ICs IC Packages CONTENTS
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- Melanie Baker
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1 CONTENT ROH Packages Part No. Explanation P. Package Ordering Units P. 7 QFP Packages P. VP Package P. 9 ON Packages P. 0 QFN Packages P. OP Packages P. HOP Packages P. mall Packages P. Non-Lead Packages P. Power Packages P. 7 BG Packages P. 9 WL-CP Packages P. 9 LPI emiconductor Packages Package List P. 0 Part No. Explanation P. 0 OP Packages P. QFP Packages P. DIP Package P. QFN Packages P. WON Package P. BG Packages P. 7 WL-CP Package P. 7 *Please check the dimensions of each products in detail. LPI emiconductor products and ROH emiconductor dimensions products have different although they have a same package name.
2 (ROH) Part No. Explanation Part No. Explanation When ordering, specify the part number. Check each code against the tables shown below. Fill in from the left,leaving any extra boxes empty on the right. Ordering information. packaging specification is not required for packaging other than taping. (Ex.) BF or BF-DX. packaging specification is required for tape packaging. (Ex.) Example of E-oriented embossed taping: BF-E or BF-DXE Please refer packages from page, 0 for LPI emiconductor products. B Part No. F Custom pecification code lphabetical symbols specify custom product. tandard product has no symbols. E (E) TR (TL) D X Embossed tape and reel Embossed tape and reel Embossed tape and reel Embossed tape and reel E Packaging and forming specification Pin fed last Pin fed first Pin fed first Pin fed last For example Reel Reel Reel(last) Leader(first) pin E Leader(first) (E) pin *Take E as standard if no special request is made. Reel(last) Leader(first) pin TR Leader(first) (TL) pin *Take TR as standard if no special request is made.
3 Package Ordering Units Embossed tape packaging <Package specification name : E(E)> Tray packaging (ROH) Package Ordering Units Please refer packages from page, 0 for LPI emiconductor products. Embossed tape packaging<package specification name : E(E)> Package Non-Lead ordering OP Packages Power Packages QFP Packages BG/QFN unit quantity Gull Wing Packages,000 ON00X, ON00X00,000 WON00X0, VON00X00, VON00X00, VON00X00, VON00X00, VP00Z0,000 VOF, HVOF/, HON, WOF/, VON00V00, VON00V00, VQFN0V00, WL-CP (.mm and under) TOP-B, OP, OP//, OP/0,00 VQFN00V00, VQFN0V00, VQFN0V00, VQFN0V00, UQFN0V00, UQFN00V00, WL-CP (over.mm ) OP//, OP-, TOP-BJ, OP-B///0, OP-J/J, HTOP-/0/, HTOP-J, TOP-BJ mm,000 VQFN00V00, UQFN0V00 