Standard range - 10Vdc to 6kVdc. X8R High Temperature capacitors. TCC/VCC capacitors. High Q capacitors. Copper Barrier capacitors

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1 Standard range 1Vdc to 6kVdc X8R High Temperature capacitors TCC/VCC capacitors High Q capacitors Copper Barrier capacitors Open Mode and Tandem capacitors IECQCECC range AECQ2 range S2A Space grade range Safety Certified capacitors ac Non Safety rated AC capacitors 115Vac 4Hz & DWV ranges LCD Inverter chip range E1 & E7 feedthrough chip capacitors X2Y Integrated Passive Components Radial Leaded capacitors

2 Introduction to Syfer Technology Contents First in the market with flexible polymer terminations the revolutionary FlexiCap capacitors our capacitor range also includes X8R high temperature types, High Q capacitors and other application specific types. Our renowned high voltage MLCC expertise has led to the development of an impressive range with working voltage capability up to. This includes surface mount Class X and Y approved Safety Certified capacitors, 63 chips with working voltages up to 5V, and 85 types up to. As part of the Dover Ceramic & Microwave Products group (CMP), we are able to offer unrivalled product quality with short leadtimes, backed up by excellent sales and technical support. With a commitment to product innovation, new ranges are continually being developed. Our experienced applications engineers are also available to provide custom solutions for specific applications. This catalogue details the standard ranges but we can provide items such as tight, low profile and non standard sizes on request. Flexibility is key, not only in design but in all aspects of customer service and support. Our quality management systems meet international requirements, with approval to IS 91, environmental approval to IS 141 and Occupational Health and Safety approval to OHSAS 181. Product approvals include, IECQ CECC, UL, TÜV and qualification to AECQ2. SPC is used extensively, supported by Continuous Improvement Programmes, 6 Sigma projects and Lean Manufacturing initiatives. Products Syfer s excellence in ceramic materials technology, has enabled us to offer an unrivalled range of multilayer ceramic products including: l Multilayer ceramic chip capacitors l High voltage MLCCs l FlexiCap capacitors with flexible terminations l Class X and Y SMD Safety Certified capacitors l Radial leaded capacitors l AECQ2 qualified capacitors l IECQ CECC approved capacitors and radials l Capacitors for space applications l High Q capacitors l Non Magnetic capacitors l 3 terminal EMI chips l X2Y Integrated Passive Components l Capacitors for medical applications Benefits l High quality and reliability l Worldleading high voltage expertise l Suitable for the most demanding applications including: automotive, aerospace, military, space and medical l Approvals to international specifications l Continual product improvement and innovation l Tight s available l Large case sizes, up to 86 l Custom product capability l Strong technical support l Short leadtimes l Environmentally responsible Suffix code controlled items such as Low profile, defined thickness and custom lead forms available by special request. Other Syfer products l Surface mount Pi filters l Panel mount threaded filters l Panel mount solderin filters l Custom filter assembly capability l Varistor filters l Discoidal capacitors l Planar capacitor and planar varistor arrays l EMI Power Filters l Hermetically sealed EMI filters Syfer Innovative, WorldClass Ceramic Capacitors General introduction Definitions of UltraStable and Stable characteristics, Impedance and E.S.R. vs Frequency Ageing, capacitance measurements and tight capacitors Production processes and reliability FlexiCap overview Testing and termination types Documentation and compliance IECQCECC and AECQ2 periodic tests Handling notes Soldering information Chip dimensions Product Selector Ceramic Chip capacitors Standard MLCC ranges 1Vdc to 6kVdc CG/NP & X8R High Temperature capacitors TCC/VCC range High Q capacitors MS range Copper Barrier capacitors Open Mode & Tandem capacitors IECQCECC ranges AECQ2 ranges S2A Space grade ranges Safety Certified capacitors ac Non Safety Rated AC capacitors 115Vac 4Hz & DWV ranges LCD Inverter chip range Surface Mount EMI filters E1 & E7 feedthrough capacitors X2Y Integrated Passive Components information Ceramic chip capacitors 441 Radial Leaded capacitors information Radial leaded capacitors

3 MLCC standard range Notes: 1) in F. 2) *These parts may require conformal coating post soldering. 3) T = Maximum thickness. 1V 6kVdc Contents CG/ NP 1V 5/63V 1v X5R CG/ NP X5R CG/ NP X5R CG/ NP X5R CG/ NP 2/ CG/ NP 5V 63V 1. 6kV CG/ NP CG/ NP CG/ NP CG/ NP CG/ NP CG/ NP CG/ NP CG/ NP CG/ NP CG/ NP CG/ NP Syfer Innovative, WorldClass Ceramic Capacitors 63.47p 3.9n 85 1.p 15n p p 1n 188 1n T=2.5mm T=mm 1825 T=2.5mm 1825 T=mm 222 T=2.5mm 222 T=4.mm 2225 T=2.5mm 2225 T=4.mm 364 T=2.5mm 364 T=4.mm 555 T=2.5mm 555 T=4.mm 86 T=2.5mm 86 T=4.mm 1p 1n 1p 1p 1.µ 33p 1.5µ 1p 1.5µ 15p 3.3µ 12n 15n 39n 1.2µ 1.5µ 1.8µ 3.3µ 1.8µ 2.7µ 3.9µ 1µ.47p 2.7n 1.p 12n 1.p 3.9p 18n 1p 1n 1p 1p 1.µ 33p 1.5µ 1p 1.5µ 15p 3.3µ.47p 12n 39n 1.2µ 1.8µ 2.7µ 1.8µ 2.2µ 3.9µ 6.8µ 1.p 1n 1.p 27n 3.9p 56n 15n 1p 1n 1p 1p 82n 33p 1.2µ 1p 1.2µ 15p 2.2µ.47p 1.5n 27n 39n 1.µ 1.5µ 2.2µ 1.5µ 2.7µ 4.7µ 1.p 5.6n 1.p 3.9p 1n 1p 1p 1p 33p 1.µ 1p 15p 2.2µ 56n 27n 56n 1.2µ 1.5µ 82n 1.µ 2.7µ 3.3µ.47p 47p 1.p 1.p 8.2n 3.9p 18n 18n 1p 1p 1n 1p 33p 1p 56n 15p 1.5µ.47p 22p 1.p 1n 1.p 3.3n 3.9p 8.2n 8.2n 1p 1n 1p 56n 1p 15n 33p 1p 27n 15p 27n 18n 22p 4.7µ 5.6µ 15µ 22p 4.7µ 5.6µ 12µ 22p 3.9µ 4.7µ 1µ 15n 22p 1.8µ 2.2µ 6.8µ 22p 1.5µ 39n 22p 5.6µ 6.8µ 18µ 22p 5.6µ 6.8µ 12µ 22p 4.7µ 5.6µ 1µ 15n 22p 3.3µ 3.9µ 6.8µ 22p 2.2µ 39n 56n 56n 33p 6.8µ 8.2µ 22µ 33p 6.8µ 8.2µ 15µ 33p 5.6µ 6.8µ 12µ 33p 3.3µ 3.9µ 1µ 82n 33p 2.7µ 56n 47p 1µ 27n 47p 5.6µ 12n 15n 18n 39p 1.n 15µ 39p 1.n 1µ 39p 27n 22p 1.µ.47p 15p* 1.p 68p 1.p 3.9p 5.6n 15n 27n 1p 1.5n* 1p 1n 1p 33p 12n 1p 12n 15p 63 1.p 56p 1.p 1.5n 3.9p 3.9n 3.9n 1n 1p 1p 33p 1p 15p 18n 1.p 18p 1.p 1.n 3.9p 1p 4.7n 1p 27n 33p 1p 15p 1n 1.p 12p 1.p 68p 3.9p 1.5n 1.5n 4.7n 12n 8.2n 5.6n 22p 56n 22p 18n 12n 22p 12n 27n 15n 8.2n 1n 22p 1.µ 27n 39n 33p 1.5µ 39n 47p 3.3µ 82n 1n 12n 1.n 5.6µ 39p 18n Note: 42, 55, 1111 & 2211 case sizes are available in our speciality ranges. 27n Please refer to the relevant sections of 68p 68p 68p 68p this catalogue for more details. 1.µ 22µ 15µ 39n 1µ 27n 56n 1V 5/63V 1v 2/ 22p 56n 18n 33p 82n 27n 39n 47p 1.µ 82n 1n 1.n 1.8µ 39p 12n 15n 18n 3.3µ 68p 27n 39n 22p 15n 18n 33p 39n 18n 27n 47p 56n 82n 1.n 1.2µ 39p 82n 1n 15n 2.2µ 68p 15n 18n 27n 22p 12n 1n 12n 15n 33p 15n 12n 15n 47p 18n 39n 56n 1.n 39n 39p 82n 1n 1.µ 68p 1n 12n 18n 1.p 82p 1p 15n 33p 1n 1p 1n 15p 1.p 33p 3.9p 82p 1.n 2.7n 1.p 39p 1p 1n 33p 1p 15p 1.p 22p 3.9p 39p 47p 1.5n 85 1p 33p 4.7n 1p 4.7n 15p 1n 1.p 1p 3.9p 22p 27p 82p 1.p 68p 3.9p 15p 1p 1.5n 15p 3.3n 18p 56p p 1.2n 15p 2.7n 12p* 27p* 3.3n 1.8n 1.n 68p 39p* 33p 22p 4.7n 5.6n 22p 82n 5.6n 1n 33p 1n 8.2n 12n 47p 15n 27n 39n 1.n 39p 39n 68p 82n 12n 22p 3.3n 22p 1n 1.5n 3.9n 1.8n 22p 3.3n 3.9n 5.6n 33p 4.7n 5.6n 47p 1n 1n 12n 18n 1.n 15n 39p 27n 39n 68p 39n 22p 27n 1.8n 3.3n 33p 2.7n 3.9n 47p 8.2n 12n 1.n 82n 39p 12n 15n 15n 68p 27n 39n 22p 1.2n 22p 3.9n 56p* 1p 1.n* 15p * 68p* 18p* 22p 27p* 22p * 39p* 1p 68p* 15p 1.2n* 47p* 12p* 15p 18p* 22p 1.8n* 27p* 1p 39p* p 1.n* (T=2.5mm) (T=mm) 22p 1.5n* 1825 (T=2.5mm) 1.5n 68p* 47p* 33p* 1825 (T=mm) 22p 8.2n 1.5n 1.8n 33p 12n 1.8n 2.7n 47p 4.7n 5.6n 8.2n 1.n 39p 1n 12n 18n 1n 68p 15n 18n 27n 22p 68p* 82p 1.2n* 33p 8.2n 82p* 1.n 1.5n* 47p 1.8n 3.3n 1.n 39p 4.7n 5.6n 82n 68p 8.2n 1n 15n 22p 4.7n* 47p* 56p 82p* 33p 5.6n* 56p* 68p 1.n* 47p 1.5n 1.8n 1.n 15n 39p 2.7n 3.3n 4.7n 68p 5.6n 1n 22p 3.9n* 33p* 39p 56p* 33p 4.7n* 39p* 47p 68p* 1.n 1.2n 1.5n 1.n 1n 39p 1.8n 3.3n 68p 3.9n 4.7n 5V 63V 1. 6kV 22p * 222 (T=2.5mm) 222 (T=4.mm) 33p 2.7n* 2225 (T=2.5mm) 2225 (T=4.mm) 364 (T=2.5mm) 364 (T=4.mm) 555 (T=2.5mm) 555 (T=4.mm) 86 (T=2.5mm) 86 (T=4.mm) General introduction Definitions of UltraStable and Stable characteristics, Impedance and E.S.R. vs Frequency Ageing, capacitance measurements and tight capacitors Production processes and reliability FlexiCap overview Testing and termination types Documentation and compliance IECQCECC and AECQ2 periodic tests Handling notes Soldering information Chip dimensions Product Selector Ceramic Chip capacitors Standard MLCC ranges 1Vdc to 6kVdc CG/NP & X8R High Temperature capacitors TCC/VCC range High Q capacitors MS range Copper Barrier capacitors Open Mode & Tandem capacitors IECQCECC ranges AECQ2 ranges S2A Space grade ranges Safety Certified capacitors ac Non Safety Rated AC capacitors 115Vac 4Hz & DWV ranges LCD Inverter chip range Surface Mount EMI filters E1 & E7 feedthrough capacitors X2Y Integrated Passive Components information Ceramic chip capacitors 441 Radial Leaded capacitors information Radial leaded capacitors

4 Definitions of UltraStable and Stable Technical Summary Technical Summary characteristics Multilayer Ceramic Capacitors are generally divided into classes which are defined by the capacitance temperature characteristics over specified temperature ranges. These are designated by alpha numeric codes. Code definitions are summarised below and are also available in the relevant national and international specifications. CG/NP Ultra Stable Class 1 Ceramic (EIA Class 1) Spec. Classification Capacitors within this class have a dielectric constant range from 1 to 1. They are used in applications which require ultra stable dielectric characteristics with negligible dependence of capacitance and dissipation factor with time, voltage and frequency. They exhibit the following characteristics: CG/NP capacitance vs temperature Temperature range C capacitance vs temperature Maximum capacitance rated DC volts Syfer dielectric code CECC 1B/CG ± 3ppm/ C C EIA CG/NP ± 3ppm/ C C MIL CG (BP) ± 3ppm/ C C X8R, and X5R Stable Class II Ceramic (EIA Class II) Spec. CECC EIA MIL Classification 2C1 2R1 2X1 X8R X5R BX BZ Temperature range C Capacitors of this type have a dielectric constant range of 14, and also have a nonlinear temperature characteristic which exhibits a dielectric constant variation of less than ±15% (2R1) from its room temperature value, over the specified temperature range. Generally used for bypassing (decoupling), coupling, filtering, frequency discrimination, DC blocking and voltage transient suppression Typical dielectric temperature characteristics a) Time does not significantly affect capacitance and dissipation factor (Tan δ) no ageing. b) and dissipation factor are not affected by voltage. c) Linear temperature coefficient. Maximum capacitance change % over temperature range No DC volt applied ±2 ±15 ±15 ±15 ±15 ±15 ±15 ±2 Rated DC Volt Syfer dielectric code R X B N X P B R Power ratings CG/NP and Technical Summary characteristics with greater volumetric efficiency than Class l units, whilst maintaining stability within defined limits. and dissipation factor are affected by: Time (Ageing) Voltage (AC or DC) Frequency IECQ CECC EIA MIL Rated temperature range Maximum capacitance change over temperature range No DC voltage applied Rated DC voltage applied Syfer dielectric ordering code Tangent of loss angle (tan δ) Insulation resistance (Ri) Time constant (Ri x Cr) (whichever is the least) strength <2V >2V to <5V 5V to <1V 5V to <1V > to <12V >12V >1V Climatic category (IEC) CG/NP X5R X8R Ultra stable Stable Stable Stable 1B/CG 2C1 2R1 2X1 CG/ NP X5R X8R CG (BP) BZ BX 55ºC to +125ºC 55ºC to +85ºC 55ºC to +125ºC 55ºC to +15ºC ± 3 ppm/ºc ± 15% ± 2% ± 15% ± 15% ± 15% +2 3% % C P R X B N Cr > 5pF.15 Cr 5pF =.15 (15 +.7) Cr Cr < F Cr > F 1G Ω or 1s ±.5pF (H) ±.F (B) ±.25pF (C) ±.5pF (D) ± 1.pF (F) ± 1% (F) ± 2% (G) ± 5% (J) ± 1% (K) 2.5 times Rated voltage times 1.25 times 1.2 times G Ω or 1s ± 5% (J) ± 1% (K) ± 2% (M) 1G Ω or 1s ± 5% (J) ± 1% (K) ± 2% (M) Voltage applied for 5 seconds. Charging current limited to 5mA maximum. 2.5 times 2.5 times Rated voltage times 1.2 times 2.5 times 1G Ω or 1s ± 5% (J) ± 1% (K) ± 2% (M) Chip 55/125/56 55/85/56 55/125/56 55/15/56 Dipped 55/125/21 55/125/21 C ppm/ C 5 UPPER LIMIT 25 TYPICAL LIMIT 25 LOWER LIMIT Temperature ( C) % Change Typical capacitance change curves will lie within the shown limits Temperature ( C) Power (mw) Operating Temperature ( C) Discoidal 55/125/56 55/125/56 Ageing characteristic (Typical) The table above highlights the difference in coding for IECQCECC, EIA and MIL standards when defining the temperature coeffiecient and the voltage coefficient. Approvals Zero <2% per time decade <2% per time decade <2% per time decade Chip QC321 QC Dipped radial IECQCECC 3618 IECQCECC 37113

