CNY17-1, CNY17-3, CNY17-2, CNY17-4 Phototransistor Optocouplers

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CNY7-, CNY7-3, CNY7-2, CNY7-4 Phototransistor Optocouplers Features CNY7-/2/3 are also available in white package by specifying -M suffix (eg. CNY7-2-M) UL recognized (File # E90700) VDE recognized 02497 for white package Add option V for white package (e.g., CNY7-2V-M) File #02497 Add option 300 for black package (e.g., CNY7-2.300) File #947 Current transfer ratio in select groups High BV CEO 70V minimum White Package (-M Suffix) Schematic Applications Power supply regulators Digital logic inputs Microprocessor inputs Appliance sensor systems Industrial controls Description November 2004 The CNY7 series consists of a Gallium Arsenide IRED coupled with an NPN phototransistor. Black Package (No -M Suffix) ANODE BASE CATHODE 2 5 COL 3 4 EMITTER 2004 Fairchild Semiconductor Corporation www.fairchildsemi.com

Parameters Symbol Device Value Units TOTAL DEVICE Storage Temperature T STG -55 to +50 C Operating Temperature T OPR -55 to +00 C Lead Solder Temperature T SOL 20 for 0 sec C Total Device Power Dissipation @ 25 C (LED plus detector) P D -M 250 mw Derate Linearly From 25 C non -M 20 -M 2.94 mw/ C non -M 3.50 EMITTER Continuous Forward Current I F -M 0 ma non -M 90 Reverse Voltage V R V Forward Current - Peak ( µs pulse, 300 pps) I F (pk) -M.5 A non -M 3.0 LED Power Dissipation 25 C Ambient P D -M 20 mw Derate Linearly From 25 C non -M 35 -M.4 mw/ C non -M.8 DETECTOR Detector Power Dissipation @ 25 C Derate Linearly from 25 C Electrical Characteristics (T A = 25 C Unless otherwise specified.) Individual Component Characteristics P D -M 50 mw non -M 200 -M.7 mw/ C non -M 2.7 Parameters Test Conditions Symbol Device Min Typ Max Units EMITTER Input Forward Voltage I F = 0 ma V F -M.35.5 V I F = 0 ma non -M.5.50 Capacitance V F = 0 V, f = MHz C J non -M 50 pf -M 8 Reverse Leakage Current V R = V I R 0.00 0 µa DETECTOR Breakdown Voltage Collector to Emitter Collector to Base Emitter to Collector Leakage Current Collector to Emitter Collector to Base Capacitance Collector to Emitter Collector to Base Emitter to Base I C = ma, I F = 0 I C = 0 µa, I F = 0 I E = 00 µa, I F = 0 V CE = 0 V, I F = 0 V CB = 0 V, I F = 0 V CE = 0, f = MHz V CB = 0, f = MHz V EB = 0, f = MHz BV CEO BV CBO BV ECO I CEO I CBO C CE C CB C EB 70 70 7 00 20 0 50 20 8 20 0 V V V na na pf pf pf 2 www.fairchildsemi.com

