THE INTERPRETATION OF ELLIPSOMETRIC MEASUREMENTS OF ION BOMBARDMENT OF NOBLE GASES ON SEMICONDUCTOR SURFACES *
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1 Surface Science 152/153 (1985) North-Holland, Amsterdam 1079 THE INTERPRETATION OF ELLIPSOMETRIC MEASUREMENTS OF ION BOMBARDMENT OF NOBLE GASES ON SEMICONDUCTOR SURFACES * A.H.M. HOLTSLAG, U.C. SLAGER and A. VAN SILFHOUT Department of Applied Physics, Twente University of Technology, P.O. Box 217, 7500 AE Enschede, The Neiherlands Received 1 April 1984 Low energy noble gas ion bombardment and thermal desorption studies were carried out on Si(ll1) and analysed, in situ, using spectroscopic ellipsometry. The amorphous layer thickness and implanted noble gas fraction were calculated. 1. Introduction The influence of ion bombardment on the structure of the silicon lattice has been the subject of numerous investigations. The various effects induced by low energy ion bombardment in the outer layers of a solid - lattice damage, ion implantation, surface roughness, sputtering and surface state changes - are reflected in changes of the complex dielectric constant Z, which can be measured by means of spectroscopic ellipsometry [l-3]. This paper reports noble gas ion bombardment and desorption studies carried out on Si(ll1) and analysed using spectroscopic ellipsometry. 2. Experimental The experiments were carried out in an UHV system (base pressure lo-* Pa), having facilities for sample temperature control, spectroscopic PSRA ellipsometry, AES, mass selective ion bombardment, sputtering and mass * This work is part of the research program of the Stichting voor Fundamenteel Onderzoek der Materie (Foundation for Fundamental Research on Matter) and was made possible by financial support from the Nederlandse Organisatie voor Wetenschappelijk Onderzoek (Netherlands Organisation for the Advancement of Pure Research) /85/$ Elsevier Science Publishers B.V. (North-Holland Physics Publishing Division)
2 1080 A.H.M. Holtslag et al. / Interpretation of ellipsometric measurements spectrometry. A minicomputer system has been constructed with automatically controls the ellipsometer and data acquisition [4]. Initially the ellipsometer was calibrated [5] and alligned (angle of incidence ). Every ellipsometric measurement (A, 4) was preceded by an offset measurement at each analyser setting, since during each desorption the silicon sample is heated up to 8OO C, resulting in the optical measurements being disturbed by the partially polarised light emitted from the sample. Before bombardment the silicon sample was cleaned by argon ion sputtering (45, 800 ev, 2 x 10e6 A cme2) followed by a 30 min anneal at 800 C and AES. The ion bombardments were carried out using a 2 kev mass selective ion beam, at normal incidence, for two different fluxes (flux 1: 15 X 10P9 A cma2; flux 2: 115 X 10m9 A cme2). The intensity and profile of the beam was measured using a Faraday cup. After each bombardment a desorption measurement was performed. Using a controllable power supply the sample was directly heated in 50 reproducible increments from 25 to 800 C. For 100 s after each increment the sample temperature and the partial pressure, p(t), of the previously implanted noble gas were measured, followed by determination of A and J, at four wavelengths (and p, T) (A, B, C and D: 695, 595, 495 and 395 nm), during 200 s. For each desorption the total amount of desorbed particles per unit surface area, N,(t), was calculated from: N,(r) P(+P( ) +L dt ) -P(O) dt,. N = -= Rf 7 0 P ref ref kt,a,,, (1) N ref P ref J where TV is the vessel temperature, Aeff is the effective implanted area and r is the quotient of the UHV vessel volume V and the effective pumping speed S (T = 62.5 s for argon). 3. Results and discussion 3.1. Optical effects of noble ion gas bombardments on Si(lll) The optical parameters SA and S$, as shown in the figures, are defined as &A=A(N, T, A)-ii(T, X) and s$=#(n, T, X)--$(T, X) wherea(t, X) and &( T, X) refer to the clean substrate and from which the dielectric constant g,( T, X) of c-silicon can be calculated. A( N, T, h) and $( N, T, X) refer to the bombardment substrate containing a dose N at temperature T. In figs. 1A and 1B the measured S+ and SA are given. In fig. 1B the effect of the bombardment can be divided into four different characteristic regions having divisions at Q, R, S and T (1.37 Ae2). From S to T, SA changes slowly with increasing N; after dose T, SA and Sic,