OP/0/, OP-0//, OP-B//0, HTOP-B/0/0, HOP HRP/7, TO-/, OT-, TO-7, TO-J/J mm,00,000 VQFN0V7070, UQFN0V7070 OP-, HTOP-/R/B, HOP/-/- QFP, TQFPV, VQFPC, HTQFPV, UQFP, TQFPU QFP-T, QFP, VQFP, VQFP0, UQFP0,TQFPV, HTQFPV, HTQFPBV 00 TO-/ VQFP00, TQFP00V :Package specification : TR(TL)pecification differ by package size of WL-CPWL-CP Package pecification : E (standard) Tray packaging Pin pitch: 0. mm Pin pitch: 0. mm Pin pitch: mm Pin pitch: 0. mm Dimensions d e(mm) Individual package quantity Tray quantity Package ordering unit quantity Tomson Case dimensions B C(mm) QFP VQFPC , QFP QFP-T/ VQFP/0, TQFPV/V UQFP0 0 0, QFP-, QFP0/T0 VQFP00, TQFP00V, HTQFP00V TQFPU QFP
4 0.±0..±0..0±0. 0.0±0. (ROH) QFP Packages QFP<Pin Pitch:0.mm> QFP<Pin Pitch:0.mm> TQFPV<Pin Pitch:mm> QFP Packages QFP<Pin Pitch:0.mm> Please refer packages from page, 0 for LPI emiconductor products. QFP QFP 9.0±0. 7.0±0..± ±0. 7.0± ±0. 0. ±0..0±0. 0.0±0..± ±0. 0.0±0.. ± ±0.,000pcs,00pcs,000pcs,000pcs QFP<Pin Pitch:0.mm> QFP-T QFP-T 0.0±0. 0.0± ±0. 0.±0..±0..0±0. 0.±0..0±0. 9.0±0..0± ±0. 0.±0.,000pcs,000pcs,000pcs TQFPV<Pin Pitch:mm> TQFPV TQFPV TQFP00V.X.0± ±0. 0.± ± ±0. 7.0± PIN RK ±.0± ,000pcs,00pcs.0±0. 0.0±0..ax..0±0. 0.±0. 9.0±0. 0.0± ± ±0.,000pcs,000pcs.0±0..ax..0± ±0. 0.±0. 7.0±0..0± ±0. 0.± pcs 00pcs
5 QFP Packages VQFP<Pin Pitch:mm> UQFP<Pin Pitch:0.mm> TQFPU<Pin Pitch:0.mm> HTQFPV<Pin Pitch:mm> VP Package VP<Pin Pitch:mm> (ROH) QFP Packages VQFP<Pin Pitch:mm> Please refer packages from page, 0 for LPI emiconductor products. VQFPC VQFP VQFP0 VQFP00.X 9.0±0. 7.0±0..±0.0 0.± ±0. 9.0±0. 7.0± PIN RK ±.0±0..0±0. 0.0±0..X.±0.0 0.±0.0.0±0. 0.0± PIN RK ,000pcs,00pcs ±0. ±.0±0..0±0..0±0..X.±0.0 0.± ±0. 0.0±0. 0. PIN RK ± ±.0±0..0±0..X.0± ±0.0 0.± ±0..0± PIN RK ,000pcs,000pcs,000pcs,000pcs ±.0±0. ±0. 00pcs 00pcs UQFP<Pin Pitch:0.mm> TQFPU<Pin Pitch:0.mm> UQFP0.0 ± ± 0. 0 TQFPU 9.0 ± 0..0 ± 0..ax..0 ± ± 0.. ± ± ±.0 ± ,000pcs,000pcs.ax..0 ± 0..0 ± ± ± ±.0 ± pcs HTQFPV<Pin Pitch:mm> HTQFPV 9.0 ± ± 0. (.) 0. ± 0.0.0X ± ± 0. (.) PIN RK 0. ± ±.0 ± ,000pcs,00pcs HTQFP00V 7.0 ax..0 ± 0..0 ± ± 0.0 (.) 0. ± ± 0..0 ± 0. (.) 7.0 PIN RK ±0. + ±.0 ± pcs VP Package VP<Pin Pitch:mm> VP00Z0. ± 0..0 ± ax. PIN RK. ± 0. C ± ± ± ,000pcs 9
