STM8309. Dual Enhancement Mode Field Effect Transistor ( N and P Channel) ABSOLUTE MAXIMUM RATINGS (TA=25 C unless otherwise noted)

Similar documents
STS3401. P -C hannel E nhancement Mode MOS FE T. ABS OLUTE MAXIMUM R ATINGS (T A=25 C unless otherwise noted) THE R MAL C HAR AC TE R IS TIC S

N-C hannel E nhancement Mode Field E ffect Transistor. T O-251(l-P AK ) (T A=25 C unles s otherwis e noted) 25 C 70 C IDM P D.

STM4886E. N-Channel Enhancement Mode Field Effect Transistor

Product Summary: BVDSS RDSON (MAX.) D 60V 60mΩ 12A I D. UIS, Rg 100% Tested Pb Free Lead Plating & Halogen Free EMB60N06C

MOSFET IRF7855 (KRF7855)

400V N-Channel MOSFET GENERAL DESCRIPTION VDSS RDS(ON) ID. Features. Ordering Information 400V 0.55Ω 10.5A. This Power MOSFET is produced using

CEP190N10/CEB190N10. N-Channel Enhancement Mode Field Effect Transistor FEATURES. Applications

CEP300N10/CEB300N10. N-Channel Enhancement Mode Field Effect Transistor FEATURES. Applications

P-Channel Enhancement Mode Field Effect Transistor PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS

PD A N-CHANNEL MOSFET 1 D2 P-CHANNEL MOSFET. Top View SO-8. 1

V DSS R DS(on) max I D 80V GS = 10V 3.6A. 29 P A = 25 C Maximum Power Dissipation 2.0 Linear Derating Factor

Product Summary: BVDSS 30V RDSON (MAX.) 50mΩ 4.5A I D. Pb Free Lead Plating & Halogen Free EMB50P03J

Maximum Ratings, att j = 25 C, unless otherwise specified Parameter Symbol Value Unit Continuous drain current. IDpulse 88 E AS 90.

P-channel enhancement mode MOS transistor

LNTA4001NT1G S-LNTA4001NT1G. Small Signal MOSFET 20 V, 238 ma, Single, N-Channel, Gate ESD Protection LESHAN RADIO COMPANY, LTD.

Product Summary: BVDSS RDSON (MAX.) D 60V 60mΩ 12A I D. UIS, Rg 100% Tested Pb Free Lead Plating & Halogen Free EMB60N06CS

AOD452 N-Channel Enhancement Mode Field Effect Transistor

Features. Symbol Parameter Rating Units V DS Drain-Source Voltage 30 V V GS Gate-Source Voltage ±20 V

TPC8116-H TPC8116-H. High Efficiency DC/DC Converter Applications Notebook PC Applications Portable Equipment Applications CCFL Inverter Applications

N- & P-Channel Enhancement Mode Field Effect Transistor

IRF5851. HEXFET Power MOSFET. Ultra Low On-Resistance Dual N and P Channel MOSFET Surface Mount Available in Tape & Reel Low Gate Charge.

P-Channel Enhancement Mode Mosfet

BSL211SP. Rev 2.0. Product Summary V DS -20 V R DS(on) 67 mω I D -4.7 A. Type Package Tape and reel BSL211SP P-TSOP6-6 H6327: 3000pcs/r.

Rev 1.2. Maximum Ratings, at T j = 25 C, unless otherwise specified Parameter Symbol Value Unit Continuous drain current I D.

P-Channel Enhancement Mode Mosfet

Type Package Pb-free Tape and Reel Information SN7002N PG-SOT-23 Yes H6327: 3000 pcs/reel SN7002N

Preliminary data. Maximum Ratings,at T j = 25 C, unless otherwise specified Parameter Symbol Value Unit Continuous drain current I D.

PowerMOS transistor PINNING - SOT428 PIN CONFIGURATION SYMBOL. tab

Preliminary data. Maximum Ratings,at T j = 25 C, unless otherwise specified Parameter Symbol Value Unit Continuous drain current I D. I D puls -2.

