Small Signal Zener Diodes
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- Alberta Manning
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1 Small Signal Zener Diodes PRIMARY CHARACTERISTICS PARAMETER VALUE UNIT V Z range nom. 2.4 to 75 V Test current I ZT 2.5; 5 ma V Z specification Pulse current Int. construction Single FEATURES Saving space Hermetic sealed parts Electrical data identical with the devices BZT55..series, TZM..series Fits onto SOD-323 Very sharp reverse characteristic Low reverse current level Very high stability Low noise AEC-Q qualified Compliant to RoHS Directive 22/95/EC and in accordance to WEEE 22/96/EC Halogen-free according to IEC definition APPLICATIONS Voltage stabilization ORDERING INFORMATION DEVICE NAME ORDERING CODE TAPED UNITS PER REEL MINIMUM ORDER QUANTITY BZM55-series BZM55-series-TR3 (8 mm tape on 3" reel) BZM55-series BZM55-series-TR (8 mm tape on 7" reel) 2 5 PACKAGE PACKAGE NAME WEIGHT MOLDING COMPOUND FLAMMABILITY RATING MicroMELF 2 mg UL 94 V- MOISTURE SENSITIVITY LEVEL MSL level (according J-STD-2) SOLDERING CONDITIONS 26 C/ s at terminals ABSOLUTE MAXIMUM RATINGS (T amb = C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Power dissipation R thja 3 K/W P tot 5 mw Junction to ambient air Mounted on epoxy-glass hard tissue, fig. R thja 5 K/W Junction tie point 35 μm copper clad,.9 mm 2 copper area per electrode R thjl 3 K/W Junction temperature T j 75 C Storage temperature range T stg - 65 to + 75 C Zener current I Z P tot /V Z ma Forward voltage I F = 2 ma V F.5 V Rev. 2., -Nov- Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
2 ELECTRICAL CHARACTERISTICS (T amb = C, unless otherwise specified) ZENER VOLTAGE RANGE () TEST REVERSE LEAKAGE DYNAMIC RESISTANCE TEMPERATURE COEFFICIENT I R at V R Z Z at I ZT Z ZK at I ZT2 PART NUMBER V Z at I ZT I ZT I ZT2 at Tamb = at T amb = C C f = khz TK VZ V ma μa V %/K MIN. NOM. MAX. MAX. MAX. MIN. MAX. BZM55C2V < 5 < < 85 < BZM55C2V < < 5 < 85 < BZM55C3V < 4 < 4 < 9 < BZM55C3V < 2 < 4 < 9 < BZM55C3V < 2 < 4 < 9 < BZM55C3V < 2 < 4 < 9 < BZM55C4V < < 2 < 9 < BZM55C4V <.5 < < 8 < BZM55C5V <. < 2 < 6 < BZM55C5V <. < 2 < 4 < BZM55C6V <. < 2 2 < < BZM55C6V <. < 2 3 < 8 < BZM55C7V <. < 2 5 < 7 < BZM55C8V <. < < 7 < BZM55C9V <. < < < BZM55C <. < < 5 < 7.3. BZM55C <. < < 2 < 7.3. BZM55C <. < 2 9. < 2 < 9.3. BZM55C <. < 2 < 26 <.3. BZM55C <. < 2 < 3 <.3. BZM55C <. < 2 2 < 4 < 7.3. BZM55C <. < 2 3 < 5 < 7.3. BZM55C <. < 2 5 < 55 < BZM55C <. < 2 6 < 55 < BZM55C <. < 2 8 < 8 < BZM55C <. < 2 2 < 8 < BZM55C <. < 2 22 < 8 < BZM55C <. < 2 24 < 8 < BZM55C <. < 2 27 < 8 < BZM55C <. < 5 3 < 9 < BZM55C <. < 5 33 < 9 < BZM55C <. < 5 36 < BZM55C <. < 39 < BZM55C <. < <.4.2 BZM55C <. < 47 5 <.4.2 BZM55C <. < 5 2 <.4.2 BZM55C <. < 56 < Notes Additional measurement of voltage group 9V to 75 at 95 % V zmin. 35 na at T j = C () t p ms, T/t p > Rev. 2., -Nov- 2 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
3 ELECTRICAL CHARACTERISTICS (T amb = C, unless otherwise specified) ZENER VOLTAGE RANGE () TEST REVERSE LEAKAGE DYNAMIC RESISTANCE TEMPERATURE COEFFICIENT I R at V R Z Z at I ZT Z ZK at I ZT2 PART NUMBER V Z at I ZT I ZT I ZT2 at Tamb = at T amb = C C f = khz TK VZ V ma μa V %/K MIN. NOM. MAX. MAX. MAX. MIN. MAX. BZM55B2V < 5 < < 85 < BZM55B2V < < 5 < 85 < BZM55B3V < 4 < 4 < 9 < BZM55B3V < 2 < 4 < 9 < BZM55B3V < 2 < 4 < 9 < BZM55B3V < 2 < 4 < 9 < BZM55B4V < < 2 < 9 < BZM55B4V <.5 < < 8 < BZM55B5V <. < 2 < 6 < BZM55B5V <. < 2 < 4 < BZM55B6V <. < 