6 (ROH) ON Packages ON-X<Pin Pitch:0.mm> VON-V<Pin Pitch:mm> VON-X<Pin Pitch:mm> ON Packages Please refer packages from page, 0 for LPI emiconductor products. ON-X<Pin Pitch:0.mm> VON-V<Pin Pitch:mm> ON00X00 ON00X VON00V00 VON00V00.0±0..0 ± 0. PIN RK.0±0..0±0. PIN RK.±0..±0. PIN RK.0±0. PIN RK.0 ± 0. 0.±0. 0.X R ±0.0 0.±0.0 0.±0.0 -C0. 0.± ±0. 0.± (0.),000pcs 0.±0. 0.X ±0. 0.7± (0.) 0.±0..0X C0. 0.±0. 0..± ±0. (0.) X C0. 0. ± ± (0.). ± ,000pcs,000pcs,000pcs VON-X<Pin Pitch:mm> VON00X00.0 ± 0.0 VON00X00.0±0. VON00X00.0 ± 0. 0.X 0.0 C0. 0. ± 0.. ± 0. ± 0.. ± 0..0 ± 0.0 PIN RK (0.) 0. ± 0. 0.X C0. 0.±0. 0..±0. PIN RK.0± ±0. (0.) X C ± 0. 0 PIN RK.0 ± 0. ± ,000pcs,000pcs,000pcs.9 ± 0..0 ± ± 0. (0.) VON00X00.0 ± 0..0 ± 0. PIN RK.0 ± 0. C0. 0. ± 0.. ± 0. 0.X (0.) ,000pcs 0
7 QFN Packages QFN0<Pin Pitch:0.mm> QFN0<Pin Pitch:mm> VQFN-V<Pin Pitch:mm> (ROH) QFN Packages Please refer packages from page, 0 for LPI emiconductor products. QFN0<Pin Pitch:0.mm> QFN0<Pin Pitch:mm> QFN0(Powervation series).0±0.0 QFN0(Powervation series).0 C0..± ±0.0 0.±0.0 VQFN-V<Pin Pitch:mm>.0 ± 0..0 ± 0..0 ± 0..0 ± 0..0 ± 0..0 ± 0..0X 0. ± 0. PIN RK. ± 0. C ± ± (0.). ± 0..0X 0. ± 0. C PIN RK. ± (0.). ± X 0. ± 0. C PIN RK. ± (0.) 7. ± ± 0..0 ± 0..0 ± 0..0 ± 0..0±0.0.0 PIN RK PIN RK 0.X () 0.9X (0.).±0.0 0.±0.0.7±0. 0.R ± , 00,,000,,000pcs 0, 00,,000,,000pcs VQFN0V00 VQFN00V00 VQFN0V00 VQFN0V00.0 ± 0..0 ± 0..0X. 0. ± 0. C0. PIN RK.7 ± (0.).7 ± ,000pcs,00pcs,00pcs,00pcs VQFN0V00 VQFN00V00 VQFN0V7070 PIN RK PIN RK PIN RK.0X C0.. ± ± ± 0. (0.) X 0. ± 0. C ± (0.) ± 0..0X C0..7 ± ± ± (0.),00pcs,000pcs,00pcs
8 (ROH) QFN Packages UQFN-V<Pin Pitch:0.mm> OP Packages OP<Pin Pitch:.7mm> QFN Packages UQFN-V<Pin Pitch:0.mm> Please refer packages from page, 0 for LPI emiconductor products. UQFN0V00 UQFN00V00 UQFN0V00 UQFN0V ± 0..0 ± 0..0 ± 0..0 ± 0..0 ± 0..0 ± 0..0 ± ± 0. PIN RK PIN RK PIN RK PIN RK.0X C0..7 ± 0. 9 ± (0.) 0.7 ± X C0.. ± ± (0.). ± X ± 0. C0..7 ± (0.).7 ± X C0..7 ± 0. ± (0.).7 ± ,00pcs,00pcs,000pcs,00pcs OP Packages OP<Pin Pitch:.7mm> OP OP OP.0±0. (X. include BURR).±0..±0..± ± IN 0.9± ±0..±0..± ±0. (X 9.0 include BURR).7 0.± ±0. (X. include BURR) 0.±0. (X. include BURR) 0.0±0. (X. include BURR).7 ± ±0. 0..±0. (X. include BURR) 9.9±0. 7.±0. 0.IN 0.IN ±0..±0..±0..± ±0. (X 0. include BURR),00pcs,00pcs,00pcs 0.± IN ±0. OP OP0 OP 7.±0..±0. 0..±0. 0.IN 9 ± ±0. 7.±0..±0. 0..±0. 0.IN 0 ± ±0. 0.,000pcs,000pcs,000pcs.±0. 7.±0..± IN OP ±0..± ±0. 0.,00pcs
9 OP Packages OP-<Pin Pitch:0.mm> OP-B<Pin Pitch:0.mm> (ROH) OP Packages OP-<Pin Pitch:0.mm> Please refer packages from page, 0 for LPI emiconductor products. OP- OP-0 OP-.±0..7±0. 0 ± 0. (X.9 include BURR) (X 9.0 include BURR) (X 0. include BURR) ±0..±0..± IN 7 ± ± ±0..±0..± IN 0 ±0. 0.± ± 0.. ± ± 0.. ± ± 0. ±0..± ,00pcs,000pcs,000pcs OP-.±0. (X.9 include BURR) 7 OP-. ± 0. (X. include BURR) 7.