5 , Impedance and E.S.R. vs Frequency Technical Summary Technical Summary Ageing of ceramic capacitors Impedance vs Frequency chips Ultra Stable CG/NP dielectric Impedance (Ohms) Stable dielectric Impedance (Ohms) Impedance vs Frequency 1nF chips Stable dielectric F 1nF Frequency (MHz) 1pF 1nF nF 1nF Frequency (MHz) 1nF 1nF ESR vs Frequency chips Ultra Stable CG/NP dielectric ESR / Ohms Stable dielectric ESR (Ohms) Frequency (MHz) Frequency (MHz) 1pF 1nF 1nF 1nF 1nF 1nF 1µF Ageing Capacitor ageing is a term used to describe the negative, logarithmic capacitance change which takes place in ceramic capacitors with time. The crystalline structure for barium titanate based ceramics changes on passing through its Curie temperature (known as the Curie Point) at about 125 C. This domain structure relaxes with time and in doing so, the dielectric constant reduces logarithmically; this is known as the ageing mechanism of the dielectric constant. The more stable dielectrics have the lowest ageing rates. The ageing process is reversible and repeatable. Whenever the capacitor is heated to a temperature above the Curie Point the ageing process starts again from zero. The ageing constant, or ageing rate, is defined as the percentage loss of capacitance due to the ageing process of the dielectric which occurs during a decade of time (a tenfold increase in age) and is expressed as percent per logarithmic decade of hours. As the law of decrease of capacitance is logarithmic, this means that in a capacitor with an ageing rate of 1% per decade of time, the capacitance will decrease at a rate of: a) 1% between 1 and 1 hours b) An additional 1% between the following 1 and 1 hours c) An additional 1% between the following 1 and 1 hours d) An additional 1% between the following 1 and 1 hours etc e) The ageing rate continues in this manner throughout the capacitor s life. Typical values of the ageing constant for our Multilayer Ceramic Capacitors are: class Ultra Stable CG/NP Stable Typical values Negligible capacitance loss through ageing <2 % per decade of time measurements Because of ageing it is necessary to specify an age for reference measurements at which the capacitance shall be within the prescribed. This is fixed at 1 hours, since for practical purposes there is not much further loss of capacitance after this time. All capacitors shipped are within their specified at the standard reference age of 1 hours after having cooled through their Curie temperature. The ageing curve for any ceramic dielectric is a straight line when plotted on semilog paper. vs time 1% per decade) c % Tight Age (Hours) CG/NP One of the advantages of Syfer s unique wet process of manufacture is the ability to offer capacitors with exceptionally tight capacitance s. The accuracy of the printing screens used in the fully automated, computer controlled manufacturing process allows for as close as +/1% on CG/NP parts greater than or equal to F. For capacitance values below F, s can be as tight as +/.5pF. 1 Impedance (Ohms) Frequency (MHz) (MHz) 4 5

6 Production processes and reliability Technical Summary Technical Summary FlexiCap overview Production process flowchart Ceramic powder preparation Plating (if specified) Additional Hi Rel activities (S2A 1% burnin, QC insp) Multilayer build (wet process) Fire Rumble Internal inspection Termination Electrical test Test verification QC inspection Finished goods store Electrode ink material Printing (if specified) Additional sample Rel tests (if specified) Syfer reliability grades Space Grade ESCC 39 (1) MIL Grade (2) IECQCECC (3) AECQ2 (4) Standard components High reliability (space quality) Standard reliability Notes: (1) Space grade tested in accordance with ESCC 39. Refer to Syfer specification S2A 1. (2) MIL Grade. Released in accordance with US standards available on request. (3) IECQCECC. The International Electrotechnical Commission (IEC) Quality Assessment System for Electronic Components. This is an internationally recognised product quality certification which provides customers with assurance that the product supplied meets high quality standards. View Syfer s IECQCECC approvals at or at (4) AECQ2. Automotive Electronics Council Stress Test Qualification For Passive Components. Refer to Syfer application note reference AN9. Syfer reliability surface mount product groups Tandem FlexiCap TM capacitors (1) Open Mode FlexiCap TM capacitors (2) Standard FlexiCap TM capacitors (3) Standard MLC capacitors (4) High reliability Standard reliability Notes: (1) Tandem construction capacitors, ie internally having the equivalent of 2 series capacitors. If one of these should fail shortcircuit, there is still capacitance end to end and the chip will still function as a capacitor, although capacitance maybe affected. Refer to application note AN21. Also available qualified to AECQ2. (2) Open Mode capacitors with FlexiCap TM termination also reduce the possibility of a short circuit by utilising inset electrode margins. Refer to application note AN22. Also available qualified to AECQ2. (3) Multilayer capacitors with Syfer FlexiCap TM termination. By using FlexiCap TM termination, there is a reduced possibility of the mechanical cracking occurring. (4) Standard capacitors includes MLCCs with tin finish over nickel, but no FlexiCap TM. FlexiCap termination MLCCs are widely used in electronic circuit design for a multitude of applications. Their small package size, technical performance and suitability for automated assembly makes them the component of choice for the specifier. However, despite the technical benefits, ceramic components are brittle and need careful handling on the production floor. In some circumstances they may be prone to mechanical stress damage if not used in an appropriate manner. Board flexing, depanelisation, mounting through hole components, poor storage and automatic testing may all result in cracking. Careful process control is important at all stages of circuit board assembly and transportation from component placement to test and packaging. Any significant board flexing may result in stress fractures in ceramic devices that may not always be evident during the board assembly process. Sometimes it may be the end customer who finds out when equipment fails! Syfer has the solution FlexiCap FlexiCap TM has been developed as a result of listening to customers experiences of stress damage to MLCCs from many manufacturers, often caused by variations in production processes. Our answer is a proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish. FlexiCap TM will accommodate a greater degree of board bending than conventional capacitors. Syfer FlexiCap termination All ranges are available with FlexiCap termination material offering increased reliability and superior mechanical performance (board flex and temperature cycling) when compared with standard termination materials. Refer to Syfer application note reference AN1. FlexiCap capacitors enable the board to be bent almost twice as much before mechanical cracking occurs. Refer to application note AN2. FlexiCap is also suitable for Space applications having passed thermal vacuum outgassing tests. Refer to Syfer application note reference AN26. Fired ceramic dielectric Tin outer layer Intermediate nickel layer FlexiCap benefits FlexiCap TM termination base FlexiCap TM MLCC cross section Metal electrodes With traditional termination materials and assembly, the chain of materials from bare PCB to soldered termination, provides no flexibility. In circumstances where excessive stress is applied the weakest link fails. This means the ceramic itself, which may fail short circuit. The benefit to the user is to facilitate a wider process window giving a greater safety margin and substantially reducing the typical root causes of mechanical stress cracking. FlexiCap TM may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes. Syfer has delivered millions of FlexiCap TM components and during that time has collected substantial test and reliability data, working in partnership with customers world wide, to eliminate mechanical cracking. An additional benefit of FlexiCap is that MLCCs can withstand temperature cycling 55ºC to 125ºC in excess of 1, times without cracking. FlexiCap termination has no adverse effect on any electrical parameters, nor affects the operation of the MLCC in any way. Available on the following ranges: All High Reliability ranges Standard and High Voltage chips Safety Certified capacitor chips 3 terminal EMI chips X2Y Integrated Passive Components X8R High Temperature capacitors Summary of PCB bend test results Application notes Picture taken at 1,x magnification using a SEM to demonstrate the fibrous nature of the FlexiCap TM termination that absorbs increased levels of mechanical stress. The bend tests conducted on have proven that the FlexiCap TM termination withstands a greater level of mechanical stress before mechanical cracking occurs. The AECQ2 test for requires a bend level of 2mm minimum and a cap change of less than 1%. Product Standard termination FlexiCap Typical bend performance under AECQ2 test conditions 2mm to 3mm Typically 8mm to 1mm FlexiCap TM may be handled, stored and transported in the same manner as standard terminated capacitors. The requirements for mounting and soldering FlexiCap TM are the same as for standard SMD capacitors. For customers currently using standard terminated capacitors there should be no requirement to change the assembly process when converting to FlexiCap TM. Based upon board bend tests in accordance with IEC the amount of board bending required to mechanically crack a FlexiCap TM terminated capacitor is significantly increased compared with standard terminated capacitors. It must be stressed however, that capacitor users must not assume that the use of FlexiCap TM terminated capacitors will totally eliminate mechanical cracking. Good process controls are still required for this objective to be achieved. 6 7

7 Testing and termination types Technical Summary Technical Summary Documentation and compliance Tests conducted during batch manufacture Standard SM capacitors Syfer reliability SM product group IECQCECC / MIL grade AECQ2 S (Space grade) High Rel S2A Solderability l l l l Resistance to soldering heat l l l l Plating thickness verification (if plated) l l l l DPA (Destructive Physical Analysis) l l l l Voltage proof test (DWV / Flash) l l l l Insulation resistance l l l l test l l l l Dissipation factor test l l l l 1% visual inspection m m l l 1% burnin. for 168 hours) m m m l Load sample 125ºC m m m LAT1 & LAT2 (1 hours) Humidity sample test. 85ºC/85%RH m m m 24 hours Hot IR sample test m m m m Axial pull sample test (MILSTD123) m m m m Breakdown voltage sample test m m m m Deflection (bend) sample test m m m m SAM (Scanning Acoustic Microscopy) m m m m LAT1 (4 x adhesion, 8 x rapid temp change + LAT2 and LAT3) m LAT2 (2 x 1 hour life test + LAT3) m LAT3 (6 x TC and 4 x solderability) m Release documentation l Release documentation supplied as standard. m Original documentation. Standard SM capacitors Syfer reliability SM product group IECQCECC AECQ2 MIL grade S (Space grade) High Rel S2A Certificate of conformance l l l IECQCECC Release certificate of conformity l Batch electrical test report m m m Included in data pack S (space grade) data documentation package l Periodic tests conducted and reliability data availability Standard Surface Mount c apacitors Components are randomly selected on a sample basis and the following routine tests are conducted: l Load Test. 1, (15ºC for X8R). Applied voltage depends on components tested. l Humidity Test ºC/85%RH. l Board Deflection (bend test). Test results are available on request. Conversion factors From To Operation FITS MTBF (hours) 1 9 FITS Example of FIT (Failure In Time) data available: FIT RV 5% of RV 25% of RV 1% of RV 25ºC 5ºC 75ºC 1ºC 125ºC l Test conducted as standard. m Optional test. Please discuss with Syfer Sales. Termination types available Standard SM capacitors Syfer reliability SM product group IECQCECC / MIL grade AECQ2 S (space grade) High Rel S2A F: Silver Palladium l l l J: Silver base with nickel barrier (1% matte tin plating) l l A: Silver base with nickel barrier (tin/lead plating with min 1% lead) CG/NP dielectric only l l l Y: FlexiCap with nickel barrier (1% matte tin plating) l l l m H: FlexiCap with nickel barrier (tin/lead plating with min 1% lead) l l m 2: Silver base with Copper Barrier (1% matte tin plating) l (1) 3: FlexiCap with Copper Barrier (1% matte tin plating) l (2) Notes: (1) Available on CG/NP and High Q only. (2) Available on all dielectrics. l Termination available. m Termination available but generally not requested for space grade components. Please discuss with Syfer Sales. m FITS MTBF (years) 1 9 (FITS x 876) FITS = Failures in 1 9 hours. MTBF = Mean time between failures. REACH (Registration, Evaluation, Authorisation and restriction of Chemicals) statement The main purpose of REACH is to improve the protection of human health and the environment from the risks arising from the use of chemicals. Syfer Technology Ltd maintains both ISO141, Environmental Management System and OHSAS 181 Health and Safety Management System approvals that require and ensure compliance with corresponding legislation such as REACH. For further information, please contact Syfer at sales@syfer.co.uk RoHS compliance Syfer routinely monitors world wide material restrictions (e.g. EU / China & Korea RoHS mandates) and is actively involved in shaping future legislation. Component type: 85 (CG/NP and ). Testing location: Syfer reliability test department. Results based on: 16,622, component test hours. All standard Syfer MLCC products are compliant with the EU RoHS directive 22/95/EC (see below for special exceptions) and those with plated terminations are suitable for soldering using common Pb free solder alloys (refer to Soldering Information for more details on soldering limitations). Compliance with EU 22/95/EC automatically signifies compliance with some other legislation (e.g. Korea RoHS). Please refer to Syfer for details of compliance with other materials legislation Breakdown of material content, SGS analysis reports and tin whisker test results are available on request. Most Syfer MLCC components are available with non RoHS compliant tin lead (SnPb) solderable termination finish by special request for exempt applications and where pure tin is not acceptable. Other tin free termination finishes may also be available please refer to Syfer for further details. Radial components have tin plated leads as standard, but tin/ lead is available as a special option. Please refer to the radial section of the catalogue for further details. Export controls and dualuse regulations Certain Syfer catalogue components are defined as dualuse items under international export controls those that can be used for civil or military purposes which meet certain specified technical standards. The defining criteria for a dualuse component with respect to Syfer products is one with a voltage rating of >75V and a capacitance value >25nF and a series inductance <1nH. Components defined as dualuse under the above criteria automatically require a licence for export outside the EU, and may require a licence for export within the EU. The application for a licence is routine, but customers for these products will be asked to supply further information. Please refer to sales if you require any further information on export restrictions. Other special components may additionally need to comply with export regulations. 8 9