2 2 < < BZM55B6V <. < 2 3 < 8 < BZM55B7V <. < 2 5 < 7 < BZM55B8V <. < < 7 < BZM55B9V <. < < < BZM55B <. < < 5 < 7.3. BZM55B <. < < 2 < 7.3. BZM55B <. < 2 9. < 2 < 9.3. BZM55B <. < 2 < 26 <.3. BZM55B <. < 2 < 3 <.3. BZM55B <. < 2 2 < 4 < 7.3. BZM55B <. < 2 3 < 5 < 7.3. BZM55B <. < 2 5 < 55 < BZM55B <. < 2 6 < 55 < BZM55B <. < 2 8 < 8 < BZM55B <. < 2 2 < 8 < BZM55B <. < 2 22 < 8 < BZM55B <. < 2 24 < 8 < BZM55B <. < 2 27 < 8 < BZM55B <. < 5 3 < 9 < BZM55B <. < 5 33 < 9 < BZM55B <. < 5 36 < < BZM55B <. < 39 < < BZM55B <. < 43 < 35 <.4.2 BZM55B <. < 47 < 5 <.4.2 BZM55B <. < 5 < 2 <.4.2 BZM55B <. < 56 < < Notes Additional measurement of voltage group 9V to 75 at 95 % V zmin. 35 na at T j = C () t p ms, T/t p > Rev. 2., -Nov- 3 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
4 BASIC CHARACTERISTICS (T amb = C, unless otherwise specified) P tot - Total Power Dissipation (mw) T amb - Ambient Temperature ( C) C D - Diode Capacitance (pf) V R = 2 V T j = C 5 2 V Z - Z-Voltage (V) Fig. - Total Power Dissipation vs. Ambient Temperature Fig. 4 - Diode Capacitance vs. Z-Voltage V Z - Voltage Change (mv) T j = C I Z = 5 ma V Z - Z-Voltage (V) V Ztn - Relative Voltage Change.3 V Ztn = V Zt /V Z ( C).2 TK VZ = x -4 /K 8 x -4 /K 6 x -4 /K. 4 x -4 /K 2 x -4 /K. - 2 x -4 /K - 4 x.9-4 /K T j - Junction Temperature ( C) Fig. 2 - Typical Change of Working Voltage under Operating Conditions at T amb = C Fig. 5 - Typical Change of Working Voltage vs. Junction Temperature 5 TK VZ - Temperature Coefficient of V Z ( -4 /K) I Z = 5 ma V Z - Z-Voltage (V) I F - Forward Current (ma) T j = C V F - Forward Voltage (V). Fig. 3 - Temperature Coefficient of Vz vs. Z-Voltage Fig. 6 - Forward Current vs. Forward Voltage Rev. 2., -Nov- 4 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
5 I Z - Z-Current (ma) P tot = 5 mw T amb = C V Z - Z-Voltage (V) Fig. 7 - Z-Current vs. Z-Voltage Fig. - Board for R thja Definition (in mm) 5 I Z - Z-Current (ma) P tot = 5 mw T amb = C Reflow Soldering V Z - Z-Voltage (V) Fig. 8 - Z-Current vs. Z-Voltage Fig. - Recommended Foot Pads (in mm) r Z - Differential Z-Resistance (Ω) I Z = ma 5 ma ma T j = C V Z - Z-Voltage (V) Wave Soldering Fig. 9 - Differential Z-Resistance vs. Z-Voltage Fig. 2 - Recommended Foot Pads (in mm) Rev. 2., -Nov- 5 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
6 .6 (.24) surface plan Z thp - Thermal Resistance for Pulse Cond. (KW) t p /T =.5 t p /T =.2 Single Pulse R thja = 3 K/W T = T jmax - T amb t p /T =. t p /T =. t p /T =.2 t p /T =.5 i ZM = (- V Z + (V 2 Z + 4r zj x T/Z thp ) /2 )/(2r zj ) - 2 t p - Pulse Length (ms) Fig. 3 - Thermal Response PACKAGE DIMENSIONS in millimeters (inches): MicroMELF Cathode indification (.39) surface plan glass <.35 (.53).2 (.47). (.43) * 2 (.79).8 (.7). (.).5 (.6) > R2.5 (.98) glass * The gap between plug and glass can be either on cathode or anode side Foot print recommendation: Reflow soldering Wave soldering 2.4 (.94) 2.8 (.).8 (.3).8 (.3).9 (.35).9 (.35).2 (.47).4 (.55).8 (.3) (.39) Created - Date: 26.July.996 Rev. 3 - Date: 7.June.26 Document no.: Rev. 2., -Nov- 6 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
7 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. 27 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 8-Feb-7 Document Number: 9
Parameter Test condition Symbol Value Unit. Mounted on epoxy-glass hard tissue, fig µm copper clad, 0.9 mm 2 copper area per electrode
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