48- BGA (6 x 10 x 1.2mm) Pb-Free Package

Transcription

1 PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code BK / FCE Body Size (mil/mm) 6 X 10 x 1.2 mm Package Weight Site 1 B1: mg B2: mg B3 : mg Package Weight Site 2 B1: mg B2: mg B3: mg Package Weight Site 3 B1: mg SUMMARY The 48L-BGA package is qualified at two assembly sites. Packages from different assembly sites are likely to have different materials composition. However, Cypress guarantees that product ordered with a part number containing an X (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meets all requirement of the EU RoHS directive. ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # , , , (Note 1) II. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES s from Level A of the EIA/JIG/JGPSSI/EICTA Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Weight by mg Cadmium and Cadmium Compounds 0 < 5.0 Hexavalent Chromium and its Compounds 0 < 5.0 Lead and Lead Compounds 0 < 5.0 Mercury and Mercury Compounds 0 < 5.0 Polybrominated Biphenyls (PBB) 0 < 5.0 Polybrominated Diphenylethers (PBDE) 0 < 5.0 Analysis Report (Note 2) CoA-BK48- ASET Asbestos 0 0 As per MSDS Azo colorants 0 0 As per MSDS Ozone Depleting Substances 0 0 As per MSDS Polychlorinated Biphenyls (PCBs) 0 0 As per MSDS Polychlorinated Napthalenes 0 0 As per MSDS Radioactive Substances 0 0 As per MSDS Shortchain Chlorinated Paraffins 0 0 As per MSDS Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0 As per MSDS Tributyl Tin Oxide (TBTO) 0 0 As per MSDS Formaldehyde 0 0 As per MSDS Document No Rev. *I Page 1 of 14

2 Substrate B1. MATERIAL COMPOSITION (Note 3) Using Gold wire material Purpose of Use Base Substance Composition CAS Number Weight by mg per Homogenous material per package SiO % 23, % Acrylic Trade Secret % 20, % Epoxy , % 13, % , Bisphenol % 34, % Triazol % 41, % Copper (Cu) % 89, % Nickel (Ni) % 3, % Gold (Au) % 1, % Sn % 40, % Solder Ball External Plating Ag % 1, % Cu % % Epoxy Resin Trade Secret % 11, % Diester Trade Secret % 45, % Die Attach Adhesive Functionalized Trade Secret % 16, % Ester Polymeric Trade Secret % 4, % Silica fused % 87, % Die Circuit Si % 102, % Wire Interconnect Au % 10, % Mold Compound Encapsulation Silica fused % 400, % Epoxy Resin % 20, % Epoxy Resin 2 Undisclosed % 9, % Phenol resin % 20, % Package Weight (mg): % Total: Document No Rev. *I Page 2 of 14

3 Substrate B2. MATERIAL COMPOSITION (Note 3) Using Copper-Palladium wire material Purpose of Use Base Substance Composition CAS Number Weight by mg per Homogenous material per package SiO % 24, % Acrylic Trade Secret % 21, % Epoxy , % 14, % , Bisphenol % 34, % Triazol % 41, % Copper (Cu) % 90, % Nickel (Ni) % 3, % Gold (Au) % 1, % Sn % 41, % Solder Ball External Plating Ag % 1, % Cu % % Epoxy Resin Trade Secret % 11, % Bismaleimide Trade Secret % 45, % monomer Die Attach Adhesive Acrylate Trade Secret % 16, % monomer Acrylic resin Trade Secret % 4, % Silica fused % 87, % Die Circuit Si % 103, % Wire Interconnect Copper % 4, % Mold Compound Encapsulation Palladium % % Silica fused % 409, % Epoxy Resin Trade Secret % 20, % Carbon Black % 1, % Phenol resin Trade Secret % 20, % Package Weight (mg): % Total: Document No Rev. *I Page 3 of 14

4 Substrate B3. MATERIAL COMPOSITION (Note 3) Using Gold wire material Purpose of Use Base Substance Composition CAS Number Weight by mg per Homogenous material per package SiO % % Acrylic Trade Secret % % Epoxy , % % , Bisphenol % % Triazol % % Copper (Cu) % % Nickel (Ni) % % Gold (Au) % % Sn % % Solder Ball External Plating Ag % % Cu % % Epoxy Resin Trade Secret % % Diester Trade Secret % % Die Attach Adhesive Functionalized Trade Secret % % Ester Polymeric Trade Secret % % Silica fused % % Die Circuit Si % % Wire Interconnect Au % % Mold Compound Encapsulation Silica fused % % Epoxy Resin % % Epoxy Resin 2 Undisclosed % % Phenol resin % % Package Weight (mg): % Total: Document No Rev. *I Page 4 of 14