±0..±0. 0.IN 9. ± ± 0. 0.in..± ±0. 0. ±0..7 ± ± 0. ± 0. 0.,000pcs,00pcs OP-B<Pin Pitch:0.mm> OP-B.0±0. (X. include BURR) 7 OP-B.0 ± 0. (X. include BURR) OP-B.0 ± 0. 9 OP-B0. ± 0. 0.±0..±0. 0..±0. () IN ± ± 0.. ± ± ± 0. 0.in. ± 0.. ± 0.. ± 0.. ± 0. 0.± ± in. ± ± 0. (X. include BURR) 0 ± 0. (X 0. include BURR). ± 0. (X.9 include BURR) 0 7. ± 0.. ± 0. 0.in. 7. ± 0.. ± 0. 0.in. 7. ± 0.. ± 0. ± 0.. ± 0.. ± 0.. ± ± 0. 0.in. ± 0.,00pcs,00pcs,00pcs,00pcs. ± OP-B OP-B OP-B0. ± ± ± 0. ± 0. ± ± ± ± 0.,000pcs,000pcs,000pcs
10 (ROH) OP Packages JEDEC<Pin Pitch:.7mm/0.mm> HOP Packages HOP<Pin Pitch:0.mm> OP Packages JEDEC<Pin Pitch:.7mm/0.mm> Please refer packages from page, 0 for LPI emiconductor products. OP-J OP-J TOP-B.9±0. (X. include BURR) ±0. (ax 9.0 include BURR) +.0±0. (X. include BURR) 7 ±.7± X.7± ±0.07 HOP<Pin Pitch:0.mm> HOP 0..±0. (X.7 include BURR).77± ±0. 7.±0. ±.± PIN RK X.0±0..9±0. 0.±.0±0. 7 PIN RK ± ,00pcs,00pcs,000pcs PIN RK.0±0. (X. include BURR) 7.0±0. (ax. include BURR).9±0..0±0. 0.± 0.9±0..±0..±0. ±.0±0..0±0..9±0. 0.in..±0..±0. ±.0±0. 0.± X.0±0.0 0.± TOP-BJ TOP-BJ ± ±.X 0.±0.0 0.± PIN RK ,00pcs.X.0±0.0 0.± PIN RK ,00pcs HOP Packages 7. ± 0.. ± 0.. ± 0. (X.9 include BURR).7 ± 0..9 ± 0. 0.in. 0. ± 0. HOP- 9.9±0. 7.±0..±0. (X. include BURR)..±0. + ±0..±.9 ± ± 0..0 ± ± ± ,000pcs,00pcs HOP- +.±0.0 0.± ,00pcs
11 HOP Packages HTOP-J<Pin Pitch:.7mm> HTOP-<Pin Pitch:0.mm> HTOP-B<Pin Pitch:0.mm> (ROH) HOP Packages Please refer packages from page, 0 for LPI emiconductor products. HTOP-J<Pin Pitch:.7mm> HTOP-<Pin Pitch:0.mm> HTOP-J HTOP- HTOP-R.0±0..0X 0.±0.0.9±0. (X. include BURR) ±.9±0. (.) 7 (.) PIN RK ±.0± ±0..0X 7.± ±0.0 ±0.0.±0.. ± 0. (X. include BURR) + (X. include BURR) + (.0) (.0) PIN RK (.0) ±.0± X 0. ± ± 0. ± ± PIN RK (.0) ±.0 ± ,00pcs,00pcs,00pcs HTOP-B<Pin Pitch:0.mm> HTOP-B HTOP-B0 HTOP-B.0±0. (ax.(include BURR)) (.0) ±0. (X. include BURR) (.0) 0 7.±0. (X. include BURR) (.0) +.0X 0.±0.0.±0..±0. 0. ± (.) PIN RK ±.0± ±0..±0..0X 0.±0.0 ± (.) ±.0± X 0.±0.0 7.±0. ±0.0.±0. 0. PIN RK 0. (.) ±.0± HTOP-B.±0..±0..0X 0.±0.0 ± ±0. (X 0.0 include BURR) (.) 0. PIN RK 0.,00pcs (.9) ±.0± HTOP-B0.0X 0.±0.0 7.±0. ± PIN RK 0.±0. (X. include BURR) (.0) 9.±0. 7.±0. (.0) ±.0±0..± ±0. (X 0. include BURR) 0 0. (.),00pcs PIN RK (.7) + ±.0± HTOP-B0.0ax. 7.±0..±0. 0.±0.0 ±0.0.±0. (X.9 include BURR) 0 0.,000pcs (.) (.) ±. ± ,00pcs,000pcs,000pcs HTOP-B + 0. PIN RK ax. 0.±0.0 ± ,00pcs
12 (ROH) mall Packages OP type Non-Lead Packages Non-Lead mall Packages OP type Please refer packages from page, 0 for LPI emiconductor products. OP OP OP.± ± ±.± ± in..± ± in ax. 0.9± ± ax..± ± ax..± ± ,000pcs,000pcs,000pcs OP OP OP0.9±0..9±0. (X. include BURR).9±0. (X. include BURR) ± in..0±0..±0. 0.9± 0.±0..0±0..±0. 0.9± 0.±0..ax..± ± X 0.7±0.0 ± PIN RK X 0.7± ±0.0 PIN RK ,000pcs,000pcs,000pcs Non-Lead Packages Non-Lead VOF HVOF HVOF HON.±0.0.±0.0 (X. include BURR).± ±0. (X. include BURR) 7.0±0.0.0±0.0.±0.0.±0.0 (X. include BURR) 0.X 0.±0.0 0.X 0.±0.0.±0.0.±0.0 0.X (X. include BURR) (0.0) 0. 0.±0.0 0.X 0.±0.0.0±0..±0. (X. include BURR) () 0.7ax. (.) 0. 0.±0.0 0.±0.0 0.X.0±0. (0.).± PIN RK (.) (0.0) (0.) () ±0. (0.9) (0.) (0.) (0.) (0.) (.) (.) (0.) (.) (0.) 7,000pcs,000pcs,000pcs,000pcs
13 Non-Lead Packages Optical Non-Lead Power Packages POWER-PIN POWER-PIN (ROH) Non-Lead Packages Optical Non-Lead Please refer packages from page, 0 for LPI emiconductor products. WOF(Clear type) WOF(Clear type) WON00X0(Clear type).±0.0.0±0.0 (X. include BURR).±0..0±0..±0.0.±0.0 0.X (X. include BURR) (0.9) (0.) (0.0) (0.) (0.) 0. 0.±0.0 0.X 0.±0.0.0±0..±0. (0.) 0.7X () (X. include BURR) 0. (.) PIN RK (.) 0.±0.0 0.±0.0.±0. C0. 0.±0. 0..±0. PIN RK 0.7±0. (0.) ,000pcs,000pcs,000pcs X Power Packages POWER-PIN TO0CP- TO- TO-J TO-. ± in. φ. ± 0..0 ± 0..0 ± 0..0 ± ± C.±0..± ± ± ±0. FIN ±0..±0. 9.±.. ±0..0±0..±0..0± ± FIN 0. (.9) 0.7 (.7).±0. ±0. ±0..0REF.9±0.0 ± 0.± ±0..9±0. 0.±0.0.BC 7 ± ±0.0 7 ± ±.0±0. ± 0.BC.0±0. 0..±0..0± ±. ±. ± POWER-PIN.±0.0.0± ±0..±0..0± ±.±0. 00pcs,000pcs,000pcs 00pcs OT-.X..±0. 0.0± ±0.0.± ± ±0.,000pcs 7
14 (ROH) Power Packages POWER-PIN POWER-7PIN Power Packages POWER-PIN Please refer packages from page, 0 for LPI emiconductor products. TO0FP- TO- HRP ±0..0±0..IN 0.±0..0± φ.±0..± C.±0..±0..± FIN 0..7.±0. ± ± ±0..0±0..0 ± ± ± 0. (X 9.7 include BURR).7. ± 0. (.) (7.9).90 ± ± 0.. ± ± ±0.. ± ± 0. 00pcs,000pcs,000pcs TO- TO-J.0REF 0. ± ± 0..9 ± ± BC ± 7 ± 7 ± ± ± 0. ± 0.BC.0 ± 0. 00pcs.07±0.7.±0..±0..REF.± FIN 0.±0.0 ± 0.±0.0.±0. ± ± ± ±0. ± ±0.0,000pcs POWER-7PIN HRP7 TO-7.07 ± 0..0 ± ± 0. (X 9.7 include BURR). ± 0. (.) 7 (7.9).90 ± ± 0.. ± ± ±0..0REF 0.± ± ± ±0.0 ±.7± ± 7 ± 7 ± ±0. ±.0±0..0 ± 0. ± 0.BC ± ± 0.,000pcs,000pcs
15 BG Packages VBG-W<Pin Pitch:mm> WL-CP Packages VCP<Pin Pitch:mm> UCP<Pin Pitch:0.mm> XCP<Pin Pitch:0.mm> (ROH) BG Packages VBG-W<Pin Pitch:mm> Please refer packages from page, 0 for LPI emiconductor products. VBG0W00 VBG099W00 PIN RK.0±0. PIN RK.0±0..0± ±0. 0.9X X -φ0.9± B ±0. P=x G F E D C B 7 B ±0. P=x 0.0 B 0.7±0. 99-φ0.9±0.0 K J H G F E D C B P=x B P=x9 0.7±0.,00pcs,000pcs WL-CP Packages VCP<Pin Pitch:mm> VCPH VCP0L VCPL VCP0L mm,000pcs Over.mm,00pcs UCP<Pin Pitch:0.mm> 0..mm,000pcs Over.mm,00pcs 0..mm,000pcs Over.mm,00pcs,000pcs.mm,000pcs Over.mm,00pcs,000pcs UCP7 UCP0L UCPL UCP0L UCPL mm,000pcs Over.mm,00pcs mm,000pcs Over.mm,00pcs mm,000pcs Over.mm,00pcs,000pcs mm,000pcs Over.mm,00pcs,000pcs ,000pcs XCP<Pin Pitch:0.mm> XCP0L ,000pcs 9
16 LPI emiconductor LI Packages LPI emiconductor LI Package List LPI emiconductor LI Part No. Explanation These package size are an example. For details, please inquire to the sales. LPI emiconductor LI Package List No PKG type PKG ymbol Title TRY T&R TUBE OP OP-00-.7,00 OP B OP-0-0.,70,00 OP B OP0--0.,000,000 OP B OP-0-.00,0,000 OP B OP OP B OP TOP TD TOP0-0-0.,0,000 TOP T TOP(I)-0-,90 9 TOP T TOP(II) ,70,000 0 TOP T TOP(II) ,00,000 QFP G QFP ,0,000 QFP G QFP-90-0.,0,000 QFP G QFP--0 0 QFP G QFP QFP G QFP QFP G QFP QFP G QFP QFP G QFP QFP G QFP QFP G LQFP ,00,000 QFP G LQFP *Regarding an unstated package, please inquire to the sales. No PKG type PKG ymbol Title TRY T&R TUBE QFP G TQFP ,00,000 QFP G TQFP ,00,000 QFP G TQFP-00-0.,00,000 QFP G TQFP-00-0,00,000 QFP G TQFP-00-0.,00,000 7 QFP G TQFP ,00 QFP G TQFP /,090 9 QFP G TQFP QFP G TQFP QFP G TQFP QFP G TQFP DIP R DIP-00-.,00 QFN GD VQFN-00-0,900,000 QFN GD WQFN-00-0,0,000 QFN GD WQFN-00-0,900,000 7 QFN GD WQFN-00-0,900,000 QFN GD WQFN ,900,000 9 QFN GD WQFN-00-0,00,000 0 QFN GD WQFN ,00,000 QFN GD WQFN0-00-0,900,00 ON D WON0-00-0,000 LPI emiconductor LI Part No. Explanation Z The device code expresses a function specific to a device using a combination of numbers and alphanumeric characters. The character symbol is added to indicate the modification of an existing product, to emphasize a specification that differs from the standard specification of an existing product, or to indicate a design standard. The package symbol expresses the type and lead bending profile of a package in two digits. The derived code indicates the speed ranking for DR products and is used as a derived code for logic products. The option classification symbol is used to distinguish between the option code and the package symbol. The option code indicates a symbol that identifies the specification of a product with an option. 0 7 J 0
17 00 OP Packages OP OP LPI emiconductor LI Packages OP Packages These package size are an example. For details, please inquire to the sales. OP P-OP-0-0. P-OP0--0. OP OP OP--0.0 P-TOP ETING PLNE INDEX RK IRROR FINIH 0.Typ ±0. 0.7±0..0± ±0.0.7±0..ax ±0. 0.7± 0.7Typ. 0..7±0.
18 LPI emiconductor LI Packages OP Packages TOP(Type Ⅰ) TOP(Type Ⅱ) OP Packages These package size are an example. For details, please inquire to the sales. TOP-0- TOP TOP TOP TOP
19 QFP Packages QFP LQFP LPI emiconductor LI Packages QFP Packages These package size are an example. For details, please inquire to the sales. P-QFP P-QFP P-QFP--0.0 P-QFP0--0. P-QFP P-LQFP P-LQFP ± ± 0. INDEX RK TYP. 0.7 ± 0.0 ETING PLNE 0..0X ± ±
20 LPI emiconductor LI Packages QFP Packages TQFP QFP Packages These package size are an example. For details, please inquire to the sales. P-TQFP P-TQFP P-TQFP P-TQFP-00-0 P-TQFP P-TQFP0--0 P-TQFP0--0. P-TQFP00--0 P-TQFP P-TQFP--0.0
21 DIP Packages DIP QFN Packages VQFN WQFN LPI emiconductor LI Packages DIP Packages These package size are an example. For details, please inquire to the sales. DIP-00-. QFN Packages P-VQFN-00-0 P-VQFN WQFN-00-0 WQFN-00-0 P-WQFN-00-0
22 LPI emiconductor LI Packages QFN Packages WQFN C-QFN WON Package WON QFN Packages These package size are an example. For details, please inquire to the sales. P-WQFN P-WQFN-00-0 P-WQFN-00-0 P-WQFN P-WQFN P-WQFN PIN INDEX (arking) 9.00 DETIL (0) 0.0X 0.0 ETING PLNE DETIL 0.0 INDEX RK.0TYP TYP DETIL B (0.0) (0.0) DETIL B C-QFN ± (.0) PIN.0± (.0) 0 9 INDEX RK ±0.0.0±0. (0.0) ± PIN.0± (.00) 0.70± ETING PLNE 0.07 WON Packages P-WON PIN INDEX RK (arking) 0.± Typ..Typ. ETING PLNE ax. 0.0 (0.0) (0)
23 K J H G D CF B 7 BG Packages TFBG WL-CP Packages WCP LPI emiconductor LI Packages BG Packages These package size are an example. For details, please inquire to the sales. -VFBG TFBG P-TFBG--0.0 WL-CP Packages -UFLG WCP0 -UFLG WWCP -UFLG WCP 0.0 B (0.9) B INDEX RK 0.0 (0.9) F E D C B 0.0± B ± ± VFLG WWCP7 0.0 B () 0.0 (TOP VIEW) 0.0 B 0.0 ±0.0 0.± (0.) 0.0±0.0 (BOTTO VIEW) 0.0 7
24 EO LPI emiconductor LI Packages
AOZ Ω Low-Voltage Dual-DPDT Analog Switch
0.3Ω Low-Voltage Dual-DPDT nalog witch General Description The OZ6274 is a dual Double-Pole, Double-Throw (DPDT) analog switch that is designed to operate from a single 1.65V to 4.3V supply. The OZ6274
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![GREEN-RED SMD LED VPSGR5450-VMS. Specification for ViTron LED SMD 5450 [VMS] Revision No. : Ver 1.0. Date : Aug. 7, VISSEM Electronics Co., Ltd.](/thumbs/89/99629760.jpg "GREEN-RED SMD LED VPSGR5450-VMS. Specification for ViTron LED SMD 5450 [VMS] Revision No. : Ver 1.0. Date : Aug. 7, VISSEM Electronics Co., Ltd.")
Specification for ViTron LED SMD 5450 [VMS] Part No. : VPSGR5450-VMS Revision No. : Ver 1.0 Date : Aug. 7, 2011 VISSEM Electronics Co., Ltd. 1. SPECIFICATION Absolute Maximum Rating (T a = 25 C) Parameter
65 V, 100 ma NPN/PNP general-purpose transistor. Table 1. Product overview Type number Package NPN/NPN PNP/PNP Nexperia JEITA
Rev. 1 17 July 29 Product data sheet 1. Product profile 1.1 General description NPN/PNP general-purpose transistor pair in a very small Surface-Mounted Device (SMD) plastic package. Table 1. Product overview