The Schottky limit and a charge neutrality level found on metal/6h-sic interfaces

Size: px
Start display at page:

Download "The Schottky limit and a charge neutrality level found on metal/6h-sic interfaces"

Transcription

1 Surface Science ) L85±L81 Surface Science Letters The Schottky lim and a charge neutraly level found on metal/6h-sic interfaces Shiro Hara National Instute of Advanced Industrial Science and Technology AIST), AIST Tsukuba Central 2, Tsukuba, Ibaraki , Japan Received 18 October 2; accepted for publication 31 August 21 Abstract We report the Schottky lim and a charge neutraly level CNL) experimentally demonstrated at metal/6h- SiC 1) interfaces. An interface wh the Schottky lim was formed by dipping SiC surfaces in boiling pure water before metallization. The total densy of interface states, D, was a drastically small value of 4:6 1 1 states cm 2 /ev, indicating the densy of the metal induced gap states was less than this value. In contrast, at incompletely passivated interfaces whout the boiling water dipping process, a broad continuum of interface states wh D of 2: states cm 2 /ev was observed wh the CNL located at.797 ev from the conduction band minimum. The origin of these interface states was found to be in the disordered interface layers. Ó 21 Elsevier Science B.V. All rights reserved. Keywords: Schottky barrier; Metal±semiconductor interfaces; Interface states; Surface electronic phenomena work function, surface potential, surface states, etc.); Silicon carbide; Evaporation and sublimation; Oxidation; Etching Despe ve decades of innumerable studies, there is still much controversy about the mechanism of Schottky barrier formation at metal/semiconductor interfaces, especially in terms of the essential factors determining the barrier height [1]. Proposed factors are often categorized into intrinsic and extrinsic factors. A so-called intrinsic factor is the metal induced gap states MIGS) conceptually proposed by Heine [2]. Computational demonstrations of MIGS have been made [3] and a method for calculating the charge neutraly level CNL) that dominates the interface Fermi level has been proposed [4]. Extensive calculations have been done [5] and CNL uctuations have been discussed address: shiro-hara@aist.go.jp S. Hara). [6]. The long-range space-charge contribution to the interface charges has also been considered [7]. Some of the reasons for the controversy arise from the lack of experimental supports for the penetration depth and energy distribution of MIGS in the semiconductor, and for a direct measurement of CNL. To reveal the MIGS e ect experimentally, a reduction of the extrinsic factors is a prerequise. Typical extrinsic factors are defects as pointed out by Spicer et al. [8], disorder that induces gap states DIGS) [9], and interface geometry as typically shown in the NiSi 2 /Si 1 1 1) interface [1]. These factors show the importance of the formation of an abrupt interface. This recognion has led to experiments of low-temperature interface formation [11] and speci c inert metal selections [12,13]. Imperfect termination of the surface before /1/$ - see front matter Ó 21 Elsevier Science B.V. All rights reserved. PII: S )1596-5

2 L86 S. Hara / Surface Science ) L85±L81 the metal deposion is also one of extrinsic factors as shown in the studies of sulfur passivation on GaAs [14] and hydrogen passivation on Si [12]. In the above studies on the extrinsic factors, however, the general trend of the Schottky barrier height SBH) for various metals is unclear and indirect. Due to the incomplete and partial control of these extrinsic factors, the energy distribution of the interface states becomes complicated, thereby making the SBH unpredictable. Further, the MIGS e ect reduces the SBH controllabily, which hinders the detection of the extrinsic factors as individual e ects on the SBH. According to the controversial history, one can express the total densy of interface states D total as D total E ˆD MIGS E D EXT E ; 1 if the interaction between MIGS, D MIGS and extrinsic states D EXT is neglected. To observe one of these two factors, the other factor should be reduced. Here, we use 6H-SiC crystal wh a wide band gap that is predicted to have a weaker MIGS e ect than Si or GaAs but still predicted to have a remarkable e ect wh D MIGS of 1 14 states cm 2 /ev [15]. 1 Also, SiC is expected to form an abrupt interface after room-temperature metal deposion [16] because of s strong Si±C bonding. We also apply the monohydride termination technique, developed for the Si 1 1 1) surface using boiling water immersion [17], for the SiC surface. Using these experimental techniques, we form atomby-atom interface connection and we demonstrate the rst perfect control of the extrinsic factors and observe the negligible MIGS e ect in this wide band gap. Commercially available nrogen-doped n-type 6H-SiC 1) epaxial wafers wh a carrier concentration of cm 3 were used. All samples were degreased followed by dipping in 5% HF solution. This cleaning process is referred to as DHF treatment. Some of the degreased samples were RCA cleaned and subsequently thermally oxidized. The oxide layer wh a thickness of 1 nm was etched by dipping in 5% HF solution. We will refer to the sequence of the treatment as O/E treatment. Some of the O/E samples were immersed in boiling water at 98 C for 1 min. The sequence of this treatment will be referred to as BW treatment. All samples were rinsed in the deionized water after each HF process. The treated surfaces were characterized using low energy electron di raction LEED), Auger electron spectroscopy AES), and X-ray photoemission spectroscopy XPS). Metals were deposed onto the SiC surfaces after each surface treatment using an e-beam evaporator wh maximum working pressures below Torr. During deposion, there was no intentional sample heating. In our preliminary report, we used only Ti, Mo, and Ni as contact materials [18]. Here we add Pt and Al to obtain D. SBH were measured by I±V and C±V methods. 2 The slope parameter S / de ned as o/ b =o/ m is a parameter required to estimate D, where / b is the SBH and / m is the metal work function. In our work, the experimental values of S / obtained from Al, Ti, Mo, Ni and Pt electrodes are.18,.549, and.754 for DHF, O/E, and BW samples, respectively. Previously reported values of S / for 6H-SiC 1) epaxial lms are.14 [19] and.63 [2], which are similar to the values of our DHF and O/E treatments, respectively. S / for the BW sample is larger than the reported ones. In a discussion on S /, one should notice that the leakage current tends to reduce the I±V measured SBH [21], which might cause an underestimation of S / compared wh the real S /. Fig. 1 is the relation between the ideal factor n and / b wh Pt electrodes. / b is the at-band barrier height canceling the image force lowering. Since all the data plots in each treatment are distributed on each straight line, the lines are extrapolated to ideal unique 1 S X values reported in this paper can be converted to D using the formulas of S / ˆ e i = e i q 2 dd and S X b m b =@/ m =@X m ˆ AS /, where X m is the electronegativy of a metal. The conversion factor A m =@X m is Detailed experimental condions and the results of our investigation on the metal/sic interface will be described in a full paper reported by Teraji and Hara, which will be submted elsewhere.

