GLAST Large Area Telescope. LAT Systems Engineering. LAT Systems Engineering LAT Test Plan Update. Tom Leisgang. Gamma-ray Large Area Space Telescope

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1 Gamma-ray Large Area Space Telescope GLAST Large Area Telescope Systems Engineering Test Plan Update Tom Leisgang Systems Engineering T. Leisgang 1 Systems Engineering Test Plan Update

2 Additions Deletions New Requirements Subsystem Plan changes Test Plan Update Topics T. Leisgang 2 Systems Engineering Test Plan Update

3 Changes/Corrections/Amplifications General Updates Reference documents (section 4) document release matrix Added Test Plan directive reference information Figure 5 : Test Plan Directive document matrix section on plan for the plans Deleted Reference to an ESD test where did this come from? Removed it T. Leisgang 3 Systems Engineering Test Plan Update

4 Test Plan Matrix Instrument Performance Verification Plan -MD Subsystem Test Plans Tracker Tower Test Plan -TD Calorimeter Test Plan -SS Performance & Operation Test Plans Component Aliveness Tests Subsystem Integration Tests Integration & Test Plan -MD Mechanical Integration -PS M-GSE -MD Facilities -MD Handling &Transportation Plan -MD MD Contamination Control Plan -MD Instrumentation Plan -MD ACD Test Plan ACD-PLAN Thermal S/S Test Plan Limited Performance Tests Comprehensive Performance Tests E-GSE Development -MD Survey & Alignment -MD Mechanical Weight & CG -MD Survey Plan -TD Mechanical S/S Test Plan -SS Dynamics Tests No Number Dynamics Test Plan -MD Operational Performance Tests Electrical Performance Tests -MD Flight Software Test Plan -TD Thermal Tests -MD-0xxxx Thermal Test Plan -MD M. Lovellette J. Wang Trigger & Datflow Test Plan -TD SUI TEM EMI Tests -MD EMI/EMC Test Plan No Number EP GASU PDU Instrument Calibration -MD SV&C Test Plan -MD E. Do Couto E Silva Beam and Particle Test Plans -MD-0440 EGSE Workstation & Software Validation Plan -MD T. Leisgang 4 Systems Engineering Test Plan Update

5 Changes/Corrections/Amplifications continued Section 6 Updated Table 6-1 to current signature plan Updated section on End Item Data Packages Topic of 8/11/03 Engineering Meeting Expanded test support requirement definitions T. Leisgang 5 Systems Engineering Test Plan Update

6 Technical Document Release- Signature Requirements Specifications L-II L-III L-IV Updated Document Release Signature Requirements Design Documents Subsystem Component Test Plans Subsystem Component Interface Documents Subsystem Component Test Procedures Subsystem Component Drawings Interface Subsystem Component Technical Documents / memos Signatory Originator / Design Engineer Originating Subsystem Lead Originating Subsystem Manager(s) Affected Subsystem Manager (s) Perfomance & Safety Assurance Systems Engineering Chief Design Engineer Chief Electronics Engineer Chief Mechanical Engineer Integration & Test Manager Instrument Operations Science Analysis Instrument Scientist Principal Investigator Project Manager GSFC Project Office Required As required Review Copy - FYI No Signature Required (If Impacted) T. Leisgang 6 Systems Engineering Test Plan Update

7 Updated Acceptance Test Data Package ID and Configuration Information Mechanical Summary Data Electrical Interface Data Software Configuration Unit Calibration Data Unit Performance Data Unit Support Data Operational Support Data Quality Data T. Leisgang 7 Systems Engineering Test Plan Update

8 Assembly & Test Flow Updated figure 5-2 Removed Sine Burst Relocated arrival of Radiators to support EMI/EMC testing Arrival, installation & removal to support current plans Changed delivery sequence T. Leisgang 8 Systems Engineering Test Plan Update

9 Updated Assembly Flow Tower Integration Integration Test Environmental Tests Observatory Integration TKR CAL Grid TEM/PS EPU SIU PDU GASU Htr Switch Box EMI Shield ACD X- Plate Integrate TKR/CAL & TEM's with Grid E A O Survey E F A Integrate E-Boxes w/ Grid E Integrate EMI Skirt, Htr F switch boxes E O E O F M F Survey Survey Integrate ACD Integrate X Plate F C M Survey (2) Weight Modal survey C Ship to NRL Install Radiators C EMI/EMC Remove Radiators L Sine Vibe Install Radiators L Acoustic Thermal Vacuum L Balance Cycling C M L M Survey C Remove Radiators Weight & CG Ship to SA C Handover L Integration L C O Thermal Vac L C M L Y Store? N Final C Storage O Survey C Radiators Mechanical Fit-Checks Spectrum Astro E Electrical InterfaceTests A Aliveness Tests Survey: F Functional Tests O Optical M Muon L Limited Performance C Comprehensive Performance v4 post CDR 10/30/03 T. Leisgang 9 Systems Engineering Test Plan Update

