Features. Applications
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1 SMT-QWB-Nxxxx Super 0.5W ool White Power PL-4 Surface Mount LED Indicator Data Sheet Description The Super 0.5W ool White Power PL-4 SMT LED is ool white mid-power PL-4 SMT LEDs using InGaN chip technology. The package can be driven at high current due to its superior package design. The product is able to dissipate the heat more efficiently compared to the Power PL-4 SMT LEDs. These LEDs produce higher light output with better flux performance compared to the Power PL-4 SMT LED. The Super 0.5W ool White Power PL-4 SMT LEDs are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. The performance characteristics of these new mid-power LEDs make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. To facilitate easy pick and place assembly, the LEDs are packed in EI-compliant tape and reel. Every reel is shipped in single intensity and color bin, to provide close uniformity. Features Industry Standard PL 4 platform (3.2x2.8x1.9mm) High reliability package with enhanced silicone resin encapsulation High brightness with optimum flux performance using InGaN chip technologies vailable in ool White vailable in 8mm carrier tape & 7 inch reel Low Thermal Resistance 40 /W Wide viewing angle at 120 degree JEDE MSL 2 pplications 1. Interior automotive a. Instrument panel backlighting b. entral console backlighting c. Navigation and audio system backlighting d. Dome/Map lighting e. Push button backlighting f. Puddle lamp g. Glove compartment illumination 2. Exterior automotive a. Number plate illumination 3. Electronic signs and signals a. Decorative lighting 4. Office automation, home appliances, industrial equipment a. Panel/button backlighting b. Display backlighting UTION: SMT-QWB-Nxxxx LEDs are lass 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to vago pplication Note N-1142 for additional details.
2 Package Drawing 2.8 ± ± ± ± ± ± ± ± 0.2 φ (TYP.) 0.56 (TYP.) 0.97 THODE MRKING 0.7 Notes: 1. ll Dimensions in millimeters. 2. Lead Polarity as shown in Figure Terminal Finish: g plating 4. Encapsulation material: Silicone resin Figure 1. Package Drawing Table 1. Device Selection Guide (T J = 25 ) olor Part Number Luminous Flux, Φ V [1] (lm) Min. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test urrent (m) ool White SMT-QWB-NHJ0E InGaN SMT-QWB-NJK0E InGaN SMT-QWB-NJKQE InGaN Notes: 1. Φ V is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. 2. Tolerance = ±12% Part Numbering System Dice Technology SMT- Q X1 B N X2 X3 X4 X5 Packaging Option olor Bin Selection Max. Flux Bin Selection Min. Flux Bin Selection olor W ool White 2
3 Table 2. bsolute Maximum Ratings (T = 25 ) Parameters D Forward urrent [1] Peak Forward urrent [2] Power Dissipation Reverse Voltage, V 10 µ 4 SMT-QWB-Nxxxx 150 m 300 m 570 mw Junction Temperature 125 Operating Temperature Storage Temperature Notes: 1. Derate Linearly as shown in Figure Duty Factor = 10%, Frequency = 1kHz -40 to to +120 Table 3. Optical haracteristics (T J = 25 ) olor Part Number Dice Technology Typical hromaticity oordinates Viewing ngle 2θ ½ [1] (Degrees) Luminous Efficiency η e (lm/w) x y Typ. Typ. Typ. ool White SMT-QWB-Nxxxx InGaN Notes: 1. θ ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. Total Flux / Luminous Intensity Φ V (lm) / I V (cd) Table 4. Electrical haracteristics (T J = 25 ) Part Number Forward Voltage V F I F = 150 m Typ. Max. SMT-QWB-NxxxE Thermal Resistance Rθ J-P ( /W) 3
4 RELTIVE INTENSITY WVELENGTH - nm Figure 2. Relative Intensity Vs. Wavelength FORWRD URRENT - m FORWRD VOLTGE - V Figure 3. Forward urrent Vs. Forward Voltage. RELTIVE LUMINOUS FLUX. (NORMLIZED T 150 m) D FORWRD URRENT - m Figure 4. Relative Flux vs. Forward urrent NORMLIZED LUMINOUS FLUX. (NORMLIZED T 25 ) T J - JUNTION TEMPERTURE - Figure 5. Relative Flux Vs. Temperature URRENT - m Rθ J = 90 /W Rθ J = 110 /W Figure 6a. Maximum Forward urrent Vs. mbient Temperature. Derated Based on T JMX = 125, Rθ J- = 110 /W & 90 /W. URRENT - m Rθ JP = 40 /W TEMPERTURE ( ) Figure 6b. Maximum Forward urrent Vs. Solder Point Temperature. Derated Based on T JMX = 125, Rθ J-P = 40 /W. 4