8 IECQCECC and AECQ2 Periodic tests Technical Summary Handling notes Periodic tests conducted for IECQCECC and AECQ2 Test ref P1 P2 P3 P4 P5 P6 P7 P8 P9 P1 P11 P12 P13 P14 P15 P16 Test High temperature exposure (storage) Temperature cycling Moisture resistance Biased humidity Operational life Resistance to solvents Mechanical shock Vibration Resistance to soldering heat Thermal shock Adhesion, rapid temp change and climatic sequence Board flex Terminal strength Beam load test Damp heat steady state Test results are available on request. P = Period in months. N = Sample size. C = Acceptance criteria. Termination type All types CG/NP: All types : Y and H only All types All types All types All types CG/NP: All types : Y and H only CG/NP: All types : Y and H only All types CG/NP: All types : Y and H only : A, F and J only CG/NP: All types : Y and H only : A, F and J only Additional requirements Unpowered. 1, T=15ºC. Measurement at 24 ± 2 hours after test conclusion 1, cycles 55ºC to +125ºC Measurement at 24 ± 2 hours after test conclusion T = 24 hours/cycle. Note: Steps 7a and 7b not required. Unpowered. Measurement at 24 ± 2 hours after test conclusion 1, hours 85ºC/85%RH. Rated voltage or 5V whichever is the least and 1.5V. Measurement at 24 ± 2 hours after test conclusion Condition D steady state TA=125ºC at full rated. Measurement at 24 ± 2 hours after test conclusion Note: Add aqueous wash chemical. Do not use banned solvents Sample acceptance P n c Figure 1 of Method 213. Condition F g s for 2 minutes, 12 cycles each of 3 orientations. Note: Use 8 x 5 PCB.31 thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2 from any secure point. Test from 12,Hz Condition B, no preheat of samples: Single wave solder Procedure 2 55ºC/+125ºC. Number of cycles 3. Maximum transfer time 2 seconds, dwell time 15 minutes. AirAir 5N force applied for 1s, 55ºC/ +125ºC for 5 cycles, damp heat cycles 3mm deflection Class I 2mm deflection Class II mm deflection Reference MILSTD22 Method 18 JESD22 Method JA14 MILSTD22 Method 16 MILSTD22 Method 13 MILSTD22 Method 18 MILSTD22 Method 215 MILSTD22 Method 213 MILSTD22 Method 24 MILSTD22 Method 21 MILSTD22 Method 17 BS EN1321 Clause 4.8, 4.12 and AECQ25 BS EN1321 Clause 4.9 All types Force of 1.8kg for 6 seconds 12 3 AECQ26 All types 12 3 AECQ23 All types 56 days, 4ºC / 93% RH 15x no volts, 15x 5Vdc, 15x rated voltage or 5V whichever is the least BS EN1321 Clause 4.14 Detailed application notes intended to guide and assist our customers in using multilayer ceramic capacitors in surface mount technology are available on the Syfer website www. syfer.com The information concentrates on the handling, mounting, connection, cleaning, test and rework requirements particular to MLC s for SMD technology, to ensure a suitable match between component capability and user expectation. Some extracts are given below. Handling Ceramics are dense, hard, brittle and abrasive materials. They are liable to suffer mechanical damage, in the form of chips or cracks, if improperly handled. Terminations may be abraded onto chip surfaces if loose chips are tumbled in bulk. Metallic tracks may be left on the chip surfaces which might pose a reliability hazard. Components should never be handled with fingers; perspiration and skin oils can inhibit solderability and will aggravate cleaning. Chip capacitors should never be handled with metallic instruments. Metal tweezers should never be used as these can chip the product and may leave abraded metal tracks on the product surface. Plastic or plastic coated metal types are readily available and recommended these should be used with an absolute minimum of applied pressure. Counting or visual inspection of chip capacitors is best performed on a clean glass or hard plastic surface. If chips are dropped or subjected to rough handling, they should be visually inspected before use. Electrical inspection may also reveal gross damage via a change in capacitance, an increase in dissipation factor or a decrease either in insulation resistance or electrical strength. Transportation Where possible, any transportation should be carried out with the product in its unopened original packaging. If already opened, any environmental control agents supplied should be returned to packaging and the packaging resealed. Avoid paper and card as a primary means of handling, packing, transportation and storage of loose components. Many grades have a sulphur content which will adversely affect termination solderability. Loose chips should always be packed with sulphurfree wadding to prevent impact or abrasion damage during transportation. Storage Incorrect storage of components can lead to problems for the user. Rapid tarnishing of the terminations, with an associated degradation of solderability, will occur if the product comes into contact with industrial gases such as sulphur dioxide and chlorine. Storage in free air, particularly moist or polluted air, can result in termination oxidation. should not be opened until the MLC s are required for use. If opened, the pack should be resealed as soon as is practicable. Alternatively, the contents could be kept in a sealed container with an environmental control agent. Long term storage conditions, ideally, should be temperature controlled between 5 and +4 C and humidity controlled between 4 and 6% R.H. Taped product should be stored out of direct sunlight, which might promote deterioration in tape or adhesive performance. Product, stored under the conditions recommended above, in its as received packaging, has a minimum shelf life of 2 years. Mechanical considerations for mounted ceramic chip capacitors Due to their brittle nature, ceramic chip capacitors are more prone to excesses of mechanical stress than other components used in surface mounting. One of the most common causes of failure is directly attributable to bending the printed circuit board after solder attachment. The excessive or sudden movement of the flexible circuit board stresses the inflexible ceramic block causing a crack to appear at the weakest point, usually the ceramic/termination interface. The crack may initially be quite small and not penetrate into the inner electrodes; however, subsequent handling and rapid changes in temperature may cause the crack to enlarge. This mode of failure is often invisible to normal inspection techniques as the resultant cracks usually lie under the capacitor terminations but if left, can lead to catastrophic failure. More importantly, mechanical cracks, unless they are severe may not be detected by normal electrical testing of the completed circuit, failure only occurring at some later stage after moisture ingression. The degree of mechanical stress generated on the printed circuit board is dependent upon several factors including the board material and thickness; the amount of solder and land pattern. The amount of solder applied is important, as an excessive amount reduces the chip s resistance to cracking. It is Syfer s experience that more than 9% are due to board depanelisation, a process where two or more circuit boards are separated after soldering is complete. Other manufacturing stages that should be reviewed include: 1) Attaching rigid components such as connectors, relays, display panels, heat sinks etc. 2) Fitting conventional leaded components. Special care must be exercised when rigid terminals, as found on large can electrolytic capacitors, are inserted. 3) Storage of boards in such a manner which allows warping. 4) Automatic test equipment, particularly the type employing bed of nails and support pillars. 5) Positioning the circuit board in its enclosure especially where this is a snapfit. Syfer were the first MLCC manufacturer to launch a flexible termination to significantly reduce the instances of mechanical cracking. Flexicap termination introduces a certain amount of give into the termination layer absorbing damaging stress. Unlike similar systems, Flexicap does not tear under tension, but absorbs the stress, so maintaining the characteristics of the MLCC. SM Pad Design Syfer conventional 2terminal chip capacitors can generally be mounted using pad designs in accordance with IPC7351, Generic Requirements for Surface Mount Design and Land Pattern Standards, but there are some other factors that have been shown to reduce mechanical stress, such as reducing the pad width to less than the chip width. In addition, the position of the chip on the board should also be considered. 3Terminal components are not specifically covered by IPC7351, but recommended pad dimensions are included in the Syfer catalogue / website for these components. 1 11

9 Soldering information Technical Summary Technical Summary Chip dimensions Soldering information Syfer MLCC s are compatible with all recognised soldering/ mounting methods for chip capacitors. A detailed application note is available online at Reflow soldering surface mount chip capacitors Syfer recommend reflow soldering as the preferred method for mounting MLCC s. Syfer MLCC s can be reflow soldered using a reflow profile generally as defined in IPC / JEDEC JSTD2. Sn plated termination chip capacitors are compatible with both conventional and lead free soldering, with peak temperatures of 26ºC to 27ºC acceptable. The heating ramp rate should be such that components see a temperature rise of 1.5ºC to 4ºC per seconds to maintain temperature uniformity through the MLCC. The time for which the solder is molten should be maintained at a minimum, so as to prevent solder leaching. Extended times above 23ºC can cause problems with oxidisation of Sn plating. Use of inert atmosphere can help if this problem is encountered. PdAg terminations can be particularly susceptible to leaching with lead free, tin rich solders and trials are recommended for this combination. Cooling to ambient temperature should be allowed to occur naturally, particularly if larger chip sizes are being soldered. Natural cooling allows a gradual relaxation of thermal mismatch stresses in the solder joints. Forced cooling should be avoided as this can induce thermal breakage. Wave soldering Chip and Radial Leaded capacitors Wave soldering is generally acceptable, but the thermal stresses caused by the wave have been shown to lead to potential problems with larger or thicker chips. Particular care should be taken when soldering SM chips larger than size 121 and with a thickness greater than 1.mm for this reason. Maximum permissible wave temperature is 27ºC for SM chips and 26ºC for Radial Leaded capacitors. The total immersion time in the solder should be kept to a minimum. It is strongly recommended that Sn/Ni plated terminations are specified for wave soldering applications. PdAg termination is particularly susceptible to leaching when subjected to lead free wave soldering and is not generally recommended for this application. Total immersion exposure time for Sn/Ni terminations is 3s at a wave temperature of 26ºC. Note that for multiple soldering operations, including the rework, the soldering time is cumulative. The preheat ramp should be such that the components see a temperature rise of 1.5ºC to 4ºC per second as for reflow soldering. This is to maintain temperature uniformity through the MLCC and prevent the formation of thermal gradients within the ceramic. The preheat temperature should be within 12ºC maximum (1ºC preferred) of the maximum solder temperature to minimise thermal shock. Cooling to ambient temperature should be allowed to occur naturally, particularly if larger chip sizes are being soldered. Natural cooling allows a gradual relaxation of thermal mismatch stresses in the solder joints. Forced cooling should be avoided as this can induce thermal breakage. Rework of Chip capacitors Syfer recommend hot air/ gas as the preferred method for applying heat for rework. Apply even heat surrounding the component to minimise internal thermal gradients. Soldering irons or other techniques that apply direct heat to the chip or surrounding area, should not be used as these can result in micro cracks being generated. Minimise the rework heat duration and allow components to cool naturally after soldering. Hand soldering Radial Leaded capacitors Radial capacitors can be hand soldered into boards using soldering irons, provided care is taken not to touch the body of the capacitor with the iron tip. Soldering should be carried out from the opposite side of the board to the radial to minimise the risk of damage to the capacitor body. Where possible, a heat sink should be used between the solder joint and the body, especially if longer dwell times are required. Use of silver loaded epoxy adhesives Chip capacitors can be mounted to circuit boards using silver loaded adhesive provided the termination material of the capacitor is selected to be compatible with the silver loaded adhesive. This is normally PdAg. Standard tin finishes are often not recommended for use with silver loaded epoxies as there can be electrical and mechanical issues with the joint integrity due to material mismatch. Solder leaching Leaching is the term for the dissolution of silver into the solder causing a failure of the termination system which causes increased ESR, tan δ and open circuit faults, including ultimately the possibility of the chip becoming detached. Leaching occurs more readily with higher temperature solders and solders with a high tin content. Pb free solders can be very prone to leaching certain termination systems. To prevent leaching, exercise care when choosing solder alloys and minimize both maximum temperature and dwell time with the solder molten. Plated terminations with nickel or copper anti leaching barrier layers are available in a range of top coat finishes to prevent leaching occurring. These finishes also include Syfer FlexiCap for improved stress resistance post soldering. Multilayer ceramic chip with nickel barrier termination Fired ceramic dielectric Tin or tin/lead outer layer (as specified by customer) Intermediate nickel layer Silver termination Metal electrodes Dimensions Size T W L L2 Length (L1) mm inches 1. ±.1.4 ± ± ± ±.2.63 ±.8 2. ±.3.8 ± ± ±.12 ± ± ±.3.14 ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±.4.25 ± ±.5.36 ± ±.5.37 ± ±.4.3 ± ±.5.4 ± ±.5.45 ± ±.5.55 ± ±.5.58 ±.2 Width (W) mm inches.5 ±.1.2 ± ± ±.1.8 ±.2.31 ± ±.2.5 ± ± ± ±.2.63 ± ±.3.1 ± ±.3.1 ± ±.2.63 ±.8 2. ±.3.8 ±.12 ± ± ±.4.25 ± ±.3.11 ± ± ± ± ± ±.4.25 ± ± ± ±.5.4 ±.2 5. ± ± ±.5.35 ± ±.5.45 ± ±.5.45 ± ±.5.5 ± ±.5.68 ±.2 Max. Thickness (T) mm inches Termination Band L2 mm inches min max ±.5.8 ± ±.5.4 ± ±.5.8 ± ±.5.6 ± Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to Syfer Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request please refer requests to the Sales Office.