5 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Lead Cadmium Cr VI Mercury PBB PBDE Analysis Report (Note2) Tape & Reel Cover tape < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-COVT-G Carrier tape < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-CART-G Plastic Reel < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-PLTL-G Tray Tray < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-TRAY-G Others Moisture Barrier bag < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-MBAG-G Shielding bag < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-G Shipping and inner/ pizza < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-ABOX-R box Desiccant < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-G Bubble Pack < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA- BUBP-G Document No Rev. *I Page 5 of 14

6 ASSEMBLY Site 2: Cypress Manufacturing Limited (CML) Package Qualification Report # , , (Note 1) II. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES s from Level A of the EIA/JIG/JGPSSI/EICTA Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Weight by mg Cadmium and Cadmium Compounds 0 < 5.0 Hexavalent Chromium and its Compounds 0 < 5.0 Lead and Lead Compounds 0 < 5.0 Mercury and Mercury Compounds 0 < 5.0 Polybrominated Biphenyls (PBB) 0 < 5.0 Polybrominated Diphenylethers (PBDE) 0 < 5.0 Analysis Report (Note 2) CoA-BK48- CML Asbestos 0 0 As per MSDS Azo colorants 0 0 As per MSDS Ozone Depleting Substances 0 0 As per MSDS Polychlorinated Biphenyls (PCBs) 0 0 As per MSDS Polychlorinated Napthalenes 0 0 As per MSDS Radioactive Substances 0 0 As per MSDS Shortchain Chlorinated Paraffins 0 0 As per MSDS Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0 As per MSDS Tributyl Tin Oxide (TBTO) 0 0 As per MSDS Formaldehyde 0 0 As per MSDS Document No Rev. *I Page 6 of 14

7 B1. MATERIAL COMPOSITION (Note 3) Using Gold wire material Purpose of Use Substance Composition CAS Number Weight by mg per Homogeneous material per package Cured Resin Proprietary % 83, % Glass Fabrics Proprietary % 66, % Copper Foil Proprietary % 90, % Diethylene Glycol Substrate Base Monoethyl Ether Proprietary Acetate % 15, % Acetophenone Proprietary Derirative % 15, % Silica Crystalline % 15, % Solvent naptha Proprietary % 15, % Solder Ball Sn % 2, % External Ag % % Plating Cu % % Silver % 11, % Bismaleimide Proprietary Die Attach Adhesive Resin % 1, % Synthetic Resin Proprietary % 1, % Additive Proprietary % % Die Circuit Silicon % 259, % Wire Interconnect Au % 10, % Mold Compound Encapsulation Silica Fused % 362, % Epoxy Resin % 24, % Epoxy Resin 2 Proprietary % 8, % Phenol Resin % 16, % Package Weight (mg): % Total: Document No Rev. *I Page 7 of 14

8 B2. MATERIAL COMPOSITION (Note 3) Using Copper-Palladium wire material Purpose of Use Substance Composition CAS Number Weight by mg per Homogeneous material per package Cured Resin Proprietary % 84, % Glass Fabrics Proprietary % 66, % Copper Foil Proprietary % 90, % Diethylene Glycol Substrate Base Monoethyl Ether Proprietary % 15, % Acetate Acetophenone Derirative Proprietary % 15, % Silica Crystalline % 15, % Solvent naptha Proprietary % 15, % Solder Ball Sn % 2, % External Ag % % Plating Cu % % Silver % 11, % Bismaleimide Die Attach Adhesive Resin Proprietary % 1, % Synthetic Resin Proprietary % 1, % Additive Proprietary % % Die Circuit Silicon % 261, % Wire Interconnect Copper % 5, % Palladium % % Silica Fused % 358, % Epoxy resin Proprietary % 20, % Phenolic resin Proprietary % 10, % Mold Encapsulation Melamine Compound Proprietary % 22, % Cyanurate Carbon black pigment % 2, % Package Weight (mg): % Total: Document No Rev. *I Page 8 of 14

9 B3. MATERIAL COMPOSITION (Note 3) Using Gold wire material Purpose of Use Substance Composition CAS Number Weight by mg per Homogeneous material per package Cured Resin Proprietary % Glass Fabrics Proprietary % Copper Foil Proprietary % Diethylene Glycol Substrate Base Monoethyl Ether Acetate Proprietary % Acetophenone Derirative Proprietary % Silica Crystalline % Solvent naptha Proprietary % Solder Ball Sn % External Ag % Plating Cu % Silica,Amorphous, treated % Bismaleimide monomer Unknown % Acrylate monomer Proprietary % Die Attach Adhesive Diphenyl methacrylate oligomer Proprietary % Additive Proprietary % Acrylic ester Proprietary % Titanium dioxide % Benzoyl peroxide % Die Circuit Silicon % Wire Interconnect Au % Mold Compound Encapsulation Silica Fused % Epoxy Resin % Epoxy Resin 2 Proprietary % Phenol Resin % Package Weight (mg): % Total: Document No Rev. *I Page 9 of 14

