BTA/BTB24, BT5, BT6 and T25 Series SNUBBERLESS & STANDARD 25A TRIACS MAIN FEATURES: Symbol Value Unit I T(RMS) 25 A V DRM /V RRM 6 and 8 V I T (Q1 ) 35 to 5 ma DESCRIPTION Available either in through-hole of surface and T25 mount packages, the BTA/BTB24-25-26 triac series is suitable for general purpose AC power switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, water heaters, induction motor starting circuits...or for phase control operation in high power motor speed controllers, soft start circuits...the snubberless versions (BTA/BTB...W and T25 series) are specially recommended for use on inductive loads, thanks to their high commutation performances. By using an internal ceramic pad, the BTA series provides voltage insulated tab (rated at 25V RMS) complying with UL standards (File ref.: E81734). ABSOLUTE MAXIMUM RATINS TO-22AB Insulated (BT4) RD91 (BT5) D 2 PAK (T25) TO-22AB (BTB24) TOP3 Insulated (BT6) Symbol Parameter Value Unit I T(RMS) RMS on-state current (full sine wave) D²PAK A Tc = 1 C TO-22AB RD91 25 Tc = 9 C TOP3 Ins. TO-22AB Ins. Tc = 75 C I TSM Non repetitive surge peak on-state F = 6 Hz t = 16.7 ms 26 A current (full cycle, Tj initial = 25 C) F = 5 Hz t = 2 ms 25 I ² t I ² t Value for fusing tp = 1 ms 34 A ² s di/dt Critical rate of rise of on-state current I = 2 x I T, tr 1 ns F = 12 Hz Tj = 125 C 5 A/µs V DSM /V RSM Non repetitive surge peak off-state voltage tp = 1 ms Tj = 25 C V DRM /V RRM + 1 I M Peak gate current tp = 2 µs Tj = 125 C 4 A P (AV) Average gate power dissipation Tj = 125 C 1 W V T stg T j Storage junction temperature range Operating junction temperature range - 4 to + 15-4 to + 125 C September 22 - Ed: 6A 1/9
BTA/BTB24, BT5, BT6 and T25 Series ELECTRICAL CHARACTERISTICS (Tj = 25 C, unless otherwise specified) SNUBBERLESS (3 Quadrants) T25-, BTA/BTB24...W, BT5...W, BT6...W Symbol Test Conditions Quadrant T25 BTA/BTB Unit T2535 CW BW I T (1) I - II - III MAX. 35 35 5 ma V D = 12 V R L = 33 Ω V T I - II - III MAX. 1.3 V V D V D = V DRM R L = 3.3 kω Tj = 125 C I - II - III MIN..2 V I H (2) I T = 5 ma MAX. 5 5 75 ma I L I = 1.2 I T I - III MAX. 7 7 8 ma II 8 8 1 dv/dt (2) V D = 67 % V DRM gate open Tj = 125 C MIN. 5 5 1 V/µs (di/dt)c (2) Without snubber Tj = 125 C MIN. 13 13 22 A/ms STANDARD (4 Quadrants): BTB24...B, BT5...B, BT6...B Symbol Test Conditions Quadrant Value Unit I T (1) I - II - III 5 ma MAX. V D = 12 V R L = 33 Ω IV 1 V T ALL MAX. 1.3 V V D V D = V DRM R L = 3.3 kω Tj = 125 C ALL MIN..2 V I H (2) I T = 5 ma MAX. 8 ma I L I = 1.2 I T I - III - IV MAX. 7 ma II 16 dv/dt (2) V D = 67 % V DRM gate open Tj = 125 C MIN. 5 V/µs (dv/dt)c (2) (di/dt)c = 13.3 A/ms Tj = 125 C MIN. 1 V/µs STATIC CHARACTERISTICS Symbol Test Conditions Value Unit V TM (2) I TM = 35 A tp = 38 µs Tj = 25 C MAX. 1.55 V V to (2) Threshold voltage Tj = 125 C MAX..85 V R d (2) Dynamic resistance Tj = 125 C MAX. 16 mω I DRM V DRM = V RRM Tj = 25 C 5 µa MAX. I RRM Tj = 125 C 3 ma Note 1: minimum IT is guaranted at 5% of IT max. Note 2: for both polarities of referenced to 2/9