Isolation Characteristics Characteristic Test Conditions Symbol Device Min Typ** Max Units Input-Output Isolation Voltage f = 0 Hz, t = min. V ISO Black Package 5300 Vac(rms)* -M White Package 7500 Vac(pk) Isolation Resistance V I-O = 500 VDC R ISO 0 Ω Isolation Capacitance V I-O = Ø, f = MHz C ISO Black Package pf -M White Package Note * 5300 Vac(rms) for minute equates to approximately 9000 Vac (pk) for second ** Typical values at T A = 25 C Transfer Characteristics (T A = 25 C Unless otherwise specified.) DC Characteristics Test Conditions Symbol Device Min Typ Max Units Current Transfer Ratio, I F = 0 ma, V CE = 5 V CTR CNY7-/--M 40 80 % Collector to Emitter CNY7-2/-2-M 3 25 CNY7-3/-3-M 00 200 CNY7-4 0 320 Saturation Voltage I F = 0 ma, I C = 2.5 ma V CE(SAT).40 V AC Characteristics Test Conditions Symbol Device Min Typ Max Units Non-Saturated Switching Times Turn-On Time (Fig.9 and Fig.20) R L = 00 Ω, I C = 2 ma, V CC = 0 V t on non -M 0 µs Turn-Off Time (Fig.9 and Fig.20) R L = 00 Ω, I C = 2 ma, V CC = 0 V t off non -M 0 µs Delay Time (Fig.9 and Fig.20) I F = 0 ma, V CC = 5 V, R L = 75 Ω t d -M 5. µs Rise Time (Fig.9 and Fig.20) I F = 0 ma, V CC = 5 V, R L = 75 Ω t r -M 4.0 µs Storage Time (Fig.9 and Fig.20) I F = 0 ma, V CC = 5 V, R L = 75 Ω t s -M 4. µs Fall Time (Fig.9 and Fig.20) I F = 0 ma, V CC = 5 V, R L = 75 Ω t f -M 3.5 µs Saturated Switching Times Turn-On Time (Fig.9 and Fig.20) I F = 20 ma, V CE = V t on CNY7-5.5 µs I F = 0 ma, V CE = V CNY7-2, CNY7-3, CNY7-4 8.0 Rise-Time (Fig.9 and Fig.20) I F = 20 ma, V CE = V t r CNY7-4.0 µs I F = 0 ma, V CE = V CNY7-2, CNY7-3, CNY7-4.0 I F = 20 ma, V CC = 5 V, R L = KΩ CNY7--M 4.0 I F = 0 ma, V CC = 5 V, R L = KΩ CNY7-2-M,.0 CNY7-3-M Delay Time (Fig.9 and Fig.20) I F = 20 ma, V CC = 5 V, R L = KΩ t d CNY7--M 5.5 µs I F = 0 ma, V CC = 5 V, R L = KΩ CNY7-2, 8.0 CNY7-3 Turn-Off Time (Fig.9 and Fig.20) I F = 20 ma, V CE = V t off CNY7-34.0 ms I F = 0 ma, V CE = V CNY7-2, CNY7-3, CNY7-4 39.0 3 www.fairchildsemi.com

Transfer Characteristics (T A = 25 C Unless otherwise specified.) (Continued) DC Characteristics Test Conditions Symbol Device Min Typ Max Units Fall-Time (Fig. 9 and Fig. 20) I F = 20 ma, V CE = V t f CNY7-20.0 µs I F = 0 ma, V CE = V CNY7-2, CNY7-3, CNY7-4 24.0 Storage Time (Fig. 9 and Fig. 20) I F = 20 ma, V CC = 5V, R L = KΩ CNY7--M 20.0 I F = 0 ma, V CC = 5V, R L = KΩ CNY7-2-M, 24.0 CNY7-3-M, I F = 20 ma, V CC = 5V, R L = KΩ t s CNY7--M 34.0 µs I F = 0 ma, V CC = 5V, R L = KΩ CNY7-2-M, 39.0 CNY7-3-M, 4 www.fairchildsemi.com

