SPECIFICATION. Product : White Top-View SMD LED (3528)

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1 SPECIFICATION Product : White Top-View SMD LED (3528) Part No. : Date : Ver. 1.0 Proposed By Checked By Checked By Checked By Approval Comment Incheon Company : 58B-4L, Gojan-dong, Namdong-gu, Incheon KOREA TEL: , FAX: Ochang Company : 9-4BL, Ochang Scientific Industrial Complex, , Namchon-ri, Oksan-myeon, Cheongwon-gun, Chungbuk, , KOREA TEL: , FAX: , URL: Version of 1.0 PAGE : 1 / 12

2 1. Features High-Luminosity SMD LED 3.5 mm x 2.8 mm x 0.8 mm (L x W x H) Small Size Surface Mount Type Wide Viewing Angle Long Operating Life 2. Applications Automotive: Backlight in Dashboard and Switch General Lighting General Use 3. Outline Drawing and Dimension Unit : mm Tolerance : ± mm 2.03mm 0.85mm 0.66mm 2.80 mm 2.80 mm <Top view> <Bottom view> mm mm 0.66 mm <Side view> <Circuit diagram> Note 1. All dimensions are in millimeters 2. All dimensions without tolerances are for reference only Version of 1.0 PAGE : 2 / 12

3 4. Absolute Maximum Ratings ( Ta = 25 ) Parameter Symbol Value Unit Power Dissipation per Chip P d 432 mw Continuous Forward Current I F 120 ma Peak Forward Current 1 I FP 300 ma Operating Temperature T opr -30 ~ +85 Storage Temperature T stg -40 ~ +100 Soldering Temperature T sol 260 (5sec) 1 Duty ratio = 1/10, Pulse width = 10ms 5. Electrical & Optical Characteristics (Ta : 25 ) Parameter Symbol Conditions Min. Typ. Max. Unit. Forward Voltage V F I F = 100mA V Reverse Voltage V R I R = 5mA V Color Coordinates I F = 100mA - =0.372 = Luminous Intensity 2 I V I F = 100mA 5,000-9,600 mcd Luminous Flux 3 Φ V I F = 100mA lm View Angle 4 I F = 100mA θ 1/2 deg 2 Luminous Intensity is tested by a tester calibrated by CAS 140B(CIE LED_B) and has an accuracy of 10%. 3 Luminous Flux is measured with an integrating sphere and has an accuracy of 10%. 4 Viewing angle is the angle until 50% of brightness measured from the front part of LED. 5.1 Luminous Intensity Rank (IF=100mA) Rank Luminous Intensity (mcd) 5.2 Luminous Flux Rank (IF=100mA) Rank Luminous Flux (lm) G 5,000~6,200 G 20~24 H 6,200~7,700 H 24~29 J 7,700~9,600 J 29~35 Version of 1.0 PAGE : 3 / 12

4 5.3 Forward Voltage Rank Rank Forward Voltage(V) 2.9 ~ ~ ~ ~ ~ ~ ~ Color Coordinates Rank ( IF = 100 ma, Ta = 25 ) Rank Z Rank A Rank B Rank C Rank D 7000~ ~ ~ ~ ~ Rank E Rank F Rank G Rank H Rank J 4500~ ~ ~ ~ ~ Rank K Rank P Rank Q Rank R 3400~ ~ ~ ~ Version of 1.0 PAGE : 4 / 12

5 Rank Z2 Rank A1 Rank A2 Rank B1 Rank B2 Rank C Rank Z4 Rank A3 Rank A4 Rank B3 Rank B4 Rank C Chromaticity Diagram Version of 1.0 PAGE : 5 / 12

6 6. Typical Characteristic Curve Forward Current(mA) Forward Current vs. Forward Voltage Forward Voltage(V) Relative Luminous Intensity vs. Ambient Temperature Relitive Luminous Intensity Lead Temperature( o C) Relative Luminous Intensity vs. Wavelength ( - Cold White - Cool white -- Warm White ) 1.0 Forward Current vs. Ambient Temperature DC Forward Current(mA) Relative Luminous Intensity vs. Forward Current Relative Luminos Intensity(%) Ambient Temperature( o C) DC Fordward Current(mA) Radiation Diagram Relative intensity Wavelength(nm) Version of 1.0 PAGE : 6 / 12

7 7. Dimension of Tape / Reel 7.1 Tape Dimension 4.00± ±0.1 A?1.1±0.1 A' 2.00±0.05 B' B 3.5± ±0.1 (2.75) 8.0± ±0.1 MAX ±0.05 *R *R 0.85 Cathode Cathode Anode Anode SECTION B-B' Tolerance ±0.1, Unit: mm MAX 5 *R *R SECTION A-A' 7.2 Reel Dimension Version of 1.0 PAGE : 7 / 12