Product Summary. Drain source voltage V DS 200 V Drain-Source on-state resistance R DS(on) 0.4 Ω Continuous drain current I D 7 A I D.

IRGPC40UD2 UltraFast CoPack IGBT

Maximum Ratings Parameter Symbol Value Unit Continuous drain current T C = 25 C T C = 100 C

BSS123. Rev K/W. R thja

Features. Symbol Parameter Rating Units V DS Drain-Source Voltage 600 V V GS Gate-Source Voltage ±30 V

N-Channel 30-V (D-S) MOSFET with Schottky Diode

Shenzhen Tuofeng Semiconductor Technology Co., Ltd 4402A. N-Channel Enhancement Mode Field Effect Transistor. Features

WFP13N50C Product Description Silicon N-Channel MOSFET

Final data. Maximum Ratings Parameter Symbol Value Unit Continuous drain current T C = 25 C T C = 100 C

N-Channel 30-V (D-S) MOSFET

Maximum Ratings, at T A = 25 C, unless otherwise specified Parameter Symbol Value Unit Continuous drain current E AS. P tot 0.36 W

V DSS R DS(on) max Qg. 30V GS = 10V 30nC. Thermal Resistance Parameter Typ. Max. Units Junction-to-Drain Lead g 20 Junction-to-Ambient f

FEATURES SYMBOL QUICK REFERENCE DATA

Maximum Ratings, at T j = 25 C, unless otherwise specified Parameter Symbol Value Unit Continuous drain current I D. I D puls 0.68.

N-channel TrenchMOS transistor

BSS84P. SIPMOS Small-Signal-Transistor Feature P-Channel Enhancement mode Logic Level Avalanche rated dv/dt rated. Class 0

2SJ332(L), 2SJ332(S)

PMN40LN. 1. Description. 2. Features. 3. Applications. 4. Pinning information. TrenchMOS logic level FET

TrenchMOS ultra low level FET

AONR V P-Channel MOSFET

BSS 223PW. ESD Class; JESD22-A114-HBM Class 0. Product Summary V DS -20 V R DS(on) 1.2 Ω I D A. Qualified according to AEC Q101

AOP605 Complementary Enhancement Mode Field Effect Transistor

PMV56XN. 1. Product profile. 2. Pinning information. µtrenchmos extremely low level FET. 1.1 Description. 1.2 Features. 1.

Features. R DS(on) = 25 C unless otherwise noted. Symbol Parameter Q2 Q1 Units

TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π-mosⅦ) TK6A50D

PHD110NQ03LT. 1. Product profile. 2. Pinning information. N-channel TrenchMOS logic level FET. 1.1 Description. 1.2 Features. 1.

IGBT Designer s Manual

Preliminary data. Type Package Ordering Code Tape and Reel Information BSS 192 P SOT89 Q67042-S4168 -

FEATURES SYMBOL QUICK REFERENCE DATA

Preliminary data. Type Package Ordering Code Tape and Reel Information BSP 317 P SOT-223 Q67042-S4167 -

AO4802 Dual N-Channel Enhancement Mode Field Effect Transistor

PMV40UN. 1. Product profile. 2. Pinning information. TrenchMOS ultra low level FET. 1.1 Description. 1.2 Features. 1.

Max Q1. Symbol V GS I DM 15 I DSM 7.8 I AS E AS V SPIKE P D 2.5 P DSM. Junction and Storage Temperature Range T J, T STG

AO7401 P-Channel Enhancement Mode Field Effect Transistor

30V GS = 10V 6.2nC

Product Summary Drain source voltage. Pin 1 Pin2/4 PIN 3 G D S

20V N-Channel Enhancement-Mode MOSFET

500V N-Channel MOSFET

AO V Dual P + N-Channel MOSFET

SPN03N60C3. Cool MOS Power Transistor V T jmax 650 V

AO V Dual N-Channel MOSFET

V DSS R DS(on) max Qg. 30V GS = 10V 30nC. 170 P A = 25 C Power Dissipation 2.5 P A = 70 C Power Dissipation Linear Derating Factor

IXTN660N04T4. TrenchT4 TM Power MOSFET = 40V = 660A. 0.85m. Advance Technical Information

µtrenchmos standard level FET Low on-state resistance in a small surface mount package. DC-to-DC primary side switching.