NORMALIZED CTR NORMALIZED CTR NORMALIZED CTR NORMALIZED CTR.4.2 Fig. Normalized CTR vs. Forward Current V CE = 5.0V Normalized to I F = 0 ma 0.0 0 5 0 5 20 I F - FORWARD CURRENT (ma)..4.2 Fig. 3 Normalized CTR vs. Ambient Temperature Normalized to I F = 0 ma I F = 20 ma I F = 0 ma I F = 5 ma -75-50 -25 0 25 50 75 00 25 T A - AMBIENT TEMPERATURE ( C)..4.2 Fig.2 Normalized CTR vs. Forward Current V CE = 5.0V Normalized to I F = 0 ma 0.0 0 2 4 8 0 2 4 8 20 I F - FORWARD CURRENT (ma).4.2 Fig. 4 Normalized CTR vs. Ambient Temperature Normalized to I F = 0 ma I F = 0 ma I F = 20 ma I F = 5 ma -0-40 -20 0 20 40 0 80 00 T A - AMBIENT TEMPERATURE ( C) NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) 0.9 0.7 0.3 0. Fig. 5 CTR vs. RBE (Unsaturated) I F = 20 ma I F = 0 ma I F = 5 ma V CE = 5.0 V 0.0 0 00 000 NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) Fig. CTR vs. RBE (Unsaturated) R BE - BASE RESISTANCE (kω) R BE - BASE RESISTANCE (kω) 0.9 0.7 0.3 0. I F = 20 ma I F = 0 ma I F = 5 ma V CE = 5.0 V 0.0 0 00 000 5 www.fairchildsemi.com

SWITCHING SPEED - (µs) SWITCHING SPEED - (µs) NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) 0.9 0.7 0.3 0. 000 00 0 Fig. 9 Switching Speed vs. Load Resistor I F = 0 ma V CC = 0 V Fig. 7 CTR vs. RBE (Saturated) 0.0 0 00 000 R BE - BASE RESISTANCE (k Ω) T off T on T r 0. 0. 0 00 R-LOAD RESISTOR (kω) T f I F = 20 ma I F = 0 ma I F = 5 ma V CE = 0.3 V NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) 0.9 0.7 0.3 0. 000 00 0 Fig. 8 CTR vs. RBE (Saturated) 0.0 0 00 000 Fig. 0 Switching Speed vs. Load Resistor I F = 0 ma V CC = 0 V R BE - BASE RESISTANCE (k Ω) T off T on T r I F = 20 ma I F = 0 ma I F = 5 ma 0. 0. 0 00 R-LOAD RESISTOR (kω) T f V CE = 0.3 V Fig. Normalized t on vs. R BE Fig. 2 Normalized t on vs. R BE 5.0 5.0 NORMALIZED ton - (ton(rbe) / ton(open)) 4.5 4.0 3.5 3.0 2.5 2.0.5 V CC = 0 V I C = 2 ma R L = 00 Ω NORMALIZED ton - (ton(rbe) / ton(open)) 4.5 4.0 3.5 3.0 2.5 2.0.5 V CC = 0 V I C = 2 ma R L = 00 Ω 0 00 000 0000 00000 0 00 000 0000 00000 R BE - BASE RESISTANCE (k Ω) R BE - BASE RESISTANCE (k Ω) www.fairchildsemi.com

NORMALIZED toff - (toff(rbe) / toff(open)) VF - FORWARD VOLTAGE (V).4.3.2. 0.9 0.7 0.3 0. 0 00 000 0000 00000.8.7 I C - (ma)..5.4.3.2. Fig. 3 Normalized t off vs. R BE R BE - BASE RESISTANCE (k Ω) V CC = 0 V I C = 2 ma R L = 00 Ω Fig. 5 LED Forward Voltage vs. Forward Current T A = 55 C T A = 00 C 0 00 I F - LED FORWARD CURRENT (ma) Fig. 7 Collector Current vs. Collector-Emitter Saturation Voltage 0 0. 0.0 I F = 20mA V CESAT - (V) I F = 2.5mA I F = 5mA I F = 0mA 0.0 0. I B = 0; T A = 25 o C NORMALIZED toff - (toff(rbe) / toff(open)) ICEO - COLLECTOR-EMITTER DARK CURRENT (µa).4.3.2. 0.9 0.7 0.3 Fig. 4 Normalized t off vs. R BE V CC = 0 V I C = 2 ma R L = 00 Ω 0. 0 00 000 0000 00000 0 0 0 0-0 -2 0-3 0-4 0-5 VF - FORWARD VOLTAGE (V) R BE - BASE RESISTANCE (k Ω) Fig. LED Forward Voltage vs. Forward Current.8.7..5.4.3.2. T A = 55 C T A = 00 C 0 00 I F - LED FORWARD CURRENT (ma) Fig. 8 Dark Current vs. Ambient Temperature V CE = 0 V 0-0 25 50 75 00 25 T A - AMBIENT TEMPERATURE ( C) 7 www.fairchildsemi.com

