M.Bersanelli Physics Department, University of Milano. IAP, June 2012 M. Bersanelli Beyond CORE Workshop

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1 IAP, Paris, June, 2012 Beyond CORE Workshop: Planning for a Polarization Space Mission Alternative design strategies and technology developments M.Bersanelli Physics Department, University of Milano

2 Foregrounds & technology Most future space projects (e.g., CORE) baseline bolometer detectors What are the prospects for coherent technology? What about European developments? Synchrotron & Spinning dust are important contaminants near foreground minimum What is the required frequency coverage? (for an L-mission?) WMAP polarized foregrounds (Page et al.) We will need full analysis of PLANCK data to answer this quesiton A possible L-mission configuration

3 Coherent detectors Phase-preserving devices - Limitations Fundamental quantum limit in sensitivity, proportional to frequency: T Q hν ν[ghz] = K k log 2 20 Power dissipated in cold focal plane Best achieved so far: 4-5 x T Q Projected performance: 2 3 T Q up to GHz - Advantages Intrinscially polarized (cross pol <0.1%, isolation 0.01%) Operation at 20K rather than 0.1K Very fast time constant Insensitivity to cosmic rays and microphonics Large dynamic range Operation over a broad temperature range Easier testing/validation Lawrence et al. 2009, Journal of Physics, 155,

4 State-of-the-art of cryo HEMT LNAs Recent results from the US 35-nm devices at Northrop Grumman / JPL Significant progress since 2010, when design/fabrication/test cycle re-started after 10-yr funding gap Measured at the flange W-band 4.25 x quantum physical temperature K

5 State-of-the-art of cryo HEMT LNAs Recent results from the US 35-nm devices at Northrop Grumman / JPL Significant progress since 2010, when design/fabrication/test cycle re-started after 10-yr funding gap Measured at the flange W-band 4.25 x quantum physical temperature K P. Kangaslahti s model prediction: 2.5 q.l. Tsys = 11K (HFI 100GHz Tsys = 10-14K) More wafer runs in pipeline, proposal for six more runs

6 New Perspectives for European MMIC technology Laboratories from several European countries have teamed up to develop a reliable source for cryogenic, low-noise HEMTs within Europe Developed several metamorphic mhemt processes with different gate lengths: 100nm, 50nm (process freeze) 35nm (pre-release) 20nm (under development) An industry-style process monitoring is established Technology is well established for room-temperature device performance at high device yields Ongoing Cryo: - characterization of the cryogenic performance of the existing processes - modify process to optimize cryogenic performance Beyond CORE Workshop

7 New Perspectives for European MMIC technology Cryo-mHEMT Technology Beyond CORE Workshop

8 New Perspectives for European MMIC technology IAF mhemt Process M. Seelmann-Eggebertet al. IEEE MicrowaveSymp. Digest 2010,(MTT), p. 501ff Beyond CORE Workshop

9 New Perspectives for European MMIC technology Cryogenic on-wafer process characterization Beyond CORE Workshop

10 European cryo HEMTs: Recent results MMIC Coplanar 10-18GHz, early 100nm Run Beyond CORE Workshop

11 European cryo HEMTs: Recent results Ka band MMIC Coplanar, 100 nm - Run 732b Beyond CORE Workshop

12 European cryo HEMTs: Recent results Q band MMIC Microstrip, 100 nm - Run 740 Beyond CORE Workshop

13 European cryo HEMTs: Recent results W-bandMMICs, 50nm Run 735b 15K opration Beyond CORE Workshop

14 European cryo HEMTs: Recent results W-bandMMICs, 50nm Run 735b 15K opration Beyond CORE Workshop

15 New Perspectives for European MMIC technology ASI-funded mm-wave tech-dev programme Passive components Coherent detectors Bolometric detectors

16 New Perspectives for European MMIC technology ASI-funded mm-wave tech-dev programme New developments in MMIC packaging (L. Valenziano et al., SPIE 2012) Modeling thermo-mechanical stresses Improved techniques for LNA chip gluing, Quantifying required accuracy for components integration Assembly with back-toback probes and no wirebonding. Ideal extreme case for S11/S22. Stress on MMIC chip induced by differential thermal contraction between InP LNA and Titanium packaging

17 New Perspectives for European MMIC technology ASI-funded mm-wave tech-dev programme Validation of European foundry processes for low noise cryo HEMTs (A. Cremonini et al., SPIE 2012) OMMIC (France) W-band, GHz Fraunhofer IAF (Germany) OMMIC MMIC Layout of a microstrip four stages W-band Low Noise amplifier IAF MMIC Layout of a grounded coplanar five stages W-Band Low Noise Amplifier

18 New Perspectives for European MMIC technology ASI-funded tech-dev programme Validation of European foundry processes for low noise cryo HEMTs W-band, GHz (A. Cremonini et al., SPIE 2012) Comparing modeled 300K OMMIC meas. vs model IF IAF measurements will confirm prediction, AND IF cryo campaign is successful THEN performance will be competitive

19 New Perspectives for European MMIC technology ASI-funded tech-dev programme F. Del Torto, C. Franceaschet, et al. W-Band feed-horn array (platelet technique) ASI millimetrico (F. Del Torto, 2012) Design of Q-Band OMT s with platelet technique Thesis, G. Trevisan & G.B. Gotti (2012)

20 New Perspectives for European MMIC technology ASI-funded tech-dev programme A. Orfei et al., R. Tascone et al. Cluster di OMT in Q-band and W-band New configuration OMT in guida 33-50GHz

21 New Perspectives for European MMIC technology ASI-funded tech-dev programme A. Simonetto et al. Characterization of large arrays of Feed-Horns (NearField) - Fast measurement of antenna radiation pattern - Scalable up to thousands elements arrays - Low Cost w.r.t. traditional antenna tests Integrated system test (Feed-Horn & OMT)