3 S. Hara / Surface Science ) L85±L81 L87 Fig. 1. Ideal factor n vs. / b for Pt/6H-SiC 1) interfaces. DHF, O/E, BW indicate diluted HF, oxidation and etching, and boiling water dipping process, respectively. Each plot indicates n and / b of individual Pt electrodes. The inset shows typical I±V curves. Fig. 2. / m vs. / b plots. Barrier height controllabily is raised going from DHF to BW through O/E treatment. On the BW line, the slope parameter S / is.994, which is approximately in the Schottky lim condion. / exp is the observed CNL of these metal/sic interfaces. / MIGS is the predicted CNL of MIGS [25]. The inset shows the energy distribution of the interface states. Distributions outside of the hatched areas are unknown in our experiment. barrier heights / b at n ˆ 1, obeying thermionic emission current transport whout leakage current. / b for DHF, O/E, and BW electrodes are 1:11 :15 ev, 1:365 :24 ev, and 1:632 :7 ev, respectively. The plot concentration in DHF and the plot broadening along the BW line suggest that the DHF interface has a large amount of D to form a strong pinning and the pinning is weaker in the BW interface. By obtaining / b also from other metal electrodes, relations between / m and / b are plotted as shown in Fig. 2. S / using / b for the DHF, O/E and BW electrodes are :215 :5, :739 :79, and :994 :53, respectively. The value of.994 is near the Schottky lim of S / ˆ 1 having the maximum SBH controllabily. C±V measured barrier heights / CV b provide almost the same barrier heights as / b and S / ˆ 1:11 for the BW interfaces. See footnote 2.) This indicates that / CV b / b 6ˆ / b at least in our experiments. In other words, the C±V barrier heights coincide wh the I±V barrier heights when the interfaces have no leakage current. We estimated D from the equation S / ˆ e i = e i q 2 dd [22], where e i is the permtivy of the interfacial layer and d the width of the interface layer. We use the bilayer thickness.252 nm in the 6H-SiC 1) crystal as d, and use the permtivy in vacuum e as e i since no report was found on e i for metal/sic interfaces. D for the DHF, O/E and BW electrodes are 2:8 1 13,2:7 1 12, and 4:6 1 1 states cm 2 / ev, respectively, as indicated in the inset gure. Even for the lower error lim of S / ˆ :941 ˆ :994 :53, D has a relatively low value of 4: states cm 2 /ev. The correlation coe cients r for the DHF, O/E, and BW lines are.928,.983, and.996, respectively. These strong correlations suggest there is no remarkable interface reaction generating interface states between the SiC substrate and the various metals. It is important to know the line shape in the relation between / b and / m to understand the distribution D E as depicted in Fig. 3. A U-shaped distribution provides a curved line. A straight line is generated by a broad distribution. Local states provide a stepwise line. According to the MIGS model proposed by Terso [4], MIGS should have

4 L88 S. Hara / Surface Science ) L85±L81 Fig. 3. Types of energy distribution in interface states and corresponding correlations of / m vs. / b. a U-shaped energy distribution. It is believed that the MIGS are not the direct penetration states of the metal wave function but metal-induced states redistributed from the conduction and the valence band states where the total number of the states in the semiconductor is preserved [4]. In our observations, the data plots in Fig. 2 form straight lines at least in the observed individual barrier height ranges that are indicated by hatched areas in the inset. This broad feature of D E suggests that the origin of the interface states is di erent from the MIGS that should have the U-shaped D E. In general, energetic broadness in electron states is a typical feature of a disordered structure. Fig. 4 shows cross-sectional lattice images of DHF and BW interfaces by transmission electron microscopy TEM). The DHF interface has a disordered interface layer of 2 nm thickness. In the BW sample the interface is atomically abrupt and has the atom-by-atom commensurate epaxial connection wh the 112 6H-SiC == 11 1 Ti relation whout any evidence of a SiO 2 formation in our cross-sectional TEM observation and electron energy loss spectroscopy EELS) of the crosssectional sample. The lattice type of the Ti layer is the face-centred cubic fcc) lattice. The formation of the fcc-ti structure has previously been suggested only in an ultra-thin Ti lm wh a thickness of several angstroms on Al surfaces [23]. We have observed the growth of the fcc-ti layer wh a thickness of 1 nm, which is the rst report on this thin layer single-crystal formation [24]. The bulk stable phase of Ti is hexagonal close-packed hcp) wh a lattice mismatch of 4% for the 6H- SiC 1) crystal. The lattice constant a of the observed fcc-ti structure is.438 nm wh a lattice mismatch of.79% between the 112 6H-SiC and 11 1 Ti faces. The phase change at the interface Fig. 4. High-resolution cross-sectional TEM lattice images wh the electron acceleration at 2 ev incident from the [1 1 2 ] direction of a) DHF and b) BW interfaces.

5 S. Hara / Surface Science ) L85±L81 L89 occurs in preference to the incommensurate hcp- Ti/6H-SiC 1) interface formation. This commensurate connection is strong evidence of direct Ti chemical bonding to the SiC crystal whout a hydrogen terminator. In LEED observations BWtreated SiC surfaces exhib sharp 1 1 patterns whereas DHF-treated SiC surfaces show no diffraction spot indicating that the DHF surface is disordered. The disordered surface and interfaces in DHF samples is consistent wh the broad D E. The uni ed disorder-induced gap state DIGS) model has been proposed as a model to deal wh interface disorder [9]. In this model, similar to the branch point mechanism, D E is a U-shaped continuum because the origin of the DIGS is de ned as the penetration tails of the valence and conduction band states. The observed broad D E suggests that another type of disorder exists whose origin is di erent from the above mechanism. One of our important observations is the rst experimental nding of a CNL, / exp ) indicated in Fig. 2. CNL is the crical parameter to determine the amount of the interface charge, but has been discussed only for the MIGS theory [4±6]. Here, we extend the CNL phenomenon to a more general concept that is not restricted to a speci c origin like MIGS. The three lines intersect wh each other at the CNL wh / b of.797 ev and / m of 4.65 ev. The observation of one CNL for the three kinds of surface preparations indicates that the origin of D is the same for the three interfaces, but the amount of D is variable. This / exp is located far from the MIGS±CNL / MIGS at 1.43 ev estimated from previous experimental values of / b [2] and the value of / m of 5.4 ev assuming that / m is equal p to the Miedima's electronegativy, X SiC ˆ X Si X C ) [25]. This is plotted in Fig. 2. In the MIGS theory, the interface Fermi level should be pinned at the branch point E BP where the e ects of the conduction and valence band balance [4]. E BP for the 6H-SiC crystal is calculated to be 1.41 ev, which has almost the same value as the above estimation of / MIGS but absolutely di erent from / exp. This di erence supports the assertion that / exp is an extrinsic level, not the intrinsic level based on the branch point mechanism. The discussed disordered features give / exp ˆ / disorder in this system. In other words, our experimentally observed CNL is a disorder-related CNL, / disorder, not MIGS±CNL / MIGS. Considering the possibily of a multiple CNL system, another general model wh an expression, D total E ˆD BP E D EXT1 E D EXT2 E ; 2 is given, where each term on the right has an individual /, and D BP is D wh the CNL at E BP, which originates from the MIGS or DIGS theories based on the branch point mechanism. Our metal/ SiC interfaces have D total D BP D disorder wh D BP < D total ˆ 4:6 1 1 states cm 2 /ev for the BW interface in the observed SBH range of.45±1.66 ev. This indicates that D MIGS is also lower than 4:6 1 1 states cm 2 /ev. According to the typical MIGS theory of Ref. [4], the penetration length of the metal wave function or the semiconductor layer depth modi ed by the metal was calculated to be.15 nm for ZnS wh the band gap of 3.6 ev that is comparable value of 6H-SiC. Nevertheless, D calculated for ZnS is 1 14 [26]. At least, our nding of for the MIGS densy strongly suggests that the MIGS penetration depth for SiC is much lower than.15 nm. This implies that actual penetration depths for other semiconductors may have much lower than the calculated values [4] and the semiconductors may have D wh one or two order of magnude lower than the predictions if one can exclude the extrinsic interface states. From XPS measurements of the core level posion of C 1s, the surface potential barrier is.19 ev and the surface band bending is nearly at of.8 ev for the BW surface. Using the value of.8 ev the ionized total densy of the surface states R D s de is evaluated to be 6: states/ cm 2. Let us estimate the densy of the surface states D s by assuming that the surface CNL has the same origin as the interface CNL. The energy width of charged states between the CNL and the Fermi level posion is.67 ev ˆ :797 :19 ev). Thus, D s is estimated at 1: states cm 2 /ev. This value is one and a half orders of magnude higher than D, implying that the residual surface states are e ectively annihilated by

6 L81 S. Hara / Surface Science ) L85±L81 the electronically ideal interface connection as well as the structurally perfect interface connection. Acknowledgement The author thanks Dr. T. Teraji for his enormous amount of experimental work. References [1] L.J. Brillson, Surf. Sci ) 99. [2] V. Heine, Phys. Rev ) A1689. [3] S.G. Louie, M.L. Cohen, Phys. Rev. B ) [4] J. Terso, Phys. Rev. Lett ) 465. [5] W. Monch, J. Appl. Phys ) 576. [6] F. Flores, A. Mu~noz, J.C. Duran, Appl. Surf. Sci ) 144. [7] C. Mailhiot, C.B. Duke, Phys. Rev. B ) [8] W.E. Spicer, I. Lindau, P. Skeath, C.Y. Su, J. Vac. Sci. Technol ) 119. [9] H. Hasegawa, H. Ohno, J. Vac. Sci. Technol. B ) 113. [1] R.T. Tung, Phys. Rev. Lett ) 461. [11] S. Chang, L.J. Brillson, Y.J. Kime, D.S. Rioux, P.D. Kirchner, G.D. Pett, J.M. Woodall, Phys. Rev. Lett ) [12] M. Wtmer, J.L. Freeouf, Phys. Rev. Lett ) 271. [13] G. Le Lay, V. Yu, Aristov, K. Hricovini, A. Taleb- Ibrahimi, P. Dumas, R. Gunther, J. Osvald, G. Indlekofer, in: I. Ohdomari, et al. Eds.), Control of Semiconductor Interfaces, Elsevier, Amsterdam, 1994, p. 39. [14] J.F. Fan, H. Oigawa, Y. Nannichi, Jpn. J. Appl. Phys ) L2125. [15] S. Kurtin, T.C. McGill, C.A. Mead, Phys. Rev. Lett ) [16] L.M. Porter, R.F. Davis, J.S. Bow, M.J. Kim, R.W. Carpenter, R.C. Glass, J. Mater. Res ) 668. [17] S. Watanabe, M. Shigeno, N. Nakayama, T. Ito, Jpn. J. Appl. Phys ) [18] S. Hara, T. Teraji, H. Okushi, K. Kajimura, Appl. Surf. Sci ) 394. [19] L.M. Porter, R.F. Davis, Mater. Sci. Engng. B ) 83. [2] J.R. Waldrop, R.W. Grant, Y.C. Wang, R.F. Davis, J. Appl. Phys ) [21] R.F. Schmsdorf, T.U. Kampen, W. Monch, J. Vac. Sci. Technol. B ) [22] S.M. Sze, Physics of Semiconductor Devices, second ed., Wiley, New York, 1981, Chapter 5. [23] A.A. Saleh, V. Shutthanandan, R.J. Smh, Phys. Rev. B ) 498. [24] Y. Sugawara, N. Shibata, S. Hara, Y. Ikuhara, J. Mater. Res. 15 2) [25] W. Monch et al., in: I. Ohdomari Ed.), Control of Semiconductor Interfaces, Elsevier, Amsterdam, 1994, p [26] S.G. Louie, J.R. Chelikowsky, M.L. Cohen, J. Vac. Sci. Technol ) 79.

Characterization of the 6H-SiC 0001 surface and the interface with Ti layer with the Schottky limit

Characterization of the 6H-SiC 0001 surface and the interface with Ti layer with the Schottky limit Applied Surface Science 162 163 2000 19 24 www.elsevier.nlrlocaterapsusc ž / Characterization of the 6H-SiC 0001 surface and the interface with Ti layer with the Schottky limit Shiro Hara ) Electrotechnical

More information

Control of interface states at metal/6h-sic(0001) interfaces

Control of interface states at metal/6h-sic(0001) interfaces Control of interface states at metal/6h-sic(0001) interfaces Tokuyuki Teraji * and Shiro Hara National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Umezono, Tsukuba, Ibraki 305-8568,

More information

Bi-directional phase transition of Cu/6H SiC( ) system discovered by positron beam study

Bi-directional phase transition of Cu/6H SiC( ) system discovered by positron beam study Applied Surface Science 194 (2002) 278 282 Bi-directional phase transition of Cu/6H SiC(0 0 0 1) system discovered by positron beam study J.D. Zhang a,*, H.M. Weng b, Y.Y. Shan a, H.M. Ching a, C.D. Beling

More information

Summary of Schottky barrier height data on epitaxially grown n- and p-gaas

Summary of Schottky barrier height data on epitaxially grown n- and p-gaas Thin Solid Films 325 (1998) 181 186 Summary of Schottky barrier height data on epitaxially grown n- and p-gaas G. Myburg a, *, F.D. Auret a, W.E. Meyer a, C.W. Louw b, M.J. van Staden b a Department of

More information

Optimizing Graphene Morphology on SiC(0001)

Optimizing Graphene Morphology on SiC(0001) Optimizing Graphene Morphology on SiC(0001) James B. Hannon Rudolf M. Tromp Graphene sheets Graphene sheets can be formed into 0D,1D, 2D, and 3D structures Chemically inert Intrinsically high carrier mobility

More information

An interfacial investigation of high-dielectric constant material hafnium oxide on Si substrate B

An interfacial investigation of high-dielectric constant material hafnium oxide on Si substrate B Thin Solid Films 488 (2005) 167 172 www.elsevier.com/locate/tsf An interfacial investigation of high-dielectric constant material hafnium oxide on Si substrate B S.C. Chen a, T, J.C. Lou a, C.H. Chien

More information

Metal Semiconductor Contacts

Metal Semiconductor Contacts Metal Semiconductor Contacts The investigation of rectification in metal-semiconductor contacts was first described by Braun [33-35], who discovered in 1874 the asymmetric nature of electrical conduction

More information

Fermi Level Pinning at Electrical Metal Contacts. of Monolayer Molybdenum Dichalcogenides

Fermi Level Pinning at Electrical Metal Contacts. of Monolayer Molybdenum Dichalcogenides Supporting information Fermi Level Pinning at Electrical Metal Contacts of Monolayer Molybdenum Dichalcogenides Changsik Kim 1,, Inyong Moon 1,, Daeyeong Lee 1, Min Sup Choi 1, Faisal Ahmed 1,2, Seunggeol

More information

doi: /

doi: / doi: 10.1063/1.350497 Morphology of hydrofluoric acid and ammonium fluoride-treated silicon surfaces studied by surface infrared spectroscopy M. Niwano, Y. Takeda, Y. Ishibashi, K. Kurita, and N. Miyamoto

More information

dynamics simulation of cluster beam deposition (1 0 0) substrate

dynamics simulation of cluster beam deposition (1 0 0) substrate Nuclear Instruments and Methods in Physics esearch B 160 (2000) 372±376 www.elsevier.nl/locate/nimb Molecular dynamics simulation of cluster beam Al deposition on Si (1 0 0) substrate H. Zhang, Z.N. Xia