V CC = 5V R L I I C F INPUT OUTPUT (V CE ) Figure 9. Switching Time Test Circuit INPUT PULSE 0% OUTPUT PULSE 90% t d t s t r t f t on t off Figure 20. Switching Time Test Circuit 8 www.fairchildsemi.com

Black Package (No -M Suffix) Package Dimensions (Through Hole) SEATING PLANE 0.070 (.78) 0.045 (.4) 00 (5.08) (2.92) 4 (3.90) 0.00 (2.54) 0.022 () 0.0 () 0.00 (2.54) TYP 0.350 (8.89) 0.330 (8.38) PIN ID. 70 (.8) 40 (.0) 0.020 () MIN 0.0 (0) 0.008 (0) 0 to 5 0.300 (7.2) TYP Package Dimensions ( Lead Spacing) SEATING PLANE 00 (5.08) 0.35 (3.43) 0.350 (8.89) 0.330 (8.38) 0.070 (.78) 0.045 (.4) PIN ID 70 (.8) 40 (.0) Package Dimensions (Surface Mount) 00 (5.08) 5 (4.8) 0.022 () 0.0 () 3 4 0.350 (8.89) 0.330 (8.38) 2 5 0.070 (.78) 0.045 (.4) PIN ID. 0.020 () MIN 0.00 (2.54) TYP Lead Coplanarity : 0.004 (0.0) MAX 70 (.8) 40 (.0) 0.300 (7.2) TYP 0.0 (0) MIN 0.35 (8.00) MIN 05 (0.30) MAX Recommended Pad Layout for Surface Mount Leadform (Black Package Only) 5 (4) 95 (7.49) 0.00 (2.54) 0.070 (.78) 0.0 () 0.008 (0) 0.00 (.52) 0.030 (0.7) 4 (3.90) 0.00 (2.54) 0.004 (0.0) MIN 0.0 (0) 0.008 (0) 0.022 () 0.0 () 0.00 (2.54) TYP 00 () TYP 0 to 5 NOTE dimensions are in inches (millimeters) 9 www.fairchildsemi.com

White Package (-M Suffix) Package Dimensions (Through Hole) 0.070 (.77) 0.040 (2) 00 (5.08) (2.93) 0.00 (2.54) 0.05 (0.38) 0.020 (0) 0.0 () 0.350 (8.89) 0.320 (8.3) 0.04 (0.3) 0.00 (5) 0 (.0) 40 (.0) 0.320 (8.3) Package Dimensions ( Lead Spacing) SEATING PLANE SEATING PLANE 0.070 (.77) 0.040 (2) 00 (5.08) (2.93) 0.350 (8.89) 0.320 (8.3) 0.04 (0.3) 0.00 (5) 0.00 (2.54) Pin ID PIN ID 0 (.0) 40 (.0) 5 0.02 (0.30) Package Dimensions (Surface Mount) SEATING PLANE 0.070 (.77) 0.040 (2) 00 (5.08) (2.93) 0.025 (3) 0.020 () 0.020 (0) 0.0 () 0.350 (8.89) 0.320 (8.3) 0.04 (0.3) 0.00 (5) PIN ID 0 (.0) 40 (.0) 0.00 [2.54] 0.02 (0.30) 0.008 (0) 0.390 (9.90) 0.332 (8.43) 0.320 (8.3) 0.035 (8) 0.00 () Recommended Pad Layout for Surface Mount Leadform (White Package Only) 25 (0.79) 0.305 (7.75) 0.00 (2.54) 0.070 (.78) 0.00 (.52) 0.030 (0.7) 0.00 (2.54) 0.05 (0.38) 0.020 (0) 0.0 () 0.00 [2.54] 0.02 (0.30) 0.008 () 25 (0) 00 () NOTE dimensions are in inches (millimeters) 0 www.fairchildsemi.com

