Data Sheet. ASMT- Mx2x / ASMT- MxEx Moonstone TM 3W Power LED Light Source. Description. Features. Applications. Specifications

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1 SMT- Mx2x / SMT- MxEx Moonstone TM 3W Power LED Light Source Data Sheet Description The Moonstone 3W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. The Cool White Power LED is available in various color temperature ranging from 4000K to 10000K and Warm White Power LED ranging from 2600K to 4000K. The low profile package design is suitable for a wide variety of applications especially where height is a constraint. The package is compatible with reflow soldering. This will give more freedom and flexibility to the light source designer. pplications Sign backlight Safety, exit and emergency sign lightings Specialty lighting such as task lighting and reading lights Retail display Commercial lighting ccent or marker lightings, strip or step lightings Portable lightings, bicycle head lamp, torch lights. Decorative lighting rchitectural lighting Pathway lighting Street lighting Pedestrian street lighting Tunnel lighting Features vailable in Cool White & Warm White color Energy efficient Exposed pad for excellent heat transfer Suitable for reflow soldering process High current operation Long operation life Wide viewing angle Silicone encapsulation Non-ESD sensitive (threshold > 16KV) MSL 4 products vailable in both electrically isolated and non-isolated metal heat slug Specifications InGaN Technology 4.3 V (max) at 700 m 120 viewing angle

2 Package Dimensions node Cathode Heat Sink 8.50 Metal Slug Ø LED + ZENER Ø Notes: 1. ll dimensions are in millimeters. 2. Unless otherwise stated, the tolerance for dimension is ±0.1mm. 3. Metal slug is connected to anode for electrically non-isolated option. Device Selection Guide (T J = 25 C) Color Part Number Luminous Flux, Φ v [1,2] (lm) Min. Typ. Max. Test Current (m) Die Technology Cool White SMT-MW InGaN No SMT-MW22 Warm White SMT-MY InGaN No Cool White Diffused Warm White Diffused SMT-MY22 SMT-MWE InGaN No SMT-MWE2 SMT-MYE InGaN No SMT-MYE2 Notes: 1. Φ V is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition. 2. Flux tolerance is ±10%. Electrically Isolated Metal Slug Yes Yes Yes Yes 2

3 Part Numbering System SMT-M x x x N x1 x2 x3 x4 Packaging Option Color Bin Selection Max Flux Bin Selection Min Flux Bin Selection Heat Sink 0 Electrically Non-isolated 2 Electrically Isolated Silicone Type 2 Non-diffused E Diffused Color W Cool White Y Warm White Note: 1. Please refer to Page 7 for selection details. bsolute Maximum Ratings Parameter SMT-Mx2x / SMT-MxEx Units DC Forward Current [1] 700 m Peak Pulsing Current [2] 1000 m Power Dissipation 3010 mw Reverse Voltage 5 V LED Junction Temperature 125 C Operating Metal Slug Temperature Range at 700m -40 to +95 C Storage Temperature Range -40 to +120 C Soldering Temperature Refer to Figure 8 Note: 1. Derate linearly based on Figure Pulse condition: duty factor = 10%, Frequency = 1 khz. 3

4 Optical Characteristics at 700 m (T J = 25 C) Part Number SMT-MW20 SMT-MW22 SMT-MY20 SMT-MY22 SMT-MWE0 SMT-MWE2 SMT-MYE0 SMT-MYE2 Color Correlated Color Temperature, CCT (Kelvin) Viewing ngle 2θ ½ [1] ( ) Min. Max. Typ. Typ. Cool White Warm White Cool White Diffused Warm White Diffused Notes: 1. θ ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. Luminous Efficiency (lm/w) Electrical Characteristic at 700 m (T J = 25 C) Dice Type Forward Voltage, V F (Volts) at I F = 700 m Thermal Resistance, Rθ j-ms ( C/W) [1] Min. Typ. Max. Typ. Typ. InGaN to -3.5 Note: 1. Rθ j-ms is the Thermal Resistance from LED junction to metal slug. Temperature Coefficient of Forward Voltage (mv/ C), V F / T J Typical Characteristic at 350 m (T J = 25 C) Part Number SMT-MW20 SMT-MW22 SMT-MY20 SMT-MY22 SMT-MWE0 SMT-MWE2 SMT-MYE0 SMT-MYE2 Color Luminous Flux, Φ V (lm) Cool White Warm White Cool White Diffused Warm White Diffused Typ. Forward Voltage, V F (Volts) Typ. 4

5 RELTIVE INTENSITY WRM WHITE COOL WHITE WVELENGTH - nm Figure 1. Relative Intensity vs. Wavelength. RELTIVE LUMINOUS FLUX (NORMLIZED T 700 m) DC FORWRD CURRENT - m Figure 2. Relative Luminous Flux vs. Forward Current. FORWRD CURRENT - m FORWRD VOLTGE - V Figure 3. Forward Current vs. Forward Voltage. NORMLIZED INTENSITY NGULR DISPLCEMENT - DEGREES Figure 4. Radiation Pattern. RELTIVE LIGHT OUTPUT (NORMLIZED T 25 C) WRM WHITE COOL WHITE JUNCTION TEMPERTURE, T J - C Figure 5. Relative Light Output vs. Junction Temperature. 5

