DATA SHEET MULTILAYER CERAMIC CAPACITORS CC Series Y5V 10 V TO 50 V

Transcription

1 DAA SHEE MULILAYER CERAMIC CAPACIORS Series Y5V 10 V O 50 V Product Specification Supersedes Date of Jan 14, 2005

2 Product specification 2 Surface Mount Multilayer Ceramic Capacitors SCOPE his specification describes Yageo Y5V series chip capacitors. ORDERING INFORMAION Part number is identified by the series, size, tolerance, packing style, temperature coefficient, rated voltage and capacitance value. Y5V BB (1) (2) (3) (4) (5) CONSRUCION (1) SIZE INCH BASED (MERIC) terminations 0402 (1005) electrodes 0603 (160) 005 (2012) 1206 (3216) Fig. 1 Surface mounted multilayer ceramic capacitor construction ceramic material MLB457 (2) OLERANCE M = ±20% Z = 20/+0% DIMENSION (3) PACKING SYLE For dimension see able 1 R = 7 paper tape K = 7 blister tape P = 13 paper tape W F = 13 blister tape C = Bulk case Fig. 2 Surface mounted multilayer ceramic capacitor dimension L 2 L 4 L 3 L1 MBB211 (4) RAED VOLAGE 6 = 10 V 7 = 16 V = 25 V 9 = 50 V (5) CAPACIANCE VALUE: First two for significant figures and 3rd for number of zero Letter R for decimal point able 1 YPE L1 (mm) 1. 0 ± ± ± ±0.15 W (mm) 0.5 ± ± ± ±0.15 (mm) min max L2/L3 (mm) min max L4 (mm) min

3 Product specification 3 Surface Mount Multilayer Ceramic Capacitors CAPACIANCE RANGE & HICKNESS FOR 10V & 16V able 2 CAPACIANCE 10V 16V (nf) ± ± ±0.1 1, ± ± ±0.1 2,200 4, ±0.1 10, ±0.1 CAPACIANCE RANGE & HICKNESS FOR 25V & 50V able 3 CAPACIANCE 25V 50V (nf) ± ± ± ± ± ± ± ± ± ±0.1 1, ± ±0.1

4 Product specification 4 Surface Mount Multilayer Ceramic Capacitors HICKNESS CLASSES AND PACKING QUANIY able 4 HICKNESS mm APE WIDH / AMOUN PER REEL CLASSIFICAION AMOUN PER BULK CASE (mm) Ø10 mm, 7 Ø330 mm, 13 Paper Blister Paper Blister ± , , , ±0.10 4, , , ±0.07 4, , , ±0.10 4, , , ± , , ± , , ,000 ELECRICAL CHARACERISICS able 5 CHARACERISICS ES CONDIIONS REQUIREMEN Operation temperature range C to +5 C emperature characteristic/coefficient (C) With respect to 25 C within operation temperature range +22% to 2% Capacitance tolerance 1Vrms/1KHz at 25 C ±20%, 20%~+0% Dissipation factor (D.F.) 1Vrms/1KHz at 25 C See table 6 Insulation resistance (IR) At U r (rated voltage) for 1 minute R ins 10 GΩ or R ins x C 100 seconds whichever is less Dielectric withstanding Voltage At 2.5 x U r for 5 seconds No breakdown able 6 D.F. specification for 0402 to 1206 sizes DISSIPAION FACOR RAED VOLAGE CAPACIANCE VALUE OF SIZES (D.F.) (U r) % 7% 9% 12.5% 25 V --- < 100 nf 270 nf < 1 µf 50 V --- < 100 nf 270 nf < 1 µf 25 V nf 270 nf < Cap. Range < 470 nf 1 µf 50 V nf > 270 nf 1 µf 10 V nf 1 µf 2.2µF 16 V nf 1 µf 2.2µF 25 V nf V all > 270 nf > 1 µf > 2.2µF 16 V all > 270 nf > 1 µf > 2.2µF

