DATA SHEET. BAS40 series Schottky barrier (double) diodes DISCRETE SEMICONDUCTORS. Product specification Supersedes data of 1999 Apr 28.

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1 DISCRETE SEMICONDUCTORS DT SHEET age MD088 MD07 BS40 series Supersedes data of 999 pr 8 00 Oct 0

2 BS40 series FETURES Low forward voltage Guard ring protected Small plastic SMD packages Low diode capacitance. PPLICTIONS Ultra high-speed switching Voltage clamping Protection circuits Blocking diodes. DESCRIPTION PINNING SOT (see Fig.a) PIN BS40 (see Fig.b) BS40-04 (see Fig.c) DESCRIPTION BS40-05 (see Fig.d) BS40-06 (see Fig.e) a a a k n.c. k a k k k,a k,k a,a handbook, columns handbook, columns Planar Schottky barrier diodes with an integrated guard ring for stress protection, encapsulated in small plastic SMD packages. Single diodes and double diodes with different pinning are available. BS40, BS40-04, BS40-05 and BS40-06 in a SOT and the BS40-07 in a SOT4B package. Top view MGC48 a. Simplified outline SOT. MGC485 c. BS40-04 handbook, columns MGC484 d. BS MRKING handbook, columns handbook, columns TYPE NUMBER MRKING CODE () MGC48 n.c. MGC486 BS40 BS40-04 BS40-05 BS40-06 BS40-07 Note p b. BS40 single diode. e. BS Fig. Simplified outline (SOT) and symbols.. = p: Made in Hong Kong. = t: Made in Malaysia. = W: Made in China. handbook, halfpage 4 4 PINNING SOT4B (see Fig.) PIN BS40-07 DESCRIPTION Top view MM94 k k a 4 a Fig. Simplified outline (SOT4B) BS40-07 and symbol. 00 Oct 0

3 BS40 series LIMITING VLUES In accordance with the bsolute Maximum Rating System (IEC 604). SYMBOL PRMETER CONDITIONS MIN. MX. UNIT Per diode V R continuous reverse voltage 40 V I F continuous forward current 0 m I FRM repetitive peak forward current t p s;δ m I FSM non-repetitive peak forward current t p < 0 ms 00 m T stg storage temperature C T j junction temperature 50 C T amb operating ambient temperature C ELECTRICL CHRCTERISTICS T amb =5 C unless otherwise specified. SYMBOL PRMETER CONDITIONS MX. UNIT Per diode V F forward voltage see Fig. I F = m 80 mv I F = 0 m 500 mv I F =40m V I R reverse current V R = 0 V; note ; see Fig.4 µ V R = 40 V; note ; see Fig.4 0 µ C d diode capacitance f = MHz; V R = 0 ; see Fig.6 5 pf Note. Pulse test: t p = 00 µs; δ = 0.0. THERML CHRCTERISTICS SYMBOL PRMETER CONDITIONS VLUE UNIT R th j-a thermal resistance from junction to ambient note 500 K/W Note. Refer to SOT or SOT4B standard mounting conditions. 00 Oct 0

4 BS40 series GRPHICL DT handbook, 0halfpage I F (m) 0 MLC6-0 handbook, halfpage I R (µ) 0 () MLC6 0 () () () (4) () 0 0 () V F (V) () T amb = 50 C. () T amb =85 C. () T amb =5 C. (4) T amb = 40 C. 0 0 () T amb = 50 C. () T amb =85 C. () T amb =5 C VR (V) Fig. Forward current as a function of forward voltage; typical values. Fig.4 Reverse current as a function of reverse voltage; typical values. 0 handbook, halfpage r diff (Ω) MLC64 5 handbook, halfpage C d (pf) 4 MLC I (m) 0 F V R (V) f = 0 khz. f = MHz T amb =5 C. Fig.5 Differential forward resistance as a function of forward current; typical values. Fig.6 Diode capacitance as a function of reverse voltage; typical values. 00 Oct 0 4

5 BS40 series PCKGE OUTLINES Plastic surface mounted package; leads SOT D B E X H E v M Q c e bp w M B Lp e detail X 0 mm scale DIMENSIONS (mm are the original dimensions) UNIT max.. mm b p c D E e e H E L p Q v w OUTLINE VERSION SOT REFERENCES IEC JEDEC EIJ TO-6B EUROPEN PROJECTION ISSUE DTE Oct 0 5

6 BS40 series Plastic surface mounted package; 4 leads SOT4B D B E X y v M H E e b p w M B 4 Q c b Lp e detail X 0 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm. 0.9 max 0. b p b c D.0.8 E.4. e.9 e.7 H E.5. L p Q v 0. w y OUTLINE VERSION REFERENCES IEC JEDEC EIJ EUROPEN PROJECTION ISSUE DTE SOT4B Oct 0 6

7 BS40 series DT SHEET STTUS DT SHEET STTUS () PRODUCT STTUS () DEFINITIONS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650. Notes. Please consult the most recently issued data sheet before initiating or completing a design.. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the bsolute Maximum Rating System (IEC 604). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. pplication information pplications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 00 Oct 0 7

8 a worldwide company Contact information For additional information please visit Fax: For sales offices addresses send to: sales.addresses@ Koninklijke Philips Electronics N.V. 00 SC7 ll rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 654/05/pp8 Date of release: 00 Oct 0 Document order number: