Full Color SMT Chip LED (3.5 x 3.0 x 1.4 mm)

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1 Full Color SMT Chip LED (3.5 x 3.0 x 1.4 mm) x Red/green/blue + white in single surface mount package x 8 mm tape on 7 reel compatible with automatic placement equipment x Each chip individually addressable to provide color on-demand x ESD protected [± 1 kv, 1 time (200 pf 0 Product Photo Here The is a full-color chip LED with multiple viewing angles and the ability to produce all colors of the visible spectrum, plus white. This small package, combined with high-light output, is ideal for miniature applications. Applications x Automotive (backlighting in dashboard and switches) x Telecommunications (indicator and backlighting in telephone and fax) x Flat backlight (LCDs, membrane switches and symbols) x Personal/portable appliances (mobile phones, pagers, audio/video players and GPS) Part Number Material Emitted Color Intensity Typ. mcd AlInGaP/InGaN Red/Green/Blue 53/165/46 Lens Color Water Clear SOLDER PATTERN RoHS Moisture DO NOT LOOK DIRECTL AT LED WITH UNSHIELDED EES OR DAMAGE TO RETINA MA OCCUR. Page 1 of 9

2 Absolute Maximum Ratings T A = 25 o C unless otherwise noted SMBOL P D I F P D I F Notes: 1. Duty 2. T OPR = 40 ~ 80 C. Use under this condition. Electrical Characteristics T A = 25 o C unless otherwise noted SMBOL PARAMETER MIN TP MA UNITS CONDITIONS V F Forward Voltage V I F = 20 I R Reverse Current µa V R = 5 V I V PARAMETER Power Dissipation (1 chip on) DC Forward Current (1 chip on) Power Dissipation (2 or 3 chips on) DC Forward Current (2 or 3 chips on) Luminous Intensity (Axial Direction) RED VALUE RED GREEN BLUE mcd I F = 20 d Dominant Wavelength nm I F = 20 Spectral Line Half Width nm I F = 20 UNIT mw mw I FP Pulsed Forward Current I F DC forward Current Reduction 2 (T A ƒ& (1 chip on) DC forward Current Reduction 2 (T A ƒ& (3 chips on) / C T OPR Operating Temperature -30 ~ +80 C T STG Storage Temperature -40 ~ +100 C Page 2 of 9

3 Electrical Characteristics T A = 25 o C unless otherwise noted GREEN SMBOL PARAMETER MIN TP MA UNITS CONDITIONS V F1 Forward Voltage V I F = 20 V F V I F = 5 µa I V Luminous Intensity (Axial Direction) mcd I F = 20 d Dominant Wavelength nm I F = 20 Spectral Line Half Width nm I F = 20 Electrical Characteristics T A = 25 o C unless otherwise noted BLUE SMBOL PARAMETER MIN TP MA UNITS CONDITIONS V F V I F = 20 Forward Voltage V F V I F = 5 µa I V Ranking I F = 20 Luminous Intensity (Axial Direction) mcd I F = 20 d Dominant Wavelength nm I F = 20 Spectral Line Half Width nm I F = 20 LUMINOUS INTENSIT (mcd) RANK RED GREEN BLUE J 25 ~ ~ 165 K 46 ~ ~ 53 L 25 ~ ~ 372 M 46 ~ 101 N 25 ~ ~ 165 P 46 ~ ~ 127 Q 25 ~ ~ 372 R 46 ~ 101 Page 3 of 9

4 Reliability Tests TEST ITEM Operating Test High Temp Storage Test Low Temp Storage Test High Humidity Storage Test High Temp Operating Test High Temp and High Humidity Operating Test Temperature Cycle Test Thermal Shock Test STANDARD TEST TEST CONDITIONS FAILURE RATE 2, 3 METHOD 1 ED-4701 D-511 B-111A B-112A B-121A 1 chip on 4 T A = 25 C, I F = 25, DC 2 t = 1000 hours 3 chips on 4 T A = 25 C, I F = 10, DC 2 t = 1000 hours T A = 100 C, t = 1000 hours T A = 30 C, t = 1000 hours T A = 85 C, RH W KRUV chip on 4 T A = 80 C, I F = 8, DC 2 t = 1000 hours T A = 60 C, RH 1 chip on 4 t = 1000 hours, B-122A B-131A B-141A I F = 16, DC T A = (-30 C, 30 minutes ~ 100 C, 30 minutes) x 100 cycles T A = (-40 C, 5 minutes ~ 80 C, 5 minutes) x 50 cycles Fall Test ---- h = 1 m, maple tree board, 10 times Failure Criteria SMBOL ITEM MIN MA CONDITIONS V F ---- U.S.L. x I F = 20 Forward Voltage V R I F = 5 µa I R Reverse Current (red only) µA V R = 5 V I V Luminous Intensity L.S.L. x I F = 20 Notes: 1. Number: EIAJ ( Electronic Industries Association of Japan ) standard methods are used. 2. Failure rate is obtained when there is no damage by static electricity. 3. Failure rate evaluated based on Criteria for Judging the Damage table. 4. One (1) chip on = electric current only to one color in one LED. Three (3) chips on = electric current to the red, the green and the blue simultaneously. 5. U.S.L.: Upper Standard Level (see maximum values on red, green and blue Electrical tables on pages 2 and 3). 6. L.S.L.: Lower Standard Level (see minimum values on red, green and blue Electrical tables on pages 2 and 3). Page 4 of 9

5 Radiation Patterns T A =25 C T A =25 C Relative Luminous Intensity Relative Luminous Intensity Cathode Mark Page 5 of 9

6 Typical Electro-Optical Characteristics Curves % Forward Voltage vs Forward Current V Forward Current vs Relative Luminous Intensity I F=20 T A=25 C % % C Ambient Temperature vs Relative Luminous Intensity nm Wavelength vs Relative Intensity ALLOWED AREA TO OPERATE: I P-TA 1 chip 3 chips C Forward Current vs Ambient Temperature Page 6 of 9

7 Typical Electro-Optical Characteristics Curves nm Red: Forward Current vs Dominant Wavelength Red: Forward Current vs Chromaticity Diagram nm Green: Forward Current vs Dominant Wavelength Green: Forward Current vs Chromaticity Diagram nm Blue: Forward Current vs Dominant Wavelength Blue: Forward Current vs Chromaticity Diagram Page 7 of 9

8 Carrier Tape Dimensions: Loaded quantity 1000 pieces per reel Vacant SMD Parts Vacant Cover Tape END START Vacant (min. 15 pcs) Vacant (min. 10 pcs) Min. 200 UNIT: MM Cathode Mark Center Hole Progressive Direction Notes: 1. General tolerance is ± Cover tape peeling-off strength is N (10 tear-away angle of the cover tape and the carrier tape). Page 8 of 9

9 Packing Information: 1000 pieces on 7-inch reel sealed in ESD protected bag TAPING REEL DIMENSION UNIT: MM Label (product name, product number, lot number Moisture Resistant Packaging Label Aluminum Moisture-proof Bag Desiccant Bar Code Label Page 9 of 9

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