Ordering Information Option Black Package (No Suffix) White Package (-M Suffix) Description Order Entry Identifier S.S S Surface Mount Lead Bend SD.SD SR2 Surface Mount; Tape and reel W.W T " Lead Spacing 300.300 V VDE 0884 300W.300W TV VDE 0884, " Lead Spacing 3S.3S SV VDE 0884, Surface Mount 3SD.3SD SR2V VDE 0884, Surface Mount, Tape & Reel Carrier Tape Specifications (Black Package, No Suffix) 4.85 ± 0 3.2 ± 0.30 ± 0.05 User Direction of Feed 4.0 ± 0. 0. MAX 0.30 ± 0 2.0 ± 0. 4.0 ± 0. Carrier Tape Specifications (White Package, -M Suffix) 4.5 ± 0 0.30 ± 0.05 4.0 ± 0. 2.0 ± 0. 2.0 ± 0.05 Ø.55 ± 0.05.75 ± 0.0 7.5 ± 0..0 ± 0.3 9.55 ± 0 Ø. ± 0. Ø.5 MIN.75 ± 0.0 2 ± 0..5 ± 24.0 ± 0.3 9. ± 0 0. MAX 0. ± 0 Ø.5 ± 0./-0 User Direction of Feed www.fairchildsemi.com

Marking Information Definitions Fairchild logo 2 Device number Reflow Profile (Black Package, No Suffix) Temperature ( C) 300 250 200 50 00 50 0 0 225 C peak Ramp up = 3C/sec CNY7- V XX YY K 3 4 5 VDE mark (Note: Only appears on parts ordered with VDE 3 option See order entry table) 4 Two digits year code, e.g., 03 5 Two digit work week ranging from 0 to 53 Assembly package code Time (Minute) 25 C, 0 30 s Time above 83 C, 0 50 sec.5 2 2.5 3 3.5 4 4.5 2 Peak reflow temperature: 225 C (package surface temperature) Time of temperature higher than 83 C for 0 50 seconds One time soldering reflow is recommended Reflow Profile (White Package, -M Suffix) Temperature ( C) 300 250 200 50 00 50 0 0 245 C peak 230 C, 0 30 s Time above 83 C, 20 80 sec Ramp up = 2 0 C/sec Peak reflow temperature: 245 C (package surface temperature) Time of temperature higher than 83 C for 20 80 seconds One time soldering reflow is recommended.5 2 2.5 3 3.5 4 4.5 Time (Minute) 2 www.fairchildsemi.com

TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx ActiveArray Bottomless CoolFET CROSSVOLT DOME EcoSPARK E 2 CMOS EnSigna FACT FACT Quiet Series DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms FAST FASTr FPS FRFET GlobalOptoisolator GTO HiSeC I 2 C i-lo ImpliedDisconnect Across the board. Around the world. The Power Franchise Programmable Active Droop ISOPLANAR LittleFET MICROCOUPLER MicroFET MicroPak MICROWIRE MSX MSXPro OCX OCXPro OPTOLOGIC OPTOPLANAR PACMAN POP Power247 PowerEdge PowerSaver PowerTrench QFET QS QT Optoelectronics Quiet Series RapidConfigure RapidConnect µserdes SILENT SWITCHER SMART START SPM Stealth SuperFET SuperSOT -3 SuperSOT - SuperSOT -8 SyncFET TinyLogic TINYOPTO TruTranslation UHC UltraFET UniFET VCX 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Formative or In Design First Production Full Production This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I4 3 www.fairchildsemi.com