5 URRENT D = D = t t p p T T I F E E E E+01 t p - Time - (S) Figure 7a. Maximum Pulse urrent Vs. mbient Temperature. Derated Based on T = 25, Rθ J- = 110 /W. URRENT D = t p T D = E E E E+01 t p - Time - (S) Figure 7b. Maximum Pulse urrent Vs. mbient Temperature. Derated Based on T = 85, Rθ J- = 110 /W. t p T I F OORDINTE SHIFT x y FORWRD URRENT - m Figure 8. hromaticity Shift Vs. Forward urrent FORWRD VOLTGE SHIFT - V TJ - JUNTION TEMPERTURE - Figure 9. Forward Voltage Shift Vs. Temperature. HROMTIITY OORDINTE SHIFT x y T J - JUNTION TEMPERTURE - Figure 10. hromaticity Shift Vs. Temperature NGULR DISPLEMENT - DEGREES Figure 11. Radiation Pattern NORMLIZED INTENSITY 5
6 10-30 SE. ID Note: Diameter "ID" should be bigger than 2.3mm TEMPERTURE /SE. MX. 3 /SE. MX. 6 /SE. MX SE. 100 SE. MX. TIME (cc. to J-STD-020) Figure 12. Recommended Pick and Place Nozzle Size Note: For detail information on reflow soldering of vago surface mount LEDs, do refer to vago pplication Note N 1060 Surface Mounting SMT LED Indicator omponents. Figure 13. Recommended Pb-free Reflow Soldering Profile X x THODE MRKING SOLDER MSK NODE THODE THODE MRKING MINIMUM 55 mm 2 OF THODE PD FOR IMPROVED HET DISSIPTION Figure 14. Recommended Soldering Pad Pattern 6
7 TRILER OMPONENT LEDER 200 mm MIN. FOR Ø180 REEL. 200 mm MIN. FOR Ø330 REEL. 480 mm MIN. FOR Ø180 REEL. 960 mm MIN. FOR Ø330 REEL. USER FEED DIRETION Figure 15. Tape Leader and Trailer Dimensions Ø ± ± ± ± ± ± ± ± 0.1 Ø ± LL DIMENSIONS IN mm. Figure 16. Tape Dimensions USER FEED DIRETION THODE SIDE PRINTED LBEL Figure 17. Reeling Orientation 7
8 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. s silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to vago pplication Note N 5288 for detail information. Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to vago pplication Note N5305 Handling of Moisture Sensitive Surface Mount Devices for details.. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40 /90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HI indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQ). B. ontrol after opening the MBB - The humidity indicator card (HI) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30 / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours.. ontrol for unfinished reel - For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. ontrol of assembled boards - If the PB soldered with the LEDs is to be subjected to other high temperature processes, the PB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - The HI indicator is not GREEN at 10% and is ZURE at 5% - The LEDs are exposed to condition of >30 / 60% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 60±5º for 20hrs F. Use of LED Device olor (X 1 ) W ool White Flux Bin Select (X 2 X 3 ) Individual reel will contain parts from one bin only X 2 X 3 Flux Bin Limits Min Flux Bin Max Flux Bin Bin ID Min. (lm) Max. (lm) B D E F G H J K L Tolerance of each bin limit = ± 12% olor Bin Select (X 4 ) Individual reel will contain parts from one sub bin only. X 4 0 Full Distribution B D E F G H J K L M N P Q R S Do not use materials that contain corrosive substance such as sulfur with the LED during assembly process and application. Silicone is permeable for gases, corrosive gases will permeate into the LED and corrode the leadframe plating result in open contact. 5K and 5L only 6K and 6L only 7K and 7L only 8K and 8L only 5K and 6K only 5L and 6L only 6K and 7K only 6L and 7L only 7K and 8K only 7L and 8L only 5K, 5L, 6K and 6L only 6K, 6L, 7K and 7L only 7K, 7L, 8K and 8L only 5L only 6L only 7L only 8L only 8
9 olor Bin Limits Bin ID Sub Bin ID Limits (hromaticity oordinates) 5K 5Ka x y Kb x y Kc x y Kd x y L 5La x y Lb x y Lc x y Ld x y K 6Ka x y Kb x y Kc x y Kd x y L 6La x y Lb x y Lc x y Ld x y Bin ID Sub Bin ID Limits (hromaticity oordinates) 7K 7Ka x y Kb x y Kc x y Kd x y L 7La x y Lb x y Lc x y Ld x y K 8Ka x y Kb x y Kc x y Kd x y L 8La x y Lb x y Lc x y Ld x Tolerance of each bin limit = ±0.01 y
10 Ld Y-OORDINTE Lb 6La 6Ld 6Lc 6Kd 6Kc 7Lb 7La 7Kb 7Ka 7Ld 7Lc 7Kd 7Kc 8Kb 8Ka 8Lb 8La 5600K K 8Lc 8Kd 8Kc 5000K K Lb 5La 5Kb 5Ka 5Ld 5Lc 5Kd 5Kc 6Kb 6Ka 10000K K 7000K K X-OORDINTE V F Bin Limits Bin ID Min. Max. S S S Tolerance of each bin limit = ±0.1V Packaging Option (X 5 ) Option Test urrent Package Type Reel Size E 150m Top Mount 7 Inch For product information and a complete list of distributors, please go to our web site: vago, vago Technologies, and the logo are trademarks of vago Technologies in the United States and other countries. Data subject to change. opyright vago Technologies. ll rights reserved. V EN - December 11, 2014
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