BTA/BTB24, BT5, BT6 and T25 Series THERMAL RESISTANCES Symbol Parameter Value Unit R th(j-c) Junction to case (AC) D ² PAK C/W.8 TO-22AB RD91 (Insulated) TOP3 Insulated 1.1 TO-22AB Insulated 1.7 R th(j-a) Junction to ambient S = 1 cm ² D ² PAK 45 C/W S: Copper surface under tab PRODUCT SELECTOR TOP3 Insulated 5 TO-22AB TO-22AB Insulated 6 Part Number Voltage (xxx) 6 V 8 V Sensitivity Type Package BTB24-xxxB X X 5 ma Standard TO-22AB BTA/BTB24-xxxBW X X 5 ma Snubberless TO-22AB BTA/BTB24-xxxCW X X 35 ma Snubberless TO-22AB BT5-xxxB X X 5 ma Standard RD-91 BT5-xxxBW X X 5 ma Snubberless RD-91 BT5-xxxCW X X 35 ma Snubberless RD-91 BT6-xxxB X X 5 ma Standard TOP3 Ins. BT6-xxxBW X X 5 ma Snubberless TOP3 Ins. BT6-xxxCW X X 35 ma Snubberless TOP3 Ins. T2535-xxx X X 35 ma Snubberless D ² PAK BTB: Non insulated TO-22AB package ORDERIN INFORMATION BT A 24-6 BW (R) TRIAC SERIES INSULATION: A: insulated B: non insulated CURRENT: 24: 25A in TO-22AB 25: 25A in Rd91 26: 25A in TOP3 VOLTAE: 6: 6V 8: 8V SENSITIVITY & TYPE B: 5mA STANDARD BW: 5mA SNUBBERLESS CW: 35mA SNUBBERLESS PACKIN MODE Blank: Bulk R: Tube 3/9
BTA/BTB24, BT5, BT6 and T25 Series TRIAC SERIES CURRENT: 25A T 25 35-6 (-TR) SENSITIVITY: 35: 35mA VOLTAE: 6: 6V 8: 8V PACKAE: 2 : D PAK PACKIN MODE: Blank: Tube -TR: Tape & Reel OTHER INFORMATION Part Number Marking Weight Base quantity Packing mode BTA/BTB24-xxxyz BTA/BTB24xxxyz 2.3 g 25 Bulk BTA/BTB24-xxxyzR BTA/BTB24-xxxyz 2.3 g 5 Tube BT5-xxxyz BT5xxxyz 2 g 25 Bulk BT6-xxxyz BT6xxxyz 4.5 g 12 Bulk T2535-xxx T2535xxx 1.5 g 5 Tube T2535-xxx-TR T2535xxx 1.5 g 1 Tape & reel Note: xxx= voltage, y = sensitivity, z = type 4/9
BTA/BTB24, BT5, BT6 and T25 Series Fig. 1: Maximum power dissipation versus RMS on-state current (full cycle). Fig. 2-1: RMS on-state current versus case temperature (full cycle). P (W) 3 IT(RMS) (A) 3 25 25 BTB/T25 2 2 BT4 15 15 BT5/26 1 1 5 IT(RMS) (A) 5 1 15 2 25 5 Tc( C) 25 5 75 1 125 Fig. 2-2: D²PAK RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35 µm), full cycle. Fig. 3: Relative variation of thermal impedance versus pulse duration. IT(RMS) (A) 4. 2 DPAK 3.5 2 (S=1cm ) 3. 2.5 2. 1.5 1..5 Tamb( C). 25 5 75 1 125 K=[Zth/Rth] 1E+ 1E-1 1E-2 Zth(j-c) Zth(j-a) BTA/BTB24/T25 Zth(j-a) BT6 tp (s) 1E-3 1E-3 1E-2 1E-1 1E+ 1E+1 1E+2 5E+2 Fig. 4: values). On-state characteristics (maximum Fig. 5: Surge peak on-state current versus number of cycles. ITM (A) 3 ITSM (A) 3 1 Tj max 25 2 Non repetitive Tj initial=25 C t=2ms One cycle 1 Tj=25 C 15 1 Repetitive Tc=75 C Tj max. Vto =.85 V Rd = 16 mω VTM (V) 1.5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5 Number of cycles 1 1 1 1 5/9