8 8. Packing Dimension Unit :mm 250 Bake: 60 C, 4hrs 220 Wheel Label Label Diameter : 180 mm Width : 12 mm P351 Series 3,000 pcs/reel Shield Bag(Polyester/Al/LDPE) 1 Reel/Bag ( T = 0.1 mm ) with Silica gel Al Pack Label, Reel Label (70 37) Lot : VF[volt] IV[mcd] CIE[x,y] MIN AVG MAX STD CHIP LED Label 226 Q ty : yyyy/mm/dd Maximum 10 Bags / 1Inner Box P351 Series 30,000 pcs / 1 Inner Box Version of 1.0 PAGE : 8 / 12

9 9. Precaution in use 9.1 Soldering Conditions When soldering Power SMD, Heat may affect the electrical and optical characteristics of the LEDs. In soldering, do not stress the lead frame and the resin part under the high temperature. The silicone part should be protected from mechanical stress or vibration until the Power SMD return to room temperature after soldering. Preliminary heating to be at 160 max. for 120 Seconds max. Soldering heat to be at 260 max. for 5 sec. Max. For manual Soldering is Not more than 3 350, under soldering iron < Lead Free > 260 Max. 5sec. Max. <Recommendable soldering pattern> 1~5 /sec 9.2 Storage 1~5 /sec Pre-heating 140~ sec.Max. 60sec.Max. Above 220 Before opening the package, the LEDs should be kept at 30 or less and 90%RH or less. The LEDs should be used within a year. After opening the package, the LEDs should be kept at 30 or less and 70%RH or less. The LEDs should be used within 168 hours (7 day) after opening the package. If the moisture absorbent material (silicagel) has faded away or the LED have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment: 60 ±5 for 24 hours. 9.3 Static Electricity Static electricity or surge voltage damages the Power SMD. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. A tip soldering iron is requested to be grounded. An ionizer should also be installed where risk of static. All devices, equipment and machinery must be properly grounded (via 1MΩ). It is recommended that measures be taken against surge voltage to the equipment that mounts the Power SMD. 9.4 Cleaning Isopropyl Alcohol or Ethylene Alcohol is recommended in 5 minutes at room temperature. Don t use unspecified chemical may cause crack or haze on the surface of the epoxy resin. Before cleaning, a pre-test should be done to confirm whether any damage to the LED will occur. Freon solvents should not be used to clean the LEDs because of worldwide regulations. 9.5 Heat generation When the LEDs are illuminating, operating current should be decided after being considering the ambient maximum temperature. Please consider the heat generation of the LED when it is designed the PCB. The LED s must be mounted on MCPCB or heat sink or applied thermal pad. <Unit: mm> Version of 1.0 PAGE : 9 / 12

10 10. Reliability 10.1 Reliability Test Item Test Items Test Conditions Notes High Temperature Storage 100, 1,000hr. 0/25 Low Temperature Storage -40, 1,000hr. 0/25 Temp. Humidity Storage 60, 90% RH, 1,000hr. 0/25 Steady State Operating life High Temperature Operating Life Low Temperature Operating Life Steady State Operating life Of High Humidity Heat 25, 120mA, 1,000hr. 85, 42mA, 1,000hr -30, 100mA, 1,000hr. 60, 90% RH, 75mA, 1,000hr. 0/25 0/25 0/25 0/25 Thermal Shock ESD -40 (30min) 100 (30min.), 100 cycle HBM, 100 pf, 1.5 kohm, 3 times 0/20 0/ Criteria for Judging the Damage Items Luminous Intensity ( IV ) Forward Voltage ( VF ) Test Conditions I F = 100mA I F = 100mA Criteria for judgment > 70% of S Less than 110% of U * U means the upper limit of specified characteristics, S means initial value. Version of 1.0 PAGE : 10 / 12

11 11. Part Name Description I W S P351 UW UW : White Color 351 : 3.5 mm x 2.8 mm x 0.8 mm t dimension P : PCB Type Package S : SMD LED IT : Company Name, ITSWELL Co., Ltd. 12. Rank Description G A 3 Voltage Rank Color Coordinates Rank Luminous Intensity / Luminous Flux Rank 13. Attention : Electric Static Discharge (ESD) Protection The symbol shown on the page herein to introduce Electro-Optical Characteristics. ESD protection for GaP and AlGaAs is based chips is still necessary even though they are safe in low static-electric discharge. Material in AlInGaP, GaP, or/and InGaN based chips are STATIC SENSITIVE devices. ESD protection has to considered and taken in the initial design stage. If manual work/process is needed, please ensure the device is well protective from ESD during all the process. LED s ESD Level is Class II and The range of Forward Voltage is 2000V ~ 3999V. Version of 1.0 PAGE : 11 / 12

12 Spec. Review History Review Ver. Date Correction List Etc. Ver Establish Version of 1.0 PAGE : 12 / 12

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