LW TTSD binning FK0PN0
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1 Produktdatenblatt Version 1.1 TOPLED TOPLED, SMT LED with integrated reflector. With our great experience in SMT LED we are able to offer a high quality product for all kind of applications. Applications Cluster, Button Backlighting Electronic Equipment Interior Illumination (e.g. Ambient Map) White Goods Features: Package: white PLCC-2 package, colored diffused silicone resin Chip technology: ThinGaN Typ. Radiation: 120 (Lambertian emitter) Color: Cx = 0.33, Cy = 0.33 acc. to CIE 1931 ( white) Corrosion Robustness Class: 3B ESD: 2 kv acc. to ANSI/ESDA/JEDEC JS-001 (HBM) 1 Version
2 Ordering Information Type Luminous Intensity 1) Ordering Code = 20 ma I v LW TTSD-U1V2-FK0PN mcd Q65112A Version
3 Maximum Ratings Parameter Symbol Values Operating Temperature T op min. max. Storage Temperature T stg min. max. -40 C 110 C -40 C 110 C Junction Temperature T j max. 125 C Forward Current T S = 25 C Surge Current t 10 µs; D = ; T S = 25 C Reverse voltage 2) T S = 25 C ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM) min. max. 1 ma 30 ma S max. 200 ma V R max. 5 V V ESD 2 kv 3 Version
4 Characteristics = 20 ma; T S = 25 C Parameter Symbol Values Chromaticity Coordinate 3) Viewing angle at 50 % I V 2φ typ. 120 Forward Voltage 4) = 20 ma Reverse current 2) V R = 5 V Cx Cy V F I R typ. typ. min. typ. max. typ. max V 3.20 V 3.80 V 0.01 µa 10 µa Real thermal resistance junction/ambient 5), 6) R thja real max. 340 K / W Real thermal resistance junction/solderpoint 5) R thjs real max. 180 K / W 4 Version
5 Brightness Groups Group Luminous Intensity 1) Luminous Intensity 1) Luminous Flux 7) = 20 ma = 20 ma = 20 ma min. max. typ. I v I v Φ V U1 450 mcd 560 mcd 1515 mlm U2 560 mcd 710 mcd 1905 mlm V1 710 mcd 900 mcd 2415 mlm V2 900 mcd 1120 mcd 3030 mlm Forward Voltage Groups Group Forward Voltage 4) Forward Voltage 4) = 20 ma = 20 ma min. max. V F V F V 2.90 V V 3.20 V V 3.50 V V 3.80 V 5 Version
6 Chromaticity Coordinate Groups Cy 0,8 FK0PN0 Cx 0,0 0,2 0,4 0,6 550 nm 0,6 500 nm 0,4 600 nm 0, nm 0, nm 0,45 Cy 0,40 0,35 0,30 0,25 0,20 GN0 FN0 FM0 MN0 LN0 MM0 LM0 ML0 KN0 KM0 LL0 MK0 JN0 JM0 KL0 LK0 IN0 KK0 JL0 IM0 HN0 JK0 IL0 HM0 IK0 HL0 GM0 HK0 GL0 GK0 FL0 FK0 PN0 NN0 PM0 NM0 PL0 NL0 PK0 NK0 0,20 0,22 0,24 0,26 0,28 0,30 0,32 0,34 0,36 0,38 Cx 6 Version
7 Color Chromaticity Groups 3) Group Cx Cy FK FL FM FN GK GL GM GN Group Cx Cy HK HL HM HN IK IL IM IN Group Cx Cy JK JL JM JN KK KL KM KN Version
8 Group Cx Cy LK LL LM LN MK ML Group Cx Cy MM MN NK NL NM NN Group Cx Cy PK PL PM PN Version
9 Group Name on Label Example: U1-FK0-3 Brightness Color Chromaticity Forward Voltage U1 FK0 3 9 Version
10 Relative Spectral Emission 7) I rel = f (λ); = 20 ma; T S = 25 C 1,0 I rel 0,8 :V λ :LK0 :LM0 :MN0 0,6 0,4 0,2 0, λ [nm] Radiation Characteristics 7) I rel = f (ϕ); T S = 25 C ϕ [ ] ,0 Irel 0, ,6-70 0,4-80 0,2-90 0, Version
11 Forward current 7), 8) Relative Luminous Intensity 7), 8) = f(v F ); T S = 25 C I v /I v (20 ma) = f( ); T S = 25 C 100 [ma] I V I V (20mA) 3,0 80 2,5 60 2,0 1,5 40 1,0 20 0,5 3 2,7 2,8 3,0 3,2 3,4 3,6 3,8 3,9 V F [V] 0, [ma] 100 Chromaticity Coordinate Shift 7) Cx, Cy = f( ); T S = 25 C Cx Cy 0,03 0,02 0,01 : Cx -LK0;MN0 : Cy -LK0;MN0 : Cx -MN0 : Cy -MN0 0,00-0,01-0,02-0, [ma] Version
12 Forward Voltage 7) V F = V F - V F (25 C) = f(t j ); = 20 ma Relative Luminous Intensity 7) I v /I v (25 C) = f(t j ); = 20 ma V F [V] 0,2 I v I v (25 C) 1,2 1,0 :LK0; LM0 :MN0 0,8 0,0 0,6 0,4-0,2 0,2-0, T j [ C] 0, T j [ C] Chromaticity Coordinate Shift 7) Cx, Cy = f(t j ); = 20 ma Cx Cy 0,03 0,02 : Cx -LK0;MN0 : Cy -LK0;MN0 : Cx -MN0 : Cy -MN0 0,01 0,00-0,01-0,02-0, T j [ C] 12 Version
13 Max. Permissible Forward Current = f(t) 32 ma OHL04278 T A T S Do not use below 1mA C 110 T Permissible Pulse Handling Capability = f(t p ); D: Duty cycle; T S = 25 C Permissible Pulse Handling Capability = f(t p ); D: Duty cycle; T S = 85 C 0.22 A 0.18 D = t P T t P T OHL A 0.18 D = t P T t P T OHL D = D = t p 1 10 s t p 1 10 s Version
14 Dimensional Drawing 9) Approximate Weight: 32.0 mg Corrosion test: Class: 3B Test condition: 40 C / 90 % RH / 15 ppm H 2 S / 14 days (stricter then IEC ) 14 Version
15 Recommended Solder Pad 9) 2.6 (0.102) 1.5 (0.059) 4.5 (0.177) 2.6 (0.102) 1.5 (0.059) OHLPY970 For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. 4.5 (0.177) Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation Lötstopplack Solder resist 2 Cu-Fläche > 16 mm Cu-area > 16 mm 2 15 Version