10 Type Tape & Reel II. DECLARATION OF PACKAGING INDIRECT MATERIALS Lead Cadmium Cr VI Mercury PBB PBDE Analysis Report (Note2) Cover tape < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-COVT-G Carrier tape < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-CART-G Plastic Reel < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-PLTL-G Tray Tray < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-TRAY-G Others Moisture Barrier bag < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-MBAG-G Shielding bag < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-G Shipping and inner/ pizza < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-ABOX-R box Desiccant < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-G Bubble Pack < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA- BUBP-G Document No Rev. *I Page 10 of 14

11 ASSEMBLY Site 3: Cypress Bangkok (SB) Package Qualification Report # (Note 1) III.DECLARATION OF PACKAGED UNITS B. BANNED SUBSTANCES s from Level A of the EIA/JIG/JGPSSI/EICTA Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Weight by mg Cadmium and Cadmium Compounds 0 < 5.0 Hexavalent Chromium and its Compounds 0 < 5.0 Lead and Lead Compounds 0 < 5.0 Mercury and Mercury Compounds 0 < 5.0 Polybrominated Biphenyls (PBB) 0 < 5.0 Polybrominated Diphenylethers (PBDE) 0 < 5.0 Analysis Report (Note 2) Analysis Report Asbestos 0 0 As per MSDS Azo colorants 0 0 As per MSDS Ozone Depleting Substances 0 0 As per MSDS Polychlorinated Biphenyls (PCBs) 0 0 As per MSDS Polychlorinated Napthalenes 0 0 As per MSDS Radioactive Substances 0 0 As per MSDS Shortchain Chlorinated Paraffins 0 0 As per MSDS Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0 As per MSDS Tributyl Tin Oxide (TBTO) 0 0 As per MSDS Formaldehyde 0 0 As per MSDS Document No Rev. *I Page 11 of 14

12 Substrate B1. MATERIAL COMPOSITION (Note 3) Using PdCu wire material Purpose of Use Base Substance Composition CAS Number Weight by mg per Homogeneou s material per package Aluminum Hydroxide % 44, % Copper % 87, % Gold % % Nickel % 10, % Epoxy resin Trade secret % 64, % SiO2 Glass Cloth % 87, % Solder Ball Tin % 37, % External Silver % % Plating Copper % % Silica Trade secret % % Organic filler Trade secret % 4, % Acrylic resin Trade secret % 10, % Die Attach Adhesive Diluent Trade secret % 6, % Elastomer Trade secret % 1, % Organic peroxide Trade secret % % Die Circuit Silicon % 225, % Wire Interconnect Copper % 4, % Palladium % % Silica (fused) % 348, % Carbon Black % 1, % Mold Epoxy resin Trade secret % 56, % Encapsulation Compound Phosphoric Trade secret % 1, % organic catalyst Metal Oxides Trade secret % 2, % Package Weight (mg): % Total: Document No Rev. *I Page 12 of 14

13 Type Tape & Reel II. DECLARATION OF PACKAGING INDIRECT MATERIALS Lead Cadmium Cr VI Mercury PBB PBDE Analysis Report (Note2) Cover tape < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-COVT-G Carrier tape < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-CART-G Plastic Reel < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-PLTL-G Tray Tray < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-TRAY-G Others Moisture Barrier bag < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-MBAG-G Shielding bag < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-G Shipping and inner/ pizza < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-ABOX-R box Desiccant < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-G Bubble Pack < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA- BUBP-G Document No Rev. *I Page 13 of 14

14 Document History Page Document Title: 48 - BGA (6X10X1.2MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: Rev. ECN No. Orig. of Description of Change Change ** MAHA Initial spec release. *A HLR Added Assembly Site 2. *B MAHA Changed four to two under the Summary on page 1. Corrected the CAS numbers of Epoxy Resin 1 and Phenol Resin for assembly site 2. Recalculated the values of assembly site 2. Expressed the weight by mg, package weight, per Homogeneous material, and per package in four decimal places for assembly sites 1 and 2. *C UDR Changed Site 2 from R to RA. Added B2 for Site 1 ASEKH (G) Copper wire qualification. Reference QTP # and Added B2 for Site 2 Autoline (CML-RA) Copper wire qualification. Reference QTP # *D YUM Added assembly site name in the assembly heading in site 1 and 2. Changed Assembly code to assembly site name in site 1 and 2. *E FJC Added QTP # on Assembly Site 2 Added B3. MATERIAL COMPOSITION (Note 3) using Gold Wire *F HLR Sunset Due No Change *G AWP Added QTP# qualification of the existing gold wire to Automotive Device and also Added B3. MATERIAL COMPOSITION (Note 3) using Gold Wire under Assembly Site 1 ASET SLLO Removed Distribution and Posting from the document history page. *H CHAL Added Assembly site 3 Cypress Bangkok, QTP# *I HLR Sunset Due Changed Cypress Logo. Document No Rev. *I Page 14 of 14