1. Automotive : Dashboards, stop lamps, turn signals. 2. Backlighting : LCDs, Key pads advertising. 3. Status indicators : Comsumer & industrial

Transcription

1 Features: 1. Emitted Color : Super Red Package Dimensions: 2. Lens Appearance : Water Clear. 3. Mono-color type x1.x1.7mm(124) standard package. 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn t contain restriction Substance, comply ROHS standard. Applications: 1. Automotive : Dashboards, stop lamps, turn signals. 2. Backlighting : LCDs, Key pads advertising. 3. Status indicators : Comsumer & industrial NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is ±.1mm (.4 ) unless otherwise specified. 3.Specifications are subject to change without notice. electronics. 4. General use. Absolute Maximum Ratings(Ta=25 ) Parameter Symbol Rating Unit Power Dissipation Pd 8 mw Forward Current I F 3 ma Peak Forward Current *1 I FP 1 ma Reverse Volage V R 5 V Operating Topr -25 ~8 - Storage Tstg -3 ~85 - Soldering Tsol See Page6 - *1 Condition for I FP is pulse of 1/1 duty and.1msec width. Ver.1.1 Page 1 of 7

2 Electrical and optical characteristics(ta=25 ) Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage Vf I F =2mA V Luminous Intensity Iv I F =2mA mcd Reverse Current I R V R =5V µa Peak Wave Length λp I F =2mA nm Dominant Wave Length λd I F =2mA nm Spectral Line Half-width Δλ I F =2mA nm Veiwing Angle 2θ 1/2 I F =2mA deg Typical Electro-Optical Characteristics Curves 1. Fig.1 Relative intensity vs. wavelength 6 Fig.2 Forward current derating curve vs. ambient temperature 5 Relative radiant intensity.5 Forward current (ma) Wavelength (nm) Ambient temperature Ta( C) Fig.3 Forward current vs. forward voltage 3. Fig.4 Relative luminous intensity vs. ambient temperature Forward current (ma) Relative Luminous intensity Forward voltage(v) Ambient A temperature Ta( C) Fig.5 Relative luminous intensity vs. forward current 2. Fig.6 Radiation diagram Relative luminous intensity (@2mA) Forward current (ma) Relative radiant intensity Ver.1. Page 2 of 7

3 Tapping and packaging specifications(units: mm) USER DIRECTION OF FEED 17.2± ± ±.1 ANODE START END CATHODE 5.3 ±.5 4. ±.1 4. ±.1 1.5±.1 2.± ± ±.5 8. ± ± ± 1 FIXING TAPE TRAILER 13.±.5 179± 1 LEADER NOTE: 3 pcs PER REEL Package Method:(unit:mm) 1 bag/box 3 pcs/reel Bar Code Label Aluminum Foil Bag box/carton Ver.1. Page 3 of 7

4 Bin Limits Intensity Bin Limits (At 2mA) BIN CODE Min. (mcd) Max. (mcd) M N P Q BIN: x Intensity BIN CODE Ver.1. Page 4 of 7

5 Reliability Test Classification Test Item Reference Standard Test Conditions Result Operation Life MIL-STD-75:126 MIL-STD-883:15 Connect with a power If=2mA Ta=Under room temperature /2 JIS-C-721 :B-1 Test time=1,hrs High Ta=+65 ±5 MIL-STD-22:13B RH=9%-95% High Humidity JIS-C-721 :B-11 Test time=24hrs /2 Storage Endurance Test Environmental Test High Storage Low Storage Cycling MIL-STD-883:18 JIS-C-721 :B-1 JIS-C-721 :B-12 MIL-STD-22:17D MIL-STD-75:151 MIL-STD-883:11 JIS-C-721 :A-4 Thermal Shock MIL-STD-22:17D MIL-STD-75:151 MIL-STD-883:111 Solder Resistance MIL-STD-22:21A MIL-STD-75:231 JIS-C-721 :A-1 High Ta=+85 ±5 Test time=1,hrs /2 Low Ta=-35 ±5 Test time=1,hrs /2-35 ~ +25 ~ +85 ~ +25 6min 2min 6min 2min Test Time=5cycle -35 ±5 ~+85 ±5 2min 2min Test Time=1cycle Preheating: 14-16,within 2 minutes. Operation heating: 235 (Max.), within 1seconds. (Max.) /2 /2 /2 Judgment criteria of failure for the reliability Measuring items Symbol Measuring conditions Judgement criteria for failure Forward voltage V F ( V) I F =2mA Over Ux1.2 Reverse current I R (ua) V R =5V Over Ux2 Luminous intensity Iv ( mcd ) I F =2mA Below SX.5 Note: 1.U means the upper limit of specified characteristics. S means initial value. 2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver.1. Page 5 of 7

6 Soldering : 1. Manual Of Soldering The temperature of the iron tip should not be higher than 3 (572 ) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 14 ~16 ±5,within 2 minutes. Operation heating : 235 (Max.) within 1 seconds.(max) Gradual Cooling (Avoid quenching). 1 SEC. MAX. 235 MAX. 14~16 4 /SEC. MAX. OVER 2 MIN. 4 /SEC. MAX. Time 3. DIP soldering (Wave Soldering) : Preheating : 12 ~15,within 12~18 sec. Operation heating : 245 ±5 within 5 sec.26 (Max) Gradual Cooling (Avoid quenching). Soldering heat Max ~15 Preheat 12~18 sec. 245 ±5 within 5 sec. Handling : Time Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. Ver.1. Page 6 of 7