product identification T C R S 1 (1) (2) (3) (4) (5) (6) (7) Part no. Designation: (1) series: TCR represent series number of epoxy-coated solid electrolytic
Electric Double Layer Capacitors Product Specification. To. : DATE : SPECIFICATION WRITTEN CHECKED APPROVED
To. : DATE : 200... SPECIFICATION PRODUCT MODEL : STARCAP : DCS series WRITTEN CHECKED APPROVED 1 Index Page No. ITEM etc. 1 Cover Page 2 Index 1. Scope 2. Part Number System 3 3. Product Model Name 4.
Surface Mount Multilayer Chip Capacitors
Class 1 NP 1/16/25/5/ V FEAURES Ultra stable class 1 dielectric Four standard sizes High capacitance per unit volume Supplied in tape on reel For high frequency applications Ni-barrier with % tin terminations
PRODUCT SPECIFICATION
1 of 10 H 1.0 GENERAL THIS SPECIFICATION COVERS.039 INCHES VERTICAL DDR II SOCKETS WITH BLANKED / FORMED CONTACT DESIGNED FOR PRINTED WIRING BOARD TO DUAL IN-LINE MEMORY MODULE INTERCONNECTION. IN ALL
SMD Wire Wound Chip Inductors / NLD TYPE(For High Q)
.Features: 1.Utilizing a miniaturized winding structure. 2.These products provide higher Q characteristics than NLF Series. 3.Resin-coated surface enables excellent mounting. 4.RoHS compliant..applications: