NEW PROUCT Features Low On-Resistance: R S(ON) Low Gate Threshold Voltage Low Input Capacitance Fast Switching Speed Low Input/Output Leakage Complementary Pair lso vailable in Lead Free Version Mechanical ata Case: SOT-, Molded Plastic Case material - UL Flammability Rating Classification 9V- Moisture sensitivity: Level per J-ST- Terminals: Solderable per MIL-ST-, Method 8 lso vailable in Lead Free Plating (Matte Tin Finish). Please see Ordering Information, Note, on Page Terminal Connections: See iagram Pb-Free package is available Weight:.8 grams (approx.) LBSS8WTG SC-88/SOT- TOP VIEW G S Q Q S G Maximum Ratings - Total evice @ T = C unless otherwise specified Characteristic Symbol Value Units Power issipation (Note ) P d mw Thermal Resistance, Junction to mbient R J C/W Operating and Storage Temperature Range T j,t STG - to + C Maximum Ratings N-CHNNEL - Q, N7 Section @ T = C unless otherwise specified Characteristic Symbol Value Units rain-source Voltage V SS V rain-gate Voltage R GS.M V GR V Gate-Source Voltage rain Current (Note ) Continuous Pulsed Continuous Continuous @ C Pulsed V GSS ± ± I 7 8 V m Maximum Ratings P-CHNNEL - Q, BSS8 Section @ T = C unless otherwise specified Characteristic Symbol Value Units rain-source Voltage V SS - V rain-gate Voltage R GS K V GR - V Gate-Source Voltage Continuous V GSS V rain Current (Note ) Continuous I - m Note:. evice mounted on FR- PCB, inch x.8 inch x. inch; pad layout as shown on iodes Inc. suggested pad layout document P, which can be found on our website at http://www.diodes.com/datasheets/ap.pdf. /
LBSS8WTG Electrical Characteristics N-CHNNEL - Q, N7 Section @ T = C unless otherwise specified OFF CHRCTERISTICS (Note ) Characteristic Symbol Min Typ Max Unit Test Condition rain-source Breakdown Voltage BV SS 7 V V GS = V, I = Zero Gate Voltage rain Current @ T C = C @ T C = C I SS. µ VS = V, V GS = V Gate-Body Leakage I GSS ± n V GS = ±V, V S = V ON CHRCTERISTICS (Note ) Gate Threshold Voltage V GS(th).. V V S = V GS, I =- Static rain-source On-Resistance @ T j = C @ T j = C R S (ON).. 7.. V GS =.V, I =. V GS = V, I =. On-State rain Current I (ON).. V GS = V, V S = 7.V Forward Transconductance g FS 8 ms V S =V, I =. YNMIC CHRCTERISTICS Input Capacitance C iss pf Output Capacitance C oss pf Reverse Transfer Capacitance C rss.. pf SWITCHING CHRCTERISTICS V S = V, V GS = V f =.MHz Turn-On elay Time t (ON) 7. ns V = V, I =., R L =, V GEN = V, Turn-Off elay Time t (OFF) ns R GEN = Electrical Characteristics P-CHNNEL - Q, BSS8 Section @ T = C unless otherwise specified OFF CHRCTERISTICS (Note ) Characteristic Symbol Min Typ Max Unit Test Condition rain-source Breakdown Voltage BV SS - V V GS = V, I = -µ Zero Gate Voltage rain Current I SS - - - µ µ n V S = -V, V GS = V, T J = C V S = -V, V GS = V, T J = C V S = -V, V GS = V, T J = C Gate-Body Leakage I GSS n V GS = V, V S = V ON CHRCTERISTICS (Note ) Gate Threshold Voltage V GS(th) -.8 -. V V S =V GS, I = -m Static rain-source On-Resistance R S (ON) V GS = -V, I =. Forward Transconductance g FS. S V S = -V, I =. YNMIC CHRCTERISTICS Input Capacitance C iss pf Output Capacitance C oss pf Reverse Transfer Capacitance C rss pf SWITCHING CHRCTERISTICS V S = -V, V GS = V f =.MHz Turn-On elay Time t (ON) ns V = -V, I = -.7, Turn-Off elay Time t (OFF) 8 ns R GEN =, V GS = -V Note:. Short duration test pulse used to minimize self-heating effect. /