10 Test Performance Updates Section 7 Updated information on Dynamics Testing Updated and improved test requirements for EMI testing Added Tracker as a Proto-flight program T. Leisgang 10 Systems Engineering Test Plan Update

11 EMI Test Requirements Matrix Emissions Susceptability Other Radiated Conducted Radiated Conducted Electric Field (RE102) Magnetic Field (RE101) Conducted Emissions(CE 101/102) Conducted Emissions Common Mode (CECM) Radiated Susceptability -Electric Field (RS 103) Radiated Susceptability Magnetic Field (RS101-Static) Conducted Susceptability Electric Field (CS101/102) Conducted Susceptability Common Mode (CSCM) Instrument Conducted Fuse Blow Transient (CS06) Static Dipole Moment EMI Safety Margin EMI Superposition (EMISM) Subsystem Components EM/Prototype Proto-flight/Qualification Acceptance/Flight Instrument Recommended Required T. Leisgang 11 Systems Engineering Test Plan Update

12 Updated Dynamics Shock Qual Proto-flight Acceptance OBS ACD sub assy S SB R A ACD shell + BFA S SB R A Tracker Calorimeter Electronics R R R Radiators Tracker S SB R S SB R Calorimeter SB R Electronics S SB R S A Weight Cg Modal Cables X- Plates EMI Shield Grid Box Static Load S SB A KEY S Sine SB SineBurst R Random A Acoustic T. Leisgang 12 Systems Engineering Test Plan Update

13 Updated Thermal Vacuum Plans Qual Proto-flight Acceptance OBS ACD 4 Cycles T/ V& T-Bal Tracker 4 Cycles T/V Tracker 4 Cycles T/V& T-Bal Calorimeter 4 Cycles T/V Calorimeter 12 Cycles T/V& T-Bal Electronics 4 Cycles T/V Electronics 12 Cycles T/V& T-Bal 4 Cycles T/V& T-Bal Radiators 4 Cycles T/V & T-Bal Cables Grid Box X- Plates EMI Shield OBS 4 Cycles T/V& T-Bal T. Leisgang 13 Systems Engineering Test Plan Update

14 Tracker Conversion to Proto-Flight Program Hardware Mechanical Electrical Thermal Other Assembly Level Unit Type Quantity Static Load Sine Burst (static equivalent acc.) Sinusoidal vibration+modal survey Random Vibe + modal survey Acoustic Pressure Profile Mass Properties Component (ITEM) Comments C E EM Tracker MCMs 8 T T T T TQ C E Tray panels 24 TQ Vibe z-axis only C E Live trays 5 TQ M T TQ Vibe & TV only 1 C E EM Mini-Tower 1 T T T T C E EM Bottom Tray 2 TQ M TQ Test 1 to destruction C E EM Tracker Std. Trays 18 A TQ TQ Vibe 5; z-axis only S E EM Tracker Tower 1 A TQ TQ TQ M T TQ T Interface Verification EMI/EMC EDS Compatibility (Grounding) Stacked Cosmic Ray Test Functional and Power Burn-In Thermal Vacuum Thermal Balance Thermal Cycle Radiation C Q Mini-MCMs (ASICs) 4 T TQ C Q Qualification MCMs 38 T M T T T TQ 2 for DPA C Q QM Tracker MCMs 36 T T T TQ C Q Tray panels 19 TQ Vibe z-axis only C Q QM Bottom Tray 1 TQ M T T T TQ C Q QM Tracker Std. Trays 18 A M T T T TQ S Q QM Tracker Tower 1 A TQ TQ TQ A M T T T T TQ T C F Flight Tracker MCMs 612 T T T T C F Tray panels 323 TA TA Vibe z-axis only C F Flight Bottom Trays 17 TA T T T TA C F Flight Tracker Std. Trays 306 T T T TA S F Flight Tracker Towers 17 TA TA TA M T QS QS T TA T Assembly Level Unit Type Verification Method: S= Subsystem F= Flight T= Test QS= Qual by Similarity C= Component Q= Qual A= Analysis TQ= Test, Qual Level E= Engineering Model M= Measurement TA= Test, Acceptance Level T. Leisgang 14 Systems Engineering Test Plan Update

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