Ultrafast Rectifier, 2 x 15 A FRED Pt
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1 Ultrafast Rectifier, x 5 FRED Pt ommon cathode, Base FETURES Ultrafast recovery time Low forward voltage drop 75 operating junction temperature 3 TO-47 3L node 3 node Low leakage current Designed and qualified according to JEDE -JESD 47 Material categorization: for definitions of compliance please see PRIMRY HRTERISTIS I F(V) x 5 V R 300 V V F at I F 0.85 V t rr typ. See Recovery table T J max. 75 Package TO-47 3L ircuit configuration ommon cathode DESRIPTION / PPLITIONS 300 V series are the state of the art ultrafast recovery rectifiers designed with optimized performance of forward voltage drop and ultrafast recovery time. The planar structure and the platinum doped life time control guarantee the best overall performance, ruggedness and reliability characteristics. These devices are intended for use in the output rectification stage of SMPS, UPS, D/D converters as well as freewheeling diodes in low voltage inverters and chopper motor drives. Their extremely optimized stored charge and low recovery current minimize the switching losses and reduce over dissipation in the switching element and snubbers. BSOLUTE MXIMUM RTINGS PRMETER SYMBOL TEST ONDITIONS VLUES UNITS Repetitive peak reverse voltage V RRM 300 V verage rectified forward current per leg 5 I F(V) T = 4 total device 30 Non-repetitive peak surge current per leg I FSM T J = 5, t p = ms 40 Operating junction and storage temperatures T J, T Stg -65 to +75 ELETRIL SPEIFITIONS (T J = 5 unless otherwise specified) PRMETER SYMBOL TEST ONDITIONS MIN. TYP. MX. UNITS Breakdown voltage, blocking voltage V BR, V R I R = 0 μ I F = Forward voltage V F I F = 5, T J = V R = V R rated Reverse leakage current I R T J = 5, V R = V R rated μ Junction capacitance T V R = 300 V pf Series inductance L S Measured lead to lead 5 mm from package body nh V Revision: 5-Oct-08 Document Number: 940 RE SUBJET TO SPEIFI DISLIMERS, SET FORTH T
2 DYNMI REOVERY HRTERISTIS (T J = 5 unless otherwise specified) PRMETER SYMBOL TEST ONDITIONS MIN. TYP. MX. UNITS Reverse recovery time t rr T J = ns I F =.0, di F /dt = 50 /μs, V R = 30 V T J = Peak recovery current I RRM T I F = 5 J = di F /dt = - 00 /μs T J = 5 V R = 00 V T J = Reverse recovery charge Q rr T J = n THERML - MEHNIL SPEIFITIONS PRMETER SYMBOL TEST ONDITIONS MIN. TYP. MX. UNITS Maximum junction and storage temperature range T J, T Stg Thermal resistance, junction to case per leg R thj Thermal resistance, junction to ambient per leg Thermal resistance, case to heatsink Weight Mounting torque R thj Typical socket mount R ths Mounting surface, flat, smooth, and greased /W g oz. Marking device ase style TO-47 3L 30PH (5.0) - () kgf cm (lbf in) Revision: 5-Oct-08 Document Number: 940 RE SUBJET TO SPEIFI DISLIMERS, SET FORTH T
3 0 00 I F - Instantaneous Forward urrent () T J = 75 T J = 5 T J = 5 I R - Reverse urrent (µ) T J = 75 T J = 50 T J = 5 T J = 0 T J = V F - Forward Voltage Drop (V) Fig. - Typical Forward Voltage Drop haracteristics V R - Reverse Voltage (V) Fig. - Typical Values of Reverse urrent vs. Reverse Voltage T - Junction apacitance (pf) 00 0 T J = V R - Reverse Voltage (V) Fig. 3 - Typical Junction apacitance vs. Reverse Voltage Z thj - Thermal Impedance ( /W) 0. D = 0.50 D = 0.0 D = 0. D = 0.05 D = 0.0 D = 0.0 t - Rectangular Pulse Duration (s) Fig. 4 - Maximum Thermal Impedance Z thj haracteristics P DM Notes:. Duty factor D = t /t.. Peak T J = P DM x Z thj + T Single pulse (thermal resistance) t t Revision: 5-Oct-08 3 Document Number: 940 RE SUBJET TO SPEIFI DISLIMERS, SET FORTH T