AON V N-Channel MOSFET

Maximum Ratings Parameter Symbol Value Unit Continuous drain current T C = 25 C T C = 100 C I D 20.7

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

AO3411 P-Channel Enhancement Mode Field Effect Transistor

SMPS MOSFET. V DSS R DS(on) max(mw) I D

N-channel TrenchMOS logic level FET

SMPS MOSFET. V DSS R DS(on) max(mw) I D

N-channel µtrenchmos ultra low level FET. Top view MBK090 SOT416 (SC-75)

BSO604NS2 OptiMOS Power-Transistor

IRGPC50F Fast Speed IGBT

AO V Dual N-Channel MOSFET

Rev Maximum Ratings, at T j = 25 C, unless otherwise specified Parameter Symbol Value Unit Continuous drain current I D

Preliminary data. Maximum Ratings, at T C = 25 C, unless otherwise specified Parameter Symbol Value Unit Continuous drain current

SIPMOS Power-Transistor

Power MOSFET D 2 PAK (TO-263) G D. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 200 Gate-Source Voltage V GS ± 20

Maximum Ratings Parameter Symbol Value Unit Continuous drain current T C = 25 C T C = 100 C

IXTN660N04T4. TrenchT4 TM Power MOSFET = 40V = 660A. 0.85m. Advance Technical Information

GP1M003A080H/ GP1M003A080F GP1M003A080HH/ GP1M003A080FH

V DSS R DS(on) max I D. 100V GS = 10V 7.3A. 58 P A = 25 C Maximum Power Dissipation 2.5 Linear Derating Factor

PHP/PHB/PHD45N03LTA. TrenchMOS logic level FET

PINNING - SOT223 PIN CONFIGURATION SYMBOL

AUTOMOTIVE GRADE. A I DM Pulsed Drain Current P A = 25 C Maximum Power Dissipation 2.0 P A = 70 C Maximum Power Dissipation 1.

A I DM. W/ C V GS Gate-to-Source Voltage ± 20. Thermal Resistance Symbol Parameter Typ. Max. Units

PPM3T60V2 P-Channel MOSFET

PINNING - TO220AB PIN CONFIGURATION SYMBOL. tab

IXTT440N04T4HV V DSS

TPCF8402 F6B TPCF8402. Portable Equipment Applications Mortor Drive Applications DC-DC Converter Applications. Maximum Ratings (Ta = 25 C)

Transcription:

SamHop Microelectronics Corp. STM39 Green Product Oct.3, 26 Dual Enhancement Mode Field Effect Traistor ( N and P Channel) PRODUCT SUMMRY (N-Channel) PRODUCT SUMMRY (P-Channel) VDSS ID RDS(ON) ( mω ) Max VDSS ID RDS(ON) ( mω ) Max 3V 7 23 @ VGS = V 3 @ VGS = 4.5V -3V -6 35 @ VGS = -V 52 @ VGS = -4.5V D D D2 D2 7 6 5 SO- 2 3 4 S G S2 G2 BSOLUTE MXIMUM RTINGS (T=25 C unless otherwise noted) Parameter Symbol N-Channel P-Channel Unit Drain-Source Voltage VDS 3-3 V Gate-Source Voltage VGS 2 2 V a Drain Current-Continuous @TJ=25 C b -Pulsed ID IDM 7-6 2-24 Drain-Source Diode Forward Current a IS.7 -.7 Maximum Power Dissipation Operating Junction and Storage Temperature Range a PD 2. W TJ, TSTG -55 to 5 C THERML CHRCTERISTICS a Thermal Resistance, Junction-to-mbient 62.5 C /W R J