BTA/BTB24, BT5, BT6 and T25 Series Fig. 6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 1ms, and corresponding value of I²t. Fig. 7: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values). 3 1 ITSM (A), I²t (A²s) di/dt limitation: 5A/µs Tj initial=25 C IT,IH,IL[Tj] / IT,IH,IL [Tj=25 C] 2.5 2. IT 1.5 ITSM 1. IH & IL tp (ms) 1.1.1 1. 1. I²t.5 Tj( C). -4-2 2 4 6 8 1 12 14 Fig. 8: Relative variation of critical rate of decrease of main current versus (dv/dt)c (typical values). Fig. 9: Relative variation of critical rate of decrease of main current versus junction temperature. (di/dt)c [(dv/dt)c] / Specified (di/dt)c 2.4 2.2 2. 1.8 1.6 BW/CW/T2535 1.4 B 1.2 1..8.6 (dv/dt)c (V/µs).4.1 1. 1. 1. (di/dt)c [Tj] / (di/dt)c [Tj specified] 6 5 4 3 2 1 Tj ( C) 25 5 75 1 125 Fig. 1: D²PAK Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm). Rth(j-a) ( C/W) 8 D²PAK 7 6 5 4 3 2 1 S(cm²) 4 8 12 16 2 24 28 32 36 4 6/9
BTA/BTB24, BT5, BT6 and T25 Series PACKAE MECHANICAL DATA D²PAK (Plastic) DIMENSIONS A REF. Millimeters Inches L L2 L3 E B2 B 2. MIN. FLAT ZONE C2 C R V2 D Min. Typ. Max. Min. Typ. Max. A 4.3 4.6.169.181 2.49 2.69.98.16.3.23.1.9 B.7.93.27.37 B2 1.25 1.4.48.55 C.45.6.17.24 C2 1.21 1.36.47.54 D 8.95 9.35.352.368 E 1. 1.28.393.45 4.88 5.28.192.28 L 15. 15.85.59.624 L2 1.27 1.4.5.55 L3 1.4 1.75.55.69 R.4.16 V2 8 8 FOOTPRINT DIMENSIONS (in millimeters) D²PAK (Plastic) 16.9 1.3 5.8 1.3 8.9 3.7 7/9
BTA/BTB24, BT5, BT6 and T25 Series PACKAE MECHANICAL DATA RD91 (Plastic) DIMENSIONS L2 L1 REF. Millimeters Inches Min. Max. Min. Max. B2 C C2 N2 C1 N1 B1 A 4. 1.575 29.9 3.3 1.177 1.193 22..867 B 27. 1.63 B1 13.5 16.5.531.65 B2 24..945 C 14..551 C1 3.5.138 E3 A F I B C2 1.95 3..77.118 E3.7.9.27.35 F 4. 4.5.157.177 I 11.2 13.6.441.535 L1 3.1 3.5.122.138 L2 1.7 1.9.67.75 N1 33 43 33 43 N2 28 38 28 38 PACKAE MECHANICAL DATA TOP3 (Plastic) REF. Millimeters DIMENSIONS Inches Min. Typ. Max. Min. Typ. Max. A 4.4 4.6.173.181 B 1.45 1.55.57.61 C 14.35 15.6.565.614 D.5.7.2.28 E 2.7 2.9.16.114 F 15.8 16.5.622.65 2.4 21.1.815.831 H 15.1 15.5.594.61 J 5.4 5.65.213.222 K 3.4 3.65.134.144 L 4.8 4.17.161.164 P 1.2 1.4.47.55 R 4.6.181 8/9
BTA/BTB24, BT5, BT6 and T25 Series PACKAE MECHANICAL DATA TO-22AB (Plastic) DIMENSIONS B C REF. Millimeters Inches b2 Min. Typ. Max. Min. Typ. Max. l4 l3 I l2 L A a1 a2 c2 F A 15.2 15.9.598.625 a1 3.75.147 a2 13. 14..511.551 B 1. 1.4.393.49 b1.61.88.24.34 b2 1.23 1.32.48.51 C 4.4 4.6.173.181 c1.49.7.19.27 c2 2.4 2.72.94.17 e 2.4 2.7.94.16 F 6.2 6.6.244.259 I 3.75 3.85.147.151 I4 15.8 16.4 16.8.622.646.661 b1 e M c1 L 2.65 2.95.14.116 l2 1.14 1.7.44.66 l3 1.14 1.7.44.66 M 2.6.12 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics 22 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics ROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - ermany Hong Kong - India - Isreal - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 9/9