LBSS8WTG N-CHNNEL - N7 SECTION NEW PROUCT I, RIN-SOURCE CURRENT ()..8... V GS = V 9.V 8.V 7.V.V.V.V.V.V.V.V.V.V.V V.V.V 7 V =.V GS V GS = V T= C j.v V S, RIN-SOURCE VOLTGE (V) Fig. On-Region Characteristics.....8. I, RIN CURRENT () Fig. On-Resistance vs rain Current. I = m I = m.. V GS, GTE SOURCE CURRENT (V) V GS = V, I = m. - - - 7 9 9 8 7 T, JUNCTION TEMPERTURE ( C) j Fig. On-Resistance vs Junction Temperature V S = V T = + C T = - C T = +7 C T = + C....8 I, RIN CURRENT () Fig. Typical Transfer Characteristics P,POWER ISSIPTION (mw) d 8 8 V GS, GTE TO SOURCE VOLTGE (V) Fig. On-Resistance vs. Gate-Source Voltage 7 7 T, MBIENT TEMPERTURE ( C) Fig. Max Power issipation vs. mbient Temperature /
LBSS8WTG P-CHNNEL - BSS8 SECTION T = C -. I, RIN SOURCE CURRENT (m) V GS = V.V.V.V.V I, RIN CURRENT () -.8 -. -. -. T = - C T = C T = C V S, RIN SOURCE (V) Fig. 7, rain Source Current vs. rain Source Voltage -. - - - - - - -7-8 V GS, GTE-TO-SOURCE VOLTGE (V) Fig. 8, rain Current vs. Gate Source Voltage 9 8 7 9 V GS = -V I = -. T = C T = C V GS, GTE TO SOURCE (V) Fig. 9, On Resistance vs. Gate Source Voltage - - 7 T, JUNCTION TEMPERTURE ( C) J Fig., On-Resistance vs. Junction Temperature... V GS = -V V GS = -.V V GS = -.V. V GS = -V V GS = -V V GS = -V. V GS = -8V V GS = -V. -. -. -. -. -.8. I, RIN CURRENT () Fig., On-Resistance vs. rain Current /
LBSS8WTG ORERING INFORMTION evice Marking Shipping LBSS8WTG KNP /Tape&Reel LBSS8WTG KNP /Tape&Reel Notes:. For Packaging etails, go to our website at http://www.diodes.com/datasheets/ap7.pdf.. For Lead Free version (with Lead Free terminal finish) part number, please add "-F" suffix to part number above. Example: LBSS8WTG. Marking Information KNP YM KNP = Product Type Marking Code YM = ate Code Marking Y = Year ex: R = M = Month ex: 9 = September ate Code Key Year 7 8 9 Code P R S T U V W Month Jan Feb March pr May Jun Jul ug Sep Oct Nov ec Code 7 8 9 O N /
LBSS8WTG SC-88/SOT- G NOTES:. IMENSIONING N TOLERNCING PER NSI Y.M, 98.. CONTROLLING IMENSION: INCH. IM INCHES MILLIMETERS MIN MX MIN MX.7.87.8. S - B- B.... C...8..... G. BSC. BSC P L. (.8) M N B M H ---. ---. J.... K.... N.8 REF. REF J S.79.87.. C H K PIN. EMITTER. BSE. COLLECTOR.EMITTER. BSE.COLLECTOR. mm (min). mm (min). mm. mm.9 mm /
Tape & Reel and Packaging Specifications for Small-Signal Transistors, FETs and iodes Embossed Tape and Reel is used to facilitate automatic pick and place equipment feed requirements. The tape is used as the shipping container for various products and requires a minimum of handling. The antistatic/conductive tape provides a secure cavity for the product when sealed with the peel back cover tape. Two Reel Sizes vailable (7"and ",) SOT, SC 7/SOT, Used for utomatic Pick and Place Feed Systems SC 89, SC 88/SOT, SC 88/SOT, Minimizes