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N-CHANNEL 3A - 600 D 2 PAK Power MESH IGBT TYPE CES CE(sat) I c STGB3NB60SD 600 <1.5 3 A HIGH INPUT IMPEDANCE (OLTAGE DRIEN) ERY LOW ON-OLTAGE DROP ( cesat ) HIGH CURRENT CAPABILITY OFF LOSSES INCLUDE TAIL CURRENT INTEGRATED FREEWHEELING DIODE SURFACE-MOUNTING D 2 PAK (TO-263) POWER PACKAGE IN TAPE & REEL (SUFFIX T4 ) DESCRIPTION Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESH IGBTs, with outstanding perfomances. The suffix S identifies a family optimized to achieve minimum on-voltage drop for low frequency applications (<1kHz). APPLICATIONS GAS DISCHARGE LAMP STATIC RELAYS MOTOR CONTROL ABSOLUTE MAXIMUM RATINGS ( )Pulse width limited by safe operating area. 1 3 D 2 PAK TO-263 (suffix T4 ) INTERNAL SCHEMATIC DIAGRAM Symbol Parameter alue Unit CES Collector-Emitter oltage ( GS = 0) 600 GE Gate-Emitter oltage ± 20 I C Collector Current (continuos) at T c =25 C 6 A I C Collector Current (continuos)at T c =100 C 3 A I CM ( ) Collector Current (pulsed) 25 A P tot Total Dissipation at T c = 25 C 70 W Derating Factor 0.46 W/ C T stg Storage Temperature 60 to 175 C T j Max. Operating Junction Temperature 175 C November 2000 1/8

THERMAL DATA R thj-case Thermal Resistance Junction-case Max 2.14 C/W R thj-amb Thermal Resistance Junction-ambient Max 62.5 C/W R thc-sink Thermal Resistance Case-sink Typ 0.5 C/W ELECTRICAL CHARACTERISTICS (T case = 25 C unless otherwise specified) OFF BR(CES) Collector-Emitter Breakdown oltage I D = 250 µa GE = 0 600 I CES Collector cut-off ( GE = 0) CE = Max Rating T j = 25 C CE = Max Rating T j = 125 C ON (*) I GSS DYNAMIC Gate-body Leakage Current ( DS = 0) 10 100 GS = ± 20 CE = 0 ±100 na GE(th) Gate Threshold oltage CE = GE I C = 250 µa 2.5 5 CE(SAT) Collector-Emitter Saturation oltage GE = 15 I C = 1.5 A GE = 15 I C = 3 A GE = 15 I D = 3 A T j = 125 C g fs Forward Transconductance CE = 25 I C = 3 A 1.7 2.5 S C ies Input Capacitance CE = 25 f = 1 MHz GE = 0 255 330 pf C oes Output Capacitance 30 40 pf C res Reverse Transfer Capacitances 1 1.2 1.1 1.5 µa µa 5.6 7 pf Q G Total Gate Charge CE =480 I C =3 A GE =15 18 nc Q GE Gate-Emitter Charge 5.4 nc Q GC Gate-Collector Charge 5.5 nc I CL Latching Current clamp = 480 R G = 1 KΩ T j =150 C 12 A SWITCHING ON t d(on) t r DelayTime Rise Time CC = 480 GE = 15 I C = 3 A R G = 1 kω 125 150 ns ns (di/dt) on E on Turn-on Current Slope Turn-on Switching Losses CC = 480 GE = 15 T j =125 C I C = 3 A R G = 1 kω 50 1100 A/ µj 2/8

ELECTRICAL CHARACTERISTICS (continued) SWITCHING OFF t c t r ( off ) t d ( off ) t f E off ( ** ) t c t r ( off ) t d ( off ) t f E off ( ** ) Cross-Over Time Off oltage Rise Time Delay Time Fall Time Turn-off Switching Loss Cross-Over Time Off oltage Rise Time Delay Time Fall Time Turn-off Switching Loss COLLECTOR-EMITTER DIODE ( )Pulse width limited by max. junction temperature (*)Pulsed: Pulse duration = 300, duty cycle 1.5 %. ( )Losses Include Also The Tail (Jedec Standardization) CC = 480 I C = 3 A R GE = 1 kω GE = 15 CC = 480 I C = 3 A R GE = 1 kω GE = 15 T j = 125 C I f I fm f t rr Q rr I rrm Thermal Impedance Forward Current Forward Current pulsed Forward On-oltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current I f = 3 A I f = 1 A I f = 3 A R = 200 di/dt = 100 A/ T j = 125 C 1.8 1.0 3.4 0.72 1.15 2.8 1.45 3.6 1.2 1.8 1.55 1.15 1700 4500 9.5 3 25 mj mj A A 1.9 ns nc A 3/8

Output Characteristics Transfer Characteristics Transconductance Collector-Emiter on oltage vs Collector Current Collector-Emitter on oltage vs Temperature Gate Threshold vs Temperature 4/8

Normalized Breakdown oltage vs Temperature Capacitance ariations Gate charge Gate-Emitter oltage Off Switching Losses vs Tj Off Switching Losses vs Ic Swittching Off Safe Operating Area 5/8

Diode Forward vs Tj Diode Forward oltage Fig. 1: Gate Charge test Circuit Fig. 2 Test Circuit For Inductive Load Switching Fig. 3: Switching Waveforms 6/8

D 2 PAK MECHANICAL DATA DIM. mm. inch MIN. TYP MAX. MIN. TYP. MAX. A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 D1 8 0.315 E 10 10.4 0.393 E1 8.5 0.334 G 4.88 5.28 0.192 0.208 L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 M 2.4 3.2 0.094 0.126 R 0.4 0.015 2 0º 8º 7/8

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is registered trademark of STMicroelectronics 2000 STMicroelectronics - All Rights Reserved All other names are the property of their respective owners. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 8/8