10 Product Selector Applications for MLC capacitors Capacitors and Filters SM and Leaded Modem/Tip and Ring Frequency Control/Tuning, Impedance Matching High Frequency Snubber Decoupling/Smoothing AC Noise Removal LCD Backlight Inverter High Speed Decoupling Medical Feedthrough Filtering Automotive Mil/Aero Harsh Environments High Safety Certified Class 1 s Class 1 s Low DF/ESR High Balanced Line Capacitors Safety Certified ac range Low High Voltage, Anti Flashover Low Inductance Capacitors MRI/Non Magnetic Medical Implantable Capacitive Capacitive/Inductive Pi MLCC Filtering Hi Reliability Capacitors and Filters Dipped Radial Leaded Capacitors /222/2225 1nF to 1µF dc, CG/NP Y2/X1, Y3/X2, X2 Safety Certified Ranges UL/TÜV 188//2211/2215/222 CG/NP Range 42 to 86.47pF to 1µF 1V to 1 CG/NP Range 42 to 86.47pF to 1µF 1V to 1 /X5R Range 42 to 86 1pF to 22µF 1V to 1, X2Y IPCs 63 to pF to 1.2µF to, CG/NP, Y2/X1, Y3/X2, X2 Safety Certified Ranges UL/TÜV 188//2211/2215/222, CG/NP Ranges Non Safety Capacitors designed for use at mains voltages FB9 LCD Inverter Range 188/ 1.5pF to 68pF /6kV 55/1111/1825 Ranges, CG/NP, High Q and CG/NP, X2Y IPCs 63 to 222 F to 1.2µF, CG/NP, High Q 42 to 44 Copper Barrier Termination.1pF to 6.8µF to High Reliability Special Testing/burn in MLCC and X2Y, CG/NP E1/E7/SBSGC/SBSMC, CG/NP 85 to 222 1A to 2A SBSP/SBSG/SBSM, CG/NP 126 to pF to F 1A to 1A X8R Range Operational temperature up to 15 C AECQ2 Ranges, CG/NP Tandem and Open Mode FlexiCap Capacitors with extra safe electrode design AECQ2 X2Y IPCs and CG/NP AECQ2 E1/E7 Feedthrough Capacitors Vac 4Hz range S2A/IECQCECC/MILPRF/Burn in Hi Rel X2Y IPCs l FlexiCap is particularly recommended for these applications where possible., CG/NP F to 15µF 1V to

11 Standard MLCC ranges 1Vdc to 6kVdc Standard MLCC CG/NP ranges Standard MLCC CG/NP ranges 16 A range of dc rated multilayer chip capacitors from.47pf to 22µF and case sizes 63 to 86 in CG/NP and dielectrics. Suitable for all general purpose and high reliability applications where package size and reliability are important. All are manufactured using Syfer s unique wet process and incorporate precious metal electrodes. Standard MLCC range dimensions Size T W L1 L2 Length (L1) mm inches 1.6 ±.2.63 ±.8 2. ±.3.8 ±.12 ± ±.12 ± ± ± ± ± ± ± ± ± ± ± ± ±.5.36 ± ±.5.55 ± ±.5.8 ±.2 Width (W) mm inches.8 ±.2.31 ± ±.2.5 ± ±.2.63 ± ±.3.1 ± ±.3.8 ±.12 ± ± ±.4.25 ± ± ± ±.4.25 ± ±.5.4 ± ±.5.5 ± ±.5.6 ±.2 Max. Thickness (T) mm inches Termination Band (L2) mm inches Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to Syfer. Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request please refer requests to the factory. Ordering information Standard MLCC ranges 121 Y 1 13 J X T _ Chip size Termination Y = FlexiCap TM termination base with nickel barrier (1% matte tin plating). RoHS compliant. H = FlexiCap TM termination base with nickel barrier (Tin/lead plating with min. 1% lead). F = Silver Palladium. RoHS compliant. J = Silver base with nickel barrier (1% matte tin plating). RoHS compliant. A = Silver base with nickel barrier (Tin/lead plating with min. 1% lead). Voltage 1 = 1V 16 = 25 = 5 = 5V 63 = 63V 1 = 2 = 2V 25 = 5 = 5V 63 = 63V 1K = 1K2 = 1. 1K5 = 2K = 2K5 = 3K = 4K = 5K = 6K = 6kV in picofarads (pf) <1.pF Insert a P for the decimal point as the first character. eg. P3 =.3pF Values in.1pf steps 1.pF & <F Insert a P for the decimal point as the second character. eg. 8P2 = 8.2pF Values are E24 series F First digit is. Second and third digits are significant figures of capacitance code. Fourth digit is number of zeros eg. 11 = 1pF Values are E24 series <F B = ±.1pF C = ±.25pF D = ±.5pF > F F = ±1% G = ±2% J = ±5% K = ±1% M = ±2% min max Suffix C = CG/NP (1B) X = (2R1) P = X5R R = 33mm B = Bulk pack tubs Used for specific customer requirements.47pf p47.47pf p47 CG/NP 1. 1p 1. 1p 1.2 1p p p p p p p p p p p p p p p p p p p p p p2 F 1 F Code 1V /63V 2/ 5V* 1V 5/63V 2/ 5V 63V 1. 1V 5/63V 2/ 5V 63V 1. 1V 5/63V 2/ 5V 63V 1. 1V 5/63V 2/ 5V 63V 1. 6kV* * * 1V 5/63V 2/ pF 11 1pF nF 12 1.nF nF 13 1nF nF 14 1nF CG/NP µF 15 1.µF 15 Note: The highlighted parts are defined as dualuse under export Note: control legislation and as such are subject to export licence 1) *These parts may require conformal coating post soldering. restrictions. Please refer to page 9 for further details. 2) Standard chip thickness = 2.5mm maximum unless specified as or 4.mm.. Note: ranges on reverse Note: ranges on reverse Note: ranges on reverse 5V mm 63V 1. mm * mm * mm 6kV* mm 1V 5/63V 2/ mm 5V 63V 1. mm mm * * 6kV* 1V 5/63V 2/ 5V 63V 1. * * 6kV* 1V 5/63V 2/ 5V 63V 1. * * 6kV* 5/63V 2/ 5V 63V 1. 6kV 5/63V 2/ 5V 63V kV 5/63V 2/ 5V 63V 1. 6kV Code 17

12 Standard MLCC ranges Standard MLCC ranges X8R High Temperature capacitors pF 11 1pF nF 12 1.nF nF 13 1nF nF 14 1nF µF 15 1.µF µF 16 1µF µF µF 226 Note: The highlighted parts are defined as dualuse under export control legislation and as such are subject to export licence restrictions. Please refer to page 9 for further details. Code 1V 5/63V 2/ 5V* 1V 5/63V 2/ 5V 63V 1V 5/63V 2/ 5V 63V 1. 1V 5/63V 2/ 5V 63V 1. 1V 5/63V 2/ 5V 63V 1. * * 6kV* 1V 5/63V 2/ 5V 63V 1. * * 6kV* 1V 5/63V 2/ 5V 63V 1. * * 6kV* 1V 5/63V 2/ 5V 63V 1. * * 6kV* 1V 5/63V 2/ 5V 63V 1. * * 6kV* 5/63V 2/ 5V 63V 1. 5/63V 2/ 5V 63V 1. 5/63V 2/ 5V 63V 1. Code The X8R dielectric will operate from 55 C to +15 C, with a maximum capacitance change ±15% (without applied voltage). The devices are available in sizes 85 to 2225, with voltage ranges from to and capacitance values from 1nF to 1.8µF. The capacitors have been developed by Syfer to meet demand from various applications in the automotive and industrial markets and in other electronic equipment exposed to high temperatures. The increased use of electronics in automotive under the hood applications has created demand for this product range. The X8R range incorporates a specially formulated termination with a nickel barrier finish that has been designed to enhance the mechanical performance of these SMD chip capacitors in harsh environments typically present in automotive applications. Range 1.nF to 1.8µF Temperature Coefficient of (TCC) ± 15% from 55 C to +15 C Dissipation Factor (DF) <.25 Max cap. values according to the rated d.c. voltage Ordering information X8R High Temperature capacitors Insulation Resistance (IR) 1G Ω or 1secs (whichever is the less). Withstand Voltage (DWV) 2.5 x rated voltage for 5±1 seconds, 5mA charging current maximum. Ageing Rate 1% per decade (typical) 126 Y K N T Chip size Termination Voltage d.c. in picofarads (pf) Y = Nickel barrier with polymeric silver termination 25 = 5 = 5V 1 = 2 = 2V 25 = Min Cap. value 1.nF F 4.7nF F 1nF 1nF Max. cap value according to the rated dc voltage 56nF 18nF F F 1.5µF 1.8µF 5V F 12nF F F F 1.µF 15nF 56nF 12nF F F 56nF 2/ 1nF F F 12nF F F First digit is. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. Example: 473 = 47pF = F J = ±5% K = ±1% M = ±2% codes N = X8R R = 33mm B = Bulk pack tubs 19 Note: 1) *These parts may require conformal coating post soldering. Note: CG/NP ranges on reverse Note: CG/NP ranges on reverse Note: CG/NP ranges on reverse

13 TCC/VCC range 2C1 (BZ) and 2X1 (BX) 2C1 (BZ) and 2X1 (BX) TCC/VCC range TCC/VCC range capacitors are available from Syfer with a defined capacitance variation under applied dc voltage, across the full operating temperature range. Whilst the capacitance of CG/NP chips does not vary with applied voltage, standard capacitors exhibit capacitance fluctuation, but with no specified limit. For applications where a limit is required, Syfer is able to offer either a B code dielectric (conforms to MIL BX dielectric and IECQ CECC 2X1 ) or R code dielectric (conforms to MIL BZ dielectric and IECQCECC 2C1 ). characteristics Stable IECQCECC 2C1 2R1 2X1 EIA MIL BZ BX Rated temperature range 55ºC to +125ºC Maximum capacitance charge over temperature range No DC voltage applied ±2% ±15% ±15% Rated DC voltage applied +23% +1525% Syfer dielectric ordering code R X B For part numbering, the X denoting the dielectric code needs to be replaced by either B or R. Please contact the Sales Office for full range information. 2C1 (BZ) capacitor range 2X1 (BX) capacitor range Code Code Code Code 1pF 11 1pF nF 12 1.nF µ 15 1.µ µ µ µ µ 155 5V 5V 2V = FlexiCap termination only. Other values available in J, Y and F terminations. 5V 2V 5V 2V 5V 2V 5V 2V 5V 2V 5V 2V 1pF 11 1pF nF 12 1.nF µ 15 1.µ µ µ µ µ V 5V 2V = FlexiCap termination only. Other values available in J, Y and F terminations. 5V 2V 5V 2V 5V 2V 5V 2V 5V 2V 5V 2V

14 High Q capacitors MS range MS range High Q capacitors The Syfer MS range offers a very stable, High Q material system that provides excellent, low loss performance in systems below 3GHz. Available in 42 to 364 case sizes with various termination options including FlexiCap, this range of high frequency capacitors is suitable for many applications where economical, high performance is required. Typical performance data 85 chip size* 1 ESR vs Frequency 85 case size Typical performance data 1111 chip size* 1 ESR vs Frequency 1111 case size Operating Temperature 55 C to +125 C Temperature Coefficient (Typical) ± 3 ppm/ C Insulation resistance at +25 C >1GΩ Insulation resistance at +125 C >1GΩ ESR (Ohms).1 1pF F F 1pF Frequency (MHz) ESR (Ohms).1 1pF F F 1pF Frequency (MHz) High Q capacitors capacitance values Chip Size Min Cap.1pF.1pF.2pF.2pF.5pF.3pF.3pF 1.pF 2.pF 2.pF 4.pF 5V 63V 33pF 22pF 33pF 68pF F 1 Q vs 85 case size 1 Q vs 1111 case size 22pF 15pF 22pF 47pF 1.5nF 3.3nF 3.3nF F 15nF 18nF V 18pF 12pF 18pF 39pF 1.2nF 2.7nF 2.7nF 4.7nF 12nF 15nF 2V 15pF 1pF 15pF 33pF 1.nF F F 3.9nF 1nF 1nF 3V 56pF 1pF 22pF 68pF 1.5nF 1.5nF 3.3nF F 8.2nF 5V 1pF 33pF 82pF 82pF F 4.7nF 5.6nF 15nF 63V 15pF 39pF 39pF 1.nF F 3.3nF F 1V 82pF 22pF 22pF 68pF 1.5nF F 4.7nF 2V 18pF 68pF 68pF 15pF 47pF 56pF 1.5nF 3V 68pF 15pF 22pF 47pF Tape quantities 7 reel 5 7 reel 4 7 reel 25 7 reel 3 7 reel reel quantities available on request Below 1pF capacitance values are available in.1pf steps. Above 1pF capacitance values are available in E24 series values. Other values and taping quantities may be available on request, consult the sales office for details. 7 reel 1 7 reel 2 7 reel 5 13 reel 2 7 reel 5 13 reel 2 7 reel 5 13 reel 2 7 reel n/a 13 reel n/a Q MHz 5 MHz 1 GHz (pf) Resonant Frequency vs 85 case size Q MHz 5 MHz 1 GHz (pf) Resonant Frequency vs 1111 case size Ordering information High Q capacitors MS range 55 J 25 4P7 B Q T Chip size Termination Voltage in picofarads (pf) Y = FlexiCap termination base with nickel barrier (1% matte tin plating). RoHS compliant. Lead free. H = FlexiCap termination base with nickel barrier (Tin/lead plating with min. 1% lead). J = Silver base with nickel barrier (1% matte tin plating). RoHS compliant. Lead free. A = Silver base with nickel barrier (Tin/lead plating with min. 1% lead). 5 = 5V 63 = 63V 1 = 15 = 15V 2 = 2V 25 = 3 = 3V 5 = 5V 63 = 63V 1K = 1V 2K = 2V 3K = 3V <1.pF Insert a P for the decimal point as the first character. eg. P3 =.3pF Values in.1pf steps 1.pF & <F Insert a P for the decimal point as the second character. eg. 8P2 = 8.2pF Values are E24 series F First digit is. Second and third digits are significant figures of capacitance code. Fourth digit is number of zeros eg. 11 = 1pF Values are E24 series <F H = ±.5pF B = ±.1pF C = ±.25pF D = ±.5pF <F B = ±.1pF C = ±.25pF D = ±.5pF F F = ±1% G = ±2% J = ±5% K = ±1% Q = High Q Ceramic R = 33mm B = Bulk pack tubs Frequency (Mhz) 1 1 Series Parallel (pf) Frequency (Mhz) 1 1 Series Parallel (pf) * Refer to the Sales Office for other chip size electrical data.