3 Fig. 1. (A, B) Ellipsometric parameter changes M and 84 as a function of argon ion dose at four wavelengths (h, = 695 nm, ha = 595 nm, h,. = 495 nm. X, = 395 nm) and at two ion fluxes (flux 1: 15 na cm- ; flux 2: 115 na cm- ) for 2 kev normal incidence, ion bombardment (at 298 K). Points Q, R, S see text. (C) 6A plot for argon and krypton ion bombardment at fluxes 1 and 2; ( + ) and ( X ) are the calculated values for SA.- S$, which give a 10 A increase in the amorphous layer thickness, for three different argon particle fractions (0, 0.05, 0.10).?-. 0 F L 5 t I I I co 0 10 m m (u, 0 Q *o c 1 1 I I 1 I 2 A * 0.10 B tl N ( A-2) 6V (degl
4 1082 A. H.M. Holtslag et al. / Interpretation of ellipsometric meusurements remain constant. Upon termination of every bombardment 6A increases and S$ decreases (see fig. 3). From point R the optical change in SA is scalable, meaning that 6A(N, T,, hk) = ukl + h,ja(n, TO, X,) where h, and A, stand for two different wavelengths. However, this relationship does not hold for the region OQR, suggesting that we can separate at least two optical processes caused by bombardment. In fig. 1C a aa- plot is given for the 2 kev argon and krypton bombardments Desorption measurements of implanted Si(l I I) surfaces The desorption curves of implanted argon are shown in fig. 2, the steps appear in the order: K, K (main step - which is also the case 8 l T (K) -10 N (A-2, T (K) Fig. 2. Argon desorption experiments. (A) The desorbed dose as function of temperature. (B) The maximum desorbed dose at 1080 K as function of the bombardment dose. (C, D) 6A and S+ as function of the desorption temperature at two wavelengths (A, C). The numbers O-7 correspond to the bombardment doses given at the top of fig. 1A. The insert in (B) gives the argon beam profile.
5 A.H. M. Holtslag et al. / Interpretation of ellipsometric measurements 1083 for krypton!) and K, with increasing ion dose. The step at K appears after a very small dose, stays almost constant upon increasing dose, and is interpreted as being due to channelling. In fig. 2B the final desorbed doses J?n are plotted as a function of the dose N; at A2 the sample is saturated with argon. The increase of $o after point 6 is partially due to the boundary of the beam profile. In figs. 2C and 2D 611 and S$ are given as a function of the sample temperature. Curves A0 and CO exhibit monotonic damage recovery. At higher doses the large changes at K are due to damage recovery and argon desorption, only above 840 K is the change in SA always positive. In fig. 3 the bombardment (flux 2) and desorption experiments are shown. For low doses the desorption curve retraces the bombardment curve (2 + 1). In general the slopes of the desorption curves are quite similar to those of the bombardment curves. From the curves in figs. 2C, 2D and 3, four different effects can be distinguished: section damage recovery at room temperature; section 4 + 5, damage recovery due to increasing temperature; section 5 --, 6, desorption of argon and a large damage recovery at K; section 6 --, 7, complete recovery of the crystal. At 1080 K the crystal regains the original crystalline state after - 30 min annealing I -J Y (deg) Fig. 3. SA-SJ, plot of argon bombardment (flux 2) and desorption experiments at three wavelengths A, B, C. Symbols l-7: divisions of characteristic regions, explained in the text.