More information

Formation and decomposition of hydrogen-related electron traps at hydrogenated PdÕGaAs n-type Schottky interfaces

Formation and decomposition of hydrogen-related electron traps at hydrogenated PdÕGaAs n-type Schottky interfaces JOURNAL OF APPLIED PHYSICS VOLUME 87, NUMBER 9 1 MAY 2000 Formation and decomposition of hydrogen-related electron traps at hydrogenated PdÕGaAs n-type Schottky interfaces H.-Y. Nie a) Surface Science

More information

Structure analysis: Electron diffraction LEED TEM RHEED

Structure analysis: Electron diffraction LEED TEM RHEED Structure analysis: Electron diffraction LEED: Low Energy Electron Diffraction SPA-LEED: Spot Profile Analysis Low Energy Electron diffraction RHEED: Reflection High Energy Electron Diffraction TEM: Transmission

More information

Lecture 7: Extrinsic semiconductors - Fermi level

Lecture 7: Extrinsic semiconductors - Fermi level Lecture 7: Extrinsic semiconductors - Fermi level Contents 1 Dopant materials 1 2 E F in extrinsic semiconductors 5 3 Temperature dependence of carrier concentration 6 3.1 Low temperature regime (T < T

More information

Al/Ti/4H SiC Schottky barrier diodes with inhomogeneous barrier heights

Al/Ti/4H SiC Schottky barrier diodes with inhomogeneous barrier heights Al/Ti/4H SiC Schottky barrier diodes with inhomogeneous barrier heights Wang Yue-Hu( ), Zhang Yi-Men( ), Zhang Yu-Ming( ), Song Qing-Wen( ), and Jia Ren-Xu( ) School of Microelectronics and Key Laboratory

More information

Extreme band bending at MBE-grown InAs(0 0 1) surfaces induced by in situ sulphur passivation

Extreme band bending at MBE-grown InAs(0 0 1) surfaces induced by in situ sulphur passivation Journal of Crystal Growth 237 239 (2002) 196 200 Extreme band bending at MBE-grown InAs(0 0 1) surfaces induced by in situ sulphur passivation M.J. Lowe a, T.D. Veal a, C.F. McConville a, G.R. Bell b,

More information

Electronic structure of transition metal high-k dielectrics: interfacial band offset energies for microelectronic devices

Electronic structure of transition metal high-k dielectrics: interfacial band offset energies for microelectronic devices Applied Surface Science 212 213 (2003) 563 569 Electronic structure of transition metal high-k dielectrics: interfacial band offset energies for microelectronic devices Gerald Lucovsky *, Gilbert B. Rayner

More information

Direct and Indirect Semiconductor

Direct and Indirect Semiconductor Direct and Indirect Semiconductor Allowed values of energy can be plotted vs. the propagation constant, k. Since the periodicity of most lattices is different in various direction, the E-k diagram must

More information

Figure 3.1 (p. 141) Figure 3.2 (p. 142)

Figure 3.1 (p. 141) Figure 3.2 (p. 142) Figure 3.1 (p. 141) Allowed electronic-energy-state systems for two isolated materials. States marked with an X are filled; those unmarked are empty. System 1 is a qualitative representation of a metal;

More information

Atomic Level Analysis of SiC Devices Using Numerical Simulation

Atomic Level Analysis of SiC Devices Using Numerical Simulation Atomic Level Analysis of Devices Using Numerical mulation HIRSE, Takayuki MRI, Daisuke TERA, Yutaka ABSTRAT Research and development of power semiconductor devices with (silicon carbide) has been very

More information

Photon Energy Dependence of Contrast in Photoelectron Emission Microscopy of Si Devices

Photon Energy Dependence of Contrast in Photoelectron Emission Microscopy of Si Devices Photon Energy Dependence of Contrast in Photoelectron Emission Microscopy of Si Devices V. W. Ballarotto, K. Siegrist, R. J. Phaneuf, and E. D. Williams University of Maryland and Laboratory for Physical

More information

Crystal Properties. MS415 Lec. 2. High performance, high current. ZnO. GaN

Crystal Properties. MS415 Lec. 2. High performance, high current. ZnO. GaN Crystal Properties Crystal Lattices: Periodic arrangement of atoms Repeated unit cells (solid-state) Stuffing atoms into unit cells Determine mechanical & electrical properties High performance, high current

More information

LOW-TEMPERATURE Si (111) HOMOEPITAXY AND DOPING MEDIATED BY A MONOLAYER OF Pb

LOW-TEMPERATURE Si (111) HOMOEPITAXY AND DOPING MEDIATED BY A MONOLAYER OF Pb LOW-TEMPERATURE Si (111) HOMOEPITAXY AND DOPING MEDIATED BY A MONOLAYER OF Pb O.D. DUBON, P.G. EVANS, J.F. CHERVINSKY, F. SPAEPEN, M.J. AZIZ, and J.A. GOLOVCHENKO Division of Engineering and Applied Sciences,

More information

Energy Spectroscopy. Ex.: Fe/MgO

Energy Spectroscopy. Ex.: Fe/MgO Energy Spectroscopy Spectroscopy gives access to the electronic properties (and thus chemistry, magnetism,..) of the investigated system with thickness dependence Ex.: Fe/MgO Fe O Mg Control of the oxidation

More information

DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD

DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD Chapter 4 DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD 4.1 INTRODUCTION Sputter deposition process is another old technique being used in modern semiconductor industries. Sputtering

More information

Solid Surfaces, Interfaces and Thin Films

Solid Surfaces, Interfaces and Thin Films Hans Lüth Solid Surfaces, Interfaces and Thin Films Fifth Edition With 427 Figures.2e Springer Contents 1 Surface and Interface Physics: Its Definition and Importance... 1 Panel I: Ultrahigh Vacuum (UHV)

More information

Review of Semiconductor Fundamentals

Review of Semiconductor Fundamentals ECE 541/ME 541 Microelectronic Fabrication Techniques Review of Semiconductor Fundamentals Zheng Yang (ERF 3017, email: yangzhen@uic.edu) Page 1 Semiconductor A semiconductor is an almost insulating material,

More information

3.1 Introduction to Semiconductors. Y. Baghzouz ECE Department UNLV

3.1 Introduction to Semiconductors. Y. Baghzouz ECE Department UNLV 3.1 Introduction to Semiconductors Y. Baghzouz ECE Department UNLV Introduction In this lecture, we will cover the basic aspects of semiconductor materials, and the physical mechanisms which are at the

More information

* motif: a single or repeated design or color

* motif: a single or repeated design or color Chapter 2. Structure A. Electronic structure vs. Geometric structure B. Clean surface vs. Adsorbate covered surface (substrate + overlayer) C. Adsorbate structure - how are the adsorbed molecules bound

More information

Sponsored by. Contract No. N K-0073: Modification P00006 DARPA Order 5674 NR

Sponsored by. Contract No. N K-0073: Modification P00006 DARPA Order 5674 NR OTIC FILE COP Study of Interfacial Chemistry between Metals and Their Effects on Electronic Systems q. o Sponsored by 00 Defense Advanced Research Projects Agency (DOD) and The Office of Naval Research