15 Copper Barrier capacitors CG/NP, High Q, CG/NP, High Q, Copper Barrier capacitors Multilayer ceramic capacitors with silver/palladium (Ag/Pd) terminations have often been used in medical applications where nonmagnetic components are required, for example in MRI equipment. The use of conventional nickel barrier terminations is not suitable due to nickel exhibiting magnetic properties. However, RoHS requirements have dictated the use of leadfree solders, and the composition of these solders has resulted in an increase in soldering temperatures. This has caused solder leaching problems for the Ag/ Pd termination, and meant alternative terminations have had to be found. As copper is nonmagnetic, one solution is to use a copper barrier instead of a nickel barrier, with a tin finish on top, and this is the solution Syfer has developed. This copper barrier termination is offered with selected nonmagnetic CG/NP, High Q and dielectrics, providing a fully nonmagnetic component. To meet high temperature 26ºC soldering reflow CG/NP & High Q maximum capacitance values Chip Size profiles as detailed in JSTD2, CG/NP dielectrics are supplied with sintered termination and dielectrics are supplied with Syfer s award winning FlexiCap termination Min Cap.1pF.1pF.2pF.2pF.5pF.3pF 1.pF 1.pF 2.pF 2.pF Min Cap Tolerance ±.5pF (<F),.1pF (>F & <F) and ±1% (>F) 5V 63V 22pF 1pF 22pF 47pF 1.5nF 15pF 68pF 15pF 33pF 1.nF F F 4.7nF 1nF 15nF 15V F 47pF 1pF 22pF 68pF 1.5nF 1.5nF 3.3nF F 1nF 2V 6.8pF 33pF 56pF 15pF 47pF 1.nF 1.nF F 4.7nF F Reeled Quantities Ordering information Copper Barrier capacitors J X T _ Chip size Reel Reel 13 reel quantities available on request Note: Other capacitance values may become available, please contact our Sales Office if you need values other than those shown in the above tables. For dimensions and soldering information, please go to our website ( or see our MLC Catalogue. Termination 2 = Sintered silver base with copper barrier (1% matte tin plating). RoHS compliant. (available on CG/NP & High Q only). 3 = FlexiCap base with copper barrier (1% matte tin plating). RoHS compliant. 4 = Sintered silver base with copper barrier (tin/ lead plating). Non RoHS compliant. (available on CG/NP & High Q only). 5 = FlexiCap base with copper barrier (tin/ lead plating). Non RoHS compliant. Voltage 16 = 25 = 5 = 5V 63 = 63V 1 = 15 = 15V 2 = 2V 25 = 5 = 5V 63 = 63V 1K = 1V 1K2 = 12V 1K5 = 15V 2K = 2V 3K = 3V in picofarads (pf) <F Insert a P for the decimal point, eg P3 =.3pF, 8P2 = 8.2pF. F 1st digit is. 2nd and 3rd digits are significant figures of capacitance code. The 4th digit is number of s following eg. 13 = 1pF Values <1pF in.1pf steps, above this values are E24 series <F H = ±.5pF B = ±.1pF C = ±.25pF D = ±.5pF F & <F B = ±.1pF C = ±.25pF D = ±.5pF F F = ±1% G = ±2% J = ±5% K = ±1% codes C = CG/NP (1B) X = (2R1) Q = High Q R = 33mm B = Bulk pack tubs Suffix Used for specific customer requirements 3V 27pF 47pF 12pF 39pF 82pF 82pF 1.8nF 3.9nF 5.6nF 5V 68pF 27pF 68pF 68pF 1.5nF 3.3nF 4.7nF 63V 15pF 39pF 39pF 1.nF F 3.3nF 1V 82pF 22pF 22pF 68pF 1.5nF F 2V 18pF 68pF 68pF 15pF 47pF 56pF 3V 68pF 15pF 22pF maximum capacitance values Chip Size Min Cap 47pF 1pF 33pF 68pF 1.5nF F 3.3nF F 1nF Min Cap Tolerance ±5% 1nF 1nF F 1.µF 1.5µF 1.5µF 3.3µF 5.6µF 6.8µF F F F 82nF 1.2µF 1.2µF 2.2µF 4.7µF 5.6µF 5V 63V 4.7nF F 15nF F 1.µF F 1.5µF 3.3µF 3.3µF 1.5nF 1nF F 15nF F F 1.µF 1.5µF 1.5µF 2V 68pF 5.6nF 27nF 1nF F 18nF F 1.µF 1.µF 5V 1.5nF 8.2nF F 1nF 1nF 27nF 56nF F 63V 4.7nF 1nF 27nF F 15nF F 39nF V 3.3nF 4.7nF 15nF 18nF 56nF 12nF 15nF 12V 3.3nF 1nF 1nF F 82nF 1nF 15V 2.7nF F F F F F 2V F 4.7nF 4.7nF 1nF 27nF F

16 Open Mode and Tandem capacitors Speciality High Rel. and approved parts IECQCECC ranges Open Mode capacitors have been designed specifically for use in applications where mechanical cracking is a severe problem and short circuits due to cracking are unacceptable. Open Mode capacitors use inset electrode margins, which prevent any mechanical cracks which may form during board assembly from connecting to the internal electrodes. When combined with Syfer s FlexiCap termination, Syfer Open Mode capacitors provide a robust component with the assurance that if a part becomes cracked, the crack will be unlikely to result in short circuit failure. A range of specialist high reliability MLCC s for use in critical or high reliability environments. All fully tested / approved and available with a range of suitable termination options, including tin/lead plating and Syfer Flexicap. Ranges include : 1. Range tested and approved in accordance with IECQCECC QC Range qualified to the requirements of AECQ2. 3. Range qualified to the requirements of ESCC 39 European Space Specification. Open Mode max capacitance ( only) nF 15nF F F 1.5µF 3.3µF 4.7µF F 12nF F 56nF 1.2µF 2.2µF 3.9µF 5/63V F 1nF F F 1.µF 1.5µF 2.7µF F 27nF 1nF F F 1.µF 1.8µF 2/ 2.7nF 15nF F 1nF F F 1.µF Tandem Capacitors have been designed as a fail safe range using a series section internal design, for use in any application where short circuits would be unacceptable. When combined with Syfer s FlexiCap termination, Syfer Tandem capacitors provide an ultra robust and reliable component, for use in the most demanding applications. Tandem max capacitance ( only) Open Mode capacitor Qualification included cracking the components by severe bend tests. Following the bend tests cracked components were subjected to endurance / humidity tests, with no failures evident due to short circuits. Note: Depending on the severity of the crack, capacitance loss was between % and 7%. IECQCECC maximum capacitance values CG/NP 1.5nF F F F F 1nF 15nF F 1nF F 1.µF 1.5µF 1.5µF 3.3µF 5.6µF 6.8µF CG/NP 1.nF 4.7nF 15nF F 27nF F 1nF 15nF 56nF F 82nF 1.2µF 1.2µF 2.2µF 4.7µF 5.6µF 5/63V CG/NP 47pF 2.7nF 1nF 18nF 18nF F F 1nF F F F 1.µF F 1.5µF 2.2µF 3.3µF CG/NP 33pF 1.8nF F 12nF 12nF 27nF F F 1nF F 15nF F F 1.µF 1.5µF 1.5µF 2V CG/NP 1pF 68pF F 4.7nF 4.7nF 12nF F 27nF 5.6nF 27nF 1nF F 18nF F 1.µF 1.µF 5V CG/NP n/a 33pF 1.5nF 3.3nF 3.3nF 1nF 15nF F n/a 8.2nF F 1nF 1nF 27nF 56nF 82nF CG/NP n/a n/a 47pF 1.nF 1.2nF 3.3nF 8.2nF 1nF n/a n/a 4.7nF 15nF 18nF 56nF 12nF 15nF 12nF F 15nF 27nF 56nF 1.2µF 1.5µF 1nF 39nF 12nF F F 1.µF 1.2µF 5/63V F F 1nF 18nF 39nF F 1.µF F 1nF F 82nF F F F 2/ 1.nF 4.7nF F F 1nF F F Ordering information Open Mode and Tandem capacitors Qualification included cracking the components by severe bend tests. Following the bend tests cracked components were subjected to endurance / humidity tests, with no failures evident due to short circuits. Note: Depending on the severity of the crack, capacitance loss was between % and 5%. 126 Y K X T _ Chip size Termination Y = Polymer Termination FlexiCap Voltage 16 = 25 = 5 = 5V 63 = 63V 1 = 2 = 2V 25 = in picofarads (pf) First digit is. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. Example: 224 = 22pF Tandem capacitor K = ±1% codes X = E = (AECQ2 product) R = 33mm Suffix M1 = Syfer Open Mode capacitor T1 = Syfer Tandem capacitor Ordering information IECQCECC ranges 121 Y 1 13 J D T _ Chip size Termination Y = FlexiCap TM termination base with Ni barrier (1% matte tin plating). RoHS compliant. H = FlexiCap TM termination base with Ni barrier (Tin/lead plating with min. 1% lead). F = Silver Palladium. RoHS compliant. J = Silver base with nickel barrier (1% matte tin plating). RoHS compliant. A = Silver base with nickel barrier (Tin/lead plating with min. 1% lead). Voltage 16 = 25 = 5 = 5V 63 = 63V 1 = 2 = 2V 25 = 5 = 5V 63 = 63V 1K = in picofarads (pf) First digit is. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following Example: 13 = 1nF <F B = ±.1pF C = ±.25pF D = ±.5pF > F F = ±1% G = ±2% J = ±5% K = ±1% M = ±2% Release codes D = (2R1) with IECQ CECC release F = CG/NP (1B/NP) with IECQ CECC release B = 2X1/ BX released in accordance with IECQCECC R = 2C1/ BZ released in accordance with IECQCECC R = 33mm B = Bulk pack tubs Suffix code Used for specific customer requirements

17 AECQ2 ranges Speciality High Rel. and approved parts Speciality High Rel. and approved parts S2A Space ranges AECQ2 ranges Maximum capacitance values 5/63V 2V 5V 63V CG/NP 47pF 2.7nF 1nF 18nF 39nF F 15nF F F 1.5µF CG/NP 33pF 1.8nF F 12nF 27nF 1nF F 15nF F 1µF CG/NP 1pF 68pF F 4.7nF 12nF 5.6nF 27nF 1nF F F CG/NP n/a 33pF 1.5nF 3.9nF 1nF n/a 8.2nF F 1nF 27nF CG/NP n/a n/a 1.nF 1.8nF 5.6nF n/a n/a 1nF 27nF 15nF CG/NP n/a n/a 47pF 1nF 3.3nF n/a n/a 4.7nF 15nF 56nF Ordering information AECQ2 121 Y 1 13 J E T _ Chip size 3 Terminal EMI Components (E1) AECQ2 ranges Maximum capacitance values 5V Termination Y = FlexiCap TM termination base with Ni barrier (1% matte tin plating). RoHS compliant. H = FlexiCap TM termination base with Ni barrier (Tin/lead plating with min. 1% lead). F = Silver Palladium. RoHS compliant. J = Silver base with nickel barrier (1% matte tin plating). RoHS compliant. A = Silver base with nickel barrier (Tin/lead plating with min. 1% lead). Voltage 16 = 25 = 5 = 5V 63 = 63V 1 = 2 = 2V 25 = 5 = 5V 63 = 63V 1K = in picofarads (pf) First digit is. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following Example: 13 = 1nF CG/NP 82pF 1.nF F F 1nF 2nF CG/NP 56pF 1.nF F 15nF 15nF F Note: For some lower capacitance parts, higher voltage rated parts may be supplied. Refer to page 36. X2Y Integrated Passive Components (E3) AECQ2 ranges Maximum capacitance values <F B = ±.1pF C = ±.25pF D = ±.5pF > F F = ±1% G = ±2% J = ±5% K = ±1% M = ±2% Release codes E = (2R1) AECQ2 A = CG/NP (1B/NP) AECQ2 R = 33mm B = Bulk pack tubs Suffix code Used for specific customer requirements S2A Space ranges Maximum capacitance values 5/63V 2V 5V CG/ NP pF 1.5nF 1pF F 1pF F F F 22pF 1nF 47pF 15nF 56pF F 33pF 1nF 1pF F 68pF 1.µF 1.nF 1.5µF 3.9nF 3.3µF 1nF 5.6µF 18nF 6.8µF CG/ NP 39pF 1.nF 1pF 4.7nF 1pF 15nF F F 22pF F 47pF 1nF 56pF 15nF 33pF 56nF 1pF F 68pF 82nF 1.nF 1.2µF 3.9nF 2.2µF 1nF 4.7µF 18nF 5.6µF CG/ NP.5pF 47pF 1pF 2.7nF 1pF 1nF F 18nF 22pF 39nF 47pF F 56pF 1nF 33pF F 1pF F 68pF F 1.nF 1.µF 3.9nF 2.2µF 1nF 3.3µF 18nF 3.3µF CG/ NP 1pF 33pF 1pF 1.8nF 1pF F F 12nF 22pF 27nF 47pF F 56pF F 1pF 1nF 1pF F 1pF 15nF 1.nF F 3.9nF 1.µF 1nF 1.5µF 18nF 1.5µF CG/ NP 1pF 1pF 1pF 68pF 1pF F F 4.7nF 22pF 12nF 47pF F 56pF 27nF 1pF 5.6nF 1pF 27nF 1pF 1nF 1.nF F 3.9nF F 1nF 1.µF 18nF 1.µF CG/ NP 1pF 27pF 1pF 1.2nF F 2.7nF 18pF F 39pF 15nF 4.7nF 18nF F 8.2nF 18pF F 39pF 1nF 39pF 27nF 1nF 56nF 15nF 82nF Note: In accordance with ESCC 39. Ordering information S2A Space ranges product code construction 121 A 1 13 J X T _ Chip size Termination (1) A = Silver base with nickel barrier (Tin/ lead plating with min. 1% lead). F = Silver Palladium. RoHS compliant. H = FlexiCap TM termination base with Ni barrier (Tin/ lead plating with min. 1% lead). Voltage 16 = 25 = 5 = 5V 63 = 63V 1 = 2 = 2V 5 = 5V in picofarads (pf) First digit is. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following Example: 13 = 1nF <F B = ±.1pF C = ±.25pF D = ±.5pF > F F = ±1% G = ±2% J = ±5% K = ±1% M = ±2% Rel Release codes C = CG/NP (1B) X = (2R1) R = 33mm B = Bulk pack tubs Q = Waffle pack Notes: (1) Termination A, H & F available for Space applications. If another termination type is required then contact Syfer Sales. (2) Please include Lot Acceptance Test requirement (LAT1, LAT2 or LAT3) on purchase order against each line item. Tests conducted after 1% BurnIn for 168 hours): LAT1: 4 x adhesion, 8 x rapid temp change + LAT2 and LAT3. LAT2: 2 x 1 hour life test + LAT3. LAT3: 6 x TC and 4 x solderability. Suffix code Used for specific customer requirements S2A = S (Space Grade) High Rel 5V CG/NP 47pF 1.5nF 5.6nF 1nF F 15nF F 56nF CG/NP 33pF 1.nF 3.9nF F 15nF F 15nF F Note: For some lower capacitance parts, higher voltage rated parts may be supplied. Refer to page 38.