4 llowable ase Temperature ( ) Square wave (D = 0.50) Rated V R applied D 30 See note () t rr (ns) I F = 30, T J = 5 I F = 30, T J = I F(V) - verage Forward urrent () di F /dt (/µs) Fig. 5 - Maximum llowable ase Temperature vs. verage Forward urrent Fig. 7 - Typical Reverse Recovery Time vs. di F /dt 00 0 verage Power Loss (W) D RMS limit D = 0.0 D = 0.0 D = 0.05 D = 0. D = 0.0 D = 0.50 Q rr (n) 0 I F = 30, T J = 5 I F = 30, T J = I F(V) - verage Forward urrent () di F /dt (/µs) Fig. 6 - Forward Power Loss haracteristics Fig. 8 - Typical Stored harge vs. di F /dt Note () Formula used: T = T J - (Pd + Pd REV ) x R thj ; Pd = forward power loss = I F(V) x V FM at (I F(V) /D) (see fig. 6); Pd REV = inverse power loss = V R x I R ( - D); I R at V R = rated V R Revision: 5-Oct-08 4 Document Number: 940 RE SUBJET TO SPEIFI DISLIMERS, SET FORTH T
5 (3) t rr 0 I F t a tb () I RRM (4) Q rr 0.5 I RRM di (rec)m /dt (5) 0.75 I RRM () di F /dt () di F /dt - rate of change of current through zero crossing (4) Q rr - area under curve defined by t rr and I RRM () I RRM - peak reverse recovery current (3) t rr - reverse recovery time measured from zero crossing point of negative going I F to point where a line passing through 0.75 I RRM and 0.50 I RRM extrapolated to zero current. t rr x I Q RRM rr = (5) di (rec)m /dt - peak rate of change of current during t b portion of t rr Fig. 9 - Reverse Recovery Waveform and Definitions ORDERING INFORMTION TBLE Device code VS- 30 P H 03 -N product - urrent rating (30 = 30 ) ircuit configuration: = common cathode Package: 4 P = TO H = hyperfast recovery 6 - Voltage rating (03 = 300 V) 7 - Environmental digit: -N3 = halogen-free, RoHS-compliant, and totally lead (Pb)-free ORDERING INFORMTION (Example) PREFERRED P/N QUNTITY PER T/R MINIMUM ORDER QUNTITY PKGING DESRIPTION ntistatic plastic tube Dimensions Part marking information SPIE models LINKS TO RELTED DOUMENTS Revision: 5-Oct-08 5 Document Number: 940 RE SUBJET TO SPEIFI DISLIMERS, SET FORTH T
6 TO mils L/F Outline Dimensions DIMENSIONS in millimeters and inches B () R/ Q (3) E S Ø K M D B M (6) Φ P (Datum B) D Φ P x R () D D (4) 3 D Thermal pad 4 (5) L L See view B (4) E 0.0 M D B M x b 3 x b 0. M M b4 x e View - Plating (b, b3, b5) Base metal DDE E (c) c (b, b, b4) (4) Section -, D - D, E - E View B SYMBOL MILLIMETERS INHES MILLIMETERS INHES NOTES SYMBOL MIN. MX. MIN. MX. MIN. MX. MIN. MX. NOTES D E E b e 5.46 BS 0.5 BS b Ø K b L b L b Ø P b Ø P c Q c R D S 5.5 BS 0.7 BS D Notes () Dimensioning and tolerancing per SME Y4.5M-994 () ontour of slot optional (3) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.7 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body (4) Thermal pad contour optional with dimensions D and E (5) Lead finish uncontrolled in L (6) Ø P to have a maximum draft angle of.5 to the top of the part with a maximum hole diameter of 3.9 mm (0.54") (7) Outline conforms to JEDE outline TO-47 with exception of dimension c and Q Revision: 0-pr-7 Document Number: 9554 RE SUBJET TO SPEIFI DISLIMERS, SET FORTH T
7 Legal Disclaimer Notice Vishay Disclaimer LL PRODUT, PRODUT SPEIFITIONS ND DT RE SUBJET TO HNGE WITHOUT NOTIE TO IMPROVE RELIBILITY, FUNTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. ll operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. ustomers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. 07 VISHY INTERTEHNOLOGY, IN. LL RIGHTS RESERVED Revision: 08-Feb-7 Document Number: 900
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