5 Surface Mount Multilayer Ceramic Capacitors Product specification 5 APING REEL able 7 APE WIDE mm mm 12 mm ØA (mm) ØB (mm) 62±1.5 62±1.5 62±1.5 ØD (mm) ØC (mm) 12.75±0.15/ ±0.15/ ±0.15/ 0 W (mm).4+1.5/ / / 0 max (mm) handbook, full pagewidth D C B A W MSA24_b Fig. 3 Reel dimension For dimension see able 7 PAPER APE SPECIFICAION able DIMENSION A (mm) 0.62± ± ± ±0.1 For dimension see able D 0 P 2 P 0 B (mm) 1.12± ± ± ±0.1 E W (mm).0±0.2.0±0.2.0±0.2.0±0.2 E (mm) 1.75± ± ± ±0.1 cover tape B F W F (mm) 3.5± ± ± ±0.05 P0 (mm) 4±0.05 4±0.05 4±0.05 4±0.05 A P 1 MBG251_a P1 (mm) 2±0.05 4±0.1 4±0.1 4±0.1 P2 (mm) 2±0.05 2±0.05 2±0.05 2±0.05 Fig. 4 Paper tape dimension ØD0 (mm) / / 0 (mm) 0.6± ± ± ±0.05 BLISER APE SPECIFICAION able 9 DIMENSION For dimension see able 9 A (mm) D 0 P 2 P 0 B (mm) E W (mm).1±0.2.1±0.2.1± ±0.2 E (mm) 1.75± ± ± ±0.1 F (mm) 3.5± ± ± ±0.05 pe B F W P0 (mm) 4±0.1 4±0.1 4±0.1 4±0.1 A D 1 MBG516_a P1 (mm) 4±0.1 4±0.1 4±0.1 ±0.1 P2 (mm) 2±0.05 2±0.05 2±0.05 2±0.05 P 1 direction of unreeling ØD0 (mm) / / / / 0 max (mm) Fig. 5 Leader/trailer tape dimension

6 Surface Mount Multilayer Ceramic Capacitors Product specification 6 PACKING MEHOD LEADER/RAILER APE SPECIFICAION trailer end empty compartments with cover tape leader end cover tape only mm trailer (max. 260 mm) leader 400 mm MEA529-2 Fig. 6 Leader and trailer tape dimension MEHOD OF MOUNING For normal use the capacitors may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapor phase soldering) or conductive adhesive in accordance with CE 0002 classification A. ypical values (sold line) Process limits (dotted lines) ( C) C 260 C 245 C 215 C 10 C 10 s 10 s 40 s MLA K/s t (s) Fig. 7 Recommended reflow soldering profile ypical values (sold line) Process limits (dotted lines) he capacitors may be soldered twice in accordance with this method if desired 300 ( C) s 235 C to 260 C second wave MLA first wave 5 K/s K/s 2 K/s C to 130 C forced cooling 50 2 K/s t (s) 250 Fig. Recommended wave soldering profile

7 Surface Mount Multilayer Ceramic Capacitors Product specification 7 ES AND REQUIREMEN able 10 IEC34-10 ES IEMS CONDIIONS REQUIREMENS 4.9 Bending Bending rate 1 mm/s, jig. radius 340 mm l C/Cl 20% 4.10 Resistance to soldering heat 260±5 C for 10±0.5 s in static solder bath 10% l C/Cl 20% 4.11 Solderability 235±5 C for 2±0.5 s in a static solder bath he termination shall be well tinned 4.12 Rapid change of temperature Y5V: 30 C to +5 C, 5 cycles l C/Cl 20% 4.14 Damp heat 4.15 Endurance Preconditioning At 40 C, 90 to 95% RH and U r applied for 500 hours Preconditioning 2 x U r applied for 1,000 hours, at upper category temperature l C/Cl within ±30% or 40% to +30% D.F. 7%, 12.5%, 15% (depending on capacitance value) IR 500 MΩ or R x C 25 s whichever is less D.F. 7%, 12.5%, 15% (depending on capacitance value) IR 1,000 MΩ or R x C 50 s whichever is less

8 Surface Mount Multilayer Ceramic Capacitors Product specification REVISION HISORY REVISION DAE CHANGE NOIFICAION DESCRIPION Version 9 June 24, Revised thickness of Y5V V 4.7 µf to 10µF Version Jan 14, Revised thickness of Y5V /25 V 1 µf Version 7 Aug 16, D.F. value added Version 6 Mar 12, hickness and packing quantity amending Version 5 Aug. 13, aping drawing amended