18 Safety Certified capacitors Certification Chart Safety Certified capacitors Safety Certified capacitors Syfer Technology s Safety Certified capacitors comply with international UL and TÜV specifications to offer designers the option of using a surface mount ceramic multilayer capacitor to replace leaded film types. Offering the benefits of simple pickandplace assembly, reduced board space required and lower profile, they are also available in a FlexiCap version to reduce the risk of mechanical cracking. Syfer s high voltage capacitor expertise means the range offers among the highest range available of capacitance values in certain case sizes. Applications include: modems, ACDC power supplies and where lightning strike or other voltage transients represent a threat to electronic equipment. Surface mount multilayer ceramic capacitors Meet Class Y2/X1, Y3/X2 and X2 requirements Approved for mains ac voltages, up to ac Approved by UL and TÜV Sizes 188,, 2211, 2215 and 222 Smaller sizes suitable for use in equipment certified to EN695 Certification specifications for larger sizes include IEC/ EN6384, UL/CSA695 and UL1414 Surface mount package Reduces board area and height restrictions Reduced assembly costs over conventional through hole components FlexiCap option available on all sizes. Class Rated voltage Impulse voltage Insulation bridging May be used in primary circuit Safety Certified capacitors classification and approval specification. CHIP SIZE DIELECTRIC CAP RANGE 188 CG/NP CG/NP 188 CG/NP F to 1.5nF 15pF to F F to 39pF 15pF to 1nF F to 39pF 15pF to 1.nF SYFER FAMILY CODE SP (1) SP (1) PY2 (1) PY2 (1) PY2 (1) PY2 (1) CLASSIFICATION Y3/X2 NWGQ2, NWGQ8 Y3/X2 NWGQ2, NWGQ8 Y2/X1 NWGQ2, NWGQ8 Y2/X1 NWGQ2, NWGQ8 Y2/X1 NWGQ2, NWGQ8 Y2/X1 NWGQ2, NWGQ8 APPROVAL SPECIFICATION IEC638414:25 EN638414:25 UL6951, 2nd Ed CSA nd Ed IEC638414:25 EN638414:25 UL6951, 2nd Ed CSA nd Ed IEC638414:25 EN638414:25 UL6951, 2nd Ed CSA nd Ed IEC638414:25 EN638414:25 UL6951, 2nd Ed CSA nd Ed IEC638414:25 EN638414:25 UL6951, 2nd Ed CSA nd Ed IEC638414:25 EN638414:25 UL6951, 2nd Ed CSA nd Ed APPROVAL BODY TÜV UL TÜV UL TÜV UL TÜV UL TÜV UL TÜV UL Y1 ac 8V Double or reinforced Line to protective earth Y2 ac 5V Basic or supplementary* Line to protective earth Y3 ac None Basic or supplementary 2211 CG/NP F to 1nF SP (2) Y2/X1 NWGQ2, NWGQ8 IEC638414:25 EN638414:25 UL6951, 2nd Ed CSA nd Ed TÜV UL Y4 15Vac Basic or supplementary* Line to protective earth X1 ac 4V Line to line X2 ac Line to line X3 ac None Line to line * 2 x Y2 or Y4 rated may bridge double or reinforced insulation when used in series CG/NP 1pF to F 82pF to 1.nF SP (2) SP (2) Y2/X1 NWGQ2, NWGQ8 Y2/X1 NWGQ2, NWGQ8 IEC638414:25 EN638414:25 UL6951, 2nd Ed CSA nd Ed IEC638414:25 EN638414:25 UL6951, 2nd Ed CSA nd Ed TÜV UL TÜV UL nF to 3.3nF SP (2) Y2/X1 NWGQ2, NWGQ8 IEC638414:25 EN638414:25 UL6951, 2nd Ed CSA nd Ed TÜV UL pF to 4.7nF B16 Y2/X1 (2) Y2/X1, (1) FOWX2 IEC638414:25 EN638414:25 UL1414: 6th Edition TÜV UL pF to 1nF B17 (2) X2 IEC638414:25 EN6384:25 TÜV Notes Termination Availability (1), (2) J: Silver base with Nickel Barrier (1% Matte Tin Plating). RoHS compliant. (1), (2) Y: FlexiCap termination base with Nickel Barrier (1% Tin Plating). RoHS compliant. (2) H: FlexiCap termination base with Nickel Barrier (Tin/ Lead plating with min 1% Lead). (2) A: Silver base with Nickel Barrier (Tin/ Lead Plating with min 1% Lead). PY2 Unmarked capacitors also available as released in accordance with approval specifications. Family code SY2 applies. SP Unmarked capacitors also available as released in accordance with approval specifications. Family code SPU applies Rheinland Product Safety BAUART GEPRÜFT TYPE APPROVED

19 Safety Certified capacitors Ordering information ac Non Safety Rated AC capacitors Ordering information Safety Certified capacitors Class SPU/SP ranges 188 J A25 12 J C T SP Chip size Termination J = Nickel barrier Y = FlexiCap TM termination base with nickel barrier (1% matte tin plating). RoHS compliant. 2211/2215 only A = Silver base with nickel barrier (Tin/lead plating with min. 1% lead). H = FlexiCap TM termination base with Ni barrier (Tin/lead plating with min. 1% lead). Voltage in picofarads (pf) A25 = ac First digit is. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. Example: 12 = 1.nF <F C = ±.25pF D = ±.5pF > F F = ±1% G = ±2% J = ±5% K = ±1% M = ±2% codes C = CG/NP X = Ordering information Safety Certified capacitors Class PY2/SY2 R = 33mm B = Bulk pack tubs Suffix SP = Surge Protection capacitors (marked and approved) SPU = Surge Protection capacitors (unmarked parts are in accordance with, but not certified) 188 J A25 12 J X T PY2 Chip size 188 Termination J = Nickel barrier Y = FlexiCap TM termination base with nickel barrier (1% matte tin plating). RoHS compliant. Voltage in picofarads (pf) A25 = ac First digit is. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. Example: 12 = 1.nF <F C = ±.25pF D = ±.5pF > F F = ±1% G = ±2% J = ±5% K = ±1% M = ±2% codes C = CG/NP X = R = 33mm B = Bulk pack tubs Suffix PY2 = Safety tested Surge Protection capacitors (marked and approved) SY2 = Surge Protection capacitors (unmarked parts are in accordance with, but not certified) Industry wide standard multilayer ceramic capacitors are supplied with a DC rating only. For AC use, Surge and Safety capacitors with an AC rating of ac have been available but the capacitance range is limited as a result of the strict impulse and VP requirements in the international standards. Syfer Technology have developed a range which provides a solution for use at up to ac 6Hz continuous use and provides for non safetycritical applications where extended capacitance ranges are required. range Case sizes 85 to 222 are available in both and CG/NP dielectrics with capacitances of up to 12nF. The capacitance ranges are divided into four groups which are based on the voltage coefficient of capacitance, CG/NP which has negligible capacitance shift with applied voltage and three subgroups of. Type A with ±3% maximum capacitance shift V24V, Type B with +3% to Chip size CG/NP 1.pF 47pF 1.pF 1.2nF F F F F F 5.6nF F 1nF A 3% B +3% 5% C +3% 8% NOTE: A) has a VCC of ± 3% over to 24Vac 5Hz B) has a VCC of +3% to 5% over to 24Vac 5Hz C) has a VCC of +3% to 8% over to 24Vac 5Hz Measurement conditions described in Syfer Application Notes AN33 Ordering information ac Non Safety Rated AC capacitors 5% maximum capacitance shift V24V and Type C with +3 to 8% maximum capacitance shift V to 24V. 56pF 1.5nF 1.5nF 1nF 2.7nF F 2.7nF F F 56nF 12nF 12nF 1.8nF 3.3nF 12nF 27nF 27nF F 82nF 3.9nF 1nF 15nF F F 1nF F 1nF 1nF 12nF Y A25 13 K X T Chip size Termination Voltage in picofarads (pf) codes Ordering information Safety Certified capacitors Class B16/B17 ranges 222 J A25 12 J X T B16 Chip size Termination Voltage in picofarads (pf) codes Suffix Y = FlexiCap J = Nickel Barrier ac 6Hz <F Insert a P for the decimal point, eg P3 =.3pF, 8P2 = 8.2pF. F 1st digit is. 2nd and 3rd digits are significant figures of capacitance code. The 4th digit is number of s following eg. 13 = 1pF Values <1pF in.1pf steps, above this values are E24 series <F B = ±.1pF C = ±.25pF D = ±.5pF F F = ±1% G = ±2% J = ±5% K = ±1% C = CG/NP X = R = 33mm B = Bulk pack tubs 222 J = Nickel barrier Y = FlexiCap TM termination base with nickel barrier (1% matte tin plating). RoHS compliant. A = Silver base with nickel barrier (Tin/lead plating with min. 1% lead). H = FlexiCap TM termination base with Ni barrier (Tin/ lead plating with min. 1% lead). A25 = ac First digit is. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. Example: 471 = 47pF J = ±5% K = ±1% M = ±2% X = 1 pieces R = 33mm 4 pieces B = Bulk B16 = Type A: X1/Y2 B17 = Type B: X

20 115Vac 4Hz & DWV ranges CG/NP LCD Inverter chip range 115Vac 4Hz Capable capacitors for aerospace applications Syfer Technology has conducted reliability testing on standard surface mount ceramic capacitors in order to ensure their performance at 115Vac 4Hz and the associated voltage and frequency transients required by MILSTD74. Self heating will occur due to losses in the capacitor but has been measured at less than 25 C rise with neutral mounting conditions at room temperature. 115Vac 4Hz Capable capacitor range values CG/NP 33pF 1.5nF 3.9nF 3.9nF 1nF 15nF 4.7nF 18nF 39nF 39nF 82nF 1nF Syfer Technology has developed a range of surface mount multilayer ceramic capacitors aimed specifically at the LCD inverter market. The advantage gained over standard product is a reduced susceptibility to surface arcing which allows for the replacement of leaded components. The improved properties are achieved by the utililisation of a unique CG/NP dielectric material. Parts for these applications are identified with the suffix code FB9. Users should carefully consider solder pad design as this can influence arcing voltage. Ordering information 115Vac 4Hz Capable capacitors 126 Y A12 13 J X T Chip size Termination Voltage in picofarads (pf) J = Nickel barrier Y = FlexiCap A = (Tin/lead) H = FlexiCap (Tin/lead) A12 = 115Vac First digit is. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. Example: 13 = 1nF High Withstand Voltage capacitors (DWV range) The Syfer DWV range is specifically designed for use in applications where a high Withstand Voltage (DWV) is required. These parts have a continuous rated voltage of 5Vdc minimum and are 1% DWV tested at the specified voltages to ensure Flashover (arcing) across the surface does not occur. <F H = ±.5pF B = ±.1pF C = ±.25pF D = ±.5pF F & <F B = ±.1pF C = ±.25pF D = ±.5pF F F = ±1% G = ±2% J = ±5% K = ±1% codes C = CG/NP X = R = 33mm B = Bulk pack tubs range Ordering information LCD Inverter range 188 Y 5K 22 J C T FB9 Chip size 188 Termination Voltage d.c. in picofarads (pf) Y = FlexiCap termination base with Nickel barrier (1% matte tin plating). RoHS compliant. J = Nickel barrier pF 22pF 3.9pF 68pF 6kV 1.5pF 12pF 3.9pF 33pF 5K = 6K = 6kV <1.pF Insert a P for the decimal point as the first character. eg. P3 =.3pF Values in.1pf steps 1.pF & <F Insert a P for the decimal point as the second character. eg. 8P2 = 8.2pF Values are E24 series F First digit is. Second and third digits are significant figures of capacitance code. Fourth digit is number of zeros eg. 11 = 1pF Values are E24 series <F B = ±.1pF C = ±.25pF D = ±.5pF > F F = ±1% G = ±2% J = ±5% K = ±1% codes C = CG/NP R = 33mm B = Bulk pack tubs Suffix LCD Inverter range High dielectric withstand voltages (DWV) of and These ratings are based on an application of the DWV voltage for a period of up to 6 seconds (where the charging current is limited to 5mA) Case sizes 126 to 2225 CG/NP and dielectrics values from F to 12nF For full range information please see Syfer web site, or contact our Sales Office. Ordering information DWV capacitors J 1K5 82 K C T DWV Chip size Termination J = Nickel barrier Y = FlexiCap Withstand Voltage 1K5 = 15V 2K5 = in picofarads (pf) First digit is. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. Example: 82 = 82pF J = ±5% K = ±1% M = ±2% codes C = CG/NP X = R = 33mm B = Bulk pack tubs Suffix Withstand Voltage 34 35