S T M39 N-C hannel E L E C TR IC L C HR C TE R IS TIC S (T = 25 C unles s otherwis e noted) 5 Parameter S ymbol Condition Min Typ Max Unit OF F C HR C T E R IS T IC S Drain-S ource Breakdown Voltage BV DS S V G S = V, ID = 25u 3 V Zero Gate Voltage Drain C urrent IDS S VDS 24V, VGS V = = Gate-Body Leakage IGS S VGS 2V, VDS V = = u ON C HR C T E R IS T IC S b Gate Threshold Voltage VGS (th) VDS = VGS, ID = 25u..9 3 V Drain-S ource On-S tate R esistance R DS (ON) V G S = V, ID = 7 V G S = 4.5V, ID =5 23 3 On-S tate Drain Current ID(ON) V DS = 5V, V G S = V 2 Forward Traconductance gf S V DS = V, ID =7 4 S DY NMIC C HR C T E R IS T IC S c Input C apacitance Output C apacitance R everse Trafer Capacitance S WIT C HING C HR C T E R IS T IC S c Turn-On Delay Time R ise Time Turn-Off Delay Time Fall Time Total Gate C harge Gate-S ource Charge Gate-Drain C harge C IS S C OS S C R S S td(on) tr td(of F ) tf Q g Q gs Q gd VDS =5V, VG S = V f =.MHZ V DD = 5V, ID = 7, R L=2. ohm, V G S = V, R GE N = 6 ohm V DS =5V, ID =7,V G S =V V DS =5V, ID =7,V G S =4.5V VDS =5V, ID = 7, V G S =V 7 6 9 5 2 7.5 4 5 5.5.7 3.3 C 23 u m ohm m ohm PF PF PF 2

S T M39 P-C hannel E L E C TR IC L C HR C TE R IS TIC S (T = 25 C unles s otherwis e noted) C Parameter S ymbol Condition Min Typ Max Unit OF F C HR C T E R IS T IC S Drain-S ource Breakdown Voltage BV DS S V G S = V, ID = -25u -3 V Zero Gate Voltage Drain C urrent IDS S VDS -24V, VGS V = = - Gate-Body Leakage IGS S VGS = 2V, VDS = V u ON C HR C T E R IS T IC S b Gate Threshold Voltage VGS (th) VDS = VGS, ID = -25u - -.9-3 V Drain-S ource On-S tate R esistance R DS (ON) V G S = -V, ID= -5 29 35 V G S = -4.5V, ID= -4 44 52 On-S tate Drain Current ID(ON) V DS = -5V, V G S = -V -2 Forward Traconductance gf S V DS = -5V, ID = - 5.5 S DY NMIC C HR C T E R IS T IC S c Input C apacitance Output C apacitance R everse Trafer Capacitance S WIT C HING C HR C T E R IS T IC S c Turn-On Delay Time R ise Time Turn-Off Delay Time Fall Time Total Gate C harge Gate-S ource Charge Gate-Drain C harge C IS S C OS S C R S S td(on) tr td(of F ) tf Q g Q gs Q gd VDS =-5V, VG S = V f =.MHZ V D = -5V, R L=5 ohm, ID = -, V G E N = -V, R G E N =6 ohm VDS =-5V,ID=-5,VGS =-V VDS =-5V,ID=-5,VGS =-4.5V 3 VDS =-5V, ID = - 5, V G S =-V 7 225 25 2 7 4 5 7.5.7 4.5 u m ohm m ohm PF PF PF