More information

Raman Spectroscopic Studies of ZnSe/GaAs Interfaces

Raman Spectroscopic Studies of ZnSe/GaAs Interfaces Egypt. J. Solids, Vol. (30), No. (1), (2007) 121 Raman Spectroscopic Studies of ZnSe/GaAs Interfaces T. A. El-Brolossy Physics Department, Faculty of Science, Ain Shams University, Cairo, Egypt ZnSe/semi-insulating

More information

Evidence of a Surface Acceptor State in Undoped Semi-Insulating GaAs by Photothermal Radiometric Deep Level Transient Spectroscopy

Evidence of a Surface Acceptor State in Undoped Semi-Insulating GaAs by Photothermal Radiometric Deep Level Transient Spectroscopy Evidence of a Surface Acceptor State in Undoped Semi-Insulating GaAs by Photothermal Radiometric Deep Level Transient Spectroscopy Andreas Mandelis** and R. Arief Budiman Photothermal and Optoelectronic

More information

Avalanche breakdown. Impact ionization causes an avalanche of current. Occurs at low doping

Avalanche breakdown. Impact ionization causes an avalanche of current. Occurs at low doping Avalanche breakdown Impact ionization causes an avalanche of current Occurs at low doping Zener tunneling Electrons tunnel from valence band to conduction band Occurs at high doping Tunneling wave decays

More information

3. Two-dimensional systems

3. Two-dimensional systems 3. Two-dimensional systems Image from IBM-Almaden 1 Introduction Type I: natural layered structures, e.g., graphite (with C nanostructures) Type II: artificial structures, heterojunctions Great technological

More information

Improved Interfacial and Electrical Properties of GaSb Metal Oxide

Improved Interfacial and Electrical Properties of GaSb Metal Oxide Improved Interfacial and Electrical Properties of GaSb Metal Oxide Semiconductor Devices Passivated with Acidic (NH 4 ) 2 S Solution Lianfeng Zhao, Zhen Tan, Jing Wang, and Jun Xu * Tsinghua National Laboratory

More information

Generation±recombination noise studied in hydrogenated amorphous silicon

Generation±recombination noise studied in hydrogenated amorphous silicon Journal of Non-Crystalline Solids 266±269 (2000) 232±236 www.elsevier.com/locate/jnoncrysol Generation±recombination noise studied in hydrogenated amorphous silicon P.A.W.E. Verleg, Jaap I. Dijkhuis *

More information

Electrical measurements of voltage stressed Al 2 O 3 /GaAs MOSFET

Electrical measurements of voltage stressed Al 2 O 3 /GaAs MOSFET Microelectronics Reliability xxx (2007) xxx xxx www.elsevier.com/locate/microrel Electrical measurements of voltage stressed Al 2 O 3 /GaAs MOSFET Z. Tang a, P.D. Ye b, D. Lee a, C.R. Wie a, * a Department

More information

Effects of plasma treatment on the precipitation of fluorine-doped silicon oxide

Effects of plasma treatment on the precipitation of fluorine-doped silicon oxide ARTICLE IN PRESS Journal of Physics and Chemistry of Solids 69 (2008) 555 560 www.elsevier.com/locate/jpcs Effects of plasma treatment on the precipitation of fluorine-doped silicon oxide Jun Wu a,, Ying-Lang

More information

Nanometer-Scale Investigation of Metal-SiC Interfaces using Ballistic Electron Emission Microscopy

Nanometer-Scale Investigation of Metal-SiC Interfaces using Ballistic Electron Emission Microscopy Nanometer-Scale Investigation of Metal-SiC Interfaces using Ballistic Electron Emission Microscopy H.-J. Im, 1 B. Kaczer, 1 J. P. Pelz, 1 S. Limpijumnong, 2 W. R. L. Lambrecht, 2 and W. J. Choyke 3 1 Department

More information

Oxidation of hydrogenated crystalline silicon as an alternative approach for ultrathin SiO 2 growth

Oxidation of hydrogenated crystalline silicon as an alternative approach for ultrathin SiO 2 growth Institute of Physics Publishing Journal of Physics: Conference Series 10 (2005) 246 250 doi:10.1088/1742-6596/10/1/061 Second Conference on Microelectronics, Microsystems and Nanotechnology Oxidation of

More information

Fabrication and Characteristics Study Ni-nSiC Schottky Photodiode Detector

Fabrication and Characteristics Study Ni-nSiC Schottky Photodiode Detector Fabrication and Characteristics Study Ni-nSiC Schottky Photodiode Detector Muhanad A. Ahamed Department of Electrical, Institution of Technology, Baghdad-Iraq. Abstract In the present work, schottky photodiode

More information

A semiconductor is an almost insulating material, in which by contamination (doping) positive or negative charge carriers can be introduced.

A semiconductor is an almost insulating material, in which by contamination (doping) positive or negative charge carriers can be introduced. Semiconductor A semiconductor is an almost insulating material, in which by contamination (doping) positive or negative charge carriers can be introduced. Page 2 Semiconductor materials Page 3 Energy levels

More information

Stopping power for MeV 12 C ions in solids

Stopping power for MeV 12 C ions in solids Nuclear Instruments and Methods in Physics Research B 35 (998) 69±74 Stopping power for MeV C ions in solids Zheng Tao, Lu Xiting *, Zhai Yongjun, Xia Zonghuang, Shen Dingyu, Wang Xuemei, Zhao Qiang Department

More information

M.J. CONDENSED MATTER VOLUME 4, NUMBER 1 1 DECEMBER 2001

M.J. CONDENSED MATTER VOLUME 4, NUMBER 1 1 DECEMBER 2001 M.J. CONDENSED MATTER VOLUME 4, NUMBER 1 1 DECEMBER 21 Au/n-Si(1) contact homogeneity studied by direct and reverse ballistic electron emission microscopy and spectroscopy A. Chahboun and I. Zorkani L.

More information

Transport gap of organic semiconductors in organic modified Schottky contacts

Transport gap of organic semiconductors in organic modified Schottky contacts Applied Surface Science 212 213 (2003) 423 427 Transport gap of organic semiconductors in organic modified Schottky contacts Dietrich R.T. Zahn *, Thorsten U. Kampen, Henry Méndez Institut für Physik,

More information

ELECTRON CURRENT IMAGE DIFFRACTION FROM CRYSTAL SURFACES AT LOW ENERGIES

ELECTRON CURRENT IMAGE DIFFRACTION FROM CRYSTAL SURFACES AT LOW ENERGIES C. BRENT BARGERON, A. NORMAN JETTE, and BERRY H. NALL ELECTRON CURRENT IMAGE DIFFRACTION FROM CRYSTAL SURFACES AT LOW ENERGIES Low-energy electron diffraction patterns in current images of crystal surfaces

More information

Nanoelectronics 09. Atsufumi Hirohata Department of Electronics. Quick Review over the Last Lecture

Nanoelectronics 09. Atsufumi Hirohata Department of Electronics. Quick Review over the Last Lecture Nanoelectronics 09 Atsufumi Hirohata Department of Electronics 13:00 Monday, 12/February/2018 (P/T 006) Quick Review over the Last Lecture ( Field effect transistor (FET) ): ( Drain ) current increases

More information

Temperature Dependent Current-voltage Characteristics of P- type Crystalline Silicon Solar Cells Fabricated Using Screenprinting

Temperature Dependent Current-voltage Characteristics of P- type Crystalline Silicon Solar Cells Fabricated Using Screenprinting Temperature Dependent Current-voltage Characteristics of P- type Crystalline Silicon Solar Cells Fabricated Using Screenprinting Process Hyun-Jin Song, Won-Ki Lee, Chel-Jong Choi* School of Semiconductor

More information

MS482 Materials Characterization ( 재료분석 ) Lecture Note 5: RBS

MS482 Materials Characterization ( 재료분석 ) Lecture Note 5: RBS 2016 Fall Semester MS482 Materials Characterization ( 재료분석 ) Lecture Note 5: RBS Byungha Shin Dept. of MSE, KAIST 1 Course Information Syllabus 1. Overview of various characterization techniques (1 lecture)

More information

2D MBE Activities in Sheffield. I. Farrer, J. Heffernan Electronic and Electrical Engineering The University of Sheffield

2D MBE Activities in Sheffield. I. Farrer, J. Heffernan Electronic and Electrical Engineering The University of Sheffield 2D MBE Activities in Sheffield I. Farrer, J. Heffernan Electronic and Electrical Engineering The University of Sheffield Outline Motivation Van der Waals crystals The Transition Metal Di-Chalcogenides

More information

Electronic properties of ideal and interface-modified metal-semiconductor interfaces

Electronic properties of ideal and interface-modified metal-semiconductor interfaces Electronic properties of ideal and interface-modified metal-semiconductor interfaces Winfried Mönch a) Laboratorium für Festkörperphysik, Gerhard-Mercator-Universität Duisburg, D-47048 Duisburg, Germany

More information

Measurement of material uniformity using 3-D position sensitive CdZnTe gamma-ray spectrometers

Measurement of material uniformity using 3-D position sensitive CdZnTe gamma-ray spectrometers Nuclear Instruments and Methods in Physics Research A 441 (2000) 459}467 Measurement of material uniformity using 3-D position sensitive CdZnTe gamma-ray spectrometers Z. He *, W.Li, G.F. Knoll, D.K. Wehe,

More information

M. S. University of Baroda, Vadodara , Gujarat, India. University of Jammu, Jammu , Jammu and Kashmir, India

M. S. University of Baroda, Vadodara , Gujarat, India. University of Jammu, Jammu , Jammu and Kashmir, India J. Nano- Electron. Phys. 3 (2011) No1, P. 995-1004 2011 SumDU (Sumy State University) PACS numbers: 73.30. + y, 85.30.De BARRIER INHOMOGENEITIES OF Al/p-In 2 Te 3 THIN FILM SCHOTTKY DIODES R.R. Desai 1,

More information

Influence of Size on the Properties of Materials

Influence of Size on the Properties of Materials Influence of Size on the Properties of Materials M. J. O Shea Kansas State University mjoshea@phys.ksu.edu If you cannot get the papers connected to this work, please e-mail me for a copy 1. General Introduction

More information

Electrostatic charging e ects in fast H interactions with thin Ar

Electrostatic charging e ects in fast H interactions with thin Ar Nuclear Instruments and Methods in Physics Research B 157 (1999) 116±120 www.elsevier.nl/locate/nimb Electrostatic charging e ects in fast H interactions with thin Ar lms D.E. Grosjean a, R.A. Baragiola

More information

An energy relaxation time model for device simulation

An energy relaxation time model for device simulation Solid-State Electronics 43 (1999) 1791±1795 An energy relaxation time model for device simulation B. Gonzalez a, *, V. Palankovski b, H. Kosina b, A. Hernandez a, S. Selberherr b a University Institute

More information

Surface-plasmon-assisted secondary-electron emission from an atomically at LiF(001) surface

Surface-plasmon-assisted secondary-electron emission from an atomically at LiF(001) surface Nuclear Instruments and Methods in Physics Research B 164±165 (2000) 933±937 www.elsevier.nl/locate/nimb Surface-plasmon-assisted secondary-electron emission from an atomically at LiF(001) surface Kenji

More information

Direct observation of a Ga adlayer on a GaN(0001) surface by LEED Patterson inversion. Xu, SH; Wu, H; Dai, XQ; Lau, WP; Zheng, LX; Xie, MH; Tong, SY

Direct observation of a Ga adlayer on a GaN(0001) surface by LEED Patterson inversion. Xu, SH; Wu, H; Dai, XQ; Lau, WP; Zheng, LX; Xie, MH; Tong, SY Title Direct observation of a Ga adlayer on a GaN(0001) surface by LEED Patterson inversion Author(s) Xu, SH; Wu, H; Dai, XQ; Lau, WP; Zheng, LX; Xie, MH; Tong, SY Citation Physical Review B - Condensed

More information

The effectiveness of HCl and HF cleaning of Si 0.85 Ge 0.15 surface. Stanford Synchrotron Radiation Lab, Menlo Park, CA 94025

The effectiveness of HCl and HF cleaning of Si 0.85 Ge 0.15 surface. Stanford Synchrotron Radiation Lab, Menlo Park, CA 94025 July 2008 SLAC-PUB-13302 The effectiveness of HCl and HF cleaning of Si 0.85 Ge 0.15 surface Yun Sun, a) Zhi Liu, Shiyu Sun, Piero Pianetta Stanford Synchrotron Radiation Lab, Menlo Park, CA 94025 The

More information

Dipole formation at metal/ptcda interfaces: Role of the Charge Neutrality Level

Dipole formation at metal/ptcda interfaces: Role of the Charge Neutrality Level EUROPHYSICS LETTERS 15 March 2004 Europhys. Lett., 65 (6), pp. 802 808 (2004) DOI: 10.1209/epl/i2003-10131-2 Dipole formation at metal/ptcda interfaces: Role of the Charge Neutrality Level H. Vázquez 1,

More information

A New Method of Scanning Tunneling Spectroscopy for Study of the Energy Structure of Semiconductors and Free Electron Gas in Metals

A New Method of Scanning Tunneling Spectroscopy for Study of the Energy Structure of Semiconductors and Free Electron Gas in Metals SCANNING Vol. 19, 59 5 (1997) Received April 1, 1997 FAMS, Inc. Accepted May, 1997 A New Method of Scanning Tunneling Spectroscopy for Study of the Energy Structure of Semiconductors and Free Electron

More information

EE495/695 Introduction to Semiconductors I. Y. Baghzouz ECE Department UNLV

EE495/695 Introduction to Semiconductors I. Y. Baghzouz ECE Department UNLV EE495/695 Introduction to Semiconductors I Y. Baghzouz ECE Department UNLV Introduction Solar cells have always been aligned closely with other electronic devices. We will cover the basic aspects of semiconductor

More information

Boron-based semiconductor solids as thermal neutron detectors

Boron-based semiconductor solids as thermal neutron detectors Boron-based semiconductor solids as thermal neutron detectors Douglas S. McGregor 1 and Stan M. Vernon 2 1 S.M.A.R.T. Laboratory, Department of Nuclear Engineering and Radiological Sciences, University

More information

Defects in Semiconductors

Defects in Semiconductors Defects in Semiconductors Mater. Res. Soc. Symp. Proc. Vol. 1370 2011 Materials Research Society DOI: 10.1557/opl.2011. 771 Electronic Structure of O-vacancy in High-k Dielectrics and Oxide Semiconductors

More information

Semiconductor Physics Problems 2015

Semiconductor Physics Problems 2015 Semiconductor Physics Problems 2015 Page and figure numbers refer to Semiconductor Devices Physics and Technology, 3rd edition, by SM Sze and M-K Lee 1. The purest semiconductor crystals it is possible

More information

Nanocrystalline Si formation inside SiN x nanostructures usingionized N 2 gas bombardment

Nanocrystalline Si formation inside SiN x nanostructures usingionized N 2 gas bombardment 연구논문 한국진공학회지제 16 권 6 호, 2007 년 11 월, pp.474~478 Nanocrystalline Si formation inside SiN x nanostructures usingionized N 2 gas bombardment Min-Cherl Jung 1, Young Ju Park 2, Hyun-Joon Shin 1, Jun Seok Byun

More information

PHYSICAL ELECTRONICS(ECE3540) CHAPTER 9 METAL SEMICONDUCTOR AND SEMICONDUCTOR HETERO-JUNCTIONS

PHYSICAL ELECTRONICS(ECE3540) CHAPTER 9 METAL SEMICONDUCTOR AND SEMICONDUCTOR HETERO-JUNCTIONS PHYSICAL ELECTRONICS(ECE3540) CHAPTER 9 METAL SEMICONDUCTOR AND SEMICONDUCTOR HETERO-JUNCTIONS Tennessee Technological University Wednesday, October 30, 013 1 Introduction Chapter 4: we considered the

More information

A THERMODYNAMIC MODEL FOR THE STACKING- FAULT ENERGY

A THERMODYNAMIC MODEL FOR THE STACKING- FAULT ENERGY Acta mater. Vol. 46, No. 13, pp. 4479±4484, 1998 # 1998 Acta Metallurgica Inc. Published by Elsevier Science Ltd. All rights reserved Printed in Great Britain PII: S1359-6454(98)00155-4 1359-6454/98 $19.00

More information

Currently, worldwide major semiconductor alloy epitaxial growth is divided into two material groups.

Currently, worldwide major semiconductor alloy epitaxial growth is divided into two material groups. ICQNM 2014 Currently, worldwide major semiconductor alloy epitaxial growth is divided into two material groups. Cubic: Diamond structures: group IV semiconductors (Si, Ge, C), Cubic zinc-blende structures:

More information

The effect of subsurface hydrogen on the adsorption of ethylene on Pd(1 1 1)

The effect of subsurface hydrogen on the adsorption of ethylene on Pd(1 1 1) Surface Science 540 (2003) L600 L604 Surface Science Letters The effect of subsurface hydrogen on the adsorption of ethylene on Pd(1 1 1) D. Stacchiola, W.T. Tysoe * Department of Chemistry and Laboratory

More information

Lecture 15: Optoelectronic devices: Introduction

Lecture 15: Optoelectronic devices: Introduction Lecture 15: Optoelectronic devices: Introduction Contents 1 Optical absorption 1 1.1 Absorption coefficient....................... 2 2 Optical recombination 5 3 Recombination and carrier lifetime 6 3.1

More information

desorption (ESD) of the O,/Si( 111) surface K. Sakamoto *, K. Nakatsuji, H. Daimon, T. Yonezawa, S. Suga

desorption (ESD) of the O,/Si( 111) surface K. Sakamoto *, K. Nakatsuji, H. Daimon, T. Yonezawa, S. Suga -!!!I c%sj ELSEVIER Surface Science 306 (1994) 93-98.:.:.j:::~:::~~~::::::~:~::~~:~~,:~.~...,.. ~. :...:E.:.:: :.:.::::::~.:.:.:.:.:.:.,:.:,:,:. ~.~:+::.:.::::::j:::~::::.:...( ~ :.:.::.:.:.:,:..:,: :,,...

More information

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. Fall Exam 1

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. Fall Exam 1 UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences EECS 143 Fall 2008 Exam 1 Professor Ali Javey Answer Key Name: SID: 1337 Closed book. One sheet

More information

Semiconductor Physics fall 2012 problems

Semiconductor Physics fall 2012 problems Semiconductor Physics fall 2012 problems 1. An n-type sample of silicon has a uniform density N D = 10 16 atoms cm -3 of arsenic, and a p-type silicon sample has N A = 10 15 atoms cm -3 of boron. For each

More information

Metal Organic interfaces

Metal Organic interfaces ORGANIC ELECTRONICS Principles, devices and applications Metal Organic interfaces D. Natali Milano, 23-27 Novembre 2015 Outline general concepts energetics Interfaces: tailoring injection mechanisms Thermal

More information

Lecture 9: Metal-semiconductor junctions

Lecture 9: Metal-semiconductor junctions Lecture 9: Metal-semiconductor junctions Contents 1 Introduction 1 2 Metal-metal junction 1 2.1 Thermocouples.......................... 2 3 Schottky junctions 4 3.1 Forward bias............................

More information

Investigation of the bonding strength and interface current of p-siõn-gaas wafers bonded by surface activated bonding at room temperature

Investigation of the bonding strength and interface current of p-siõn-gaas wafers bonded by surface activated bonding at room temperature Investigation of the bonding strength and interface current of p-siõn-gaas wafers bonded by surface activated bonding at room temperature M. M. R. Howlader, a) T. Watanabe, and T. Suga Research Center

More information

(a) (b) Supplementary Figure 1. (a) (b) (a) Supplementary Figure 2. (a) (b) (c) (d) (e)

(a) (b) Supplementary Figure 1. (a) (b) (a) Supplementary Figure 2. (a) (b) (c) (d) (e) (a) (b) Supplementary Figure 1. (a) An AFM image of the device after the formation of the contact electrodes and the top gate dielectric Al 2 O 3. (b) A line scan performed along the white dashed line

More information

Supplementary Information

Supplementary Information Supplementary Information Supplementary Figure 1. fabrication. A schematic of the experimental setup used for graphene Supplementary Figure 2. Emission spectrum of the plasma: Negative peaks indicate an

More information

Wet-chemical passivation of Si(111)- and Si(100)-substrates

Wet-chemical passivation of Si(111)- and Si(100)-substrates Materials Science and Engineering B73 (2000) 178 183 www.elsevier.com/locate/mseb Wet-chemical passivation of Si(111)- and Si(100)-substrates H. Angermann a, *, W. Henrion a,a.röseler b, M. Rebien a a

More information

Carrier Transport Mechanisms of a-gaas/ n-si Heterojunctions

Carrier Transport Mechanisms of a-gaas/ n-si Heterojunctions Egypt. J. Sol., Vol. (24), No. (2), (2001) 245 Carrier Transport Mechanisms of a-gaas/ n-si Heterojunctions N.I.Aly, A.A.Akl, A.A.Ibrahim, and A.S.Riad Department of Physics, Faculty of Science, Minia

More information

Observation of Bulk Defects by Scanning Tunneling Microscopy and Spectroscopy: Arsenic Antisite Defects in GaAs

Observation of Bulk Defects by Scanning Tunneling Microscopy and Spectroscopy: Arsenic Antisite Defects in GaAs VOLUME 71, NUMBER 8 PH YSICAL REVI EW LETTERS 23 AUGUST 1993 Observation of Bulk Defects by Scanning Tunneling Microscopy and Spectroscopy: Arsenic Antisite Defects in GaAs R. M. Feenstra, J. M. Woodall,

More information

Surfaces, Interfaces, and Layered Devices

Surfaces, Interfaces, and Layered Devices Surfaces, Interfaces, and Layered Devices Building blocks for nanodevices! W. Pauli: God made solids, but surfaces were the work of Devil. Surfaces and Interfaces 1 Interface between a crystal and vacuum