21 Surface mount EMI Filters E1 & E7 feedthrough capacitors The Syfer E1 and E7 ranges of feedthrough MLCC chip C filters are 3 terminal chip devices designed to offer reduced inductance compared to conventional MLCC s when used in signal line filtering. Open board insertion loss performance in 5W system Open Board Performance.1MHz 1MHz 1MHz 1MHz 1GHz Resonance Freq (MHz) approx. The filtered signal passes through the chip internal electrodes and the noise is filtered to the grounded side contacts, resulting in reduced length noise transmission paths. F pF pF pF Available in CG/NP and dielectrics, with current ratings of 3mA, 1A, 2A and voltage ratings of dc to 2Vdc. Also available with FlexiCap termination which is strongly recommended for new designs. 68pF pF pF pF pF pF pF pF pF nF nF F nF nF F nF nF F F F F nF nF F F F nF Commonly used in automotive applications, a range qualified to AECQ2 is also available. E1 3mA, E7 1A/2A C E1 / E7 Recommended solder lands E1/E7 L D B T Earth track E A W C Signal track Dimensions L 1.6 ±.2 (.63 ±.8) 2. ±.3 (.79 ±.12) ±.3 (.126 ±.12) 4.5 ±.35 (.177 ±.14) W.8 ±.2 (.3 ±.8) 1.25 ±.2 (.49 ±.8) 1.6 ±.2 (.63 ±.8) T.5 ±.15 (.2 ±.6) 1. ±.15 (.39 ±.6) B1.3 ±.2 (.12 ±.8) B2.2 ±.1 (.8 ±.4) A.6 (.24).95 (.37) 1.2 (.47) 1.2 (.47) 1.6 ±.2 (.63 ±.8) B.6 (.24).9 (.35).9 (.35) 1.4 (.55) 1.1 ±.2 (.43 ±.8) 1.1 ±.2 (.43 ±.8) C.4 (.16).3 (.12).6 (.24).8 (.31).6 ±.2 (.24 ±.8).95 ±.3 (.37 ±.12) 1.4 ±.3 (.55 ±.12) D.2 (.8).4 (.16).8 (.31) 1.4 (.55).3 ±.15 (.12 ±.6).5 ±.25 (.2 ±.1).5 ±.25 (.2 ±.1) E.4 (.16).75 (.3) 1. (.39) 1.4 (.55) 1 1 Loss (db) Loss (db) B1 B2 Notes: 1) All dimensions mm (inches). 2) Pad widths less than chip width gives improved mechanical performance. 3) The solder stencil should place 4 discrete solder pads. The unprinted distance between ground pads is shown as dim E. 4) Insulating the earth track underneath the filters is acceptable and can help avoid displacement of filter during soldering but can result in residue entrapment under the chip. E1 Type E Max Current 3mA 3mA 3mA 3mA 1A 2A 2A 2A 82pF4.7nF 126 Chip Size Termination J = Nickel Barrier (Tin) Y = FlexiCap (Tin) A = (Tin/Lead) H = FlexiCap (Tin/Lead) dc 5Vdc dc 2Vdc Minimum and maximum capacitance values CG/NP 15pF39pF 18pF1.5nF 56pF3.9nF 82pF4.7nF 15pF39pF 18pF1.5nF 56pF3.9nF F18nF 47pF1nF 5.6nFF 3.9nF56nF F18nF 82pF1nF 1nFF F56nF CG/NP F56pF 22pF82pF 22pF3.3nF 22pF3.9nF 12pF56pF F22pF 22pF1nF 1pFF 2.7nF12nF 56pFF 4.7nFF 3.3nFF 2.7nF12nF 1nFF 1nFF FF CG/NP 22pF56pF 22pFF 22pF3.3nF F12pF 22pF56pF 1pF68pF 56pF27nF 1.8nF1nF 3.3nF18nF 1nF27nF 1nF1nF F18nF CG/NP 56pF1.2nF 56pF1nF 15pF18pF 56pF47pF 2.7nF56nF 3.9nF1nF 12nF56nF F1nF Notes: 1) E1 ranges in red available as qualified AECQ2. 2) E7 dc CG/NP 85 to 186 ranges in green, have maximum current of 1A. F CG 22pF CG 47pF CG 1pF CG 47pF CG F CG F 4.7nF 1nF F 1nF 2nF 3 Chip Size Rated Voltage 36 Surface mount EMI Filters E1 & E7 feedthrough capacitors Frequency (MHz) Frequency (MHz) Ordering Information E1 & E7 feedthrough capacitors Reeled quantities Y 178mm 1 13 M Voltage in picofarads (pf) Tolerance 25 = dc First digit is. Second and third M = ±2% 5 = 5Vdc digits are significant figures of 1 = dc capacitance code. The fourth digit 2 = 2Vdc is number of zeros following Example: 13=1pF. X T E7 Type A = CG/NP AECQ2 E1 E7 C = CG/NP R = 33mm E = AECQ2 37 B = Bulk X = mm

22 Surface mount EMI filters X2Y Integrated Passive Components X2Y Integrated Passive Components Surface mount EMI filters X2Y The Syfer X2Y Integrated Passive Component is a 3 terminal EMI chip device. When used in balanced line applications, the revolutionary design provides simultaneous linetoline and linetoground filtering, using a single ceramic chip. In this way, differential and common mode filtering are provided in one device. For unbalanced applications, it provides ultra low ESL (equivalent series inductance). Capable of replacing 2 or more conventional devices, it is ideal for balanced and unbalanced lines, twisted pairs and dc motors, in automotive, audio, sensor and other applications. Available in sizes from 63 to 222, these filters can prove invaluable in meeting stringent EMC demands. Manufactured in the UK by Syfer Technology Limited under licence from X2Y attenuators LLC. or CG/NP Electrical configuration Multiple capacitance measurement At 1hr point Rated voltage dc dc 5Vdc dc 2Vdc 5Vdc T Type Chip size W L B2 B1 L W T B1 B ±.2 (.63±.8).8±.2 (.3±.8).5±.15 (.2±.6).4±.15 (.16±.6).25±.15 (.1±.6) E3 Minimum and maximum capacitance values CG/NP 15pF 15nF CG/NP 12pF 56pF 82pF 1.8nF 3.3nF F 8.2nF 12nF 15nF F F 12nF 56nF F F 82nF 1.2µF CG/NP F 1pF 39pF 47pF 1.2nF 1.5nF 4.7nF 5.6nF 8.2nF 1nF 18nF 15pF 1nF 18nF F 56nF F 18nF 4nF 39nF F 56nF 1.µF CG/NP F 33pF 22pF 1.nF 1pF 3.9nF 82pF F 1.nF 15nF 47pF 15nF 1.5nF F 4.7nF 15nF 8.2nF F 1nF F CG/NP 22pF 1.nF 1pF 3.3nF 82pF 5.6nF 1.nF 15nF 82pF F 1.2nF 12nF 2.7nF 18nF 4.7nF F CG/NP 82pF 3.9nF 1.nF 1nF 2.7nF 1nF 4.7nF 18nF Notes: 1) For some lower capacitance parts, higher voltage rated parts may be supplied. Recommended solder lands D B E A Typical capacitance matching Better than 5% Temperature rating 55 C to 125 C Insulation resistance 1Gohms or 1s (whichever is the less) 2.±.3 (.8±.12) 1.25±.2 (.5±.8) 1.±.15 (.4±.6).5±.25 (.2±.1).3±.15 (.12±.6) ±.3 (.126±.12) 1.6±.2 (.63±.8) 1.1±.2 (.43±.8).95±.3 (.37±.12).5±.25 (.2±.1) withstand voltage <2V 2.5 times rated Volts for 5 secs 5V 1.5 times rated Volts for 5 secs Charging current limited to 5mA Max. 3.6±.3 (.14±.12) 2.5±.3 (.1±.12) 2. max. (.8 max.) 1.2±.3 (.47±.12).5±.25 (.2±.1) 4.5±.35 (.18±.14) ±.3 (.126±.12) 2.1 max. (.8 max.) 1.4±.35 (.6±.14).75±.25 (.3±.1) 5.7±.4 (.22±.16) 5.±.4 (.2±.16) 2.5 max. (.1 max.) 2.25±.4 (.9±.16).75±.25 (.3±.1) Notes: 1) All dimensions mm (inches). 2) Pad widths less than chip width gives improved mechanical performance. 3) The solder stencil should place 4 discrete solder pads. The unprinted distance between ground pads is shown as dim E. 4) Insulating the earth track underneath the filters is acceptable and can help avoid displacement of filter during soldering but can result in residue entrapment under the chip A.6 (.24).95 (.37) 1.2 (.47) 2.5 (.8) 2.65 (.14) 4.15 (.163) B.6 (.24).9 (.35).9 (.35) 1. (.4) 1.4 (.55) 1.4 (.55) C.4 (.16).3 (.12).6 (.24).7 (.28).8 (.31) 1.2 (.47) AECQ2 range (E3) capacitance values Component Advantages Disadvantages Applications Chip capacitor 3 terminal feedthrough Syfer X2Y Integrated Passive Component Filtering application Insertion loss (db) INPUT 1 INPUT 2 F 1nF F Industry standard Feedthrough Lower inductance Very low inductance Replaces 2 (or 3) components Negates the effects of temperature, voltage and ageing Provides both common mode and differential mode attenuation Can be used on balanced & unbalanced lines GROUND A B 6 4nF 1nF F 1nF Ordering information Frequency (MHz) C1 C1 C2 27pF 1pF 47pF A B Requires 1 per line High inductance matching problems Current limited Care must be taken to optimise circuit design Decoupling application Insertion loss (db) SIGNAL RETURN F Bypass Low frequency Feedthrough Unbalanced lines High frequency Bypass Balanced lines High frequency dc electric motors Unbalanced lines Audio amplifiers CANBUS 6 1nF 1nF C1 C1 Frequency (MHz) Y M X T E3 Chip Size Termination Voltage in picofarads (pf) C 1 Tolerance Type Vdc dc Chip size J = Nickel barrier Y = FlexiCap A = (Tin/lead) H = FlexiCap (Tin/lead) CG/NP 39pF 47pF 1.2nF 1.5nF 4.7nF 5.6nF 8.2nF 1nF 18nF F 56nF 15nF 18nF F 39nF 56nF CG/NP F 33pF 22pF 1.nF 1pF 3.9nF 82pF F 47pF 15nF 1.5nF F 4.7nF 15nF 8.2nF F 16 = dc 25 = dc 5 = 5Vdc 1 = dc 2 = 2Vdc 5 = 5Vdc First digit is. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following Example: 334=F. Note: C 1 = 2C M = ±2% (Tighter s may be available on request). A = CG/NP AECQ2 C = CG/NP E = AECQ2 X = R = 33mm B = Bulk 47pF 1nF Syfer X2Y Integrated Passive Component C D.2 (.8).4 (.16).8 (.31 ).9 (.35) 1.4 (.55) 1.8 (.71) E.4 (.16).75 (.3) 1. (.39) 1.85 (.71) 2.5 (.8) 3.95 (.156) Reeled quantities 178mm mm

23 Ceramic chip capacitors information information Ceramic chip capacitors Tape and reel packing of surface mounting chip capacitors for automatic placement are in accordance with IEC Plastic carrier tape Product identifying label Reel dimensions mm (inches) A 1.5(.6) min 2.2(.795) min 13(.512) ±.5(.2) T 6(2.36) min Missing components The number of missing components in the tape may not exceed.25% of the total quantity with not more than three consecutive components missing. This must be followed by at least six properly placed components. Identification Each reel is labelled with the following information: manufacturer, chip size, capacitance,, rated voltage, dielectric type, batch number, date code and quantity of components. Leader and Trailer END 4 empty sealed length is embossments minimum quantity dependent TRAILER COMPONENTS 2 sealed embossments minimum LEADER 4mm min. START Top tape Embossment 8 or 12mm nominal 178mm (7 ) or 33mm (13 ) dia. reel Peel force The peel force of the top sealing tape is between.2 and 1. Newton at 18. The breaking force of the carrier and sealing tape in the direction of unreeling is greater than 1 Newtons. Tape dimensions Symbol Description 178mm reel 33mm reel A Reel diameter 178 (7) 33 (13) G Reel inside width 8.4 (.33) 12.4 (.49) T Reel outside width G 14.4 (.56) max 18.4 (.72) max Component orientation Tape and reeling is in accordance with IEC 6286 part 3, which defines the packaging specifications of leadless components on continuous tapes. NOTES: 1) IED6286 stats Ao < Bo (see Tape Dimensions above). 2) Regarding the orientation of 1825 & 2225 components, the termination bands are right to left, NOT front to back. Please see diagram. Outer Outer Carton Dimensions mm (inches) max. Reel Size No. of reels L W T 178 (7.) (7.28) 185 (7.28) 25 (.98) Orientation of 1825 & 2225 components T Product identifying label Feed direction 178 (7.) 4 19 (7.48) 195 (7.76) 75 (2.95) W T D P Sealing tape P 2 33 (13.) (13.19) 335 (13.19) 25 (.98) E K B F W Note: Labelling of box and reel with bar codes (Code 39) available by arrangement. L t 1 D 1 P 1 A Embossment Cavity centre lines Reel quantities Dimensions mm (inches) Symbol Description 8mm tape 12mm tape A B K Width of cavity Length of cavity Depth of cavity Dependent on chip size to minimize rotation W Width of tape 8. (.315) 12. (.472) F Distance between drive hole centres and cavity centres 3.5 (.138) 5.5 (.213) E Distance between drive hole centres and tape edge 1.75 (.69) P 1 Distance between cavity centres 4. (.156) 8. (.315) P 2 Axial distance between drive hole centres and cavity centres 2. (.79) P Axial distance between drive hole centres 4. (.156) D Drive hole diameter 1.5 (.59) D 1 Diameter of cavity piercing 1. (.39) 1.5 (.59) XT Carrier tape thickness.3 (.12) ±.1 (.4).4 (.16) ±.1 (.4) Xt 1 Top tape thickness.1 (.4) max Chip size Bulk packing tubs Chips are supplied in rigid resealable plastic tubs together with impact cushioning wadding. Tubs are labelled with the details: chip size, capacitance,, rated voltage, dielectric type, batch number, date code and quantity of components. Dimensions mm (inches) H 6 (2.36) D 5 (1.97) 4 D 41 Max. chip thickness Reel quantities 178mm (7 ) 33mm (13 ).5mm 1.3mm.8mm 1.3mm 2.mm 1.6mm 2.mm 2.mm 2.mm 2.5mm 2.5mm 2.5mm 2.5mm 2.5mm 2.5mm H 5/ 1 2/ Notes: (1) The above quantities per reel are for the maximum manufactured chip thickness. Thinner chips can be taped in larger quantities per reel. (2) Where two different quantities are shown for the same case size, please contact the Sales Office to determine the exact quantity for any specific part number. 5/ 1 2/ 4 Product identifying label Caution label 5/ 1 2/ 4