S T M39 ELECTRICL CHRCTERISTICS (T=25 C unless otherwise noted) Parameter Symbol Condition Min Typ Max Unit DRIN-SOURCE DIODE CHRCTERISTICS Diode Forward Voltage Notes VSD a.surface Mounted on FR4 Board, t sec. b.pulse Test:Pulse Width 3 s, Duty Cycle 2%. c.guaranteed by design, not subject to production testing. N-Channel b VGS = V, Is =.7 N-Ch..2 VGS = V, Is =-.7 P-Ch -. -.2 V C 5 4 32 VGS=V VGS=5V VGS=4.5V VGS=4V 2 6 ID, Drain Current() 24 6 VGS=3.5V VGS=3V ID, Drain Current () 2 4 Tj=25 C -55 C 25 C.5.5 2 2.5 3 VDS, Drain-to-Source Voltage (V) Figure. Output Characteristics.7.4 2. 2. 3.5 4.2 VGS, Gate-to-Source Voltage (V) Figure 2. Trafer Characteristics 6.5 R DS (on) (mω) 5 4 3 2 V G S =4.5V V G S =V R DS (ON), On-R esistance Normalized.4.3.2.. V G S =V ID=7 V G S =4.5V ID=5 6 24 32 4 ID, Drain C urrent () F igure 3. On-R esistance vs. Drain C urrent and G ate V oltage.9-25 25 5 75 25 5 T j( C ) T j, J unction T emperature ( C ) F igure 4. On-R esistance Variation with Drain C urrent and Temperature 4

S T M39 6 V th, Normalized G ate-s ource T hres hold V oltage.3.2...9..7 V DS =V G S ID=25u.6-5 -25 25 5 75 25 5 B V DS S, Normalized Drain-S ource B reakdown V oltage.5-5 -25 25 5 75 25 5 T j, J unction T emperature ( C ) T j, J unction T emperature ( C ) F igure 5. G ate T hres hold V ariation with T emperature.5..5..95.9 ID=25u F igure 6. B reakdown V oltage V ariation with T emperature R DS (on) (mω) 49 42 35 2 2 4 ID=7 75 C 25 C 25 C Is, S ource-drain current () 2.. 25 C 25 C 75 C 7 2 4 6..4.6...2.4 V G S, G ate-s ource Voltage (V ) F igure 7. On-R esistance vs. G ate-s ource V oltage VS D, Body Diode Forward Voltage (V ) F igure. B ody Diode F orward V oltage V ariation with S ource C urrent 5

S T M39 6 C, Capacitance (pf) 9 75 Ciss 6 45 3 Coss 5 Crss 5 5 2 25 3 V G S, G ate to S ource V oltage (V ) 6 4 2 V DS =5V ID=7 2 4 6 2 4 6 VDS, Drain-to Source Voltage (V) Q g, T otal G ate C harge ( ) F igure. C apacitance F igure 9. G ate C harge 25 4 S witching T ime ( ) 6 T D(off) T D(on) VDS =5V,ID=7 VGS =V 6 6 T r T f 3 6 ID, Drain C urrent () R DS (O N) Limit. V G S =V S ingle Pulse T=25 C.3. 3 5 DC s ms ms R g, G ate R es is tance (Ω) F igure. s witching characteris tics V DS, Drain-S ource V oltage (V ) F igure. Maximum S afe O perating rea 6

S T M39 P-Channel -ID, Drain C urrent () 2 6 2 4 VGS=V VGS=5V VGS=4.5V VGS=3.5V VGS=3V VGS=4V -ID, Drain C urrent () 2 6 2 4 25 C -55 C 25 C.5.5 2 2.5 3 -VDS, Drain-to-S ource Voltage (V ) F igure. Output C haracteristics.9. 2.7 3.6 4.5 5.4 -V G S, G ate-to-s ource Voltage (V ) F igure 2. Trafer C haracteristics 9.5 R DS (on) (mω) 75 6 45 3 5 V G S =-4.5V V G S =-V R DS (ON), On-R esistance Normalized.4.3.2.. V G S =-V ID=-5 V G S =-4.5V ID=-4 4 2 6 2 -ID, Drain C urrent () F igure 3. On-R esistance vs. Drain C urrent and G ate V oltage 25 5 75 25 5 T j( C ) T j, J unction T emperature ( C ) F igure 4. On-R esistance Variation with Drain C urrent and Temperature 7