Product Handling SO, SO- in Tape EI 8,, Use the standard device title and add the required suffix as listed in the option table below (Table ). Note that the individual reels have a finite number of devices depending on the type of product contained in the tape. lso note the minimum lot size is one full reel for each line item, and orders are required to be in increments of the single reel quantity. SO- SC-9, SC-7, SC-7,SOT- SC-88, SOT- T Orientation SC-88, SOT- T Orientation irection of Feed Typical Reel Orientations Table. EMBOSSE TPE N REEL ORERING INFORMTION Package SOT SC 7/SOT SC 89 SC 88/SOT- SC 88/SOT- SO- Tape Width Pitch Reel Size evices Per Reel evice (mm) mm mm(inch) and Minimum Suffix Order Quantity 8 78 (7), T 8 (), T 8 78 (7), T 8 (), T 8 78 (7), T 8 (), T 8 78 (7), T 8 (), T 8 78 (7), T 8 (), T 8 78 (7), T 8 (), T SO- 8 78 (7), T 8 (), T /
EMBOSSE TPE N REEL T FOR ISCRETES CRRIER TPE SPECIFICTIONS K t P P Pitches Cumulative Tolerance on Tape ±.mm( ±.8 ) Top Cover Tape E F W B K See Note B P Embossment Center Lines of Cavity For Components.mm x.mm and Larger For Machine Reference Only Including raft and RII Concentric round B User irection of Feed o R Min Bar Code Label Tape and Components Shall Pass round Radius R Bending Radius Embossed Carrier Without amage mm Maximum Component Rotation (.97 ) mm Max Typical Component Cavity Center Line Typical Component Center Line mm(.9 ) Max mm (9.8 ) *Top Cover Tape Thickness(t ).mm (. )Max. Tape Embossment Camber (Top View) llowable Camber To Be mm/ mm Nonaccumulative Over mm IMENSIONS Tape Size B Max E F K P P RMin TMax WMax 8mm mm mm mm.mm (.79 ) 8.mm (. ).mm (.7 ).mm (.79 ).+.mm -. (.9+. -.).Min (.9 ).mm Min (. ).7 ±.mm (.9 ±.). ±.mm (.8±. ). ±.mm (.7 ±. ) 7. ±.mm (.9 ±. ). ±.mm (. ±. ).mm Max (.9 ).mm Max (. ) 7.9mm Max (. ).9mm Max (.8 ). ±.mm (.7 ±. ). ±.mm (.79 ±. ) mm (.98 ) mm (.8 ).mm (. ) 8.mm (.7 ) ±.mm (.7 ±. ).mm (. ).mm (.97 ) Metric dimensions govern - English are in parentheses for reference only. NOTE :, B, and K are determined by component size. The clearance between the components and the cavity must be within. mm min. to. mm max., NOTE : the component cannot rotate more than o within the determined cavity. NOTE : If B exceeds. mm (. ) for embossed tape, the tape may not feed through all tape feeders. /
EMBOSSE TPE N REEL T FOR ISCRETES.mm Min (. ).mm ±.mm (. ±. ) T Max Outside imension Measured at Edge.mm Min (.79 ) mm Min (.99 ) Full Radius G Inside imension Measured Near Hub Size Max G T Max mm (.99 ) 8.mm+.mm, -. (. +.9, -.).mm (. ) mm mm (.99 ).mm+.mm, -. (.9 +.79, -.) 8.mm (.7 ) mm mm (.7 ).mm+.mm, -. (. +.78, -.).mm (.88 ) mm mm (.7 ).mm+.mm, -. (.9 +.7, -.).mm (.97 ) Reel imensions Metric imensions Govern English are in parentheses for reference only Storage Conditions Temperature: to eg.c ( to eg. C is preferred) Humidity: to 8 RH ( to is preferred ) Recommended Period: One year after manufacturing (This recommended period is for the soldering condition only. The characteristics and reliabilities of the products are not restricted to this limitation) /