16 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 300 C T C 217 C 200 t P t L T p OHA C 150 t S C s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat *) 25 C to 150 C 2 3 K/s Time t S t S s T Smin to T Smax Ramp-up rate to peak *) 2 3 K/s T Smax to T P Liquidus temperature T L 217 C Time above liquidus temperature t L s Peak temperature T P C Time within 5 C of the specified peak temperature T P - 5 K Ramp-down rate* T P to 100 C t P s 3 6 K/s Time 480 s 25 C to T P All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 16 Version
17 Taping 9) 17 Version
18 Tape and Reel 10) Reel dimensions [mm] A W N min W 1 W 2 max Pieces per PU 180 mm / mm / Version
19 _< C). _< If wet, 5% parts still adequately dry. change desiccant If wet, 10% examine units, if necessary bake units If wet, 15% examine units, if necessary bake units WET Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Barcode-Product-Label (BPL) Dry Packing Process and Materials 9) CAUTION LEVEL If blank, see bar code label This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours OSRAM Moisture-sensitive label or print Barcode label Humidity indicator Barcode label Comparator check dot Desiccant Humidity Indicator MIL-I-8835 OSRAM OHA00539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD Version
20 _< C). _< ML C R 2a (9D) D/C: Bin2: Q-1-20 Bin3: ML Temp ST C R 2a Transportation Packing and Materials 9) Barcode label Barcode label CAUTION This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours LEVEL If blank, see bar code label OSRAM Opto Semiconductors LSY T676 Multi TOPLED Bin1: P-1-20 Bin2: Q-1-20 Bin3: Temp ST 240 C R C RT Additional TEXT R077 PACKVAR: (G) GROUP: DEMY R18 P-1+Q-1 OHA02044 Muster (6P) BATCH NO: (1T) LOT NO: (9D) D/C: (X) PROD NO: 1 123GH (Q)QTY: 2000 OSRAM Opto Semiconductors (6P) BATCH NO: (1T) LOT NO: (X) PROD NO: 1 123GH1234 Muster (Q)QTY: 2000 LSY T676 Multi TOPLED Bin1: P C R C RT Additional TEXT R077 PACKVAR: (G) GROUP: DEMY R18 P-1+Q-1 OSRAM Packing Sealing label Dimensions of transportation box in mm Width Length Height 200 ± 5 mm 195 ± 5 mm 30 ± 5 mm 352 ± 5 mm 352 ± 5 mm 33 ± 5 mm 20 Version
21 Type Designation System Wavelength Emission Color Color coordinates according (λ dom typ.) CIE 1931/Emission color: A: 617 nm amber W: white S: 633 nm super red UW: ultra white T: 528 nm true green CB: color on demand blue Y: 587 nm yellow CG: color on demand green O: 606 nm orange CL: color on demand lagune G: 570 nm green P: 560 nm pure green R: 625 nm red B: 470 nm blue H: 645 nm hyper-red V: 505 nm verde green L: Light emitting diode Package Type T: TOPLED L A T Lead / Package Properties 6: folded leads 7: reverse gullwing leads T: folded leads, improved corrosion stability Au-LF), w/o TiO2 jetting V: folded leads and UX:3 w/ improved corrosion stability (Au-LF), TiO2 jetting Encapsulant Type / Lens Properties 7: Colorless clear or white volume conversion (resin encapsulation) S: Silicone (with or without diffuser) Chip Technology: 1: TSN 3: standard InGaN 4: AlGaAs (RECLED) 5: HOP : Standard InGalP 9: TSN low current B: HOP 2000 C: ATON D: Low cost ThinGaN/ Thinfilm (e.g. 6mil) F: Thinfilm InGaAlP G: ThinGaN(Thinfilm InGaN) (Subcon:Sapphire) K: InGaAlP low current S: standard InGaN low current 0: TSN 21 Version
22 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize LED exposure to aggressive substances during storage, production, and use. LEDs that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC For further application related informations please visit 22 Version
23 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS webside. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer or Customer supplied by Buyer considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer. 23 Version
24 Glossary 1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3). 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Chromaticity coordinate groups: Chromaticity coordinates are measured during a current pulse of typically 25 ms, with an internal reproducibility of ±0.005 and an expanded uncertainty of ±0.01 (acc. to GUM with a coverage factor of k = 3). 4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3). 5) Thermal Resistance: Rth max is based on statistic values (6σ). 6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad) 7) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single devices within one packing unit. 9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 10) Tape and Reel: All dimensions and tolerances are specified acc. IEC and specified in mm. 24 Version
25 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D Regensburg All Rights Reserved. 25 Version
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