22 University of Manchester Advanced Technology Group Academics: Lucio Piccirillo, Mike Cruise, Danielle George PDRAs: Simon Melhuish, Scott Lewis, Pete McGovern, Lorenzo Trojan Post-grad: Mark McCulloch, Shahram Amiri Students: Susana Fernandez, Zoe Landgraf Senior Engineers: Lorenzo Martinis Towards the quantum limit at Ka, Q and W-band Our research lines: Understand the noise mechanisms in HEMT transistor as a function of physical temperature Improve the processing (I-gate and T-gate) Reducing I d to achieve much lower dissipation towards 4K operations and below Towards large arrays of low noise, low power dissipation MMIC amplifiers at cm/mm wavelengths Beyond CORE Workshop

23 L. Piccirillo et al. Pospieszalski simple noise formula min ( ) f T f RT T t g d ft R t = R S + R d + R i (typical of the processing) T g : physical temperature of the gate T d ~ 100K: non-physical temperature, connected to drain current I d (here needs research in the physics of the device) f T depends on gate length f max = v e 2π L Lower R t, T g, T d Higher f T g Beyond CORE Workshop

24 L. Piccirillo et al. I-gate vs T-gate T-gates are used to have a small foot-print and a small bulk resistance They are realized using a 3-layer resist process Issues in term of yield mostly because of limitations in aspect ratio, i.e., ratio between height and foot print Manchester has developed a novel resist with high aspect ratio Conventional T-gate Beyond CORE Workshop

25 Attack the problem: novel I-gate design Improve the physics of the e-beam resist Develop a resist with extremely low sensitivity to scattering Will result in high aspect ratio Record aspect ratio achieved! Electron beam Electron beam (H/L) of 98:1 Scattering L. Piccirillo et al. Resist A Resist B Substrate Lower parasitics Single step manufacturing Smaller gate length higher f T lower noise Planning a collaboration with Caltech/JPL for new MMICs based on our I-gate Beyond CORE Workshop

26 L. Piccirillo et al. Low I d Lowering I d has two advantages: - Lower T d (?) - Lower dissipation large format arrays? Amplify in the linear regime of V-I curve Going to lower physical temperatures might help Certainly needs experimental research Summary from Manchester Manchester ATG is involved in R&D on HEMT transistors potentially interesting for space applications Towards the quantum limit and low power dissipation SPACE! Novel processing with proprietary resist to improve the yield on 35 nm JPL Beyond CORE Workshop

27 Focal plane array Feed module LSPE/STRIP: Instrument design Cryogenic array of HEMT-based pseudo-correlation polarimeters MB, A. Mennella, G. Morgante, M. Zannoni et al. SPIE 2012 OMT module P = 3W, T = 20K 49 elements Q-band 7 elements W-band Pseudocorrelation polarimeter (QUIET-like design) QUIET/STRIP Polarimeter module Tn 20K

28 STRIP: Optical design M. Sandri, F. Villa, et al. Dragonian side-fed Classical Gregorian Inverse Cassegrain

29 STRIP: Instrument design Cryogenic array of HEMT-based pseudo-correlation polarimeters M. Sandri, F. Villa, et al.

30 Calibration Targets F. Cuttaia et al. Calibration targets are essential part of polarimeter design BB optimal cryo Calibrators & RF-thermal modelling: Unique experience gained from Planck Challenge: include absolute measure of CMB spectrum? Wire Grid

31 Calibration Targets F. Cuttaia et al. Calibration targets are essential part of polarimeter design BB optimal cryo Calibrators & RF-thermal modelling: Unique experience gained from Planck 4KRL Model EM PLANCK LFI 4KRL PLANCK LFI-HFI: Sky Load Target (CSL, Liege 2008) Challenge: include absolute measure of CMB spectrum?

32 With present LNA performance 230nK per 1 pixel

33 With model-extrapolated LNA performance 70nK per 1 pixel

34 Double satellite concept GHz, self-calibrating, formation-flight system CORE1 Angular resolution = GHz 3-axis control Maximise commonalities of SVMs, operations, etc (cost effective) CORE2 Angular resolution = 1 23, 30, 44, 70, 100 GHz Mutual polarized calibrators In-flight tests: far sidelobes, bolometer time constant,

35 CORE 2 A concept for a HEMT-based instrument Dragonian side-fed optics Modular focal plane array

36 CORE 2 A concept for a HEMT-based instrument

37 CORE 2 A concept for a HEMT-based instrument 243 modules, Cooling power: 9.2W Planck Sorption Cooler with 35K precooling would get 10W cooling power Telescope apertures: 100m, 75cm, 50cm, 2 x 30cm

38 Double satellite concept CORE2 CORE1

39 Summary Priorities - Optimise for primordial CMB fluctuations (then, ancillary science) - Sensitivity: ~sub-100nk per pixel - Angular resolution ~deg - Systematics and foregrounds are likely to set ultimate limit Frequency coverage? - Frequency bands to be chosen to remove foregrounds (then, ancillary science) - Limited (~20%) bandpasses to ensure spectral discrimination - Planck data will need to be metabolized before we know the answer Coherent technology - Amplifiers competitive to GHz (depending on future developments) - Excellent inherent systematic rejection, easy (and less expensive) operating temperature of 20 K, freedom from cosmic rays, and super fast response times. - European HEMT/coherent technology extremely promising L-mission? - A double spacecraft mission may offer best option for spectral coverage, thermal decoupling, in-flight calibration & testing, systematics crosscheck, max heritage from Planck - In alternative: Coordinated ground-based program?