6 1084 A. H.M. Holtsiag et al. / Interpretation of ellipsometric measurements 3.3. Discussion The complex dielectric constant, Z, of a mixture of components in a solid can be calculated with the EMA equation [6]. We assume a simple model of a homogeneous amorphous layer of variable thickness (O-150 A) containing a particle fraction, 8,, of implanted argon (0, 0.05 and 0.10) above a crystalline substrate. The dielectric constant of argon (EI, = Oi) was calculated using the Clausius-Mossotti equation [6]. The problem now arises which of the published Z,(X) to use. Davis and Mott [ll] propose that for amorphous silicon ( ane) j3 = c(e - E,,), confirmed by other authors [1,12], where c and E, are constants, n is the index of refraction, (Y is the absorption coefficient and E is the photon energy. From our measured 6A and Sic/ values in the E region ev, after a dose N = A-*, we calculate the amorphous layer thickness, d, under the condition that (ane) I3 is a linear function of E; from this calculation it follows that E, = 1.05 ev, c = 5.45 ev2j3 pmp /3, d = 100 & 5 A, obtaining at the same time Z,(X) (see fig. 4) where 8, is taken as The results of the calculation for SA and S# are shown in fig. 1C. For all wavelengths the measured values of 6A and S# for argon, at flux 2, can be explained by a layer of - 85 A which amorphosises until point Q is reached, - 2 Jlld0ped :ki-'c'id -E2 *Ilm I I O E (ev) Fig. 4. The dielectric constant Z,(x). A comparison with regard to the expression of Davis and Mott is made for an Ar-bombarded sample (+ + +), a sputtered film (-.-) sample 1 from ref. [12], and an undoped LPCVD film (- - -) from ref. [l].
7 A.H.M. Holtslag et al. / Interpretation of ellipsometric measurements 1085 followed by a growth of the layer up to A with 8, = For the similar situation of krypton ion bombardment the values are 70 A and A respectively. At the dose of point Q (0.03 Ae2) we compare the calculated amorphous layer thickness wi,fh the projected range, xp, and range straggling, up. [7], of argon (x, = 34.3 A, up = 19.9 A) and krypton (x, = 38.3 A, up = 13.4 A) for 2 kev bombardment. One can expect an amorphous layer of xp _+ 3crP, however, by using an layer of xp + 2.5~~ the predicted thickness is 84 A for argon and 72 A for krypton, which is in agreement with the observed values. Furthermore, from the ion collection model of Schulz and Wittmaack [8], using a sputter coefficient s = 1 [9,10], one can calculate a maximum implanted argon dose of 1.7 A-*, while the measured value from the desorption experiments (fig. 2B) is 0.38 Ae2. This means that the total amount of argon is limited by the solubility of argon in bhe silicon lattice, or s = 4 finally. By distributing the dose of 0.38 A-2 in a homogenous layer of 140 A one can calculate an argon concentration of 13~ = 0.05 instead of 8, = 0.10 in the final state. However for an accurate calculation one requires the actual distributions 0(z) and we have also omitted the surface roughness arising during bombardment. For the lower particle flux 1 it seems likely that the amorphous layer is not completely built up, as compared to flux 2. References [l] D.E. Aspnes, A.A. Studna and E. Kinsbron, Phys. Rev. B29 (1984) 768. [2] J.R. Adams and N.M. Bashara, Surface Sci. 49 (1975) 441. [3] J.W.D. Martens, W.F. van den Bogert and A. van Silfhout, Surface Sci. 105 (1981) 275. [4] K.O. van der Werf, R.J.S. Sieverdink, W. Vonk, G. Meijer and L.J. Hanekamp, to be published. [5] A.H.M. Holtslag and A. van Silfhout, to be published. [6] D.E. Aspnes, Am. J. Phys. 50 (8) (1982) 704. [7] J.F. Gibbons, W.S. Johnson and S.W. Mylroie, Projected Range Statistics, Semiconductors and Related Material (Halsted, 1975). [8] F. Schulz and K. Wittmaack, Radiation Effects 29 (1975) 31. [9] K. Wittmaack and P. Blank, Appl. Phys. Letters 31 (1977) 21. [lo] R. Behrisch, Topics in Applied Physics 47 (Springer, Berlin, 1981) p [ll] E.A. Davis and N.F. Mott, Phil. Mag. 22 (1970) 903. (121 R.H. Klazes, M.H.L.M. van den Broek, J. Bezemer and S. Radelaar, Phil. Mag. B45 (1982) 377.
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