Nanoparticle Counter Applications in Advanced Process

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Anne Boone
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1 Naoparticle Couter Applicatios i Advaced Process 2014 奈米微粒量測技術標準座談會 Ageda Itroductio Use Cases ad Applicatios Semi Tool Moitorig Clearoom Moitorig Gas applicatios Disk Drive Maufacturers Coclusios 1

2 Itroductio - The Moitorig Gap ITRS critical or killer particle size is shrikig with device geometry Use Cases & Applicatios Semi Tool Moitorig g Moitor aoparticles i clearooms ad process tools Clearoom Moitorig g Characterizatio ad troubleshootig; evaluate draft ISO Gas applicatios g Moitor iert gas quality with the optioal high-pressure diffuser (HPD-III) Disk Drive Maufacturers g Moitor aoparticles iside HDD process/assembly tools 2

3 Use Case #1 Semi Tool Moitorig Semicoductor process tools such as stockers, sorters, all frot-ed wafer hadlig / trasport, reticle ispectio, lithography ad surface sca Critical success factors are: g Fast sample times to correlate particles with wafer movemet g Locatio of sample tube close to wafer path Implemetatio details how to do it correctly g Sample poit placemet should just below the wafer plae of movemet g Sample tube legth should be as short as possible ad with miimal beds Semi Tool Moitorig Data 3

Nao Particle Geeratio Summed Particle Couts Over 8 Hours Locatio > 100 m > 10 m 10 m/100m Ratio A. Etch 243 459879 1893 A. Chemical Hood 224 2028 9.1 A.

4 Nao Particle Geeratio Summed Particle Couts Over 8 Hours Locatio > 100 m > 10 m 10 m/100m Ratio A. Etch A. Chemical Hood A. Coater/Developer A. Stocker A large ratio of 10 m to 100 m suggests particle geeratio withi the clearoom/mii-eviromet Chemical formatio Mechaical formatio 4

5 Use Case #2 Geeral Clearoom Two applicatios mobile ad fixed moitorig Characterize clearooms below 100 m g Produce baselie data for curret clearoom clealiess g Characterizatio of suspected problem areas i clearooms g Coduct prelimiary ivestigatios i accordace with ew draft ISO stadard for clearooms ISO Critical success factors are: g Ability to operate uatteded ad cotiuously g Graphical data presetatio ad data storage Implemetatio details how to do it correctly g Idetifyig critical samplig locatios g Take care to maage data records for various sample locatios Draft ISO Highlights Draft ISO Stadard Classificatio of Air Clealiess by Naoscale Particle Cocetratio New guidelies give for 50 m dow to 1 m for Class 1 ad 2 Assumes d 2.08 distributio 5

Laboratory Tests: ISO Class 1-4 Laboratory test at PMS to create differet ISO class levels The 10 m Couter Out Couts the 100 m Couter by a Greater Margi as the Eviromet becomes Cleaer Istrumet

6 Laboratory Tests: ISO Class 1-4 Laboratory test at PMS to create differet ISO class levels The 10 m Couter Out Couts the 100 m Couter by a Greater Margi as the Eviromet becomes Cleaer Istrumet (Particle couts per m3) ISO Class 1 ISO Class 2 ISO Class 3 ISO Class 4 Lasair II ,480 NPC10 uit ,160 17,719 Results Summary Cout ratio NPC10 vs Lasair II Use Case #3 Process Gas Moitorig The eed for higher purity process gases used i IC maufacture has led to a rethikig of the criteria used to evaluate filter performace ad ao-cotamiatio moitorig. Target gases are iert semicoductor process gasses such as CDA ad N2. Challege to successful measuremet are: g Low backgroud couts, high sesitivity ad fast sample times 6

Use Case #4 HDD Assembly Moitor ao particles i HDD assembly processes g The ao particle couter ca detect particulate cotamiatio well below the critical fly height of HDD heads Critical success

7 Use Case #4 HDD Assembly Moitor ao particles i HDD assembly processes g The ao particle couter ca detect particulate cotamiatio well below the critical fly height of HDD heads Critical success factors are: g Low flow rate, low backgroud couts, high sesitivity & fast sample times Implemetatio details how to do it correctly g Short sample tube legths g Target areas where media may be exposed Coclusios High sesitivity metrology required for likig aocotamiatio to defects. Past: Possible see o particles i very clea eviromets ad fluids. Preset: The latest techology for ao-cotamiatio moitorig provides. Data for correlatig cotamiatio to yield. Statistically valid cotamiatio data for settig actioable cotrol limits. Techology ow exists to determie wafer eviromet aocotamiatio levels. Work with idustry parters to optimize moitorig locatios. 7

MICROCHIP MANUFACTURING by S. Wolf

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