More information

Characteristics and parameter extraction for NiGe/n-type Ge Schottky diode with variable annealing temperatures

Characteristics and parameter extraction for NiGe/n-type Ge Schottky diode with variable annealing temperatures 034 Chin. Phys. B Vol. 19, No. 5 2010) 057303 Characteristics and parameter extraction for NiGe/n-type Ge Schottky diode with variable annealing temperatures Liu Hong-Xia ), Wu Xiao-Feng ), Hu Shi-Gang

More information

Module-6: Schottky barrier capacitance-impurity concentration

Module-6: Schottky barrier capacitance-impurity concentration 6.1 Introduction: Module-6: Schottky barrier capacitance-impurity concentration The electric current flowing across a metal semiconductor interface is generally non-linear with respect to the applied bias

More information

8 Summary and outlook

8 Summary and outlook 91 8 Summary and outlook The main task of present work was to investigate the growth, the atomic and the electronic structures of Co oxide as well as Mn oxide films on Ag(001) by means of STM/STS at LT

More information

MENA9510 characterization course: Capacitance-voltage (CV) measurements

MENA9510 characterization course: Capacitance-voltage (CV) measurements MENA9510 characterization course: Capacitance-voltage (CV) measurements 30.10.2017 Halvard Haug Outline Overview of interesting sample structures Ohmic and schottky contacts Why C-V for solar cells? The

More information

1 Name: Student number: DEPARTMENT OF PHYSICS AND PHYSICAL OCEANOGRAPHY MEMORIAL UNIVERSITY OF NEWFOUNDLAND. Fall :00-11:00

1 Name: Student number: DEPARTMENT OF PHYSICS AND PHYSICAL OCEANOGRAPHY MEMORIAL UNIVERSITY OF NEWFOUNDLAND. Fall :00-11:00 1 Name: DEPARTMENT OF PHYSICS AND PHYSICAL OCEANOGRAPHY MEMORIAL UNIVERSITY OF NEWFOUNDLAND Final Exam Physics 3000 December 11, 2012 Fall 2012 9:00-11:00 INSTRUCTIONS: 1. Answer all seven (7) questions.

More information

Solid State Device Fundamentals

Solid State Device Fundamentals Solid State Device Fundamentals ENS 345 Lecture Course by Alexander M. Zaitsev alexander.zaitsev@csi.cuny.edu Tel: 718 982 2812 Office 4N101b 1 Outline - Goals of the course. What is electronic device?

More information

Lecture 1. OUTLINE Basic Semiconductor Physics. Reading: Chapter 2.1. Semiconductors Intrinsic (undoped) silicon Doping Carrier concentrations

Lecture 1. OUTLINE Basic Semiconductor Physics. Reading: Chapter 2.1. Semiconductors Intrinsic (undoped) silicon Doping Carrier concentrations Lecture 1 OUTLINE Basic Semiconductor Physics Semiconductors Intrinsic (undoped) silicon Doping Carrier concentrations Reading: Chapter 2.1 EE105 Fall 2007 Lecture 1, Slide 1 What is a Semiconductor? Low

More information

The relentless march of the MOSFET gate oxide thickness to zero

The relentless march of the MOSFET gate oxide thickness to zero Microelectronics Reliability 40 (2000) 557±562 www.elsevier.com/locate/microrel The relentless march of the MOSFET gate oxide thickness to zero G. Timp a, *, J. Bude a, F. Baumann a, K.K. Bourdelle a,

More information

Surface and Electronic Structure Study of Substrate-dependent Pyrite Thin Films

Surface and Electronic Structure Study of Substrate-dependent Pyrite Thin Films Surface and Electronic Structure Study of Substrate-dependent Pyrite Thin Films Talk Outline Stoichiometry and sodium study of pyrite thin films: Quick Review Surface structure of pyrite thin films Electronic

More information

Electrons, Holes, and Defect ionization

Electrons, Holes, and Defect ionization Electrons, Holes, and Defect ionization The process of forming intrinsic electron-hole pairs is excitation a cross the band gap ( formation energy ). intrinsic electronic reaction : null e + h When electrons

More information

Two-dimensional structure of the detached recombining helium plasma associated with molecular activated recombination

Two-dimensional structure of the detached recombining helium plasma associated with molecular activated recombination Journal of Nuclear Materials 266±269 (1999) 1161±1166 Two-dimensional structure of the detached recombining helium plasma associated with molecular activated recombination D. Nishijima a, *, N. Ezumi a,

More information

Structure and electrical conductance of Pb-covered Si 111 surfaces

Structure and electrical conductance of Pb-covered Si 111 surfaces PHYSICAL REVIEW B VOLUME 60, NUMBER 8 15 AUGUST 1999-II Structure and electrical conductance of Pb-covered Si 111 surfaces Xiao Tong* and Kotaro Horikoshi Department of Physics, School of Science, University

More information

Removal of Cu Impurities on a Si Substrate by Using (H 2 O 2 +HF) and (UV/O 3 +HF)

Removal of Cu Impurities on a Si Substrate by Using (H 2 O 2 +HF) and (UV/O 3 +HF) Journal of the Korean Physical Society, Vol. 33, No. 5, November 1998, pp. 579 583 Removal of Cu Impurities on a Si Substrate by Using (H 2 O 2 +HF) and (UV/O 3 +HF) Baikil Choi and Hyeongtag Jeon School

More information

Temperature dependence of spin diffusion length in silicon by Hanle-type spin. precession

Temperature dependence of spin diffusion length in silicon by Hanle-type spin. precession Temperature dependence of spin diffusion length in silicon by Hanle-type spin precession T. Sasaki 1,a), T. Oikawa 1, T. Suzuki 2, M. Shiraishi 3, Y. Suzuki 3, and K. Noguchi 1 SQ Research Center, TDK

More information

Semi-insulating SiC substrates for high frequency devices

Semi-insulating SiC substrates for high frequency devices Klausurtagung Silberbach, 19. - 21. Feb. 2002 Institut für Werkstoffwissenschaften - WW 6 Semi-insulating SiC substrates for high frequency devices Vortrag von Matthias Bickermann Semi-insulating SiC substrates

More information

SUPPLEMENTARY INFORMATION

SUPPLEMENTARY INFORMATION Hihly efficient ate-tunable photocurrent eneration in vertical heterostructures of layered materials Woo Jon Yu, Yuan Liu, Hailon Zhou, Anxian Yin, Zhen Li, Yu Huan, and Xianfen Duan. Schematic illustration

More information

Supplementary information for Tunneling Spectroscopy of Graphene-Boron Nitride Heterostructures

Supplementary information for Tunneling Spectroscopy of Graphene-Boron Nitride Heterostructures Supplementary information for Tunneling Spectroscopy of Graphene-Boron Nitride Heterostructures F. Amet, 1 J. R. Williams, 2 A. G. F. Garcia, 2 M. Yankowitz, 2 K.Watanabe, 3 T.Taniguchi, 3 and D. Goldhaber-Gordon

More information

Fabrication of a 600V/20A 4H-SiC Schottky Barrier Diode

Fabrication of a 600V/20A 4H-SiC Schottky Barrier Diode Fabrication of a 600V/20A 4H-SiC Schottky Barrier Diode In-Ho Kang, Sang-Cheol Kim, Jung-Hyeon Moon, Wook Bahng, and Nam-Kyun Kim Power Ssemiconductor Research Center, Korea Electrotechnology Research

More information