24 Radial Leaded capacitors Radial Leaded capacitors Syfer Technology produces a wide range of dipped radial leaded capacitors. These are available in rated voltages of 5V up to 6kV. Although our catalogue range extends to 6kV, we are able to offer a capability for specials up to. Our larger case sizes and high voltage versions are particularly in demand, especially for mil/aero and medical power supply applications. Please contact our Sales Office to discuss any special requirements. IECQCECC approved parts are also included within the ranges. High working voltage up to dc Large case sizes RoHS compliant versions Tinlead plated wire option to reduce tin whiskers (quote suffix A97 for 8111 to 8141 & A31 for 8151, 8161, 8171). Min. cap values 5/63V 2/ 5V 63V 1. 6kV 8111M 8111N 8121M 8121N 8121T 8131M 8131M T = 8131T 8141M 8151M 8151M T = CG/NP F F F F F F F F F 39pF 68pF 1pF 1pF 1pF 1pF 33pF 1pF 15pF 1pF 47pF 1.nF F CG/NP 5.6nF 5.6nF 18nF 18nF 18nF 1nF F 15nF F 39nF F F F 1.µF 1.µF 1.µF 3.3µF 2.2µF 4.7µF 8.2µF 1µF 15µF CG/NP 2.7nF 2.7nF 12nF 12nF 12nF F 27nF 1nF 18nF F 56nF 1nF 1nF F F F 1.5µF 1.µF 2.2µF 8.2µF 1µF 15µF CG/NP 1.nF 1.nF 4.7nF 4.7nF 4.7nF 27nF F 12nF F 82nF 18nF 12nF F 27nF 56nF 56nF 56nF F F F 1.µF F 1.µF 1.5µF 3.9µF 8.2µF CG/NP 47pF 47pF 3.9nF 3.9nF 3.9nF F F 1nF F 56nF 12nF 1nF 27nF 18nF F 8.2nF 8.2nF 1nF 1nF 1nF 82nF 27nF F 1.µF 1.8µF 3.3µF CG/NP 27pF 27pF 1.8nF 1.8nF 1.8nF 15nF 39nF 5.6nF F 39nF 1nF F 18nF 15nF 39nF 4.7nF 4.7nF 27nF 27nF 27nF 39nF 15nF F F 1.2µF 2.2µF CG/NP 1pF 1pF 1.nF 1.nF 1.nF 1nF 27nF 3.3nF 15nF F 82nF 39nF 15nF F 27nF 3.3nF 3.3nF 15nF 15nF 15nF 15nF 56nF 15nF 18nF 39nF 1.µF CG/NP 68pF 68pF 68pF F F F F 18nF 56nF F 1nF F 18nF 1nF 1nF 1nF 1nF F 1nF 15nF F F CG/NP 47pF 47pF 47pF 4.7nF 12nF 1.5nF 4.7nF 12nF 39nF F F F 12nF F F F F F F 1nF 15nF F CG/NP 22pF 22pF 22pF F F 82pF 3.3nF 5.6nF 18nF 1nF 39nF 18nF F 4.7nF 4.7nF 4.7nF F 1nF F F 82nF 15nF CG/NP 1.8nF 3.9nF 68pF 1.8nF 4.7nF 12nF F F 12nF 39nF 12nF 3.3nF 12nF F F 1nF CG/NP 1.5nF 2.7nF 47pF 1.nF F 8.2nF 4.7nF 18nF 8.2nF 27nF F 2.7nF 1nF 18nF 39nF F CG/NP 82pF 1.5nF 27pF 68pF 1.nF 3.3nF F F 4.7nF 15nF 5.6nF F 5.6nF F 15nF F CG/NP 56pF 1.nF 18pF 47pF 56pF F 1.5nF 4.7nF 3.3nF 1nF 4.7nF 1.2nF 3.3nF 3.9nF 8.2nF 18nF CG/NP 39pF 68pF 12pF 1.nF 1.5nF 3.3nF F 2.7nF 1.nF 1.nF 2.7nF Note: T = Maximum thickness. 8111M 8111N 8121M 8121N 8121T 8131M 8131M T = 8131T 8141M 8151M 8151M T = 8161M 8161M 8161M T = 7.mm 8161M T = 7.mm 8171M 8171M 8171M T = 7.mm 8171M T = 7.mm Dimensions Dipped Radial Pattern A Ordering information Radial Leaded capacitors 8111M 1 12 J C Type No./ Size ref CECC Width Height Thickness Lead Space Lead Diameter Case reference X S Pattern 8111M A A 8111N F B 8121M B A 8121N C B 8121T 8131M D A 8131T 8141M 8151M 8161M 8165M 8171M B B A A A A A Voltage d.c. (marking code) Y 5. (.2) min. 1.5 (.6) max. (X) max. mm inches Z Seating Plane Note: Pattern A may be substituted with Pattern B at Syfer s discretion. Marking information All encapsulated capacitors are marked with: value,, rated d.c. voltage, dielectric, and where size permits the Syfer Technology S logo. Example: 1pF ±1% 5V 2X1 dielectric d in picofarads (pf) (Y) max. mm inches Pattern B (Z) max. mm inches /6.3.15/ /6.3.2/.25 6./7..24/ /7..24/.28 X S Rel Release codes (S) mm inches 2.54±.4.1± ±.4.2± ±.4.1± ±.4.2± ±.4.3± ±.4.2± ±.4.3± ±.4.2± ±.4.4± ±.5.57± ±.5.67±.2 2.5±.5.81±.2 5. (.2) min. Y Logo Suffix Z Seating Plane d (d) mm inches.5±.5.2±.2.5±.5.2±.2.5±.5.2±.2.5±.5.2±.2.5±.5.2±.2.5±.5.2±.2.5±.5.2±.2.5±.5.2±.2.6±.5.25±.2.6±.5.25±.2.6±.5.25±.2.6±.5.25±.2 code Voltage code code Suffix Fixed Multilayer Ceramic Radial capacitor IECQCECC approvals Dipped Climatic category: 55/125/21 Dipped product approval range CECC case size A F Syfer product code 8111M 8111N 8111M 8111N 8121M 8121N 8121T 8131M 8131T 8141M 8151M 8161M 8165M 8171M 5 = 63 = 1 = 2 = 5 = 1K = 1K2 = 1K5 = 2K = 2K5 = 5V 63V 2V 5V 1. (A) (D) (B) (C) (Q) (Z) () (T) (M) First digit is. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. Example: 8P2 = 8.2pF <F D: ±.5pF F: ± 1.pF >F J: ± 5% K: ± 1% M: ± 2% >27pF G: ± 2% (CG/NP only). C = CG/NP (1B/CG; CG/BP) X = (2R1) To Special Order B = 2X1 (BX) R = 2C1 (BZ) Used for specific customer requirements. C42 denotes RoHS compliant. A31 or A97 denote nonrohs tin/lead wires. Suffix A97 for 8111 to 8141 & A31 for 8151, 8161, s: CG/NP 5%, 1% & 2% B 8121M 42 1% & 2% C 8121N 3K = (P) 43 Approved rated voltages: 5V/63V, & 2V D 8131M 4K = (S) range CECC specification 5K = (2) 6K = 6kV CG/NP 3.9pF to 27nF CECC pF to 1.uF CECC Notes: The voltage code may be replaced with the complete voltage (e.g. 15V = 1K5V) at Syfer s discretion. Marking may be over both sides of the component as necessary.

25 Radial Leaded capacitors CG/NP & ranges 8111M / 8111N 8121M / 8121N 8121T 8131M 8131T Code CG/NP CG/NP CG/NP CG/NP CG/NP Code F 4p7 F 4p p p p p p p2 F 1 F pF 11 1pF nF 12 1.nF nF 13 1nF nF 14 1nF µF 15 1.µF µF 16 1µF µF µF 156 5/63V 2/ 5V 63V 5/63V 2/ 5V 63V 5/63V 2/ 5V 63V 1. 5/63V 2/ 5V 63V 1. 5/63V 2/ 5V 63V 1. 5/63V 2/ 5V 63V /63V 2/ 5V 63V 1. 6kV 5/63V 2/ 5V 63V 1. 6kV 5/63V 2/ 5V 63V 1. 6kV 5/63V 2/ 5V 63V 1. 6kV

26 Radial Leaded capacitors CG/NP & ranges 8141M 8151M 8161M 8171M Code CG/NP CG/NP CG/NP CG/NP Code F 4p7 F 4p p p p p p p2 F 1 F pF 11 1pF nF 12 1.nF nF 13 1nF nF 14 1nF µF 15 1.µF µF 16 1µF µF µF 156 5/63V 2/ 5V 63V 1. 5/63V 2/ 5V 63V 1. 6kV 5/63V 2/ 5V 63V 1. 6kV 5/63V 2/ 5V 63V 1. 6kV /63V 2/ 7.mm 5V 7.mm 63V 7.mm 7.mm 1. 7.mm 7.mm 7.mm 7.mm 7.mm 7.mm 7.mm 6kV 7.mm 5/63V 2/ 5V 63V 1. 5/63V 2/ 7.mm 5V 7.mm 63V 7.mm 7.mm 1. 7.mm 7.mm 7.mm Note: The highlighted parts are defined as dualuse under export control legislation and as such are subject to export licence restrictions. Please refer to page 9 for further details. 7.mm 7.mm 7.mm 7.mm 6kV 7.mm 5/63V 2/ 5V 63V 1.

27 Radial Leaded capacitors information information Radial Leaded capacitors Cropped leads Cropped leads between 4. (.157) and 3. (1.18) are available to special order. Some of the preferred codes are listed below, together with the appropriate suffix code. Dimensions as for standard product except as specified. Suffix code AE3 All radial ranges Lead length (L) 6 ±1 (.236 ±.4) from seating plane Snap in leads Various forms of snap in leads (preformed) are available to special order, some of the preferred suffix codes are listed below. Dimensions as for standard product except as specified. Suffix code AD1 For PCB holes.9mm diameter Types 8121N and 8131M Dimensions Y = 8121N 8 (.315) Max 8131M 1 (.394) Max L = Min: 2.75 (.18) Max: 3.5 (.138) Suffix code AD3 For PCB holes 1.2mm diameter Types 8121N Dimensions Y = 8 (.315) Max L = Min: 2.75 (.18) Max: 3.5 (.138) Bandoliered suffix codes Dipped radial leaded with 2.54 and 5.8mm lead spacing can be supplied bandoliered on reels or in ammo boxes to special order. Some of the preferred suffix codes for bandoliered products are given below. A B H H Dipped standoff lead form Y H This style has been developed to provide a meniscusfree seating plane with a stress relieving form for autoinsertion. Suffix code AE4 All radial ranges Lead length (L) 4 ± 1 (.162 ±.4) from seating plane Seating plane Seating plane Dipped straight and formed leads 4±.5 5±.5 6± ±.5 5±.5 6.6± Max For bandoliered products the minimum order quantity, pieces, is specified in the tables below, larger orders must be in multiples of this quantity. Reel Suffix code AMMO pack Product code Lead style Diagram H H 25pcs 1pcs 2pcs 8111M Straight 2.54 crs A 19±1 C1 C2 C M Straight 2.54 crs A 16±.5 C3 C31 C N Formed 5.8 crs B 16±.5 C1 C2 C M Straight 2.54 crs A 19±1 C1 C2 C M Straight 2.54 crs A 16±.5 C3 C31 C N Formed 5.8 crs B 16±.5 C1 C2 C M Straight 5.8 crs A 19±1 C1 C2 C M Straight 5.8 crs A 16±.5 C3 C31 C T and 8131T available in bulk packaging only. Y L Y L Suffix code AD7 All radial ranges Lead length (L) 5 ± 1 (.2 ±.4) from seating plane Suffix code AD2 For PCB holes 1.2mm diameter Types 8131M Dimensions Y = 1 (.294) Max L = Min: 2.75 (.18) Max: 3.5 (.138) Suffix code AD5 All radial ranges Lead length (L) 1 ± 1 (.4 ±.4) from seating plane Dimensions mm (inches) Seating plane ±.5 Product code Lead style Y max H 25pcs 1pcs 2pcs 8111N Formed 5.8 crs ±.5 C12 C23 C N Formed 5.8 crs ±1 C13 C25 C N Formed 5.8 crs ±.5 C12 C23 C N Formed 5.8 crs ±1 C13 C25 C24 5±.5 6.6± Max Y L A maximum of 3 consecutive components may be missing from the bandolier, followed by at least 6 filled positions. Components missing from the bandolier are included in the total quantity, whereby the number of missing components may not exceed.25% of this total per packing module. At the beginning and end of a reel the bandolier will exhibit at least 1 blank positions. Minimum pull strength of product from tape = 5N. Each reel/carton is provided with a label showing the: Manufacturer, product style, batch identification, quantity and date code. Labelling with bar codes (code 39) is available on request. Dimensions mm (inches) Description Symbol 2.5mm lead space Lead wire diameter d.5 (.2).6 (.25) Bandoliered reels 355±1. 45±1. The adhesive tape faces outwards. The dispensing direction is as shown. For the protection of the components a paper inlay is inserted between the windings of the bandolier. At the end of the bandolier this paper inlay continues for at least a further two rotations. 3±1. 85±1. 52 max Dh W 23 (9.5) (2 pcs) In accordance with IEC 6286 part 2. Bandoliered ammo packing 2 carton sizes W 1 t W 2 W 115 (4.5) (1 pcs) 45 (1.77) D P 2 L 2 F 5mm lead space.5 (.2).6 (.25) 335 (13.1) P P 1 P 48 (1.88) 24 (.94) H 1 H H L Tolerance ±.5 (.2) Component pitch P 12.7 (.5) 12.7 (.5) 1. (.4) Feed hole pitch P 12.7 (.5) 12.7 (.5) ±.3 (.1) Feed hole centre to lead P (.2) 3.81 (.15) ±.7 (.3) Feed hole centre to component P (.25) 6.35 (.25) ±.7 (.3) Lead spacing F 2.54 (.1) 5.8 (.2) +.6 (.2).1 (.4) Component alignment Dh ±2.(.8) Tape width W 18. (.7) 18. (.7) +1. (.4).5 (.2) Hold down tape width W 6. (.23) 6. (.23) ±.3 (.1) Hole position W 1 9. (.35) 9. (.35) ±.5 (.2) Hold down tape position W 2.5 (.2).5 (.2) Max Height to seating plane from tape centre (straight leads) (2) H 16 (.63) to 2 (.79) 16 (.63) to 2 (.79) As required Height to seating plane from tape centre (formed leads) (2) H 16 (.63) to 2 (.79) 16 (.63) to 2 (.79) As required Height to top of component from tape centre H (1.26) 32.2 (1.26) Max Feed hole diameter D 4. (.16) 4. (.16) ±.2 (.8) Carrier tape plus adhesive tape thickness t.7 (.3).7 (.3) ±.2 (.8) Carrier tape thickness.5 (.2).5 (.2) ±.1 (.4) Cut out component snipped lead length from tape centre L 11. (.43) 11. (.43) Max Lead wire protusion from hold down L 2 2. (.8) 2. (.8) Max dia. (.79)

28 BSC Filters Limited Dover House, 111 Sterling Park, Amy Johnson Way, Clifton Moor, York YO3 4WU UK Phone: Fax: Laboratories, Inc 2777 Route 2 East, Cazenovia, NY 1335 USA Phone: Fax: sales@dilabs.com DowKey Microwave 4822 McGrath Street, Ventura, CA 933 USA Phone: Fax: askdk@dowkey.com Copyright Syfer Technology Limited 211 design creations@panpublicity.co.uk K&L Microwave 225 Northwood Drive, Salisbury, MD 2181 USA Phone: Fax: sales@klmicrowave.com Novacap Anza Drive, Valencia, CA USA Phone: Fax: info@novacap.com Pole/Zero Corporation 5558 Union Centre Drive, West Chester, OH 4569 USA Phone: Fax: support@polezero.com Syfer Technology Limited Old Stoke Road, Arminghall, Norwich, NR14 8SQ UK Phone: Fax: sales@syfer.co.uk Voltronics Corporation 225 Northwood Drive, Salisbury, MD 2181 USA Phone: Fax: info@voltronicscorp.com 46/11/C Ceramic & Microwave Products (CMP) designs, manufactures and sells special electronic components and systems, including highperformance filters, switches, capacitors and EMI and cosite signal interference solutions. Our products are used in military, space, telecom infrastructure, medical and industrial applications where function and reliability are crucial.