6 MX LLOWBLE DC CURRENT - m Rθ J- = 20 C/W Rθ J- = 25 C/W Rθ J- = 30 C/W T - MBIENT TEMPERTURE - C Figure 6. Maximum Forward Current vs. mbient Temperature. Derated based on TJMX = 125 C, Rθ J- = 20 C/W, 25 C/W and 30 C/W. MX LLOWBLE DC CURRENT - m Rθ J-MS = 10 C/W T MS - METL SLUG TEMPERTURE - C Figure 7. Maximum Forward Current vs. Metal Slug Temperature. Derated based on TJMX = 125 C, Rθ J-MS = 10 C/W ±0.10 TEMPERTURE 217 C 200 C 150 C C 3 C/SEC. MX. 3 C/SEC. MX SEC. TIME SEC. 6 C/SEC. MX. 100 SEC. MX. (cc. to J-STD-020C) 17.00± ± ± ± ±0.10 Figure 8. Recommended Reflow Soldering. Figure 9. Recommended soldering land pattern. 6

7 Option Selection Details SMT-Mxxx N x 1 x 2 x 3 x 4 x 1 Minimum Flux Bin x 2 Maximum Flux Bin x 3 Color Bin Selection x 4 Packaging Option Flux Bin Limit [x 1 x 2 ] Luminous Flux (lm) at I F = 700m Bin Min. Max. L M N Tolerance for each bin limits is ±10%. Color Bin Selections [x 3 ] Individual reel will contain parts from one full bin only. Cool White O Full Distribution only B B only C C only D D only E E only F F only G G only H H only L and G only M B and H only N and C only P B and D only Q E and C only R F and D only S G and H only U E and F only W C and D only Z and B only 1, B, C and D only 2 G, H, and B only 4 C, D, E and F only Warm White O Full Distribution only B B only C C only D D only E E only F F only N and C only P B and D only Q E and C only R F and D only U E and F only W C and D only Z and B only V D and E only 1, B, C and D only 4 C, D, E and F only 7

8 Color Bin Limit Cool White Color Limits (Chromaticity Coordinates) Bin X Y Bin B X Y Bin C X Y Bin D X Y Bin E X Y Bin F X Y Bin G X Y Bin H X Y Tolerance: ± 0.01 Warm White Color Limits (Chromaticity Coordinates) Bin X Y Bin B X Y Bin C X Y Bin D X Y Bin E X Y Bin F X Y Tolerance: ± 0.01 Y - COORDINTE k E F C B 5.6k 7k D X - COORDINTE Figure 10a. Color bins (Cool White). G 4.0k 4.5k H Black Body Curve Y - COORDINTE k F E 3.5k D C 3.0k B X - COORDINTE Figure 10b. Color bins (Warm White). 2.6k Black Body Curve Packaging Option [x 4 ] Selection Option 0 Tube 1 Tape and Reel Example SMT-MW20-NLNZ0 SMT-MW20-Nxxxx Cool White, Electrically Non-isolated Heat Sink, Non-diffused X 1 = L Minimum Flux Bin L X 2 = N Maximum Flux Bin N X 3 = Z Color Bin and B only X 4 = 0 Tube Option 8

9 Packing Tube Option SIDE VIEW TOP VIEW Figure 11. Tube dimensions Tape & Reel Option 1 E Dim Value O 8.80±0.10 F B O 16.45±0.10 W Bo K O 3.60±0.1 B B E 1.75±0.10 F 11.50±0.10 P 2.5 Ko SECTION W 24.0±0.10 P 16.0±0.10 Q'ty/Reel 250 units ll dimensions in millimeters. o SECTION B Figure 12. Carrier tape dimensions 9

10 END STRT MINIMUM OF 160 mm OF EMPTY COMPONENT POCKETS SELED WITH COVER TPE. MOUNTED WITH COMPONENTS MINIMUM OF 390 mm OF EMPTY COMPONENT POCKETS SELED WITH COVER TPE. Figure 13. Carrier tape leader and trailer dimensions. Reel Dimension R º ± ± ± 0.50 R10.50 ± ± º Figure 14. Reel dimensions. 10

11 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. s silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to vago pplication Note N 5288 for detail information. Moisture Sensitivity This product is qualified as Moisture Sensitive Level 4 per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to vago pplication Note N5305 Handling of Moisture Sensitive Surface Mount Devices for details.. Storage before use Unopen moisture barrier bag (MBB) can be stored at <40 C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB The humidity indicator card (HIC) shall be read immediately upon opening of MBB. The LEDs must be kept at <30 C/60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 72 hours. C. Control for unfinished reel For any unused LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembly boards If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 72 hours. E. Baking is required if HIC 10% indicator is not blue and 5% indicator is pink. The LEDs are exposed to condition of >30 C/60% RH at any time. The LEDs floor life exceeded 72hrs. Recommended baking condition: 60±5 C for 20hrs. DISCLIMER: vago s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: vago, vago Technologies, and the logo are trademarks of vago Technologies in the United States and other countries. Data subject to change. Copyright vago Technologies. ll rights reserved. V EN - pril 3, 2009

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