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1 el: (86) Skype: tpdide Website: ML m Surface Munt Switching Dide- 100 Package utline Features GLSS MIRO-MELF Fast speed switching. Fr general purpse switching applicatin. High cnductance. Hermetically sealed glass Silicn epitaxial planar chip. Lead-free parts meet RHS requirments..078(2.0).070(1.8).019(.48).011(.28) SOLDERLE ENDS.048(1.2).040(1.0) Mechanical data ase : GLSS MIRO-MELF erminals : Slder plated, slderable per MIL-SD-750, Methd 2026 Plarity : Indicated by cathde band Munting Psitin : ny Weight : pprximated gram.053 (1.35) Glass Dimensins in inches and (millimeters) Maximum ratings and Electrical haracteristics ( =25 unless therwise nted) PRMEER Repetitive peak reverse vltage Reverse vltage Peak frward surge current Frward current verage frward current Pwer dissipatin Junctin temperature Strage temperature t p = 1 s Frward vltage I F = 10 m Reverse current Dide capacitance R = 20 R = 20, J = 150 R = 0, f = 1MHz ONDIIONS Reverse recvery time I F = 10 m, R = 6, I RR = X I R, R L = 100Ω Symbl RRM R I FSM I F I F P J SG MIN. -65 YP. MX F I R 25 R = 75 I R 5.0 u I R D t rr UNI m m m mw n u pf ns Nte: Specificatin is subject t change withut further ntice. Fr mre details and updates, please visit ur website.
2 el: (86) Skype: tpdide Website: ML4148 Rating and characteristic curves (ML4148) Fig.1 DMISSILE REPEIIE PEK FORWRD URREN ERSUS PULSE DURION I v = t p / = 1/ f p IFRM tp IFRM t = 0 = 0. 1 = 0. 2 = S tp Fig.2-DYNMI FORWRD RESISNE ERSUS FORWRD URREN 10 4 J=25 f=1khz Fig.3 FORWRD HRERISIS 10 3 FORWRD RESISNE, 10 3 FORWRD URREN, m FORWRD OLGE, OLS FORWRD URREN, m 10-2 Fig.4 DERING URE Fig.5 YPIL JUNION PINE POWER DISSIPION, mw PINE, pf J=25 f=1khz MIEN EMPERURE REERSE OLGE, OLS Nte: Specificatin is subject t change withut further ntice. Fr mre details and updates, please visit ur website.
3 el: (86) Skype: tpdide Website: ML4148 Pinning infrmatin Pin Simplified utline Symbl Pin1 Pin2 cathde ande Marking ype number ML4148 Marking cde cathde band nly Suggested slder pad layut Dimensins in inches and (millimeters) PKGE MIRO-MELF 0.055(1.40) 0.024(0.60) 0.051(1.30) Nte: Specificatin is subject t change withut further ntice. Fr mre details and updates, please visit ur website.
4 el: (86) Skype: tpdide Website: ML4148 Packing infrmatin P0 d P1 E F W P D2 D1 D W1 unit:mm Item Symbl lerance MIRO-MELF arrier width arrier length arrier depth Sprcket hle d " Reel utside diameter 7" Reel inner diameter Feed hle diameter Sprcket hle psitin Punch hle psitin Punch hle pitch Sprcket hle pitch Embssment center Overall tape thickness ape width Reel width D D1 D2 E F P P0 P1 W W1 2.0 min Nte:Devices are packed in accr dance with EI standar RS-481- and specificatins listed abve. Nte: Specificatin is subject t change withut further ntice. Fr mre details and updates, please visit ur website.
5 el: (86) Skype: tpdide Website: ML4148 Reel packing OMPONEN INNER REEL RON PPROX. PKGE REEL SIZE REEL SPING OX OX DI, SIZE RON GROSS WEIGH (pcs) (m/m) (pcs) (m/m) (m/m) (m/m) (pcs) (kg) GLSS MIRO -MELF 7" 2, 25, *183* *262* , Suggested thermal prfiles fr sldering prcesses 1.Strage envirnment: emperature=5 ~40 Humidity=55%±25% 2.Reflw sldering f surface-munt devices P p ritical Zne L t P Ramp-up L smax L smin emperature ts Preheat Ramp-dwn 25 t25 t Peak 3.Reflw sldering ime Prfile Feature Sldering nditin verage ramp-up rate(l t P) <3 /sec Preheat -emperature Min(smin) -emperature Max(smax) -ime(min t max)(ts) smax t L -Ramp-upRate ime maintained abve: -emperature(l) -ime(tl) Peak emperature(p) ime within 5 f actual Peak emperature(tp) Ramp-dwn Rate ime 25 t Peak emperature ~120sec <3 /sec ~260sec 255-0/+5 10~30sec <6 /sec <6minutes Nte: Specificatin is subject t change withut further ntice. Fr mre details and updates, please visit ur website.
List... Package outline... Features Mechanical data Maximum ratings... Rating and characteristic curves Pinning information...
List List... Package utline... 1 2 Features... 2 Mechanical data... 2 Maximum ratings... 2 Rating and characteristic curves... 3 Pinning infrmatin... 4 Marking... Suggested slder pad layut... 4 4 Packing
More informationList... Package outline... Features Mechanical data... Maximum ratings and Electrical characteristics... Rating and characteristic curves...
List List... Package utline... 1 Features... Mechanical data... Maximum ratings and Electrical characteristics..... Rating and characteristic curves... 3 Pinning infrmatin... 4 Marking... Suggested slder
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List List... Package utline... 1 Features... Mechanical data... Maximum ratings and electrical characteristics... Rating and characteristic curves... 3 Pinning infrmatin... 4 Marking... Suggested slder
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List List... Package utline... 1 Features... Mechanical data... Maximum ratings... Rating and characteristic curves... 3 Pinning infrmatin... 4 Marking... Suggested slder pad layut... 4 4 Packing infrmatin...
More informationList... Package outline... Features Mechanical data... Maximum ratings... Electrical characteristics Rating and characteristic curves...
List List... Package utline... Features... Mechanical data... Maximum ratings... Electrical characteristics... 3 Rating and characteristic curves... 4~ Pinning infrmatin... 6 Suggested slder pad layut...
More informationC unless otherwise noted) CONDITIONS. 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) f=1mhz and applied 4V DC reverse voltage
rwnp Technlgy 1. Surface Munt Fast Recvery Rectifiers--1V Features atch prcess design, excellent pwer dissipatin ffers better reverse leakage current and thermal resistance. Lw prfile surface munted applicatin
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Frmsa MS List List... Package utline... 1 2 Features... 2 Mechanical data... 2 Maximum ratings and Electrical characteristics... 2 Rating and characteristic curves... 3 Pinning infrmatin... 4 Marking...
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List List... Package utline... 1 2 Features... 2 Mechanical data... Maximum ratings... Electrical characteristics... Rating and characteristic curves... 2 2 3 4 Pinning infrmatin... 5 Marking... Suggested
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List List... Package utline... 1 Features... Mechanical data... Maximum ratings and Electrical characteristics... Rating and characteristic curves... 3 Pinning infrmatin... 4 Marking... Suggested slder
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List List... Package utline... 1 2 Features... 2 Mechanical data... Maximum ratings... 2 2 Electrical characteristics... 3 Rating and characteristic curves... 4~5 Pinning infrmatin... 6 Marking... Suggested
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List List... Package utline... 1 Features... Mechanical data... Maximum ratings... lectrical characteristics... Rating and characteristic curves... 3 Pinning infrmatin... 4 Marking... Suggested slder pad
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SMD NPN Transistr Frmsa MS List List... Package utline... 1 2 Features... 2 Mechanical data... Maximum ratings... Switching time equivalent test circuits... Rating and characteristic curves... 2 2~3 4
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List List... Package utline... 1 2 Features... 2 Mechanical data... 2 Maximum ratings... 2 Electrical characteristics... 2 Rating and characteristic curves... 3 Pinning infrmatin... 4 Marking... Suggested
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High Vltage PNP Silicn Transistr Frmsa MS List List... Package utline... 1 2 Features... 2 Mechanical data... Maximum ratings... Rating and characteristic curves... 2 2~3 4~5 Pinning infrmatin... 6 Marking...
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List List... Package utline... 1 2 Features... 2 Mechanical data... Maximum ratings... 2 2 Electrical characteristics... 3~4 Switching time equivalent test circuits... Rating and characteristic curves...
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List List... Package utline... 1 2 Features... 2 Mechanical data... Maximum ratings... Rating and characteristic curves... 2 2~3 4 Pinning infrmatin... 5 Marking... Suggested slder pad layut... 5 5 Packing
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SMD NPN Transistr Frmsa MS List List... Package utline... 1 2 Features... 2 Mechanical data... Maximum ratings... Rating and characteristic curves... 2 2~3 4~6 Pinning infrmatin... 7 Marking... Suggested
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Drive NPN Transistr Frmsa MS List List... Package utline... 1 2 Features... 2 Mechanical data... Maximum ratings... Rating and characteristic curves... 2 2~3 4~5 Pinning infrmatin... 6 Marking... Suggested
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List List... Pakage utline... 1 2 Features... 2 Mehanial data... Maximum ratings... Rating and harateristi urves... 2 2,3,4 5~9 Pinning infrmatin... 10 Marking... Suggested slder pad layut... 10 10 Paking
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