S T M39 5 V th, Normalized G ate-s ource T hres hold V oltage.2...9..7.6 V DS =V G S ID=-25u.5-5 -25 25 5 75 25 5 B V DS S, Normalized Drain-S ource B reakdown V oltage.3 ID=-25u.2...9..7-5 -25 25 5 75 25 5 T j, J unction T emperature ( C ) T j, J unction T emperature ( C ) F igure 5. G ate T hres hold V ariation F igure 6. B reakdown V oltage V ariation with T emperature with T emperature R DS (on) (mω) 2. ID =-5 9 6 25 C 4 2 75 C 25 C 2 4 6 -Is, S ource-drain current ().. 25 C 25 C 75 C.25.5.75..25 -V G S, G ate- S ource Voltage (V ) F igure 7. On-R esistance vs. G ate-s ource V oltage -VS D, Body Diode Forward Voltage (V ) F igure. B ody Diode F orward V oltage V ariation with S ource C urrent

S T M39 6 C, Capacitance (pf) 2 Ciss 6 4 Coss 2 Crss 5 5 2 25 3 -V G S, G ate to S ource V oltage (V ) 6 4 2 V DS =-5 V ID=- 5 2 4 6 2 4 6 VDS, Drain-to Source Voltage (V) F igure. C apacitance Q g, T otal G ate C harge ( ) F igure 9. G ate C harge 25 5 S witching T ime ( ) 6 T r T D(off) T f T D(on) V D S = -5V,I D=- V G S = - V 6 6 3 6 -ID, Drain C urrent () R DS (O N) Limit. V G S =-V S ingle Pulse T=25 C.3. 5 DC s ms ms R g, G ate R es is tance (Ω) -V DS, B ody Diode F orward V oltage (V ) F igure. s witching characteris tics F igure. Maximum S afe O perating rea 9

S T M39 V DD ton toff R L td(on) tr td(off) V IN 9% 9% D V OUT 5 VG S V OUT % INV E R T E D % R G E N G 9% 5% 5% S VIN % PULS E WIDTH tf 9 F igure 3. S witching T est C ircuit N-C hannel F igure 4. S witching Waveforms Normalized Traient Thermal Resistance..5.2..5.2 P DM t t2.. Single Pulse. R thj (t)=r (t) * R thj 2. R thj =S ee Datasheet 3. TJ M-T = P DM* R thj (t) 4. Duty Cycle, D=t/t2..... P-C hannel 9 Square Wave Pulse Duration(sec) Normalized Thermal Traient Impedance Curve Normalized Traient Thermal Resistance...5.2..5.2. Single Pulse P DM t t2. R thj (t)=r (t) * R thj 2. R thj =S ee Datasheet 3. TJ M-T = P DM* R thj (t) 4. Duty Cycle, D=t/t2..... Square Wave Pulse Duration(sec) Normalized Thermal Traient Impedance Curve

S T M39 PC K G E OUT LINE DIME NS IONS S O- L D E.5X45 e B C.5 TYP..6 TYP.. TYP. H S Y MB OLS D E H L MILLIME T E R S MIN.35. 4. 3. 5.79.4 MX.75.25 4.9 3.99 6.2.27 MIN.53.4.9.5.22.6 INC HE S MX.69..96.57.244.5

STM39 SO-TapeandReelData SO- Carrier Tape unit: PCKGE SOPN 5 B K D D E E E2 P P P2 T 6.4 5.2 2..5 (MIN).5 +. -. 2..3.75 5.5.5. 4. 2..5.3.5 SO- Reel UNIT: TPE SIZE REEL SIZE M N W W H K S G R V 2 33 33 62.5 2.4+.2 6.-.4 2.75 +.5 2..5 2